2011 EMC Directory & Design Guide - Interference Technology

TM 

2011 

EMC Directory 

& Design Guide 

technologies 

Cables & Connectors............................................78 

EMC Design........................................................122 

Filters ..................................................................106 

Shielding...............................................................78 

Software................................................................78 

Surge & Transients.....................................100, 122 

Testing & Test Equipment.....................................10 

directories 

Company Directory.............................................159 

Consultant Services............................................126 

Government Directory.........................................144 

Products & Services Index................................. 151 

Professional Societies........................................138 

Standards Recap................................................128 

industries & applications 

Aerospace.............................................................56 

Automotive............................................................78 

Power....................................................................46 

Radiated Emissions..................................10, 28, 90 

Smart Grid.............................................................46 

Standards......................................................66, 128 

Wireless................................................................22 

interferencetechnology.com

contents2011 

10 

TESTING & TEST EQUIPMENT 

Troubleshooting Radiated Emissions Using Low-Cost 

Bench-Top Methods.............................................................................10 

KENNETH WYATT, WYATT TECHNICAL SERVICES 

Wireless Approvals for Japan: A Hiro’s Tale .............................. 22 

MIKE VIOLETTE, AMERICAN CERTIFICATION BODY, INC. 

14 

Measurement Uncertainty for Conducted and 

Radiated Emissions............................................................................. 28 

DANIEL HOOLIHAN, HOOLIHAN EMC CONSULTING 

On the Radiation Patterns of Common EMC Antennas............. 34 

VICENTE RODRIGUEZ, ETS-LINDGREN L.P. 

High Power Electromagnetic (HPEM) Threats 

To the Smart Grid.................................................................................. 46 

WILLIAM A. RADASKY, METATECH CORPORATION 

34 

New EMC Requirements For Commercial Avionics: 

RTCA/DO-160G..................................................................................... 56 

ERIK J. BORGSTROM, ENVIRON LABORATORIES LLC 

66 STANDARDS 

On the Nature and Use of the 1.04 m 

Electric Field Probe.............................................................................66 

KEN JAVOR, EMC COMPLIANCE 

76 

2 interference technology emc directory & design guide 2011


Interference Technology 

EMC Test & Design Guide 2008 

78 ShIElDING 

Numerical Solution of EMC Problems Involving Cables 

with a Combined Field/ Transmission Line Approach................ 78 

MARLIZE SCHOEMAN and ULRICH JAKOBUS, 

EM SOFTWARE & SYSTEMS – S.A. (PTY) LTD 

90 

RADIATED emissioNS 

Going from Analog to Digital: Radiated Emissions Performance 

of a Nuclear Plant Control System..................................................90 

PHILIP F. KEEBLER, ELECTRIC POWER RESEARCH INSTITUTE (EPRI); 

and STEPHEN BERGER, TEM CONSULTING, LLC 

102 

100 

SURGE & TRANSIENTS 

A Risk Assessment for Lightning Protection System ............100 

BRYAN COLE, TECHNOLOGY RESEARCH COUNCIL 

106 

FILTERs 

Accurate Feedthrough Capacitor Measurements at 

High Frequencies Critical for Component Evaluation and 

High Current Design .........................................................................106 

GEORGE M. KAUFFMAN, NEXTEK, INC. 

110 

Measurements above 1 GHz in Time-Domain: 

Theory and Application.................................................................... 114 

CHRISTIAN HOFFMANN, PETER RUSSER, TECHNISCHE 

UNIVERSITÄT MÜNCHEN; and STEPHAN BRAUN, ARND FRECH, 

GAUSS INSTRUMENTS GMBH 

122 

DESIGN 

Electromagnetic Interference Sources and Their Most 

Significant Effects.............................................................................122 

ANTHONY A. DiBIASE, Spec-Hardened Systems 

121 



DEPARTMENTS & DIREctoRIES 

EDITORIAL ...............................................................................8 

CONSULTANT SERvICES..................................................126 

STANDARDS RECAP...........................................................128 

PROFESSIONAL SOCIETIES.............................................138 

GovERNMENT DIRECTORy.............................................144 

PRODUCTS & SERvICES INDEx.....................................151 

78 

COMPANy DIRECTORy.....................................................159 

INDEx OF AdvERTISERS..................................................176 

EDIToRIAl RevIEw BoARD 

Keith Armstrong 

Cherry Clough Consultants 

Stephen Caine 

Alion Science & Technology 

Thomas Chesworth 

Seven Mountains Scientific, Inc. 

Richard Ford 

Consultant 

Donald Heirman 

Don Heirman Consultants, LLC 

Daniel D. Hoolihan 

Hoolihan EMC Consultants 

William F. Johnson 

WFJ Consulting 

Herbert Mertel 

Mertel Associates 

Mark Montrose 

Montrose Compliance Services, Inc. 

Henry W. Ott 

Henry Ott Consultants 

InterferenceTechnology—The EMC Directory & Design Guide, The EMC Symposium Guide, and The EMC Test & Design Guide are distributed annually at no charge to qualified 

engineers and managers who are engaged in the application, selection, design, test, specification or procurement of electronic components, systems, materials, equipment, facilities or 

related fabrication services. To be placed on the subscriber list, complete the subscription qualification card or subscribe online at InterferenceTechnology.com. 

ITEM Publications endeavors to offer accurate information, but assumes no liability for errors or omissions in its technical articles. Furthermore, the opinions contained herein do not 

necessarily reflect those of the publisher. 

ITEM TM , InterferenceTechnology—The EMC Directory & Design Guide TM , and Interference Technology.com TM are trademarks of ITEM PublicaTIons and may not be used without 

express permission. ITEM, InterferenceTechnology—The EMC Directory & Design Guide, The EMC Symposium Guide, The EMC Test & Design Guide and InterferenceTechnology. 

com, are copyrighted publications of ITEM PublicaTIons. Contents may not be reproduced in any form without express permission. 


from the editor 

A look back — and forward 

Anniversaries offer the opportunity to look back 

and reminisce, but it’s also a good time to take stock and 

look ahead. As ITEM noted the passing of its 40th anniversary, I 

pulled the 1971 edition of the Interference Technology Directory & 

Design Guide off its dusty shelf and cracked open the stiff spine. 

What immediately struck me in perusing the pages of the 

inaugural issue was not how far we’ve come but, instead, how little has 

changed. 

In introducing ITEM, Publisher & Editor-in-chief Robert D. Goldblum wrote: 

“Radiated and electrical interference has once been stated as “Everyone’s 

Problem”. If you are involved with engineering, whether it be research, design, 

applications management or purchasing, the problems associated with 

electrical noise and radiation are all around you. The EMC (Electromagnetic 

Compatibility) engineer is a specialist in the control and measurement of 

noise, but there are too few of these specialists to go around. Thus, there are 

several alternatives; hiring an EMC specialist, obtaining consulting services, 

and educating each engineer and manager to deal effectively with the noise 

problems. These are the objectives of ITEM.” 

And these remain our objectives today. Many of the topics covered in that first 

issue — electro-explosive devices, EM susceptibility generators, military EMI 

specifications, transients caused by inductive loads – are still actively covered 

by ITEM’s authors. Ever-growing demand for electrical devices and electronic 

goods means EMC specialists are more valuable than ever before. Just as the 

focus has remained on these timeless topics for the last few decades, where we 

go in the next 40 years will be dictated by those specialists working in the field. 

What are you working on? Whether it’s the technologies of tomorrow – 

hybrid and electric cars, wind and solar generated power, the Smart Grid 

and nanotechnology – or always-useful troubleshooting tips from the bench 

top, we want you to share your knowledge and findings with your colleagues. 

If you’ve heard about a topic, technology or standard that deserves to be 

publicized, email me at slong@interferencetechnology.com. 

Anyone who is interested in the 1971 Directory & Design Guide can contact me 

for a copy. I hope you’ll enjoy the trip down memory lane as much as I did. 

Sarah Long, Editor 

2011 EMC Directory & Design Guide 

Publisher 

Paul Salotto 

Editor 

Sarah Long 

Graphic Designer 

Ann Schibik 

Editorial Assistant 

Cait O’Driscoll 

Marketing Specialist 

Jacqueline Gentile 

Business Development Manager 

Bob Poust 

Business Development Executives 

Tim Bretz 

Daryl McFadyen 

Leslie Ringe 

Janet Ward 

Administrative Manager 

Eileen M. Ambler 

Circulation Manager 

Irene H. Nugent 

Product Development Manager 

Helen S. Flood 

Administrative Assistant 

Karen Holder 

President 

Graham S. Kilshaw 

Publisher Emeritus 

Robert D. Goldblum 

ITEM 

USA 

1000 Germantown Pike, F-2 

Plymouth Meeting, PA 19462 

Phone: (484) 688-0300 

Fax: (484) 688-0303 

E-mail: 

info@interferencetechnology.com 

www.interferencetechnology.com 

china, taiwan, hong kong 

Leadzil 

Jenny Chen, +86-010-65250537 

E-mail: service@leadzil.com 

JAPAN 

TÜV SÜD Ohtama, Ltd. 

Miho Toshima, +81-44-980-2092 

E-mail: m-toshima@tuv-ohtama.co.jp 

ITEM PublicaTIons endeavors to offer accurate information, but 

assumes no liability for errors or omissions. Information published 

herein is based on the latest information available at the time of 

publication. Furthermore, the opinions contained herein do not 

necessarily reflect those of the publisher. 

S u b s c r i p t i o n s 

ITEM, InterferenceTechnology—The EMC Directory & Design Guide, EMC Symposium Guide, Europe EMC Guide and EMC Test & Design Guide 

are distributed annually at no charge to engineers and managers engaged in the application, selection, design, test, specification or procurement of electronic 

components, systems, materials, equipment, facilities or related fabrication services. Subscriptions are available through interferencetechnology.com. 

I T E M T M , I n t e r f e r e n c e T e c h n o l o g y a n d 

InterferenceTechnology.com TM are trademarks of 

ITEM PublicaTIons and may not be used without 

express permission. ITEM, InterferenceTechnology and 

InterferenceTechnology.com are copyrighted publications 

of ITEM PublicaTIons. Contents may not be reproduced in 

any form without express permission. 

Copyright © 2011 • ITEM Publications • ISSN 0190-0943 


testing & test equipment 

Troubleshooting Radiated Emissions 


Using Low-Cost Bench-Top Methods 

Figure 1. Source-path-receptor model. 

kenneth wyatt, SR. 

Wyatt Technical Services 

Woodland Park, Colorado USA 

Because time-to-market and budget 

factors often drive many of today’s 

high-tech designs, electromagnetic 

compatibility (EMC) issues often surface at 

the last moment in the design cycle, potentially 

delaying product introductions. Very 

often, simple troubleshooting techniques 

can identify issues early when the cost of 

implementation is substantially lower and 

design improvements may be made with less 

impact on schedules. This article describes 

a number of simple probing tools and 

techniques useful in reducing the radiated 

emissions (RE) of a product that will better 

prepare it for a successful radiated emission 

compliance test. 

IntRODUCTION 

There are usually five key threats that comprise 

most electromagnetic compatibility 

(EMC) problems: radiated emissions, electrostatic 

discharge (ESD), susceptibility to 

RF fields, power disturbances and internal 

crosstalk. Of these, radiated emissions (RE) 

can be the most difficult test for a product 

to pass. Because emissions limits are established 

worldwide, products that don’t 

meet the limits may not be placed on the 

market. The best way to achieve compliance 

is through proper product design, but often 

these design techniques are not taught in 

universities, nor are these techniques fully 

understood by many experienced engineers. 

The result is that EMC is considered “black 

magic” and many products must be tested 

repeatedly through a system of trial and error, 

in order to finally achieve compliance. 

This is unfortunate, because the emissions 

a product may produce is easily 

understood if the designer considers that 

high-frequency currents in circuit loops 

tend to broadcast these emissions. These 

circuit loops may be in the form of printed 

circuit traces (differential-mode currents) 

or cables connecting two subsystems 

(common-mode currents). There may also 

be combinations of these phenomenon, as 

well as poor printed circuit board layout 

practices. The circuit and system design of 

a product usually falls within the domain 

of the electronic engineer. The other consideration 

is the shielding properties of the 

product, which typically falls within the 

domain of the mechanical engineer. Ideally, 

these two must work together as a team to 

address the whole product in order to be 

successful in addressing EMC. 

TROUBLESHOOTING PHILOSOPhy 

In troubleshooting any radiated emission 

problem, it’s useful to think of the problem 

in the form of a “source-path-receptor” 

model. See Figure 1. 

Typically, the source of radiated emis- 

10 interference technology emc Directory & design guide 2011


sions is a high-frequency crystal oscillator or other highfrequency, 

fast-edged, high-current signal. ASICs, FPGAs 

and A/D or D/A converters may also generate these highfrequency 

harmonics. Sources of common-mode currents 

include simultaneous switching noise (SSN) through common 

impedances, routing of clock traces over gaps in return 

planes and unbalanced physical structures or resonances 

in PC boards or enclosures. 

The “path” is the coupling mechanism, or the means, by 

which the high-frequency energy is coupled to the radiating 

element (enclosure slot, cable, etc.). This may include 

conducted, radiated, inductive or capacitive couplings. 

The “receptor”, in most cases, is the EMI receiver at the 

test site with specified emission limits, but in the real world 

could include interference to radio, television, or communication 

systems. 

By using simple measurement probes, it should be possible 

to identify the source or sources. Once the sources 

are identified, the path or coupling mechanism must be 

identified and fixed. What’s difficult is that there may be 

multiple sources and coupling mechanisms to identify 

and fix, before passing results are achieved. In addition, if 

a fix is improperly installed, the emission can actually get 

worse! That’s probably why the field of EMC is considered 

so mysterious. 

By using a structured approach, the troubleshooting 


phase should go smoothly. Generally, you’ll want to diagnose 

the issues first – then try various fixes. Leave these fixes 

installed as you continue the troubleshooting process. By 

setting up a simple antenna and EMI receiver or spectrum 

analyzer a fixed distance away (1 to 3m) from where you’re 

troubleshooting you can monitor your results real-time. 

Note, however, a 10 dB drop in emissions at 1m does not 

necessarily indicate the same drop in the measurement 

chamber, due to near-field effects. 

Identify the sources 

The first step should always be to identify the likely sources. 

If you’re failing at 300 or 500 MHz, for example, are these 

the third or fifth harmonics of a 100 MHz clock oscillator? 

How about the memory clocking? Generally memory 

address and data busses are fairly random. The exception 

would be the A0 or D0 line, which is clocking at a relatively 

non-random rate. What about clock lines to ASICs or FP- 

GAs? If you have multiple crystal oscillators, which could 

be the cause of a particular harmonic, applying freeze spray 

on one, then the other, can often identify the offending 

oscillator. 

Frequency 

The frequency is key to any radiated emission problem. As 

a quick rule of thumb, the higher the frequency, the more 




oscillator with fast edge speeds, the harmonic content can 

be estimated with the formula in Equation 1. 

Equation 1. Maximal RE frequency estimate, where f = EMI frequency 

(Hz) and t r 

= risetime (seconds). 

For example, with 1 nsec logic, the harmonic content 

may be centered around 300 MHz. Another rule of thumb 

is that for frequencies below about 300 MHz, the problem 

is most likely due to common-mode emissions from cables 

and above that; the problem is most likely radiation from 

slots or seams in the metal chassis or circuit board radiation. 

Figure 2. Examples of DIY antennas for radiated emissions 

troubleshooting. The “rabbit ears” are resonant from 65 to 200 

MHz, while the bowtie works well from 300 to 800 MHz. I installed a 

television-style balun to better match to 50-ohm coax for the bowtie. 

Dimensions 

The dimensions of physical structures are also an important 

factor in troubleshooting an emissions problem. Recall 

that the wavelength (m) of a resonant wire at frequency, f, 

in free space is: 

likely the coupling path is radiated. The lower the frequency, 

the more likely the path is conducted. In fact, the common 

break frequency during compliance testing is 30 MHz. Below 

that, we measure conducted emissions (CE) – above that we 

measure RE. If your product uses a high-frequency crystal 

8483 Retlif EMC_ITEM ad 2/3/11 2:36 PM Page 1 

Equation 2. Wavelength of a wire in free space, where c = speed of 

light in m/s and f = frequency in Hz. 

The dimensions of physical structures, like circuit boards, 

must be reduced by the velocity factor of the board mate- 

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resonate strongly at multiples of a quarter wavelength. For 

example, a 1m long cable has a full-wave resonance of 300 

MHz, but may also radiate strongly at 150 and 75 MHz. 

Slots or seams of 8 to 15 cm may resonate in the area of 500 

to 800 MHz. As a general rule of thumb, radiating cables 

or chassis slots of 1/ 20th wavelength or greater, start to 

become significant radiating elements (or antennas) for RE. 

Figure 3. Examples of commercial E- and H-field probes from Beehive 

Electronics. 

Figure 4. Examples of homemade H-field probes. 

Figure 5. I made my own broadband preamp using a Mini-Circuits 

model ZX60-3018G-S. It is powered it with two 6V Duracell #28A 

batteries, which happen to fit in a standard “AA” battery holder. The 

amplifier covers 20 to 3000 MHz at 20 dB gain and is used to boost the 

probe signals. 

rial (example, 4.7 for FR4 circuit boards). However, typical 

cables, such as USB or video, are approximately 1m long and 

can be considered as being in free space. Wires or slots may 

USEFUL TOOLS 

Antennas 

The antenna you select should ideally be somewhere near 

resonance for the frequencies of concern, however, it’s not 

really that critical for troubleshooting purposes. So long 

as the antenna is fixed in length and fixed in place on the 

bench, you’ll receive consistent results. During troubleshooting, 

it’s more important to know whether the fix is 

“better” or “worse” or “no change” and as long as the test 

setup doesn’t change, the results should be believable. 

Now, EMC antennas are not inexpensive, as you might 

imagine, so for general troubleshooting, I tend to use a 

couple inexpensive television antennas - a pair of “rabbit 

ears” and a UHF “bowtie” (with TV balun to match 50-ohm 

coax). See Figure 2. If the workbench is wooden, I’ll extend 

the antenna to approximate resonance (if possible) and tape 

it down to the bench with duct tape. If the bench is metallic, 

I’ll find a non-conductive support and position it some 

distance away from the bench. I usually use a test distance 

of about a meter, but as long as you can see the product’s 

harmonics on a spectrum analyzer, you’ll be able to determine 

your progress. Sometimes I need to insert a low-noise 

wide-band preamp between antenna and analyzer. 

Now, obviously, ambient signals from broadcast radio, 

television mobile phones and two-way radio services will 

tend to interfere with observing the product harmonics. 

You may need to bring the antenna closer or set up the 

troubleshooting measurement in a basement or building 

interior away from outside windows. I usually record the 

known harmonics of concern using an H-field probe or by 

bringing the measurement antenna in close and then try 

to characterize them in relation to other nearby ambient 

signals. 

Probes 

There are a variety of useful probes that may be used to 

troubleshoot RE problems; E-field, H-field and current 

probes. 1 All are easily made in the lab or are available from 

several manufacturers. An E-field probe may be made by 

extending the center conductor about 0.5 cm from a section 

of semi-rigid coax or high-quality flexible coax; then 

attaching a coax connector to the other end. Shorting of 

the probe to circuit traces may be avoided by wrapping 

insulating tape around the end. A useful H-field probe may 

be fashioned by looping the center conductor around and 

soldering it to the shield to form a small loop of 0.5 to 5 cm in 

diameter - the larger the loop, the more sensitivity. A better 

1 

Probe manufacturers include Fischer Custom Communications, Beehive 

Electronics or Teseq. 




H-field probe design uses semi-rigid coax to form the loop 

(see examples in Figures 3 and 4). Occasionally, I’ll need to 

amplify the harmonic signals and so use a DIY broadband 

preamplifier as shown in Figure 5. Beehive Electronics also 

makes a low-cost amplifier. 

TROUBLESHOOTING StePS 

Locating internal sources 

Connect your probe to the input of an EMI receiver or 

spectrum analyzer to display the harmonics as the probe is 

brought into close contact with the circuit traces or chassis 

slots. Depending on the diameter of your H-field probe, 

you may need to use a broadband preamplifier between the 

probe and analyzer. 2 

Generally, once you are finished mapping out your 

sources, you should start with the lower harmonics and 

work upwards. Often, lower-frequency sources will cause 

significant high-frequency harmonics, depending upon the 

rise time. By fixing the low-frequency source, you’ll often 

resolve the high-frequency harmonics, as well. Next, check 

cables and then the enclosure. 

Cables 

Check your cables next, as they are often the worst offenders. 

Moving a “hot” cable will alter the RE levels. I usually 

unplug all cables; then try plugging each one in individually 

to find all that are radiating. Remember that there may be 

more than one bad cable! Snapping a ferrite choke around 

the base of the cable will probably help as an interim fix. I’ve 

found that most cable emissions are very likely due to poor 

grounding to the enclosure at the I/O connector. 

Cable common-mode currents may also be measured 

directly versus frequency with a current probe. 3 Use of current 

probes usually works better than antennas, because they 

tend to pick up fewer ambient signals due to their e-field 

shield. Clamp the probe around the cable in question and 

move it back and forth to maximize the readings – then fix 

it in place while you apply potential fixes. 

You can make your own current probe or purchase commercial 

versions. The advantage of commercial versions is 

that they can open up and snap around a cable. Examples 

of my DIY probe is shown in Figure 7, while commercial 

versions are shown in Figure 8. 

It is possible to predict whether a particular cable will 

pass or fail by measuring the CM current at the offending 

frequency, solving for Ic (Figure 11 and Equation 3 on the 

next page) and plugging this into Equation 4 to solve for the 

field level in V/m. The length of the cable is L and the offending 

harmonic frequency is f. Use a test distance of either 3 or 

10m to predict the outcome at those test distances. 

Figure 6. Use of simple H-field probes to locate emission sources. 

Figure 7. Examples of DIY current probes. These photos were taken 

prior to installing the E-field shield by wrapping a layer of copper tape 

over the windings, leaving a small gap around the inside of the probe. 

14 turns of Teflon-insulted wire wound around a Würth Electronik 

#74270097 ferrite core (4W620 material) was used, which is useful from 

10 to 1000 MHz. 

2 

I made my own broadband preamp using a MiniCircuits model ZX60- 

3018G-S, which covers 20 to 3000 MHz at 18-23 dB gain and 2.7 dB noise 

figure. It sells for USD 50. 

3 

Commercial current probes are available from Fischer Custom Communications, 

Teseq or Solar Electronics, as well as many others. 

Figure 8. Examples of commercial current probes. 


W yat t 


LAN conn needs 

gnd shell. 

Note a lack of good 

connection between 

chassis enclosure and 

connector ground. 

Figure 9. A lack of solid ground can allow CM currents generated inside the product to flow out the I/O cable and radiate – usually causing RE 

failures. The included graph shows poor margins to the CISPR 11 Class A 3m RE limit (for ISM products, in this case). ITE products, such as PCs and 

printers have a limit 10 dB lower. 

Looking from 500 to 1000 MHz 

Test setup: 

Current probe on USB cable. Connection 

between connector ground shell and chassis 

enclosure made with screwdriver blade. 

Before 

After 

Some harmonics dropped by 10-15 dB! 

Figure 10. Cables should be tested individually. Here, I have a current probe clamped around the cable under test and am monitoring the 

harmonics with a simple hand-held spectrum analyzer.4 As I ground the connector shell to the chassis with the screwdriver blade, the harmonics 

are reduced 10 to 15 dB! 

4 

The handheld spectrum analyzer being used for the cable test is made by Thurlby Thander Instruments. It sells for approximately USD 1995 and covers 

1 MHz to 2.7 GHz. 

interferencetechnology.com interference technology 19



emission level in V/m. Converting this to dBuV/m will indicate a pass or 

fail due to the cable being measured. 

The equation for calculating the emission level in volts/ 

meter for a CM signal is shown below in Equation 4. 

Equation 4. Field level (V/m) due to CM current, where f = frequency 

(Hz), L = length of the wires (m) and d = the measurement distance 

(typically 3m or 10m). 

Figure 11. Transfer impedance (Zt) graph of a typical current probe 

(courtesy of Fischer Custom Communications). The x-axis is frequency, 

while the y-axis is dB . Use this to calculate the value of Ic, given the 

measured voltage at the probe terminals V(dBuV) and Zt. 

Equation 3. Calculation of Ic given the measured V and Zt (from Figure 

11). Next, plug Ic into Equation 4 to calculate the predicted E-field 

Slots & seams 

Once the cables and associated I/O connectors are addressed, 

it’s time to probe for radiation leakage through 

slots or seams in the chassis. Remember, that the length of 

the slot or seam is important. Any seam with leakage whose 

effective length is longer than 1/ 20th of a wavelength at the 

harmonic of concern has the potential to be an effective radiator. 

For example, a slot of 2.5 cm can just start radiating 

harmonics at 1000 MHz. I use a permanent marking pen 

to record the areas of leakage and frequencies of concern 

from every seam/slot on the enclosure. 

Once these are marked, I’ll carefully cover over all the 

openings with copper tape and re-measure the RE levels. 

Keeping an eye on the RE levels, I’ll start removing the 

tape piece-by-piece to determine which slots or seams are 


W yat t 


actually causing problems. Often, just 

a few slots or seams will cause the most 

problems. Once the leakages are identified, 

you can determine the appropriate 

fixes with your mechanical engineer. 

Troubleshooting kit 

For speedy troubleshooting and analysis, 

I’ve assembled an EMC troubleshooting 

kit into a portable Pelican 

case, which can be wheeled right 

to an engineer’s workbench. Major 

contents include a small spectrum 

analyzer (Thurlby Thander PSA2701T, 

available from Newark Electronics), a 

broadband preamplifier (Mini-Circuit 

Labs or Beehive Electronics), small 

DIY antennas, various probes and 

other accessories. Other useful items 

for your troubleshooting kit include 

ferrite chokes, aluminum foil, copper 

tape, power line filters, signal filters 

and various values of resistors and 

capacitors. Figure 12 shows an overall 

view of the contents. 

SUMMARY 

In order to pass required EMC tests 

for radiated emissions, it is necessary 

to understand the basic concepts of 

current flow through loops, as well 

as differential- and common-mode 

currents and how they’re generated. 

Troubleshooting an existing design 

is simply the process of identifying 

the likely sources, determining the 

coupling paths through probing, and 

applying temporary fixes. Once these 

fixes have been applied and the product 

passes, then the electronic and 

mechanical engineers may determine 

the most cost-effective solutions. Obviously, 

troubleshooting or characterizing 

products early in the design cycle 

are preferred in order to reduce overall 

implementation costs. 

Figure 12. Contents of the special EMC troubleshooting kit I’ve assembled. I can probe for 

various RE problems, as well as test for ESD and radiated immunity. Performing these tests early 

in the design cycle, results in a greater chance of passing the required EMC product qualification 

tests. 

Kenneth Wyatt, Sr. EMC Engineer, Wyatt 

Technical Services LLC, holds degrees in biology 

and electronic engineering and has worked as a 

senior EMC engineer for Hewlett-Packard and 

Agilent Technologies for 21 years. He also worked 

as a product development engineer for 10 years at 

various aerospace firms on projects ranging from 

DC-DC power converters to RF and microwave 

systems for shipboard and space systems. He 

can be contacted at ken@emc-seminars.com. n 



Wir e l e s s A p p r o va l s f o r Ja pa n 

Wireless Approvals for Japan: 

A Hiro’s Tale 

Figure 1. Zen garden. 

Mike Violette 

American Certification Body, Inc. 

McLean, Virginia USA 

Hiro dug into his soup. 

“Did your dad fight in the war?” 

Nodding, slurping up fat udon 

noodles, “Korea,” pausing and picking up a 

napkin to dab his chin. “My father was an 

engineer, highways and bridges, mostly in 

the North.” Hiro put down his napkin, laid 

his fast-food chopsticks across his bowl 

and picked up the chopstick wrapper. He 

meticulously folded the long paper in thirds 

and then lengthwise, making a little tent 

that he put on the table next to the tall can 

of Kirin beer we were sharing. “That was a 

long time ago.” He moved his chopsticks 

onto the paper rest and lifted the bowl to his 

lips, the steamy broth fogging his glasses. 

“Why do you ask?” 

“Just curious.” It was a long time ago. 

So much has changed and the vast Pacific 

theatre of conflict in the mid-20th century 

is now crisscrossed by cargo ships and 

frequent-flyers. Japan, at the center of so 

much history in the region, figures prominently 

in technology trade, and 

recent regulatory changes have 

propped the door open—a little. 

Hiro put down his bowl. “And 

now, U.S. manufacturers can get 

radios certified in the U.S.—but 

it is necessary to understand the 

process.” He took off his glasses 

and wiped them slowly with the 

dry end of the napkin. 

“Can you tell me?” 

Hiro put his glasses back on 

and pushed back from the table, gracefully 

straightening in his chair. “Hai.” 

We sat at one of the quickie eateries that 

are clustered around the departure gates in 

Terminal 1 at Narita Airport—an East-West 

melting pot of travelers and outpost of diversity 

on an island of monolithic ethnicity. 

Narita, opened in 1978 after much local 

protest and the lobbing of Molotov cocktails 

(!), is now an international hub, knitting together 

destinations such as Taipei, Beijing, 

San Francisco and Seoul. In the 70s, though, 

the construction of the airport was not a 

universally popular notion; years of protest 

preceded its opening and lasted well into 

its operations. In sharp contrast to the notion 

that Japan is a society of conformists, 

considerable resistance was mounted to try 

to block the construction of the airport, 

including protests and riots and, in the 

manner of the 60s and 70s crowd control: 

water cannons and tear gas. 

But by the 1990s Narita became a key 

Asian hub and started accruing an interesting 

legacy. In 2001, Kim Jong-Nam, eldest 

son of North Korea’s King Jong-Il, was arrested 

at the airport with a fake passport. 

He apparently wanted to visit Disneyland 

Japan, but instead got a ride to China. His 

fake Dominican Republic passport failed to 

get him to "Space Mountain" and the jaunt 

allegedly cost him rule over his own "Magic 

Kingdom," the anointment ultimately passing 

to his younger brother Kim Jong-Un. 

We were just passing through—heading 

home—and Hiro was keeping us company 

during our extended layover after the APEC 

(Asia-Pacific Economic Cooperation) Telecommunications 

meetings, a biannual event 




that links the 21 economies that form the trading group. Mutual 

Recognition Arrangements and Agreements (MRAs) 

are a hallmark of that work. Several such agreements, based 

on harmonized conformity assessment regimes, have facilitated 

much of the enormous trade between the U.S. and 

Asia. It is one of the reasons we’re spending a few hours in 

the large international airport outside of Tokyo. 

Some 10 years after the implementation of the APEC Mutual 

Recognition Arrangement (MRA), trade between the 

21 economies is around $9.4T (that's Trillion with a capital 

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“T”), according to the office of the U.S. Trade Representative, 

accounting for 44% of world trade. That is a lot of noodles. 

The APEC Mutual Recognition Arrangement for conformity 

assessment of telecommunications equipment, the 

world’s first multi-lateral MRA, celebrated its 10th anniversary 

in July 2009. Developed by the APEC Telecommunications 

and Information Working Group (APEC TEL), the 

MRA benefits manufacturers by reducing the cost of getting 

a product approved and by reducing the time to market. 

The MRA, a voluntary agreement, has fostered the expansion 

of technology and the access to 

competitively priced products amongst 

partner countries by reducing barriers 

to trade. Just as APEC continues to 

pursue its goals of “stability, security 

and prosperity,” the APEC TEL MRA 

Task Force continues to meet twice a 

year to discuss and develop additional 

arrangements, work out MRA issues 

and create bonds of friendship that 

reach across the oceans [1]. 

That beats fighting every time. 

Opportunity for 

U.S. Organizations 

The reality of U.S.-Japan trade in the 

past 40 years—since the mass proliferation 

of transistor-based devices—has 

been quite one-sided. One of the last 

access-issues to fall is the certification 

of wireless devices by U.S. Conformity 

Assessment Bodies (CABs). In contrast, 

CBs in the European Union have 

enjoyed this privilege since Valentine’s 

day 2003. (Singapore, too, has had an 

operating MRA since the early 2000s.) 

So, for roughly the past seven years, 

European CBs (and implicitly European 

manufacturers) have had a greater access 

to the Japanese radio market than 

U.S. organizations. Of course, there are 

other economic realities that skew this 

benefit, such as the desirability of U.S. 

products on the Japanese market and 

other flavors of the U.S.-Japan cultural 

and business inter-relationship. 

But now, at least, the U.S. is catching 

up. 

Within the context of the APEC TEL 

MRA, Japan and the U.S. have implemented 

the MRA for wireless devices. 

The initial agreement was signed Feb. 

16, 2007. Another three years passed 

before the technical and administrative 

details and criteria were hammered out. 

Forged after a series of correspondences, 

meetings, queries, clarifica- 


Viol e t t e 


tions, discussions, understanding (and 

misunderstandings) between the U.S. 

National Institute of Standards and 

Technology (NIST) and the Japanese 

Ministry of Internal Affairs and Communications 

(MIC), the U.S.-Japan 

MRA is now in full-force. Effective 

Nov. 1, 2010, NIST has been accepting 

applications from CABS that meet 

the specific criteria laid out under the 

agreement (for all of the bloody details, 

see [2]). 

The agreement, like a difficult childbirth, 

was a bit painful and took some 

postpartum nursing, but it is finally 

standing and walking. In essence, the 

criteria require the CAB seeking approval 

to gain the necessary accreditation 

from a designated Accreditation 

Bodies, and ABs can now accept and 

process applications from Certification 

US Government 

(NIST) 

Figure 2. Regulatory food chain. 

Bodies accredited to meet the international requirements in 

ISO Guide 65. The food chain is now established and looks 

a little like this: 

Under the MRA, once a candidate CAB passes muster 

with its domestic “Designating Authority” or DA (NIST in 

the U.S.), then the DA advances the proposed CAB to the 

DA of the other country. There is a period of review and 

comment and, if the CAB is accepted, then the authority 

to issue certifications is granted by the process of a Joint 

Committee, which is composed of one or more members 

of each DA. 

To understand why the agreement and final implementation 

were so stretched out, it is necessary to understand a few 

fundamental differences between U.S. and Japan practices. 

Some of the more interesting bits include challenges relating 

to differences in: 

1) Laboratory/CAB Acceptance. An informal “Accreditation 

system” in Japan is the most different aspect 

between the systems. In contrast to the U.S., which 

relies on established mix of private and public-sector 

independent accrediting bodies, the Japanese system 

of accepting lab results was more on a relationship 

basis—not surprisingly given the customary and traditional 

internally focused system of kyoryoku (meaning 

"collaboration" and obliquely referring to a system of 

preference that makes it difficult for outsiders to break 

into Japan's business circles.) 

2) Regulatory structure difficulties in aligning methods 

and product certification schemes. 

3) Test methods. Test procedures for measuring specific 

devices are difficult to identify and cross-reference. 

Items 2) and 3) are essentially linked together. The method 

of organizing the regulations in the U.S. under the FCC system 

is essentially based on a Byzantine division of general 

device functionality and intended use mapped against frequency 

allocation; the requirements are, however, all covered 

MRA 

Accreditation Bodies 

CABs 

Test Laboratories 

Manufacturers 

Japanese 

Government 

(MIC) 

under a single title (47) of the “Code of Federal Regulations”, 

the how-to manual of the United States federal government. 

The method of organizing the regulations in Japan is, at first, 

a little inscrutable and buried under a half-dozen or so ordnances 

and radio laws, with the technical requirements based 



on specific device type rather than general usage. This makes 

the mapping of well-understood methods of device assessment 

here (FCC) against there (MIC) quite, er, challenging. 

A private sector organization and CB in Japan (DSP 

Research: http://www.dspr.co.jp/) has developed an Englishlanguage 

database that eases this issue. Still, it would be 

useful to understand a bit of kanji. 

Note that there are similarities under both regimens for 

how non-licensed and licensed devices are handled. Nonlicensed 

equipment (such as low power devices, cordless 

phones and the like) can be placed on the market without secondary 

licensing. Cellular phones, on the other hand, must 

have a “blanket license” that applies to the system operator; 

this is not unlike the U.S., where cell phones are licensed to 

the operator and the process is transparent to the end-user. 

One of the requirements of the MRA is to demonstrate 

that a Conformity Assessment Body is approved to a scope 

that is equal to or greater than the requirements outlined in 

the MIC regulations. This bit of cross-referencing requires a 

deep dive into the methods for the devices, sorting through 

the technical requirements and demonstrating “competency 

by association.” 

I WAnt my radio certified. Where to begin? 

For any type of produce certification, one asks the same questions: 

What Provisions? What Requirements? What Limits? 

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Any roadmap to certify a radio to Japanese law includes 

three main documents, starting with the Radio Law (Law 

No. 131 of May 2, 1950, as amended) which says that radios 

of a certain type (Specified Radio Equipment) must be certified. 

The Radio Law covers the usual administration and 

authority requirements, as well as spelling out a path for 

certifying equipment and operators. Other various topics 

include operation of coast guard stations and aeronautical 

stations and there are chapters on lawsuits and penal provisions. 

(Note that Terminal Equipment is covered by the 

Telecommunications Business Law—Law No. 86 Dec. 25, 

1984, as amended. In short, the approval process is similar 

for wireless and wireless telephony.) 

Article 38-2 of the Radio Law covers the requirements 

for Certification Bodies, to wit “…a person who wishes to 

conduct the business of certifying such radio equipment’s 

conformity with the technical regulations specified in the 

preceding Chapter may obtain registration from the Minister…[The 

Radio Law includes, by the way, requirements 

for maintaining decency and decorum on the air. George 

Carlin would certainly balk: 

“Article 108: Any person who transmits a message with 

indecent contents by means of radio equipment or communications 

equipment under Article 100 paragraph (1) item 

(i) shall be guilty of an offense and liable to imprisonment 

with work for a period not exceeding two years or to a fine 

not exceeding one million yen.” 

Note that this is not your ordinary imprisonment, it is 

imprisonment with work—breaking rocks. This is where 

they get all the nice stone for their Zen gardens.] 

Chapter 3 of the Radio Law is specific to radio equipment 

and this is where we dig into the details and how, ultimately, 

the MRA provides the bridge between the U.S. certification 

bodies (more properly: Conformity Assessment Bodies) and 

wireless certifications for Japan. NIST is now actively in 

the process of approving CABs for this process. As stated 

before, the private sector has existing capacity (under the 

APEC Tel MRA and the Japan-EU MRA). 

To get an approval, one must generate a report and demonstrate 

conformance (and submit to a Certification Body). 

To determine what data must be collected, it is necessary to 

refer to the ordnances that cover the specified equipment, 

notably the “Ordinance concerning Technical Regulations 

Conformity Certification of Specified Radio Equipment (aka 

Ordinance of the Ministry of Posts and Telecommunications 

No. 37, 1981).” This document lays out the various types 

of equipment and what data are to be collected and what 

instrument is used to collect the data. 

Table No. 1 (which covers eight pages) breaks down the 

action in a paragraph-by-paragraph cross-reference dependent 

on device function, providing the general quantity 

to be measured—“Frequency” and “Occupied Frequency 

Bandwidth”—and the type of instrumentation necessary. 

A fragment is shown in Figure 3 for illustrative purposes. 

By way of example, Article 2 (Specific Radio Equipment, 

etc.) calls out the frequency allocation and power limits for 

marine mobile equipment as follows: 


Viol e t t e 


Figure 3. A fragment of Table No. 1 from the Radio Law. 

“(1)-13 The radio equipment with an 

antenna power of 50 W or less which 

is used at a radio station for maritime 

mobile service using class A3E emissions 

of a frequency in a range of higher 

than 26.1 MHz to 28 MHz, higher than 

29.7 MHz to 41 MHz, or higher than 

146 MHz to 162.0375 MHz.” 

For this specific equipment, referring 

to Table No. 1, the following data 

need to be collected: 

Frequency, Occupied Bandwidth, 

Spurs, Deviation, Power, Overall Frequency 

Characteristics, Distortion… 

etc. Requirements also exist for the 

receiver: Spurious radiated emissions, 

Sensitivity, Passing bandwidth, 

Attenuation and Spurious response, 

Fluctuation of LO and overall distortion 

and noise. 

Now that we know what data must 

be collected, the question becomes: 

what are the limits? The answer is to be 

found, in part, in the Radio Regulatory 

Commission Regulations No. 18, 1950. 

The 293-page document has the technical 

details, limits on power, use, and 

construction, viz “The high-frequency 

section and modulation section (except 

for the antenna system) shall not be 

capable of being opened easily.” 

derstand ordnances 37 and 18, right?” 

He nodded, smiled and said, “And, 

maybe get a little help from your 

friends.” 

United Flight 890 to Los Angeles 

now boarding Gate 8. 

My friend polished off the last drops 

of soup and sat back, smiling. 

“Ready to go?” 

“Always. Arigato!” 

To figure out where the requirements 

are in this document, one starts 

at the table of contents and reads 

through the description in the “Conditions 

for Radio Equipment Classified 

by Service or Emission Class and Frequency 

Band.” This index is invaluable. 

For example, Article 49.20 of No. 18 

covers the requirements for low power 

spread spectrum devices operating in 

the ISM 2.4 GHz band, a pretty popular 

spot for WiFi, Bluetooth, etc. 

These three critical documents can 

be found online: http://www.soumu. 

go.jp/main_sosiki/joho_tsusin/eng/ 

laws_dt02.html 

If you’re adept at reading Japanese, 

you can always download the original 

versions; it is a little tricky because the 

documents don’t have traditional title 

pages, at least in the English form. 

To summarize, 

The Radio Law (Law No. 131 of May 

2, 1950) has the general requirements 

(akin to Part 2 of CFR47). Ordinance 

of the Ministry of Posts and Telecommunications 

No. 37, 1981 contains 

the parameters to measure, and Radio 

Regulatory Commission Regulations 

No. 18, 1950 has the limits. 

“So, Hiro, it’s really necessary to un- 

References 

• [1]” Fostering International Trade: Ten Years of 

MRA Success,” APEC, Sep. 2010, . 

• [2] “Criteria for Designation of U.S. Conformity 

Assessment Bodies under the US- 

Japan Mutual Recognition Agreement,” NIST, 

Oct. 2010, . 

Mike Violette is founder and director of 

American Certification Body and president 

of Washington Laboratories. Violette oversees 

operations of ACB’s activities in the U.S., 

Asia and the EU and knows where to find 

decent sushi at Narita. He can be reached at 

mikev@acbcert.com. n 



M e a s ur e m e n t Un c e r ta in t y f o r C o nduc t e d, R a di at e d Emi s s i o n s 

Measurement Uncertainty for Conducted 

and Radiated Emissions 

Daniel Hoolihan 

Hoolihan EMC Consulting 

Lindstrom, Minnesota USA 

One of the key elements to making 

scientific measurements in an EMC 

lab in today's modern world is having 

the engineers understand and control 

the Measurement Uncertainty (MU) of the 

instrumentation used for making conducted 

and radiated emission measurements. The 

emission levels measured by an accredited 

lab must have measurement uncertainties 

below certain levels to be acceptable to its 

accreditation body. Also, some international 

standards have begun to quote levels of 

acceptable measurement uncertainties for 

electromagnetic emissions. This article outlines 

a brief history of MU, reviews the MU 

for equipment used for typical conducted 

and radiated emission measurements, and 

give some hints on how a lab can reduce its 

Measurement Uncertainty for instrumentation 

used for emission measurements. 

General 

In this article, Measurement Uncertainty 

will refer to the Instrumentation’s Measurement 

Uncertainty. At first glance, MU 

is a complex subject, however, with a little 

study it becomes more understandable and 

more easily understood. Most practicing 

engineers are familiar with tolerances and 

error and similar terms. In general, the 

concept of MU is not as well known. One 

of the reasons for this is that the theory and 

practice of measurement uncertainty has 

only been around about 20 years. 

Brief History of Measurement 

Uncertainty 

The ISO/IEC Guide 98-3 is the "father" of 

all Measurement Uncertainty documents. It 

is commonly just called the "GUM." It was 

first released in 1993 and, then, corrected 

and reprinted in 1995. It changed the world 

of measurements and the associated errors 

of measurement instrumentation. 

The world's highest authority in metrology, 

CIPM (Comite International des Poids 

et Mesures) realized that there was a need 

to convene the world's experts on Measurement 

Uncertainty in order to arrive 

at a consensus position on the subject. In 

1977, the CIPM requested the BIPM (Bureau 

International des Poids et Mesures) to 

communicate with the national metrology 

laboratories around the world and assess 

the situation. 

By early 1979, responses had been received 

from 21 laboratories and the great 

majority of the labs thought that something 

needed to be done. Specifically, the labs 

thought that "it was important to arrive 

at an internationally accepted procedure 

for expressing measurement uncertainty 

and for combining individual uncertainty 

components into a single total uncertainty." 

A working group was formed, developed 

a process, and released Recommendation 

INC-1 on Expression of Experimental Uncertainties 

in 1980. This Recommendation 

was approved by the CIPM in 1981 and reaffirmed 

by the same body in 1986. 

The ISO (International Organization for 

Standardization) was given the responsibility 

of developing a detailed Guide based 




on the 1980 Recommendation. The 

responsibility was assigned to ISO 

Technical Advisory Group on Metrology 

(TAG 4) which promptly established 

Working Group 3 comprised of 

experts nominated by BIPM, IEC (International 

Electrotechnical Commission), 

ISO, and OIML (International 

Organization of Metrology). This TAG 

labored throughout the 1980s and into 

the early 1990s to produce the "Guide 

to the Expression of Uncertainty in 

Measurement" in 1993. This guide was 

corrected and reprinted in 1995 and 

then eventually published as ISO/IEC 

Guide 98-3 in 2008. 

Because of its historical significance, 

Recommendation INC-1 (1980) 

is reproduced below for your convenience. 

Recommendation INC-1 (1980) 

- Expression of Experimental 

Uncertainties 

1. The uncertainty in the result of a 

measurement generally consists of several 

components which may be grouped 

into two categories according to the 

way in which their numerical value is 

estimated: 

A. those which are evaluated by 

statistical methods 

B. those which are evaluated by 

other means 

There is not always a simple correspondence 

between the classification 

into categories A or B and the previously 

used classification into "random" and 

"systematic" uncertainties. The term 

"systematic uncertainty" can be misleading 

and should be avoided. 

Any detailed report of the uncertainty 

should consist of a complete list 

of the components, specifying for each 

the method used to obtain its numerical 

value. 

2. The components in category A are 

characterized by the estimated variances 

s2i (or the estimated "standard 

deviations" si ) and the number of degrees 

of freedom vi. Where appropriate, 

the covariances should be given. 

3. The components in category B 

should be characterized by quantities 

u2j, which may be considered as 

approximations to the corresponding 

variances, the existence of which is 

assumed. The quantities u2j may be 

treated like variances and the quantities 

uj like standard deviations. Where 

appropriate, the covariances should be 

treated in a similar way. 

4. The combined uncertainty should 

be characterized by the numerical 

value obtained by applying the usual 

method for the combination of variances. 

The combined uncertainty and 

its components should be expressed in 

the form of "standard deviations." 

5. If, for particular applications, it 

is necessary to multiply the combined 

uncertainty by a factor to obtain an 

overall uncertainty, the multiplying 

factor used must always be stated. 

References for 

Measurement Uncertainty 

ISO/IEC Guide 98-3 - Uncertainty of 

Measurement - Part 3: Guide to the 

Expression of Uncertainty in Measurement 

(GUM: 1995). 

IEC CISPR 16-4-2: Specification 

for Radio Disturbance and Immunity 

Measuring Apparatus and Methods - 

Part 4-2: Uncertainties, Statistics and 

Limit Modeling - Uncertainty in EMC 

Measurements -First Edition - 2003-11. 

Source of Uncertainty 

Value dB 

+/- 

Probability 

Distribution 

Divisor 

U(y) 

dB 

(U(y))2 

dB 

LISN Impedance 2.70 Triangular 2.449 1.10 1.215 

Receiver Pulse Amplitude 1.50 Rectangular 1.732 0.87 0.750 

Receiver Pulse Repetition 1.50 Rectangular 1.732 0.87 0.750 

Mismatch -0.89 U-Shaped 1.414 -0.63 0.397 

Receiver Sine Wave 1.00 Rectangular 1.732 0.58 0.333 

Attenuation LISN-Receiver 0.40 Normal 2 2.000 0.20 0.040 

LISN Voltage Division Factor 0.20 Normal 2 2.000 0.10 0.010 

Receiver Reading 0.05 Rectangular 1.732 0.03 0.001 

Combined Standard Uncertainty √3.496 = 1.87 

Expanded Uncertainty Normal k = 2 3.74 

Table 1. 150 kHz to 30 MHz with a 50 ohm/50 microhenry Line Impedance Stabilization Network (LISN). 




United Kingdom Accreditation 

Service - LAB34 - The Expression of 

Uncertainty in EMC Testing - Edition 

1 - August 2002. 

Two Examples of Measurement 

Uncertainty – Conducted 

Emissions and Radiated 

Emissions 

The following paragraphs go into detail 

on the MU for instrumentation 

for conducted and radiated emissions. 

The presentation of the table is different 

from what is seen in the usual MU 

references; namely CISPR 16-4-2 and 

LAB34. 

First of all, we have listed our 

Sources of Uncertainty in the two 

accompanying tables in order of the 

largest contributor to the smallest 

contributor. This allows us to see which 

Source is contributing the most to the 

Measurement Uncertainty. 

Secondly, we are going to assume 

the sensitivity coefficient is one for 

all our contributing factors thus 

eliminating one column in our table of 

standard uncertainties (the sensitivity 

coefficient is effectively a conversion 

factor from one unit to another). This is 

logical in the EMC Engineering world 

since almost every contributing factor 

is quoted in "dBs." 

Our table then becomes easier 

to understand with the Value of the 

Sources of Uncertainty (second column) 

being divided by its accompanying 

Probability Distribution Function 

Divisor (fourth column) to arrive at 

the standard uncertainty for that 

uncertainty component [U(y)] in the 

fifth column. The sixth column is arrived 

at by simply squaring the "result 

in the fifth column." Summing all the 

factors in the sixth column and taking 

the square root of the total, we arrive at 

the Combined Standard Uncertainty. 

The Expanded Uncertainty is achieved 

by multiplying the Combined Standard 

Uncertainty by two for a coverage of 

95%. The Expanded Uncertainty is the 

engineer’s “padding factor” to make 

sure he has the answer covered in the 

range of values quoted. 

By using the Expanded Uncertainty, 

we arrive at a 95% probability that the 

true answer lies within a band of values 

bracketed by the measured value plus 

or minus the Expanded Uncertainty. 

Conducted Emissions 

The above table assumes typical values 

from LAB34 and CISPR 16-4-2 and is 

ordered from the largest contributor 

to the smallest contributor. In order 

to reduce the Combined Standard Uncertainty, 

the lab should start with the 

largest contributors and try to reduce 

their values. 

In the case of the conducted emissions, 

the largest contributor is the 

LISN Impedance. 

A check of the calibration certificate 

of one of the well-known calibration 

labs in the country indicates a maximum 

measurement uncertainty of plus 

or minus 1.2 ohms for a LISN Calibration. 

This maximum uncertainty was 

arrived at by the calibration lab by a 

Type A evaluation using at least 10 

data sets. The 1.2 ohms translates into a 

value in dBs equivalent to +/- 1.6 dB. If 

we substitute this 1.6 dB value into the 

table for the present 2.7 dB, we lower 

our combined standard uncertainty 

to 1.71 dB which lowers our Expanded 

Uncertainty to 3.42 dB or a reduction 

of 0.32 dB. One of the reasons that the 

LISN factor reduction does not make a 

big difference is that it is divided by the 

square root of 6 (2.449) for a triangular 

distribution. 

We would next have to look at the 

biggest contributors to the Measurement 

Uncertainty after the LISN Impedance. 

They would be the Receiver 

Pulse Amplitude and the Receiver 

Pulse Repetition. One way to reduce 

these two contributions from the Re- 

Source of Uncertainty 

Value dB 

Probability 

Distribution 

Divisor 

U(y) 

dB 

(U(y))2 

dB 

Site Imperfections 4.00 Triangular 2.449 1.63 2.667 

Mismatch -1.25 U-shaped 1.414 -0.88 0.781 

Receiver Pulse Amplitude 1.50 Rectangular 1.732 0.87 0.750 

Receiver Pulse Repetition 1.50 Rectangular 1.732 0.87 0.750 

Receiver Sine Wave 1.00 Normal 2 2.000 0.50 0.250 

Antenna Factor Calibration 1.00 Normal 2 2.000 0.50 0.250 

Miscellaneous Factors Various Various 0.84 0.701 

Measurement Distance Variation 0.60 Rectangular 1.732 0.35 0.120 

Combined Standard Uncertainty √6.269 = 2.50 

Expanded Uncertainty 5.00 

Table 2. 30 MHz to 300 MHz with a biconical antenna in the vertical polarization – 3 & 10 meters. 


H o o l ih a n 


ceiver is to have it calibrated a number 

of times (it could be over a period of 

years). Then, you can divide the "mean 

value of n measurements" by the square 

root of "n" to arrive at the standard 

deviation of the mean. If we could 

lower the two receiver 1.5 dB values 

to 1.0 dB,(in tandem with lowering the 

LISN contribution), we would arrive 

at a combined standard uncertainty of 

1.45 dB or an Expanded Uncertainty 

of 2.90 dB. 

All the other sources of uncertainty 

in the conducted emission table are 

1.0 dB or less, and, it will be difficult 

to lower those to make a significant 

change in the total MU for conducted 

emissions. 

So, we can conclude that it would 

be very difficult to get the Expanded 

Uncertainty of conducted emissions 

below 3 dB. 

Radiated Emissions 

30 MHz to 300 MHz with a biconical 

antenna in the vertical polarization – 3 

& 10 meters 

Again, the above table assumes 

typical values from LAB34 and CISPR 

16-4-2 and is ordered from the largest 

contributor to the smallest contributor. 

In order to reduce the measurement 

uncertainty for radiated emissions, an 

EMC lab should start with the largest 

contributors and try to reduce their 

values. 

The table also assumes a horizontally-polarized 

biconical antenna having 

a uniform pattern in the vertical plane 

so that the antenna factor height deviation 

and the antenna factor directivity 

difference contributions are zero. 

(Note - a Complex antenna would have 

non-zero components for both of those 

factors). 

The Site Imperfections is the largest 

contributor to the Radiated Emission 

Measurement Uncertainty. In order 

to reduce that, labs can use antennas 

with smaller antenna factors, receivers 

with smaller measurement uncertainties, 

and semi-anechoic chambers with 

improved anechoic material. It would 

then be reasonable for the lab to lower 

that contribution to plus or minus 3 

dB. Substituting that value into the 

equation, gives us a Combined Standard 

Uncertainty of 2.26 dB and an 

Expanded Uncertainty of 4.52 dB or a 

reduction of 0.48 dB from the original 

5.00 dB. Again, one of the reasons for 

the relatively small reduction in the expanded 

uncertainty is the large divisor 

value for site uncertainty, that is, the 

square root of 6 (2.449) for a triangular 

probability distribution. 

The Mismatch factor can be reduced 

by increasing the attenuation 

of the well-matched two port network 

preceding the receiver, however, the 

penalty of that maneuver is a reduction 

in measurement sensitivity. Let's assume 

we can add some attenuation to 

the front-end of the receiver and lower 

the Mismatch contribution to -0.65. 

Substituting this value in combination 

with the Site Imperfection reduction, 

allows us to lower the Expanded Uncertainty 

to 4.3 dB or a total reduction 

from the original 5.00 dB of 0.7 dB. 

If we then look at the next two 

biggest contributions, we have, again, 

the Receiver Pulse Amplitude and 

the Receiver Pulse Repetition. If we 

again, using the same technique as for 

conducted emissions, lower the two 

receiver 1.5 dB values to 1.0 dB,(in 

tandem with lowering the Site Imperfections 

and the Mismatch contributions), 

we would arrive at a combined 

standard uncertainty of 1.83 dB or an 

Expanded Uncertainty of 3.66 dB. This 

would be a reduction of 1.34 dB from 

the original value. 

The Remaining Factors are all 1.0 dB 

or less and they would be difficult to 

lower in sufficient amplitude to make a 

significant difference to the Expanded 

Measurement Uncertainty for radiated 

emissions. 

Thus, we conclude that the minimum 

value for Expanded Uncertainty 

for radiated emissions, with presentday 

equipment, is around 3.5 dB. 

suMMary 

Measurement Uncertainty of the instrumentation 

used for emission testing 

in an EMC Lab is an important part 

of the lab’s overall technical capability. 

We know that Measurement Uncertainty 

is a relatively new concept and 

has only been around the EMC Labs of 

the world for about 20 years. 

We see from the above two specific 

examples that it is difficult to lower 

the Expanded Uncertainty values of a 

typical EMC Lab for both conducted 

emissions and radiated emissions. 

We saw that reducing the two largest 

values in the table of standard 

uncertainties for conducted emissions 

only lowered the Expanded Uncertainty 

by about 0.74 dB so that the 

Expanded Uncertainty for conducted 

emissions was approximately 3.0 dB. 

We also observed that lowering 

the top four contributors to the Combined 

Standard Uncertainty value for 

radiated emissions, only lowered the 

Expanded Uncertainty value from 5 dB 

to around 3.5 dB. 

We concluded that even when a lab 

is logically concentrating on lowering 

its Equipment Measurement Uncertainty 

by reducing the largest contributors 

to the Combined Standard 

Uncertainty for emission testing, it 

is difficult to significantly lower the 

overall Expanded Uncertainty of the 

instrumentation of the EMC lab for 

conducted and radiated emissions. 

Daniel Hoolihan is a past president of the 

IEEE EMC Society. He has been a member of 

the Board of Directors since 1987 and has held 

numerous leadership positions in the society. 

Hoolihan is also active on the ANSI Accredited 

Standards Committee on EMC, C63 as Vice 

Chairman. He was co-founder of Amador 

Corporation (1984-1995). He can be reached at 

DanHoolihanEMC@aol.com. n 

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O n t h e R a di at i o n Pat t e rns of C o mmon EMC A n t e nn a s 

On the Radiation Patterns of Common 

EMC Antennas 

Vicente Rodriguez 

ETS-Lindgren L.P. 

Cedar Park, Texas USA 

Antennas have been used in EMC 

measurements since the early days. 

Knowledge of the antenna pattern 

was not a requirement of the standards. 

While MIL STD 461 and some SAE standards 

called for information on the half 

power beamwidth, most standards did not 

require any knowledge of the antenna radiation 

characteristics. With the evolution of 

standards to cover frequencies above 1 GHz 

knowledge of the pattern has become more 

important. Since above 1 GHz most antennas 

are very directive and very un-dipole-like, 

information on the pattern has become very 

important, especially when it comes to understanding 

how much area the main beam 

is covering. The present paper starts by giving 

the reader a refresher on antenna pattern 

parameters and then shows typical patterns 

for the most common antennas used in EMC. 

The antennas covered are biconicals, log 

periodic dipole arrays, hybrid antennas and 

dual ridge horns. Measured data is presented 

except for patterns above 18 GHz. 

All photos used with permission of ETS-Lindgren 

Figure 1. A modified shaped dipole (biconical) radiating; example of a resonant antenna. 

intRoduction 

An antenna is a device that radiates and 

receives radio waves. There are different 

methods or mechanisms by which antennas 

radiate. We all are familiar with resonator 

antennas. Dipoles are a clear example of 

this type on antennas. In resonant antennas 

there is a movement of charges as the energy 

changes between the electric field and 

the magnetic field. This movement of the 

charges on the antenna causes the field lines 

to vibrate, generating waves that propagate 

in free space away from the resonant antenna. 

Figure 1 shows this type of behavior. 

Another mechanism by which antennas 

radiate is by having an impedance transition 

that causes the energy being propagated 

in a transmission line to be launched into 

free space. Horn antennas are an example 

of a travelling wave antenna. Their method 

for radiation is based on a wave impedance 

transition from the transmission waveguide 

or line to the impedance of free space. Figure 

2 shows this mechanism of radiation on 

a horn antenna. 

RAdiAtion PAtteRNS 

An antenna radiation pattern or antenna 

pattern is a mathematical function or a 

graphical representation of the radiation 

properties of the antenna as a function of 

space coordinates [1]. That is, as we rotate 

the antenna around on two orthogonal axes 

we measure the intensity of the radiated 

field. Figure 3 shows one of these plots of 

magnitude of radiation versus direction. 

E and H plane 

While today it is really easy to create pat- 




Figure 2. A pyramidal horn radiating; a sample of an impedance transition between the 

transmission line and free space. 

Figure 3. A horn antenna and its radiation pattern at a given frequency. 

human brain likes to classify things to 

make it easier to study them. Radiation 

patterns are no different. One of the 

first divisions that we can do is to break 

patterns into two principal groups: 

Directional and Omnidirectional patterns. 

Omnidirectional comes from 

the Latin word omni meaning “every” 

or “all” and “direction”. These, it appears, 

are patterns that radiate in all 

directions. That is not exactly it. Omnidirectional 

antennas, which radiate 

omnidirectional patterns, radiate in all 

directions on a given principal plane 

(the E or the H plane. Figure 4 shows 

the most simple of all omnidirectional 

antennas, the dipole. The dipole radiates 

in all directions on the H plane, 

but it has two nulls (areas of little or no 

radiation) on the E plane. 

Omnidirectional should not be 

confused with isotropic. Isotropic 

(from the Greek, isos meaning “the 

same” or “equal” and tropos meaning 

“direction”) implies that the radiator 

puts exactly the same radiation in all 

directions around it. There is no such 

thing as an isotropic antenna. A combination 

of three dipole-like antennas 

may have certain isotropicity, but it 

will never be a perfect isotropic source. 

Isotropic sources are a mathematical 

tool that is used in describing the gain 

of antennas. Directional antennas are 

clearly antennas where the radiation is 

mainly on one direction as we rotate 

around the antenna. 

Figure 4. Omnidirectional antenna. 

terns such as the one in Figure 3 and 

to manipulate them on the computer, 

this was not the case in the earlier days 

of antenna engineering. Hence, to facilitate 

the graphical representation of 

radiation patterns, engineers usually 

plotted two single orthogonal planes of 

the pattern. Rather than arbitrarily plot 

a plane for a given angle of the spherical 

coordinate system (for example 

φ=90 o ), engineers chose the plane on 

which the Electric field was oscillating. 

This plane was called the E plane. The 

orthogonal plane to this one was named 

the H-plane. Even today patterns are 

commonly shown in E and H planes in 

the literature. 

Omnidirectional and Directional 

Like many other things in nature, the 

Main lobe, side lobes, back lobe 

We now continue our human approach 

to classify things to make them easier 

to study. If we look at a radiation pattern 

we observe a series of features. 

There is going to be an area of the 

pattern where most of the radiation 

is directed. That is the main lobe. To 

the sides of the main lobe we may find 

areas where the radiation is higher 

than the adjacent areas. These are side 

lobes. The side lobes are usually separated 

by areas of little radiation called 

nulls. There is usually a side lobe in the 

direction opposite the main lobe. This 

special side lobe is known as the back 

lobe. Figure 5 shows a pattern and the 

features described above. 


R o drigue z 


Figure 5. A pattern showing typical features. 

Half power beam width 

It should be clear that the most important 

lobe is the main lobe. After all, the 

main lobe contains most of the radiated 

energy. This does not mean that 

the other lobes are irrelevant. The back 

lobe should be small. We do not want 

to send too much radiation towards 

the back. This is especially important 

during immunity at frequencies above 

1 GHz, when usually the amplifiers are 

placed inside the chamber close to the 

Figure 6. HPBW identified in red for a given pattern. 

antenna to reduce cable losses. Side 

lobes are also important; high side 

lobes illuminating the sides of a chamber 

will affect the field uniformity if 

the absorber treatment is not adequate. 

Outside of EMC these parameters of 

the patterns are even more important. 

But clearly, as mentioned above, the 

main lobe is the most important as it 

is the one that should encompass the 

EUT. The parameter that describes 

the main lobe size is the half power 

beamwidth. Since 1/2 is 0.5 and 10Log 10 

(0.5) ≈-3dB, the half power beamwidth 


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Figure 7. Model of a log periodic in front of a metal 

top bench (the ground is metallic). 

Figure 8. Results for the model in Figure 7. Notice that the radiation 

is deflected by the presence of the metallic top bench. 

(HPBW) is also known as the 3dB beam 

width. The HPBW is given in degrees 

and it describes the arc of the angle 

between the two points to the side of 

the point of highest radiation that are 

3dB lower in radiated power. Figure 

6 shows the half power beamwidth 

for the pattern shown in Figure 5. For 

clarity, the pattern is represented in 

Cartesian coordinates rather than polar 

coordinates. It is important to note 

that the HPBW is from -3dB point to 

-3dB point not from -3dB point to peak. 

Manufacturers should supply the 

HPBW information to users of their 

antennas. The HPBW will be given 

for the E and H plane. For a linearly 

polarized antenna, the E plane will be 

vertical when the antenna is on vertical 

polarization. When the antenna is 

rotated to horizontal polarization, the 

E plane will be horizontal. Similarly the 

H plane will be horizontal when the antenna 

is set for vertical polarization and 

the H plane will be vertical when the 

antenna is on horizontal polarization. 

Another important issue is that the 

HPBW, like any other pattern parameter, 

is a free space, far field parameters. 

The beamwidth will give you an 

idea of the area covered, but in some 

cases structures in the test area such as 

grounded benches and ground planes 

will affect the radiation pattern and the 

beamwidth. Figures 7 and 8 show a log 

periodic antenna placed on horizontal 

polarization radiation 1 meter away 

from a bench. This is a common set up 

in CISPR 25 and other standards [2-4]. 

So the user must be careful when using 

the HPBW extracted from the pattern 

to estimate the area of coverage of 

the main beam. In some cases, such as 

the new set up from above 1GHz test- 

ing [5], it will provide a good estimate. 

In other cases, such as in the presence 

of benches and other features, it will be 

better to use field probes to estimate 

the coverage of the main beam. 

PAtteRN MEASUREMentS 

As mentioned above, in most cases 

the measured pattern and HPBW is 

good enough to give the user of the 

antenna an idea of the coverage. Since 

the HPBW gives you an arc or coverage 

given the test distance and some 

trigonometry it is possible to estimate 

an area of coverage for a given antenna. 

In the next sections we show 

typical patterns for the most common 

antennas used in EMC. Rectangular 

Anechoic chamber and Tapered Anechoic 

chambers were used to measure 

the radiation pattern of typical EMC 

antennas from 400 MHz to 18 GHz. 

Figure 10. The outdoor set up. A ferrite tile 

patch is place on the ground plane between the 

antennas to reduce the effects of the OATS on 

the measurement. 

Figure 9. The test set up in the rectangular 

anechoic chamber. 




Figure 11. E plane patterns. Notice that the low dynamic range at 

30 MHz causes a poor definition of the null. 

Figure 14. H plane pattern from 80 MHz to 800 MHz for an LPDA antenna. 

Figure 12. H plane patterns for a biconical antenna. 

Figure 15. E plane pattern from 1 to 2 GHz for an LPDA antenna. 

Figure 13. E plane pattern from 80 MHz to 800 MHz for an LPDA antenna. 

Figure 16. H plane pattern 1 to 2 GHz for an LPDA antenna. 


R o drigue z 


Below that, the antennas were set on the OATS and the 

patterns on the two principal planes were measured. Figure 

9 shows a hybrid antenna covering from 30 MHz to 6 GHz 

being measured inside a rectangular anechoic chamber. The 

rectangular anechoic chamber provides better results for 

the 2 to 6 GHz range when compared to the taper anechoic 

chamber, which covers from 400 MHz to 2 GHz optimally. 

Figure 10 shows the outdoor set up. A biconical antenna is 

being measured in this case. A hybrid antenna is used as 

the source antenna while the antenna under test (AUT) is 

rotated in its presence. 

BiconicALS 

To start we look at the biconical antenna. These antennas 

are the workhorse of EMC from 30 MHz to 200 MHz. In 

general models are available covering from down on the 20 

MHz range to up in the 300 MHz range. Biconical antennas 

are an example of omnidirectional antennas. Its pattern is 

omnidirectional on the H plane and has two nulls on the E 

plane. Figures 11 and 12 show the typical measured pattern 

for a biconical antenna commonly used in EMC. 

From these patterns we can extract the HPBW. For the H 

plane it is clear that the HPBW is larger than 180 degrees; 

there is no main beam. For the E plane the beamwidth ranges 

between 45 and 90 degrees. 

LPDAS 

The other workhorse for the EMC engineer is the Log Periodic 

Dipole Array (LPDA) antenna. These are directional 

antennas and have a very well defined main beam as well as 

all the other features commonly seen in directional patterns. 

In this particular case we measured an LPDA model covering 

from 80 MHz to 2 GHz. The most common models are 

those covering from 200 MHz to 2 GHz. Their patterns are 

very similar as long as their geometry has the same design 

parameters [1]. Figures 13 and 14 show the pattern for the 

log periodic antenna for frequencies below 1GHz. Notice 

that the E plane pattern has a null in the 90 and 270 degrees 

direction. This is similar to dipoles, which are the elements 

that make the array on a LPDA. Figures 15 and 16 show the 

patterns at different frequencies above 1GHz. 

The HPBW of LPDA antennas is usually fairly flat. This 

is especially the case for the center of the frequency band 

that the antenna covers. From about 200 to 1500 MHz the 

antennas being measured exhibit an HPBW averaging 50 

degrees for both planes. 

HYBRid AntennAS 

Although hybrid antennas are not particularly liked by 

CISPR 16 [5] because of their length, other standards do not 

have a problem. Additionally, because of their wide coverage 

they are ideal for preliminary scans of the EUT prior to the 

final compliance measurement. These antennas are a hybrid 

of the two types shown before. The biconical elements have 

been transformed into bowties to better match the geometry 

of the LPDA section. Their patterns clearly show this. At low 

frequency they behave like biconical antennas and at high 

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Figure 17. E plane pattern from 30 to 900 MHz for a hybrid antenna. 

Figure 20. H plane pattern from 2 to 6 GHz for a hybrid antenna. 

frequencies the log periodic behavior is evident. Figures 17 

to 20 show the patterns at the principal planes for lower and 

upper frequencies of the range. It is important to notice the 

biconical behavior at the lower frequencies of the range. 

As with the biconical antennas the hybrids have HPBW 

larger than 180 degrees at the frequencies below 100 MHz. 

Once the log periodic section is active, the HPBW is fairly 

flat unless there are changes to the LPDA design parameters. 

Figure 18. H plane pattern from 30 to 900 MHz for a hybrid antenna. 

duAL Ridge HORNS 

Dual Ridge Horn Antennas (DRHA) are the antenna of 

choice for MIL STD [2]. This family of antennas have been 

the best described family in the literature. This is especially 

true regarding their radiation patterns. Starting with [6] 

there was a big issue with the upper frequency behavior of 

the patterns of Dual Ridge Horn Antennas. In [7-10] several 

improvements were done to the radiation patterns of these 

antennas to avoid nulls in the middle on the main beam. 

HPBW information for the three most common models of 

dual ridge horn antennas are shown in Figures 21 to 23. 

These are the models where the pattern performance has 

been improved as described in the references [8-10]. 

concLUSion 

The reader has been introduced to antenna pattern nomenclature. 

The different concepts and parameters that describe 

patterns have been defined and illustrated. Finally pattern 

and HPBW information has been given for the most common 

EMC antennas used. 

Figure 19. E plane pattern from 2 to 6 GHz for a hybrid antenna. 

ACKnoWLedgeMentS 

The author would like to thank the antenna calibration lab at 

ETS-Lindgren in Cedar Park, Texas for their help in setting 

up the OATS for measuring the patterns below 400 MHz. 

The author also would like to thank the staff of the CTIA 

authorized test laboratory (CATL) at ETS-Lindgren for their 

help in measuring the patterns in two of their four anechoic 


R o drigue z 


Figure 21. HPBW for both principal planes for an improved designed of 

the 200 MHz to 2 GHz DRHA. 

Figure 22. HPBW for both principal planes for the improved design of the 

1 to 18 GHz DRHA. 

Figure 23. HPBW for both principal planes for an improved design of the 

18 to 40 GHz DRHA. 

chambers. Finally, the author thanks the marketing department 

at ETS-Lindgren for the pictures taken of the different 

set-ups needed for the measurement of the patterns. 

REFERenceS 

• [1] C. Balanis, Antenna Theory: Analysis and Design, 2nd ed., John 

Wiley and Sons: New York, 1997. 

• [2] “Mil STD 461F Department of Defense Interface Standard: Requirements 

for the Control of Electromagnetic Interference Characteristics 

of Subsystems and Equipment,” U.S. Department of Defense, 

December 2007. 

• [3] CISPR 25, “Radio Disturbance Characteristics for the Protection of 

Receivers used on Board Vehicles, Boats, and on Devices- Limits and 

Methods of Measurement,” 2nd ed., IEC Geneva, Switzerland 2002. 

• [4] “SAE Surface Vehicle Electromagnetic Compatibility (EMC) Standards 

Manual,” Society of Automotive Engineers, Warrendale, PA 1999. 

• [5] CISPR 16-1-4, “Specification for Radio Disturbance and Immunity 

Measurement Apparatus and Methods Part 1-4 Radio Disturbance 

and Immunity Measuring Apparatus – Antennas and Test Sites for 

Radiated Disturbance Measurements,” 3rd ed., IEC Geneva, Switzerland 

2010. 

• [6] C. Bruns, P. Leuchtmann, and R. Vahldieck, “Analysis of a 1-18 

GHz Broadband Double-Ridge Antenna,” IEEE Transactions of Electromagnetic 

Compatibility, Vol. 45 No. 1 February 2003: 55-60. Print. 

• [7] V. Rodriguez, “New Broadband EMC Double-Ridge Guide Horn 

Antenna,” RF Design, May 2004: 44-50. Print. 

• [8] V. Rodriguez, “A New Broadband Double Ridge Guide Horn with 

Improved Radiation Pattern for Electromagnetic Compatibility 

Testing,” 16th International Zurich Symposium on Electromagnetic 

compatibility, Zurich, Switzerland, February 2005. 

• [9] V. Rodriguez, “Improvements to Broadband Dual Ridge Waveguide 

Horn Antennas,” 2009 IEEE International Symposium on Antennas 

and Propagation and USNC/URSI National Radio Science Meeting, 

Charleston, SC, June 2009. 

• [10] V. Rodriguez, “Recent Improvements to Dual Ridge Horn Antennas: 

The 200 MHz to 2 GHz and 18 GHz to 40 GHz Models,” 2009 IEEE 

International Symposium on EMC, Austin, TX, Aug. 2009. 

Vicente Rodriguez attended Ole Miss, in Oxford Miss., where he obtained 

his B.S.E.E. M.S. and Ph.D. degrees in 1994, 96 and 99 respectively. 

In June 2000, after a short period as visiting professor at the department 

of Electrical Engineering and Computer Science at Texas A&M University- 

Kingsville, Dr. Rodriguez joined EMC Test Systems (now ETS-Lindgren) as 

an RF and Electromagnetics engineer. In September 2004, Dr. Rodriguez 

took over the position of Senior Principal Antenna Design Engineer, placing 

him in charge of the development of new antennas for different applications 

and on improving the existing antenna line. In 2006, Dr. Rodriguez became 

Acting Antenna Product Manager placing him in charge of the development, 

marketing and maintenance of the antenna product line. During the fall of 

2010, Dr. Rodriguez became the official Antenna Product Manager. 

During his time at ETS-Lindgren, he has been involved in the RF anechoic 

design of several chambers, including rectangular and taper antenna 

pattern measurement chambers, some of which operate from 100 MHz to 

40 GHz. He was also the principal RF engineer for the anechoic chamber 

at the Brazilian Institute for Space Research (INPE), the largest chamber 

in Latin America and the only fully automotive EMC and Satellite testing 

chamber. Among the antennas developed by Dr. Rodriguez are new 

broadband double and quad-ridged guide horns with single lobe pattern 

and high field generator horns for the automotive and defense industry, as 

well as omnidirectional antennas for field surveying. He can be reached at 

Vince.Rodriguez@ets-lindgren.com n 



Hi g h P o w e r El e c t r o m a g n e t i c Thr e at s t o t h e Smart Grid 

High Power Electromagnetic (HPEM) 

Threats to the Smart Grid 

Figure 1. Basic elements of a power grid [2]. 

William A. Radasky 

Metatech Corporation 

Goleta, California USA 

This paper is focused on the threats 

and impacts of High Power Electromagnetic 

(HPEM) environments on 

the U.S. Power Grid and further introduces 

the implications of making the power grid 

“smarter” through the introduction of 

additional electronics. These Smart Grid 

electronics may introduce additional vulnerabilities 

if the grid is exposed to the 

high power EM threats of High-altitude 

Electromagnetic Pulse (HEMP) from a 

nuclear detonation in space over the U.S.; 

Intentional Electromagnetic Interference 

(IEMI) from terrorists or criminals who 

wish to attack and create regional blackouts 

using electromagnetic weapons; and, 

finally, from an extreme geomagnetic storm 

(initiated by solar activity) that could create 

damage to the high-voltage electric grid. 

This author has previously referred to these 

three electromagnetic environments as a 

“triple threat” [1]. 

This paper will briefly introduce the 

basic electricity delivery system as it exists 

today with an explanation of the trends that 

are underway to make the grid “smarter”. 

Some discussion of the impacts of electromagnetic 

interference on the existing grid 

will be mentioned, including the fact that 

standards have been developed to protect 

existing power grid electronics from these 

“standard” electromagnetic threats. Next, 

the relationship of these HPEM threats 

to the existing EM environments will be 

explained, including work initiated by the 

EMP Commission where tests were performed 

to determine vulnerability levels of 

the existing grid. 

The next portion of this paper discusses 

an approach to be taken to protect both the 

current power grid and the future Smart 

Grid from these HPEM threats. This paper 

will then conclude with a summary of the 

activities of various national and international 

organizations working to develop 

HPEM procedures and standards to protect 

power grids and other critical infrastructures 

throughout the world. 

What is the Smart Grid? 

The electric power grid consists of basic 

elements of generation, transmission, 

distribution and users. Currently, power 

generators are dispatched based on the 

projected power needs for each day, and in 

some states auctions are held to achieve the 

best price and reliability outcome for the 


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Figure 2. Comparison of IEMI wideband and narrowband threats with the early-time HEMP and 

lightning electromagnetic fields [4]. 

consumer. Each large power company 

has a control center that works to keep 

the power generated and used in balance, 

through diverse communications 

networks. In addition, they use communications 

networks to keep track 

of the health of the control electronics 

within substations to react in case of 

faults or equipment failures. Figure 1 

illustrates a basic power grid example 

with three types of power-generating 

plants illustrated and three types of 

users (residential, commercial and 

industrial). It should be noted that the 

terminology of transmission, subtransmission 

and distribution in the figure 

may vary with respect to particular 

voltage levels in different parts of the 

U.S. and the world. In addition, the IEC 

[3] defines a.c. high-voltage as above 

100 kV, low voltage as below 1 kV, and 

medium voltage as in between these 

two levels. Additionally, the term EHV 

(extra high voltage) is usually defined 

above 345 kV, and a new term of UHV 

(ultra high voltage) is defined above 800 

kV, both for a.c. power flow. 

With regard to the trends for Smart 

Grid, there are several aspects to 

consider. Due to the emphasis put on 

renewable sources of energy, there 

are large numbers of wind turbines 

and solar farms being built by power 

companies. As these forms of generation 

become a larger portion of the 

power generation availability, sensors 

to track the actual flow of power over 

short periods of time become more 

important (as is the reliability of the 

communications networks to provide 

this information to the control centers). 

In addition, forecasting of wind 

velocity over hours and even minutes 

may become important in the future. 

If the wind generation drops suddenly, 

the control center needs to have this 

information in order to bring up alternate 

power generators (or drop load) to 

avoid a power blackout. 

Another area of Smart Grid activity 

is to upgrade the electronics in high 

voltage and medium voltage substations 

and to develop new rapid communications 

methods to relay status 

information and to take actions when 

necessary. Another area of power 

company activity is to increase the 

monitoring in the distribution network 

to determine the location of local outages 

if they occur and to command 

the opening of sectionalizing switches 

if needed. 

A final area of Smart Grid activity 

involves the actual consumer of electricity 

through the rollout of Smart 

Meters. These electronic meters can 

communicate back to the control center 

through a new communications 

network providing information regarding 

the use of electricity. In addition, 

consumers may be given alerts regarding 

the use of power and changes in 

the price of electricity during different 

times of the day. There is even a concept 

to build in control chips for consumer 

appliances that would allow particular 

items to be turned off remotely by the 

power company (presumably with the 

permission of the consumer, with a 

possible benefit of lower power rates). 

There is work ongoing now in the 

Smart Grid community to develop 

the communications protocols for this 

aspect of appliance control. It should 

be noted that this “demand response” 

aspect of Smart Grid is viewed as a 

way to avoid building too many power 

plants by reducing the margin between 

the peak power required and the peak 

power available. 

In reviewing the paragraphs above, 

it is clear that the main aspect of Smart 

Grid is to introduce new electronics 

in large numbers with new ways to 

communicate to them. It is of some 

concern that with a small operational 

margin, if the ability to communicate is 

disturbed or if Smart Grid equipment 

is damaged, then the smaller margin 

that we have today would likely result 

in a lower reliability of operation of the 

power grid. As described below it will 

be clear that severe (yet infrequent) 

electromagnetic threats have the capability 

to both damage and disrupt the 

current and future power grids. 

HPEM Threats 

IEMI background 

To refresh the reader regarding the 

terminology employed here, the term 

Intentional Electromagnetic Interference 

(IEMI) refers to the deliberate 

attempt to produce electromagnetic radiated 

and/or conducted disturbances 

to interfere with the operation of commercial 

equipment or to create damage 

to that equipment [4-6]. This could be 

done for criminal or terrorist purposes, 

although the purpose of the technical 

work is to determine the feasibility of 

such attacks and to determine ways 

to detect an attack and/or to protect 

against the types of disturbances that 

might be generated. As shown in Figure 

2, the IEMI environments are split into 

two categories known as wideband and 


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forward in the IEEE EMC Society, IEC 

SC 77C, Cigré and ITU-T and will be 

discussed later in this paper. 

Figure 3. Level of B-dot disturbance (measured) from the severe geomagnetic storm that 

created the blackout in the Quebec power system a few minutes earlier [8]. 

(Source: Metatech Corporation Applied Power Solutions) 

narrowband, with both normally produced 

at frequencies above 100 MHz. 

In the time domain, the peak electric 

HEMP background 

The terminology of the electromagnetic 

pulse has evolved over the years, 

but today the generic term for all types 

of nuclear generated electromagnetic 

transients is EMP. Sometimes one 

will see the term NEMP, which clearly 

identifies the particular pulse of interest 

as being generated by a nuclear 

detonation. Of interest here is the EMP 

created by a high-altitude burst, generally 

defined as one occurring at a burst 

height greater than 30 km. For this 

altitude regime, the radiation produced 

by the nuclear burst does not reach the 

Earth’s surface, but several types of 

intense electromagnetic signals will. 

Because the burst is at high altitudes 

(in space), this type of EMP is usually 

referred to as HEMP. The HEMP has 

three time (and frequency) portions 

with the early-time (E1) HEMP reachfields 

exposing equipment are typically 

higher than 10 kV/m. Standardization 

work dealing with IEMI is moving 

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[1,7]. Based on research performed over 

the years, it has been concluded that 

the E1 and E3 HEMP are the biggest 

concerns to the power system due to 

their high peak field levels and efficiency 

in coupling to power and control 

lines. They both have an area coverage 

that can exceed several thousand kilometers 

from a single burst. 

The concern is that these high-level 

electromagnetic fields and their area 

coverage will create simultaneous 

problems for computers and other electronic 

systems on the Earth’s surface, 

including the critical infrastructures 

(power, telecommunications, transportation, 

finance, water, food, etc.). This 

was the focus of the U.S. Congressional 

EMP Commission studies [8, 9]. 

Figure 4. Indication of the area exposed to E1 HEMP from a high-altitude burst over the central 

United States for various burst altitudes given in km. 

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ing field levels of 50 kV/m within 10 

ns, the intermediate-time (E2) HEMP 

reaching 100 V/m between 1 microsecond 

and 1 second, and the late-time 

(E3) HEMP reaching 40 V/km for times 

between 1 and several hundred seconds 

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Extreme geomagnetic storm 

background 

The first two high-power threats and 

environments discussed above are 

man-made. There is, however, a natural 

environment known as an extreme 

geomagnetic storm that has strong 

similarities (spatial distribution and 

time variation) to the late-time (E3) 

portion of the HEMP [10]. Because of 

this, the protection methods are also 

very similar, although the specification 

levels of protective devices may 

vary. It should be noted that the term 

extreme geomagnetic storm is used 

here to indicate that the level of the 

storm exceeds the usual description by 

NOAA of a severe geomagnetic storm, 

which may occur more than once during 

a solar cycle (11 years). The extreme 

geomagnetic storm is defined as a 1 in 

100 year storm [8]. 

In brief, a large increase in charged 

particles ejected from the Sun and into 

the solar wind can interact with the 

Earth’s magnetic field and produce a 

significant distortion of the geomagnetic 

field at the surface of the Earth. 

This rapid variation of the geomagnetic 

field (on the order of seconds to 

minutes) induces time varying electric 

fields in the Earth, which through 

the neutrals of transformers create 

time-varying (yet quasi-dc relative to 

60 Hz) currents in the high-voltage 

power network. These currents induce 

severe harmonics, increase inductive 


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load and produce heating in each 

exposed transformer. This can lead 

to voltage collapse of the network 

as experienced by the power grid in 

Quebec in March 1989 and damage to 

highly exposed transformers. Figure 

3 illustrates the contours of the B-dot 

environment at the Earth’s surface (in 

nT/min), minutes after the collapse of 

the Quebec power network. The spatial 

extent of the severe fields is quite large, 

and the footprint can move (and has 

moved) further south during other 

storms. For additional information 

about geomagnetic storms and their 

impact on power grids, one should 

consult the literature [11, 12]. 

Potential Impacts of HPEM 

with the Power Grid 

Early-time (E1) HEMP impacts 

The early-time (E1) HEMP produces a 

fast rising and narrow electric field pulse (2.5/25 ns) that 

propagates at the speed of light from the burst point. Figure 

4 illustrates that the area coverage depends on the burst 

height. Due to the rapid rise of the E1 HEMP in the time 

domain, the frequency content is much higher in magnitude 

and frequency than lightning electromagnetic fields and 

normal substation electric fields produced by switching 

events in the high voltage yard. These electromagnetic fields 

can couple to low voltage control cables in a substation and 

propagate levels on the order of 20 kV to the control house 

electronics. This presents a severe disturbance to existing 

substation solid-state protective relays. In addition, the EM 

fields are high enough also to penetrate the walls of most 

substation control houses, as the walls are not designed 

to attenuate EM fields significantly (as shown in Table 1). 

As more Smart Grid electronics are placed in substations, 

these E1 HEMP fields become a significant concern to their 

performance. Also the placement of new Smart Grid communication 

antennas and electronics in substations should 

consider the threat of E1 HEMP. It is noted that microwave 

towers with their long cables extending to the ground are 

an ideal pickup geometry for E1 HEMP fields, and unless 

good grounding practices (circumferential bonding) are 

employed at the entrance of the cables to communications 

buildings, the high-level induced E1 HEMP currents and 

voltages will propagate efficiently to the cable connections 

of the electronics, creating likely damage. 

E1 HEMP will also couple efficiently to aboveground 

medium and low voltage power lines that are typical for the 

distribution grid and also to the low voltage drop lines to 

homes or businesses. While burial of distribution lines is 

becoming more common in the U.S., there are still on the 

order of 70% of U.S. distribution lines at medium voltage 

that are above ground. The problem with this is that the E1 

HEMP can couple voltages up to 1 MV common mode with 

Shielding Measurements 

Normal Shielding, dB Room Shielding, dB 

0 All wooden building 2 

Room under wood roof 4 

5 

Wood Bldg-Room 1 4 

Concrete - no rebar 5 

Wood Bldg-Room 2 6 

10 

Concrete + rebar-room1 7 



20 


Metal bldg. 26 

30 Concrete + well-prot. room 29 

Table 1. Shielding effectiveness measurements for various power system buildings and rooms. 

a rise time of 10 ns and a pulse width of 100 ns [13]. These 

levels will create insulator flashover on many distribution 

lines (simultaneously) and can cause mechanical damage to 

some insulators [14]. For the shorter drop lines to homes, 




levels on the order of several hundred kV are possible that 

could seriously damage solid-state Smart Meters. As for 

distribution sensors and electronic controls, these would 

also be fully exposed to the E1 HEMP environment; without 

protection for the sensors, cables, electronics and communications, 

damage could be expected. 

Another concern is the protection of the control center 

for each power company that consists of computers/terminals 

and displays to keep track of the status of the power 

system under control and the supporting computer and 

communications rooms to send and receive data to and from 

substations. Currently there is some variation in the building 

construction quality used at different power companies 

(Table 1), but the best approach to avoid problems is to place 

the control center in the middle of the building on a low 

floor or in the basement. This is because soil and concrete 

provide some protection from high frequency EM fields. 

Locating the control center on the top floor with outside 

walls and windows increases the penetration of EM fields 

inside the building where they can interact directly with the 

computers and their ubiquitous Ethernet cables (which are 

extremely vulnerable to high levels of pulsed EM fields). In 

the context of Smart Grid, it is likely that more electronics 

and communications will be added to the control centers, 

increasing the likelihood of damage or upset to equipment 

that are required to operate at a higher data rate than today’s 

equipment. 

In terms of power generation, E1 HEMP is a threat to 

the low voltage controls of power plants, including those 

SCADA systems that control the flow of fuel to the generator. 

If additional communications are added to the 

generators to update the power control center periodically 

for Smart Grid, then these communication antennas, cables 

and electronics should be protected at least against damage 

(upset can be handled more easily as personnel are present). 

For the issue of distributed generation, the proliferation 

of variable generators such as wind turbines will require 

new communications for Smart Grid applications to keep 

track of the amount of power being generated on a shorter 

time basis. Both wind and solar power generators will be 

exposed to E1 HEMP fields, and additional test data are 

needed to determine whether the turbine electronics and 

power converters themselves will be able to survive the effects 

induced by E1 HEMP. 

Intentional electromagnetic interference 

(IEMI) impacts 

As indicated in Figure 2, IEMI environments tend to be 

present at somewhat higher frequencies than the E1 HEMP. 

The typical field levels are also on the order of 10s of kV/m 

(depending on the location of the attacker relative to the 

sensitive electronics), but because of the higher frequency 

content, most electronics appear to be slightly more vulnerable 

than when exposed to E1 HEMP. This is due to the fact 

that the penetration of EM fields into an equipment case is 

typically more efficient as the frequency increases. Also the 

ability to upset electronics is increased when the frequencies 

of the EM environment are similar to the operational 

frequency of a microprocessor (typically in the GHz range). 

E1 HEMP has most of its field energy below 100 MHz. 

While the IEMI threat field level is similar to E1 HEMP, 

it does not resemble a plane wave field that is propagating 

downward from space. Since the attacker for IEMI is likely 

within 100 meters, the EM field propagating away from the 

weapon tends to decrease as 1/r. This variation in field level 

with distance (unlike E1 HEMP) does not allow significant 

coupling to lines with length on the order of 100 meters or 

more. Therefore, IEMI is not a significant threat to insulators 

on medium voltage power lines. On the other hand, 

the IEMI threat to Smart Meters, distribution electronics, 

substation electronics, substation communications, control 

rooms and power generating facilities (including wind and 

solar facilities) is the same as for the E1 HEMP. Of course 

only one facility at a time is exposed by IEMI, but a team of 

criminals or terrorists could expose a significant set of assets 

in a city or town by using a weapon mounted inside a vehicle. 

Late-time (E3) HEMP impacts 

The late-time (E3) HEMP produces a disturbed geomagnetic 

field beneath the burst that induces slow rising (rise time 

on the order of 1 second) electric fields in the Earth up to 

40 V/km. The area coverage beneath the nuclear burst is on 

the order of several thousand kilometers and long trans- 


R a da s k y 


mission lines (e.g. 100 km) can couple 4000 V between the 

grounded neutrals of their transformers. With a typical line/ 

transformer/grounding resistance of 5 ohms, this results 

in a quasi-dc current flow of approximately 800 A (for this 

example). This is more than enough to create severe levels 

of transformer saturation, leading to the creation of high 

levels of even harmonics in the a.c. waveform and also heating 

and potential damage to the large transformer itself. As 

these transformers are very expensive and for voltages of 

500 kV and higher are manufactured off shore, the loss of a 

significant number of transformers could create a long-term 

power outage in the exposed area (months or more). Also a 

blackout situation is likely to result even where transformers 

were not damaged, and it would take significant time and 

effort to restart the grid where assets were not damaged. 

A second aspect of the E3 HEMP is the fact that the 

severe harmonics would propagate throughout the grid 

and create malfunctions and potential damage to building 

backup power systems. Harmonic immunity is built into 

most UPS and backup diesel generator systems; however, 

the harmonics generated by an E3 HEMP (and also an 

extreme geomagnetic storm) will greatly exceed those normal 

immunity levels. As for Smart Grid, there are already 

concerns that the harmonics normally present in many 

power systems create accuracy problems for Smart Meters. 

The IEC is working to add tests to the International Smart 

Meter standard to cover this problem. The IEC immunity 

tests do not cover the enhanced levels due to E3 HEMP or 

geomagnetic storms, so the impact to Smart Meters is not 

currently known. 

Finally the low-frequency HEMP environment occurs 

immediately after the early-time, high-frequency E1 HEMP. 

This raises the prospect that control electronics, including 

high voltage protection relays, may not operate properly due 

to the E1 HEMP, and this could result in additional damage 

that would occur due to the E3 HEMP. This is different than 

the case of the geomagnetic storm that only produces the 

low frequency environment similar to E3 HEMP. 

HPEM Protection Approach 

Protection from electromagnetic fields is strongly dependent 

on the frequency range and magnitude of the environment. 

This is due to the fact that high frequency transients penetrate 

more easily through gaps in metal shields or through 

dielectrics such as windows; they also couple well to “floating” 

wires, which act as antennas. Also high-frequency 

conducted transients usually have high power but modest 

energy, allowing the use of surge protection devices that do 

not require a high-energy handling capability. 

In the case of low-frequency electromagnetic fields, 

grounding is very important and conducted transients with 

low voltages can be isolated by relatively small gaps. 

For these reasons we will discuss the protection concepts 

for the high-frequency HPEM threats (E1 HEMP and IEMI) 

together and the low-frequency HPEM threats (E3 HEMP 

and Extreme Geomagnetic Storms) together. While there 

are great similarities within the two groupings, care must 

be taken to ensure that protective devices are properly sized 

for both threats within each group. 

High-frequency HPEM protection approach 

The basic approach for protecting from high-frequency 

HPEM threats is to first take advantage of the EM shielding 

that may be available in your installation. This is applicable 

to cases where the sensitive electronics are inside of a substa- 

Extreme geomagnetic storms 

While geomagnetic storms are an act of nature (the Sun), 

they vary in intensity and location on the Earth. Through 

evaluations of the probability and magnitude of a worst-case 

geomagnetic storm, Kappenman studied the Carrington 

storm in 1859 [15] and has estimated that an extreme geomagnetic 

storm could produce electric fields on the order of 

20 V/km, although the spatial extent would likely be larger 

than that of E3 HEMP (by two to three times). The particular 

types of impacts on the U.S. power grid would be similar to 

the E3 HEMP impacts discussed above, although the area 

coverage would likely be larger, depending on the latitude 

of the storm and its longitudinal coverage (see Figure 3). 

The major difference between the geomagnetic storm and 

the E3 HEMP is that there is no early-time, high-frequency 

electric field that precedes the geomagnetic storm. It is 

therefore likely that in the region of HEMP exposure, the 

total impacts will be more significant. 




tion building, a power control center building, a generator 

control building, or a communications control building. 

Many building materials will attenuate high frequency 

fields from the outside to the inside. For cases in which the 

attenuation is insufficient (see examples in Table 1), then 

one can consider an augmentation of the shielding through 

external building additions, internal room wall shielding, or 

even moving equipment to a newly built shielded enclosure. 

For electronics that are fully exposed to the E1 HEMP 

or IEMI (e.g. Smart Meters, distribution system sensors 

and communications, and antenna systems on substations, 

control center buildings and power plants), it will be necessary 

to evaluate by analysis and test the ability of connected 

electronics to withstand the E1 HEMP or IEMI environment 

when high-frequency grounding is improved and filters and 

surge arresters are added. 

In both cases, it is necessary to perform detailed assessments 

that include evaluations of the shielding effectiveness, 

coupling to cables, consideration of fiber optic cabling, 

evaluation of existing filters and surge arresters and vulnerability 

of the equipment before protection is added. This 

approach is discussed in some detail for E1 HEMP and IEMI 

in a recent conference paper that provides additional details 

beyond those given here [16]. 

Low-frequency HPEM protection approach 

The basic approach for protecting against the two lowfrequency 

HPEM threats described here, is to prevent the 

electric fields induced in the Earth from coupling to the 

neutral connections of the high voltage transformers in 

substations. This can be done with neutral capacitors (to 

block) or resistors (to reduce), but the difficulty is that a fast 

bypass must be provided to allow for lightning surges and 

faults to flow safely to ground without damaging the neutral 

“blocking” device. While these types of devices have been 

successfully applied in large numbers at lower transformer 

voltages than we require for the EHV power grid, some 

techniques have been developed that should work for EHV 

transformers. The next step is to develop and test prototypes, 

write standards and then field the devices. If the reader has 

further interest in this area of protection, see [17]. 

Organizations Dealing with the Threats 

of HEMP and IEMI 

IEC SC 77C (EMC: High Power Transient 

Phenomena) 

Since 1989, the International Electrotechnical Commission 

(IEC) headquartered in Geneva, Switzerland has been publishing 

standards and reports dealing with the HEMP and 

IEMI threats and methods to protect civilian systems from 

these threats under IEC SC 77C. As these are electromagnetic 

threats, it was decided from the beginning that this 

work would be closely integrated with the EMC work being 

performed by the IEC and other organizations throughout 

the world. In fact IEC Technical Committee 77, the “parent 

committee” of SC 77C, has the title “EMC”. There are 

several recent papers that provide details on the 20 IEC 

SC 77C publications that can be applied to the definition 

of the threats, the coupling to systems and the protection 

of systems [6, 18]. It is noted that these are basic standards 

and as such do not describe the resultant recommended immunity 

levels for particular types of equipment. This means 

that the standards must be applied on a case-by-case basis. 

ITU-T Study Group 5 

The International Telecommunications Union – Telecommunications 

Standardization Sector (ITU-T) has been 

working since 2005 to protect telecommunications and data 

centers from disruption from HPEM threats, which include 

HEMP and IEMI. They have relied a great deal on the basic 

publications of IEC SC 77C to prepare their recommendations. 

As of 2011 they have completed two recommendations 

for protecting against the E1 HEMP and IEMI [19, 20]. 

IEEE P1642 

The IEEE EMC Society with the support of TC-5 (High 

Power EM) has been developing the “Recommended Practice 

for Protecting Public Accessible Computer Systems 

from Intentional EMI [21].” The purpose of this work is to 

provide guidance to businesses and government agencies 

that are operating computer systems in close proximity to 

public access. The concern is that criminals and terrorists 

could use small electromagnetic weapons to disrupt or 

destroy important computer systems without any trace of 

an attack. The focus on this work is to establish appropriate 

threat levels, protection methods, monitoring techniques 

and to recommend test techniques to ensure that installed 

protection is adequate. This document is scheduled for 

publication in early 2012. 

Cigré C4 Brochure on IEMI 

The International Council on Large Electric Systems has 

formed a working group WG C4.206 entitled, “Protection of 

the high voltage power network control electronics against 

intentional electromagnetic interference (IEMI) [22].” This 

working group is preparing a brochure that will recommend 

IEMI protection methods for the control electronics found 

in high voltage substations. The work is expected to be 

completed by the end of 2011. 

Summary 

In this paper we have introduced three severe HPEM threats 

and discussed their likely impacts on the current and future 

U.S. power grid (Smart Grid). While we cannot be sure of all 

of the features of the eventual Smart Grid, there is enough 

information to evaluate the trends. In addition to pointing 

out the likely impacts on particular aspects of Smart 

Grid, assessment methods and protection measures have 

been described with references to more detailed studies. It 

is expected that efforts to assess and protect Smart Grid 

electronics and communications from electromagnetic 

interference (EMI) from “everyday” threats will continue; 

it is also recommended that assessments and protection 


R a da s k y 


be considered for these “low probability” HPEM threats. 

Any readers who are interested in contributing to 

this research or standards, please contact this author at 

wradasky@aol.com. 

References 

• [1] Radasky, W. A., “Protection of Commercial Installations from the 

‘Triple Threat’ of HEMP, IEMI, and Severe Geomagnetic Storms,” Interference 

Technology Directory & Design Guide, April 2009: 90-94. Print. 

• [2] Olofsson, M., A. McEachern, and W. Radasky, “EMC in Power 

Systems Including Smart Grid,” APEMC, Jeju Island, Korea, May 2011. 

• [3] International Electrotechnical Vocabulary (IEV), IEC 60050. 

• [4] “Electromagnetic Compatibility (EMC) – Part 2-13: Environment 

– High Power Electromagnetic (HPEM) Environments – Radiated and 

Conducted,” IEC 61000-2-13 Ed. 1.0 (2005-03). 

• [5] “Special Issue on High-Power Electromagnetics (HPEM) and Intentional 

Electromagnetic Interference (IEMI),” IEEE Transactions 

on Electromagnetic Compatibility, Vol. 46, No. 3 August 2004. Print. 

• [6] Radasky, W. A., “2010 Update on Intentional Electromagnetic Interference 

(IEMI) and High-Altitude Electromagnetic Pulse (HEMP),” 

Interference Technology EMC Directory & Design Guide, April 2010: 

124-131. 

• [7] “Electromagnetic Compatibility (EMC) – Part 2: Environment 

– Section 9: Description of HEMP Environment – Radiated Disturbance,” 

IEC 61000-2-9 Ed. 1.0 (1996-02). 

• [8] “Report of the Commission to Assess the Threat to the United 

States from Electromagnetic Pulse (EMP) Attack,” Vol. I: Executive 

Report, April 2004 . 

• [9] “Report of the Commission to Assess the Threat to the United 

States from Electromagnetic Pulse (EMP) Attack, Critical National 

Infrastructures,” April 2008 < www.empcommission.org>. 

• [10] Radasky, W. A., J. Kappenman and R. Pfeffer, “Nuclear and Space 

Weather Effects on the Electric Power Infrastructure,” NBC Report, 

Fall/Winter 2001: 37-42. Print. 

• [11] Kappenman, J. G., W. A. Radasky, J. L. Gilbert, and L. A. Erinmez, 

“Advanced Geomagnetic Storm Forecasting: A Risk Management Tool 

for Electric Power System Operations,” IEEE Transactions on Plasma 

Science, Vol. 28, No. 6, December 2000: 2114-2121. Print. 

• [12] Kappenman, J. G., and W. A. Radasky, “Too Important to Fail: 

The Looming Threats of Large Geomagnetic Storms and Other High- 

Altitude Disturbances with Modern Electric Power Grids May Produce 

Significant Damage to Critical Infrastructure,” Space Weather Journal, 

18 May 2005. Print. 

• [13] “Electromagnetic Compatibility (EMC) – Part 2-10: Environment 

– Description of HEMP Environment – Conducted Disturbance.” IEC 

61000-2-10 Ed. 1.0 (1998-11) 

• [14] Kozlov, A., S. Louzganov, Yu. Parfenov, M. Povareshkin, V. 

Polischouk, A. Shurupov, L. Zdoukhov, and W. Radasky, “Research 

of Power Line Insulator Flashover Due to the Joint Effect of a High 

Voltage Disturbance and Line Operating Voltage,” 16th International 

Zurich Symposium on EMC, Zurich, February 2005: 385-388. Print. 

• [15] J. Kappenman, “Geomagnetic Storms and their Impacts on the 

U.S. Power Grid,” Meta-R-319, Metatech Corporation, January 2010. 

• [16] Radasky, W. A., E. B. Savage, and J. L. Gilbert, “Approach for the 

Threat Assessment of E1 HEMP and Wideband IEMI on Commercial 

Electronics,” APEMC, Jeju Island, Korea, May 2011. 

• [17] J. Kappenman, “Low-Frequency Protection Concepts for the 

Electric Power Grid: Geomagnetically Induced Current (GIC) and E3 

HEMP Mitigation,” Meta-R-322, Metatech Corporation, January 2010. 

• [18] Radasky, W. A., “The Development of High-Power Electromagnetic 

(HPEM) Publications in the IEC: History and Current Status,” IEEE 

EMC Quarterly Magazine, 2008. 

• [19] “High Altitude Electromagnetic Pulse Immunity Guide for Telecommunication 

Centres,” ITU-T, K.78, June 2009. 

• [20] “High-power Electromagnetic Immunity Guide for Telecommunication 

Systems,” ITU-T, K.81, November 2009. 

• [21] “Recommended Practice for Protecting Public Accessible Computer 

Systems from Intentional EMI,” IEEE P1642, Draft, August 2009. 

• [22] “Protection of the High Voltage Power Network Control Electronics 

against Intentional Electromagnetic Interference (IEMI),” Cigré 

Study Committee C4, WG C4.206, April 2008. 

William A. Radasky, Ph.D., P.E., received his Ph.D. in Electrical 

Engineering from the University of California at Santa Barbara in 1981. 

He has worked on high power electromagnetics applications for more 

than 42 years. In 1984 he founded Metatech Corporation in California, 

which performs work for customers in government and industry. He has 

published over 400 reports, papers and articles dealing with transient 

electromagnetic environments, effects and protection during his career. 

He is Chairman of IEC SC 77C and IEEE EMC Society TC-5. He can be 

reached at wradasky@aol.com n 

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N e w EMC Requir e m e n t s F o r C o mm e r c i a l Av i o nic s 

New EMC Requirements For 

Commercial Avionics: RTCA/DO-160G 

Erik J. Borgstrom 

Environ Laboratories LLC 

Bloomington, Minnesota USA 

RTCA/DO-160G, Environmental Conditions 

and Test Procedures for Airborne 

Equipment, prepared by RTCA 

Special Committee 135, was issued on Dec. 

8, 2010, superseding the previous version, 

DO-160F [1]. 

DO-160G covers standard procedures 

and environmental test criteria for testing 

airborne electrical and electronic equipment 

(avionics). The tests specified in DO-160G 

are typically performed to meet Federal 

Aviation Administration (FAA) or other 

international regulations covering electrical 

or electronic equipment that is installed on 

commercial aircraft. 

The tests and test levels/limits (also referred 

to as “Equipment Categories”) found 

in DO-160G are applicable to virtually every 

type of aircraft in use today, including 

small general aviation aircraft, business jets, 

helicopters, regional jets, and “Jumbo Jets,” 

such as the newest airliners from Airbus (the 

A350XWB) and Boeing (the 747-8). 

The document includes 26 sections and 

three Appendices, but it is Sections 15 

through 23 and also Section 25 that cover 

EMC. Examples of other tests covered in 

DO-160G are: temperature, altitude, vibration, 

sand/dust, power input, radio frequency 

susceptibility, lightning, and electrostatic 

discharge. 

Creation and revision of DO-160G is 

coordinated with the European Union sister 

organization to RTCA, EUROCAE. As 

a result of this trans-Atlantic cooperation 

and joint effort by the two organizations, 

RTCA/DO-160G and its European twin, 

EUROCAE/ED-14G, are identically worded. 

The purpose of this article is to provide 

an overview of each of the sections that deal 

with EMC in DO-160G. Changes in each 

section since the release of DO-160F will 

be summarized. Finally, we will look at the 

future direction of SC-135, and the timetable 

for future revisions to DO-160, and the DO- 

160 Users Guide. 

SECTIONS 1-3 

The first three sections cover the Purpose 

and Applicability (Section 1) of DO-160, provide 

a Definition of Terms (Section 2) used 

throughout the document, and give Conditions 

of Tests (Section 3). These first three 

sections are referenced in all of the subsequent 

sections of DO-160, and provide the 

general information and guidance needed to 

properly perform the specified tests. 

What’s new for DO-160G? 

• In Section 1, a discussion of the Users 

Guide material found in an appendix after 

many sections, and the confirmation that 

any information found in the Users Guide 

is GUIDANCE ONLY (emphasis added). 

• In Section 2, additional guidance covering 

“Category Tests and Declarations”. In 

particular, Section 2.8 now states that if 

equipment is qualified to a particular category, 

the equipment can be considered to 

be qualified to any other category that is 

less severe. 

• In Section 3, additional guidance covering 

“EUT Configuration for Susceptibility Tests”, 

with special attention given to the firmware 




and/or software used during testing. 

SECTION 15: MAGNETIC EFFECT 

This “MC” (for “Magnetic Compatibility” as opposed to 

“EMC” for Electromagnetic Compatibility) test is performed 

to determine how much the Equipment Under Test (EUT) 

will deflect a compass needle, or affect the indication from 

a magnetic field sensor, also known as a “Flux Gate”. 

A standard compass that has a large enough dial to read 

one degree of needle deflection, or an “equivalent magnetic 

sensor” (electronic compass) is the only test equipment required. 

The EUT is simply moved closer to the compass on 

an East-West line until one degree of deflection away from 

magnetic North is observed. The separation distance is then 

measured and the "Equipment Category" is determined. 

Equipment classes 

There are five Equipment Categories (Y, Z, A, B, and C) that 

apply to installation separation distances between the EUT 

and compass (or compass sensor) of less than 30 centimeters 

to more than 300 centimeters. 


• Figure 15-1, showing the Test Installation and Procedure, 

was revised to better show how the EUT and compass (sensor) 

are to be properly set up for testing, and how to correctly 

determine the distance at which one degree of needle 

deflection is observed. 

SECTION 16: POWER INPUT 

Although an argument can be made that “Power Input” (or 

“Power Quality” as they are referred to in other standards) 

tests are not truly EMC tests, they are included here for two 

reasons: 

1) Power Input/Quality tests are often performed in the 

EMC lab by the EMC test personnel. 

2) In the latest versions of DO-160, the frequency ranges 

for some of the tests fall well within the realm of typical EMC 

tests, and the test equipment used is similar to many other 

“true” EMC tests found elsewhere in DO-160 and other EMC 

standards. 

The tests in Section 16 are performed to determine that 

the EUT can operate as required during all of the different 

conditions of AC and/or DC power variations that occur 

during normal and emergency aircraft operation. In addition, 

Section 16 contains tests to verify that the EUT does not 

have a negative influence on the aircraft power system that 

would be harmful or otherwise cause degraded performance 

in other installed equipment. 

One interesting note about Section 16 is the fact that it is 

the only section of DO-160 that contains requirements and 

tests that cover both the susceptibility of the EUT (such as 

surge, dropout, frequency transients, etc.), and the generation 

of harmful interference (emissions) from the EUT (such as 

current harmonics, re-generated energy, power factor, etc.). 

This fact, along with the increasing complexity and variety of 

modern aircraft power systems, and the sheer size of Section 

16 (69 pages in DO-160G), is spurring some discussion on 

SC-135 about the possibility of splitting off the Power Input/ 

Quality requirements to a completely different document; 

although no immediate change is being considered. 

In order to keep pace with the “state-of-the-art” in aircraft 

power system design, Section 16 has seen dramatic changes 

over the last decade, but (thankfully) the changes made for 

DO-160G, are not as extensive as previous revisions, and 

with a couple of exceptions, fall more under the heading of 

clarification and improvements for ease of use. 

Change 2 to DO-160D, issued June 12, 2001, revised 

Section 16 fairly dramatically, by including new tests, and 

modifications to existing testing, to address the issues of 

AC Harmonic Current Content and Variable Frequency AC 

power systems [2]. 

In DO-160E, the entire section was re-ordered so that all 

the AC tests were in one subsection, and all DC tests were 

in another subsection, making Section 16 easier to use and 

understand. DO-160E also introduced some new tests, such 

as a DC Content test for AC powered equipment, and a new 

sub-section covering “Load Equipment Influence on Aircraft 

Electrical Power Systems”. 

In DO-160F, even more tests were added, for both AC and 

DC powered equipment. In addition, a whole series of new 

tests and test levels to cover 270 Volt DC power systems, and 

a greatly expanded list of tests to cover the EUT influence on 

the aircraft electrical power systems was instituted. 

DO-160G does not contain any new tests, but does add 

some clarification of the applicability of some tests. 

DC input tests 

On DC inputs, there are tests that cover: 

• Steady-state over- and under-voltage conditions 

• Ripple voltage 

• Momentary power interruption 

• Momentary sags and surges 

• Exposed voltage decay time (270 Volt only) 

• Inrush current 

AC input tests 

AC inputs are subjected to the following tests: 

• Steady-state over- and under-voltage conditions 

• Steady-state over- and under-frequency conditions 

• Steady-state phase unbalance (three-phase power) 

• Voltage and frequency modulation 

• Voltage and frequency transients 

• Momentary power interruption 

• Momentary sags and surges 

• DC offset and voltage distortion 

• Harmonic current emissions 

• Phase unbalance (3 phase inputs) 

• DC current content 

• Inrush current 

• Current modulation 

• Power factor 




Figure 1. Category Q conducted RF emissions 

limit - power leads. 

Equipment categories 

There are four Equipment Categories 

(A, B, D, or Z) that indicate the type of 

power used by the equipment and the 

type of AC and/or DC power source 

with which the equipment is compatible. 

For AC powered equipment, an 

additional designator, placed in parenthesis 

following the Category designator, 

is a two character code indicating 

that the equipment has been tested 

for use with Constant Frequency (CF), 

Narrow Variable Frequency (NF), or 

Wide Variable Frequency (WF). 

Up to four additional category designators 

are used to indicate testing for: 

• AC current harmonics (H) 

• AC current modulation (L) 

• AC power factor (P) 

• DC current ripple (R) 

• AC or DC inrush (I) 

What’s New for DO-160G 

• Directions regarding the testing 

process for equipment with multiple 

power sources. 

• The requirement to test all AC powered 

equipment (regardless of whether 

they contain “Digital Circuits”) to 

the Momentary Power Interruptions 

given in Table 16-1 (and 16-2 if the 

equipment uses “Narrow” or “Wide” 

Variable Frequency AC power). 

• Abnormal Surge test is now specified 

for each individual phase of 3 phase 

AC powered EUTs. 

• Tolerances for some test voltage 

levels have been added or modified 

to make the test easier to perform, 

and also more accurately simulate 

the intended conditions that would 

be seen on the aircraft. 

• Revisions to Momentary Interruptions 

Tables 16-1, 16-2, and 16-3, to 

make it much easier to understand 

the test requirements. 

SECTION 17: VOLTAGE SPIKE 

This test determines whether the EUT 

can operate as required during and/ 

or after voltage spikes are applied to 

the AC and/or DC power input(s). 

Any method of generating the spike 

may be used, provided that the pulse 

produced has a duration of at least 10 

microseconds, a rise-time of less than 2 

microseconds, and a source impedance 

of 50 ohms. A minimum of 50 voltage 

spikes are applied within 1 minute. This 

test is very similar to MIL-STD-461F 

test method CS106 [3]. 


There are two Equipment Categories. 

The Category B test level is twice the 

AC (rms) and/or DC line voltage (or 200 

volts, whichever is less). The Category 

A test level is 600 volts. 


• Clarification that a minimum of 

50 spikes in positive polarity, and 

50 spikes in negative polarity, are 

required. 

SECTION 18: AUDIO 

FREQUENCY CONDUCTED 

SUSCEPTIBILITY - POWER 

INPUTS 

This test is performed to determine 

that the EUT will operate as specified 

when audio frequency interference is 

applied to the AC and/or DC power 

input. The test setup and procedure are 

nearly identical to MIL-STD 461F test 

method CS101, with the only difference 

being the actual test level and frequency 

range. The audio frequency interference 

is transformer coupled onto each power 

input lead, and the peak-to-peak voltage 

level of the interference signal is 

measured across the power input and 

return leads. Test levels are up to 8% of 

the nominal AC input voltage, and the 

frequency range is as broad as 10 Hz 

to 150 kHz. 

The EUT must be tested while operating 

at both minimum and maximum 

current draw (if applicable), and at the 

AC power frequency extremes if designated 

for use with Variable Frequency 

systems. The frequency scan rate is 30 

steps per decade, with a 1 minute dwell 

time at each frequency. 


There are three DC power Equipment 

Categories (R, B, and Z) that indicate 

the type of power used by the equipment 

and the type of DC power source with 

which the equipment is compatible. 

Two AC power Equipment Categories 

are specified (R & K). Category 

R is used with an additional designation 

(a two character code), placed in 

parenthesis following the Category 

designator, indicating that the equipment 

has been tested for use with 

Constant Frequency (CF), Narrow Variable 

Frequency (NF), or Wide Variable 

Frequency (WF). Category K designates 

that the EUT has been tested for use 

with any type of AC power input, and 

tested to a higher level of voltage distortion 

than category R. 


• Users Guide has been added to the 

end of the section, resulting in many 

comments and remarks being moved 

from the requirements section to the 

new Users Guide. 

• The allowance to limit applied power 

(of the test signal) to 100 watts has 

been removed and replaced by a 36 

Amp peak-to-peak test current limit. 

Test setup figures have been modified 

to show the “Optional AC Current 

Monitor” in the proper location. 

• The 0.6 ohm output impedance 

specification for the coupling transformer 

has been deleted. 


B o r g s t r o m 


SECTION 19: INDUCED SIGNAL SUSCEPTIBILITY 

The tests in this section are performed to determine that 

the EUT can operate as required when the equipment and 

interconnecting cables are subjected to audio frequency 

electric fields, magnetic fields and transient voltage spikes. 

The test levels for the interconnecting cable tests are determined 

by the length of wire that is exposed to the radiating 

wire. For the Inductive Switching Transients (induced spikes) 

test, the exposed length is either 1.2 or 3.0 meters, with the 

amplitude of the spikes applied to the radiating wire being 

at least 600 Volts peak-to-peak. 

For the magnetic and electric fields induced into cables, 

the test level is defined as the product of the length of interconnecting 

cable that is exposed to the radiating wire and 

the rms voltage or current applied to the wire. This test level 

is given as "volts x meters" (V-m), or "amps x meters" (A-m). 

For example, category Z requires an electric field test level of 

1800 V-m, which is typically obtained by exposing 3 meters 

of cable to a radiating wire with 600 volts rms applied to 

it. If less than 3 meters of cable is exposed to the radiating 

wire (due to space restrictions, for example), the voltage applied 

to the wire must be increased so that the test level of 

1800 V-m is achieved. The exception to this requirement is 

when the actual length of the cable in the final installation 

is known to be less than 3 meters. In this case, the test level 

may be reduced in proportion to the ratio of the reduced 

coupling length. 

The frequency ranges for the swept frequency tests are 

determined by the Equipment Category specified. The frequency 

scan rate is 30 steps per decade, with a 10 second 

dwell time at each frequency. 


The Equipment Categories are comprised of two characters. 

The first character (A, B, C, or Z) indicates the tests performed 

and severity level of the tests. The second character 

(C, N, or W) indicates the AC power system operating frequency 

(Constant, Narrow Variable, or Wide Variable) with 

which the EUT is compatible. 


• Clarification that these tests are not applicable to Power 

Input cables/leads. 

• An “Electric Fields Induced Into the Equipment” test has 

been added. This test is very similar to the existing “Magnetic 

Fields Induced Into the Equipment” test, and a single 

test level of 170 Vrms (400 Hz) is used for all Equipment 

Categories. Corresponding Test Setup Figure also added. 

• The requirement to sweep the radiating wire across the 

face of the equipment in both the Magnetic and Electric 

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Figure 2. Category Q conducted RF emissions 

limit - Interconnecting cables. 

Fields Induced Into the Equipment 

tests. 

• Clarification added to the Inductive 

Switching Transients (Induced 

Spikes) figure, to allow for the fact 

that spikes of varying amplitude will 

be produced during the test, and that 

some spikes will be less than the 

indicated 600 Vpp amplitude. 

SECTION 20: RADIO 

FREQUENCY SUSCEPTIBILITY 

(RADIATED AND CONDUCTED) 

These tests are performed to determine 

that equipment will operate as specified 

when the EUT and its interconnecting 

cables are exposed to Radio Frequency 

interference. Continuous Wave (CW), 

Square Wave AM (SW), and Pulse 

Modulated (PM) RF signals are required. 

A Line Impedance Stabilization 

Network (LISN) must be inserted 

in series with each power lead and 

ungrounded power return lead, with 

a 10 uF capacitor connected between 

the power input of the LISN and the 

ground plane. Unless otherwise specified, 

interconnecting cables shall be at 

least 3.3 meters in length, and power 

leads will be no more than 1 meter in 

length for these tests. 

Conducted susceptibility 

The RF conducted susceptibility test 

procedure is similar to MIL-STD-461F 

test method CS114. RF interference is 

coupled into the EUT interconnecting 

cables and power leads using an 

injection probe that is calibrated (in 

a 50 ohm fixture) to the required test 

level prior to performing the test. The 

amount of RF power applied to the injection 

probe that is required to achieve 

the specified RF current in the fixture 

is recorded for each test frequency. This 

calibration table, showing RF power 

required at a given frequency, is then 

used during the actual test. 

During testing, the RF current that 

is induced into the cable or lead under 

test is monitored with a calibrated RF 

current probe, and the RF power applied 

to the injection probe is increased 

until the appropriate current level (as 

defined by the applicable Equipment 

Category used) is reached. The amount 

of RF applied to the injection probe is 

limited to no more than 6 dB above the 

power level recorded during calibration 

in the 50 ohm calibration fixture. 

The test frequency range is 10 kHz to 

400 MHz, and 2 scans are typically 

required for each test - once with a 

CW signal, and then again with a SW 

modulated signal. 

Radiated susceptibility 

The RF radiated susceptibility test 

procedure is similar to MIL-STD-461F 

test method RS103. The EUT and its 

interconnecting cables and power leads 

are exposed to RF radiated fields in the 

frequency range of 100 MHz to 18 GHz. 

There are two RF radiated susceptibility 

test methods specified in Section 20. 

The first uses a standard semi-anechoic 

chamber as in MIL-STD-461F 

test method RS103. The chamber must 

be lined with RF absorber, and the 

minimum performance of the absorber 

is specified. The minimum antenna 

distance is normally 1 meter, and multiple 

antenna positions are required 

when the beamwidth of the antenna 

does not totally cover the system. If 

the EUT has apertures, connectors, 

seams, or other points of penetration 

in the EUT enclosure, all of these must 

be directly exposed to the test antenna, 

requiring multiple EUT positions during 

testing. 

Calibration of the RF field prior to 

placement of the EUT is required. The 

RF power required to achieve the specified 

test level is applied to the antenna 

input and this power level is recorded 

at each calibration frequency, for each 

antenna used. During EUT testing, 

the calibrated power level for each test 

frequency is applied to the antenna. 

The second method uses a Reverberation 

Chamber, which requires a Field 

Uniformity Validation and Maximum 

Chamber Loading Verification prior to 

the first use of the chamber, or after any 

modifications. Field Uniformity measurements 

are performed with a 3-axis 

E-Field probe at up to nine different 

positions within the chamber. In addition, 

a passive, linear, monitor antenna 

is moved to different positions within 

the chamber to calibrate the monitor 

antenna for use prior to each test. This 

calibration allows the monitor antenna 

to be used to measure Chamber Q, 

Time Constant, and Test Level determination, 

during EUT testing. 

The RF power level required to 

achieve the desired test level for each 

test frequency is determined by injecting 

a known RF power level (typically 

1 watt) into the chamber, and then 

measuring the field level inside the 

Reverb Chamber with the monitor 

antenna, after the EUT installed in 

the chamber. 


Equipment Category designation for 

Section 20 consists of two letters. 

Conducted susceptibility test levels 

are designated with the first category 

character and radiated susceptibility 

test levels with the second category 

character. There are 7 Equipment Categories 

for conducted susceptibility, and 

10 Equipment Categories for radiated 

susceptibility. These categories indicate 

the severity level of the tests performed, 

and/or the type of modulation used. 

Category S is the least severe at 1 V/m, 

and Category L is the most severe, with 

test levels as high as 7200 V/m. 





• Users Guide added. 

• Wording throughout the section has been revised or added 

to align Section 20 with the requirements of the new FAA 

HIRF Rule, FAA Advisory Circular 20-158, and SAE document 

ARP5583A (HIRF Users Guide). 

• The requirement that when using the Anechoic Chamber 

method for Radiated Susceptibility, all faces of the EUT 

must be directly exposed to the test antenna, and if any 

face of the EUT is not directly exposed to the test antenna, 

the justification for this decision must be included in the 

Test Report. 

• Clarification that the distance between the test antenna 

and the EUT must be the same for calibration and test. 

• The Reverberation Chamber test method has been modified 

from a “Mode-Tuned” process to a “Mode-Stirred” 

process. This change has resulted in a major re-write of 

Section 20.6, to such an extent that it cannot be discussed 

in sufficient detail in this article, but a few highlights can 

be provided: 

1. Field Uniformity determination using 3-axes E-Field 

probes is still required. 

2. Test Level is determined by measuring the power received 

by a monitor antenna (with the EUT installed), and then 

calculating the field based on the maximum received level 

on the monitor antenna, over one tuner rotation. 

3. Tuner speed is 4 rpm below 1 GHz, and 2 rpm above 1 

GHz, or slower (usually a slower speed is needed). 

SECTION 21: EMISSION OF RADIO FREQUENCY 

The tests in this section are performed to determine that the 

EUT does not emit radio frequency interference in excess 

of the specified limits. Conducted RF emissions appearing 

on interconnecting cables and power leads are measured. 

Radiated RF emissions from the EUT, interconnecting cables, 

and power leads are also measured. 

Measurements must be made with an instrument using a 

peak detector, and with IF bandwidths, frequency step size, 

and dwell time as specified in Section 21, Table 1, for the 

frequency range being scanned. 

A LISN must be inserted in series with each power lead 

and ungrounded power return lead, with a 10 uF capacitor 

connected between the power input of the LISN and the 

ground plane. Unless otherwise specified, interconnecting 

cables shall be at least 3.3 meters in length, and power leads 

will be no more than 1 meter in length for these tests. 

Ambient emission levels must be at least 6 dB below the 

applicable limit, and must be measured and recorded if any 

signals are found to be within 3 dB of the applicable limit. 

Conducted emissions 

Conducted RF currents on interconnecting cables and 

power leads are measured with a clamp-on current probe. 

The probe is positioned 5 centimeters from the EUT and 

measurements are made over the frequency range of 150 

kHz to 152 MHz. 

Figure 3. Waveform 6. 

Radiated emissions 

Radiated RF fields are measured with a linearly polarized 

antenna over the frequency range of 100 MHz to 6 GHz. As 

with RF radiated susceptibility testing in Section 20, there are 

two RF radiated emissions test methods allowed in Section 

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21: the Anechoic Chamber method, and 

the Reverberation Chamber method. 

The Anechoic Chamber method 

requires a chamber lined with RF 

absorber, and the minimum performance 

of the absorber is specified. The 

measurement antenna distance is 1 

meter, and multiple antenna positions 

are required when the beamwidth of 

the antenna does not totally cover 

the system. If the EUT has apertures, 

connectors, seams, or other points of 

penetration in the EUT enclosure, all 

of these must be directly exposed to the 

test antenna, requiring multiple EUT 

positions during testing. 

The second method uses a Reverberation 

Chamber, which requires a Field 

Uniformity Validation from Section 

20. EUT Loading is measured after the 

EUT is installed in the chamber, and 

this data is used as a correction factor 

for the radiated emissions measurement. 

A minimum of 200 sweeps of the 

analyzer or measurement receiver is 

required over one rotation of the tuner, 

for each measured frequency range. 


There are 6 Equipment Categories (B, 

L, M, H, P, and Q) that indicate the 

location of the equipment and the 

separation between the equipment and 

aircraft antennas. In general, the closer 

the equipment is to an aircraft antenna, 

and the more it approaches a "direct 

view" of an aircraft antenna, the tighter 

the emissions limits. 


• Users Guide. 

• A new limit category has been added 

- Category Q - to provide added protection 

for VHF and GPS receivers, 

but without the Conducted Emissions 

“HF notch” used in Category P 

(see Figure 1 and Figure 2). 

• Change in the frequency for the 

bandwidth step from 100 kHz to 1 

MHz. Previous versions had this step 

at 1 GHz. DO-160G has the step at 

960 MHz. 

• Removal of the option to use a 10 kHz 

bandwidth to measure in the notches 

above 960 MHz, and instead, a note 

that a high-gain pre-amplifier may 

(will) be required. 

SECTION 22: LIGHTNING 

INDUCED TRANSIENT 

SUSCEPTIBILITY 

These tests determine whether the 

EUT can operate as specified during 

and/or after various lightning induced 

transient waveforms are injected into 

connector pins, interconnecting cables, 

and power leads using pin injection, 

and/or cable bundle tests. The pin 

injection method is normally used to 

show damage tolerance, while the cable 

bundle tests are normally used to show 

upset tolerance. 

Change 3 to DO-160D, issued December 

5, 2002, was a major revision 

of Section 22, primarily to add procedures, 

waveforms, and test levels for 

Multiple Burst and Multiple Stroke 

Cable Bundle test methods. New Waveform 

Set designators (G through K) 

were also added to cover the Multiple 

Burst and Multiple Stroke tests. 

Pin injection 

During pin injection testing, the EUT is 

normally powered, so that the circuits 

being tested are biased as they would 

be in normal operation. The test level 

is defined as an open circuit voltage 

(Voc) with a specified source impedance 

from the generator. For example, 

waveform 3, test level 2 specifies Voc as 

250 volts, with a short circuit current 

(Isc) of 10 amps. The ratio of Voc to Isc 

yields a generator source impedance 

requirement of 25 ohms. The generator 

is adjusted to produce waveform 3 

with these specified characteristics, and 

the transient waveform is then applied 

directly to the interface pins. After the 

pins have been tested, the EUT is evaluated 

to determine if its performance has 

been degraded. 

Cable bundle tests 

Cable Bundle Tests are performed using 

either Cable Induction or Ground Injection 

to couple the transient waveforms 

into the interconnecting cable bundles 

and power leads. 

The cable induction test method 

uses an injection probe to induce the 

transient waveforms into interconnecting 

cables and power leads. The ground 

injection method is very similar to the 

cable induction method, except that the 

transient waveform is applied between 

the EUT case and the ground plane. 

The EUT is isolated from the ground 

plane by lifting all local grounds and 

returns, and insulating the case from 

the ground plane, which forces the 

injected transient into the cable shields 

and any other return paths back to the 

ground plane. 

A Line Impedance Stabilization Network 

(LISN) must be inserted in series 

with each power lead and ungrounded 

power return lead, with a 10 uF capacitor 

connected between the power 

input of the LISN and the ground plane 

for AC powered equipment, or with a 

33,000 uF capacitor connected across 

the power inputs of the LISNs for DC 

powered equipment. Unless otherwise 

specified, interconnecting cables shall 

be at least 3.3 meters in length, and 

power leads will be no more than 1 

meter in length for these tests. 

For each waveform, either a voltage 

or current test level is given, along with 

a current or voltage limit. For example, 

waveform 2, test level 3, specifies a voltage 

test level (VT) of 300 volts, and current 

limit (IL) of 600 amps. This means 

that during the test, the generator level 

is increased until the peak voltage measured 

on a single turn monitor loop 

placed thru the injection probe reaches 

300 volts, or the monitored induced 

current in the cable or lead reaches the 

600 amp limit. 

Cable Bundle tests may be performed 

using the Single Stroke method 

only, or using a combination of the 

Single Stroke, Multiple Stroke, and 

Multiple Burst methods. 

The Single Stroke test method is designed 

to represent the internal aircraft 

wiring response to the most severe external 

aircraft lightning strike. A single 

occurrence (stroke) of the specified test 

waveform is applied to the cable bundle 

or wire under test, and repeated for a 

total of 10 applications in each polarity. 

The Multiple Stroke test method 

is designed to represent the induced 

effects to internal aircraft wiring in 

response to an external aircraft lightning 

strike that is composed of a first 

return stroke immediately followed by 

multiple return strokes (see Figure 5). 

The Multiple Burst test method is 




designed to represent the induced effects 

to internal aircraft wiring in response 

to an external aircraft lightning 

strike of a multiple burst nature (see 

Figure 6). The specified test waveform 

is applied to the cable bundle or wire 

under test, and repeated for at least 5 

minutes in each polarity. 


Category designations consist of six 

characters that describe the pin and cable 

test Waveform Sets and test levels. 

The 3 Pin Injection test waveforms 

are grouped together in two Waveform 

Sets (A & B). The 6 Cable Bundle test 

waveforms are grouped together in 

four Single Stroke Waveform Sets (C 

through F), and four combined Single 

Stroke and Multiple Stroke (G through 

K), and two Multiple Burst Waveform 

Sets (L& M). 


• Users Guide added, resulting in 

many notes and remarks being moved 

from the requirements section to the 

Users Guide. A vast amount of additional 

(helpful) information is included 

in the Section 22 Users Guide. 

• The “resistor method” for determining 

the source impedance of the 

Pin-Injection test waveforms has been 

eliminated. 

• Cable Bundle test Waveform 6 was 

added, for the Multiple-Burst test only. 

See Figure 3. 

• Pin-Injection calibration and test 

setup figures were revised for clarity. 

SECTION 23: LIGHTNING 

DIRECT EFFECTS 

The tests in this section are performed 

to determine the ability of externally 

mounted electrical and electronic 

equipment to withstand the direct 

effects of a severe lightning strike. 

The equipment will not normally be 

powered during the test, and these 

tests usually cause damage (sometimes 

spectacular damage) to the EUT. High 

voltage and/or high current tests at 

levels of thousands of kilo-Volts and/ 

or hundreds of kilo-Amps are required. 


Category designations consist of four 

characters that describe the nature and 

severity of the test waveforms applied. 

The first 2 characters designate the 

High Voltage Strike Attachment test 

category, and the last two characters 

designate the High Current Physical 

Damage test category. The designated 

test category for the EUT should correspond 

to the lightning strike zone 

in which the EUT will be installed on 

the aircraft. 


• No changes. 

SECTION 25: ELECTROSTATIC 

DISCHARGE (ESD) 

This test determines whether the 

EUT can operate as specified during 

and after being subjected to an electrostatic 

air discharge event. The test 

procedure and test generator used is 

similar to most other international 

ESD standards, except that the EUT is 

bonded to the ground plane and only 

air discharge is specified. Test points 

are chosen based on their accessibility 

to personnel, with 10 positive and 10 

negative polarity discharges at 15 kV 

applied to each one. 


There is only one category (A), with a 

test level of 15 kV. 


• Clarification of applicability of test 

points, in particular, stating that 

connector pins are not to be tested. 

THE LATEST FROM SC-135 

At the most recent meeting of the 

RTCA Program Management Committee 

(which directs the activities of SC- 

135), where Revision G of DO-160 was 

approved, the decision was made to allow 

for a minimum of 5 years until another 

revision of DO-160 was released. 

The Program Management Committee 

revised the “Terms of Reference” 

for SC-135 to create a “stand-alone” 

document (possibly in the form of an 

appendix) that would contain all the 

Users Guide material for all sections of 

DO-160. Although no target date was 

given for the release of this new Users 

Guide, it is to be completed before the 

committee resumes work on the next 

revision of DO-160 (DO-160H). 

SUMMARY 

RTCA/DO-160, and its European 

twin, EUROCAE/ED-14, are truly the 

world standards for Electromagnetic 

Compatibility requirements for aircraft 

electronic equipment. 

The test levels, requirements, and 

procedures are intended to reflect the 

"state-of-the-art" in aviation technology 

and EMC testing methodology. 

Since both aviation technology and 

EMC testing methodology are evolving 

at a rapid rate, work is continuing on a 

comprehensive Users Guide covering 

all sections of RTCA/DO-160G and 

eventually, the next revision, DO-160H. 

REFERENCES 

• [1] RTCA/DO-160F, "Environmental Conditions 


Equipment," RTCA, Incorporated, December 

2007. 

• [2] RTCA/DO-160D, "Environmental Conditions 


Equipment," RTCA, Incorporated, July 1997. 

• [3] MIL-STD-461F, "Requirements for the 

Control of Electromagnetic Interference 

Characteristics of Subsystems and Equipment,” 

Dept. of Defense Interface Standard, 

December 2007. 

Erik J. Borgstrom has worked in the EMC 

testing field for more than 24 years. He currently 

holds the position of EMC Operations Manager 

for Environ Laboratories LLC, and specializes 

in the EMC testing requirements for the Defense 

and Aerospace industries. Borgstrom is an active 

member of SAE Committees AE-2, where he leads 

the DO-160 Section 22 Task Group. He was also 

a member of the AE-4 (HIRF) Working Group, 

which worked on SAE document ARP5583 (HIRF 

Users Guide) Revision A, published in 2010. 

Borgstrom is one of Environ’s representatives 

to RTCA, where he serves on Special Committee 

135, as Change Coordinator for Section 22 

(Lightning Induced Transient Susceptibility) and 

Section 25 (ESD) of DO-160. He can be reached at 

ejb@environlab.com n 

MORE ON OUR website 

Read more about this topic at the 

Interference Technology website at 



standards 

O n t h e N at ur e a nd Us e of t h e 1.04 m El e c t ric Fiel d Probe 

On the Nature and Use of the 

1.04 m Electric Field Probe 

Ken Javor 

EMC Compliance 

Huntsville, Alabama USA 

R 

epeatability problems have been noted 

with 1.04 m rod antenna measurements 

in the past (Jensen [1], Turnbull 

[2]). The problems noted center on 

resonances caused by the test set-up that 

result in erroneous measurements of field 

intensity with actual detected levels varying 

among test facilities. A complete history of 

the use of the 1.04 m rod antenna from the 

1950s forward and test data showing the 

effects of different rod antenna use may be 

found in Javor [3]. 

Various vehicle-related standards utilize 

the 1.04 m rod antenna below 30 MHz. 

Military (MIL-STD-461 basic and all revisions), 

aerospace (RTCA/DO-160 basic 

through the E revision), and automotive 

EMI standards (CISPR 25-2002, among 

others) all make use of the rod antenna. To 

date, only MIL-STD-461F (2007) incorporates 

fixes to the resonance problem. And 

none of the other standards address the 

accuracy of the fundamental measurement, 

at frequencies where resonances are not a 

problem. Recently, Weston [4] criticized the 

MIL-STD-461F change. His main points are 

discussed herein. 

Analytical modeling supported by experimental 

investigation shows that a floated 

counterpoise with transformer coupling 

between the rod antenna matching network 

and the test chamber ground provides the 

best performance at all frequencies. Experimental 

data shows the unacceptable perturbation 

caused by a grounded counterpoise. 

In addition to these particular issues, and 

as a means of making specific points, the 

general nature of the rod as an electric field 

probe, and the transfer function between 

field source and measured field intensity 

are explained. 

INTRODUCTION 

The 1.04 m rod “antenna” is electrically short 

at all test frequencies and does not function 

as a true antenna, which is a transducer 

that effectively radiates or receives “power” 

associated with electromagnetic fields. The 

rod is better understood as an electric field 

probe or sensor. The output impedance 

associated with the induced voltage in the 

rod is the reactance of 10 pF. Networks used 

with rod antennas are impedance matching 

devices which convert the rod’s high impedance 

to a 50 Ohm output. 

Use of the 1.04 m rod antenna has 

changed dramatically since its introduction 

in 1953 (MIL-I-6181B). Original use 

is shown in Figure 1, with the rod element 

connected directly to a battery-powered 

EMI receiver; the only ground connection 

being a very short bond strap to the tabletop 

ground plane. The first change allowed 

remote use of the EMI receiver from the antenna, 

which made EMI testing more practical, 

but introduced both a potential ground 

loop and also a difference in rf potential 

between the rod counterpoise and the EMI 

receiver. Another change increased the upper 

frequency at which the rod antenna was 

used from 25 to 30 MHz. This, coupled with 

a later change that increased separation 

between antenna and test sample from the 

original 12 inches to the present one meter 


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standards 


Figure 1a. 

MIL-I-6181B 

use of 1.04 m 

rod antenna 

(ca. 1953). 

Figure 1b. Recreation of Figure 1a. 

made the measurement more susceptible 

to test chamber resonances. There 

was good rationale for the changes, but 

measurement accuracy suffered. The 

counterpoise isolation proposed herein 

restores the integrity of the measurement 

set-up as originally configured. 

The field sensing mechanism of the 

rod antenna is the effective potential 

difference between the rod base (counterpoise) 

and the rod tip. Since the 

rod's potential is measured relative to 

the counterpoise's potential, anything 

that affects the counterpoise's potential 

affects the measurement. This is the 

key point ignored by all present standards. 

Weston’s critique [5] does not 

ignore the effect of the counterpoise, 

but that effort promotes the use of the 

grounded counterpoise, which references 

[1] – [3] as well as this effort show 

to be quite detrimental. Of all present 

standards, only MIL-STD-461F (2007) 

attempts to provide some control of the 

counterpoise potential. In so doing, 

MIL-STD-461F provides dampening of 

resonances occurring above 20 MHz. 

Theoretical 1.04 m rod performance, 

actual performance of the traditional 

and the MIL-STD-461F implementation, 

and the proposed counterpoise 

isolation technique are compared 

herein. It is important to realize that 

“traditional” does not imply correct. 

In [3], evolution of the use of the 1.04 

m rod antenna from the earliest days 

is explained and it is shown that what 

is now considered “traditional,” due to 

common use since 1970, is in fact an 

aberration. 

BACKGROUND 

Analytical modeling and chamber testing 

described herein are based on a one 

meter long cable suspended 5 cm above 

a ground plane 10 cm back from the 

edge of the plane as shown in Figures 

2 and 3. A level of -10 dBm was applied 

from 2 – 32 MHz driving a 50 Ohm termination. 

The -10 dBm level converts to 

70.7 mV in a 50 ohm system. All data 

plots are 2-32 MHz. The test chamber 

size was 8’ x 8’ x 8’, unlined. The lowest 

chamber resonance can be calculated 

from a commonly used equation to be 

87 MHz, which is almost three times 

the highest measurement frequency 

of interest (30 MHz). Thus the fact 

that the measurements were made in 

a hybrid shield/screen room with no 

absorber lining does not affect measurement 

integrity. The rod antenna 

used was the Ailtech 95010-1, with a 

constant antenna factor of 8 dB/m from 

10 kHz to 40 MHz. Data plots included 

herein are uncorrected raw antennainduced 

potentials. The correlation of 

this data with analytical predictions 

is not obscured by any hidden factors. 

The rod antenna network was also used 

to measure counterpoise potentials 

with respect to the chamber floor. For 

this measurement, the network has 0 

dB voltage gain and no correction factor 

is necessary for the actual voltage. 

Figure 2. Radiating structure, following common usage. 

EFFECTIVE FIELD STRENGTH 

MEASURED BY AN IDEAL 

1.04 M ROD ANTENNA 

An analytical derivation is presented of 

the voltage developed on the 1.04 meter 

rod antenna due to radiation from a 

one meter long cable suspended 5 cm 

above a ground plane, spaced one meter 

away, as in Figures 2 and 3a. A separate 

but similar derivation is provided for 

the configuration of Figure 3b. The 

computed values will serve as targets 


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standards 


Drawing 1. Radially directed electric field line 

from center of line of charge of length L. 

The radially symmetric electric field from the center of a 

line of charge of finite length L (drawing 1) is (Gauss’ Law) 

Eqn. 1a 

Figure 3a. MIL-STD-462 Notice 2 through MIL-STD-461E, RTCA/DO-160 

through -160E, CISPR 25-2002 rod antenna set-up. 

where, 

E is the radially directed electric field in Volts per meter, 

0 

is the permittivity of free space (8.85 pF/m) 

L 

is the linear charge density, Coulombs per meter 

r is the radial separation from the line of charge, meters, 

L is the length of the line of charge, 1 meter in our case. 

In order to keep the math tractable, the first two terms 

of a binomial expansion of the radical term are retained. 

This is accurate to within 4%. Equation 1a then reduces to 

Eqn. 1b 

Figure 3b. MIL-STD-461F rod antenna set-up. 

for the experimental measurements which follow. For those 

who wish to skip the derivation, here is an outline of what 

is involved. First the electric field from a line of charge and 

its image as described above is derived using Gauss’ Law. 

Then the component of each field along the length of the 

rod antenna is developed, and then each of those fields is 

integrated along the length of the rod to get the induced 

potential. The end-to-end potentials due to the line and its 

image are summed and compared to the actual measurements 

and the results are captured in Table 1. 

The derivation starts with the static (dc) equation for the 

electric field from a line of charge. The method of images 

is used to get the net electric field at any distance from a 

pair of positive and negative lines of charge. The vertical 

component of the net electric field is integrated over the line 

representing the 1.04 m rod antenna. The integration is the 

potential collected by the rod antenna. The static analysis 

is valid because the rod antenna measurement at one meter, 

below 30 MHz is a quasi-static measurement: both the radiating 

element and the receiving elements are electrically 

short (one-tenth wavelength or less), and the separation 

between radiator and pick-up is less than /2, the accepted 

near field - far field boundary for a near isotropic radiator 

( being wavelength). 

The only value not immediately available in equation 1b 

is the linear charge density. We can use the definition of 

capacitance to express the linear charge density in terms of 

the capacitance of the wire and the potential on it: 

L 

= q/L = CV/L Eqn. 2 

where, 

q is charge, Coulombs, 

C is capacitance in Farads, and 

V is the potential on the line, in Volts 

In the above, we have everything but the capacitance of 

the wire. In order to evaluate that, we have to evaluate the 

expression for the capacitance of a two wire line. 

From Barnes [5], we have 

where S and D are as in drawing 2a. 

Eqn. 3 

Drawing 2a. Geometry for wire 

above ground on left, geometry for 

capacitance calculation on right. 

Because separation between wire 

& image is twice that in actual 

set-up, the value plugged into 

equation 3 for S is 10, not 5 cm. 

For values of S = 5 cm, and D = 1mm (AWG 18), we get 

C = 5.25 pF/m. Actual cable length was 1.1 m. 

Using equation 2, we compute the linear charge density, 

knowing that the line potential is -10 dBm, or 97 dBuV, or 

70.7 mV. 

L 

= 5.25 pF/m*1.1 m * 0.07 Volts = 0.4 pC/m 

Substituting into equation 1b (and noting that L = 1.1 

meter, we have the equation for the electric field from the 


JAVOR 

standards 

wire of our test set-up, but ignoring the effect of the ground 

plane. 

Eqn. 4 

Using the method of images (drawing 2b), we calculate 

the electric field from an identical line of opposite charge 5 

cm below the ground plane. The symmetry of the situation 

is such that between –d/2 and d/2, the horizontal components 

of the two field lines cancel precisely, but the vertical 

components add, and they add in a negative sense. Above 

d/2 the contribution from the two wires are in opposite 

phase and tend to cancel. 

Given the geometry of drawing 2b, the expression for the 

electric field from the above ground wire is 

Eqn. 5a 

or 

Eqn. 5b 

Drawing 2b. Method of images 

geometry. 

We can similarly calculate the electric field from the line 

of charge below the ground plane, which is removed vertically 

by a separation of d. 

where x is vertical displacement from the point on the 

rod opposite the wire closest to the region of integration. 

Equation 5a is the magnitude of the radially directed 

electric field; we desire the vertical component parallel to 

the rod. From the geometry of drawing 2b, the expression 

for the vertical component of the field is 

when 0 < x < d/2 

when x≥ d/2, and 

Eqn. 5c 

Eqn. 5d 


standards 


Just as above, this is the magnitude of the radially directed 

field; we desire the vertical component, which is (x≥d/2) 

or 

Eqn. 5e 

Eqn. 6b 

Between d/2 (5 cm) and 1.04 meter along the rod antenna, 

the electric field from the wire above the ground 

plane contributes a potential given by 

and (when 0 < x < d/2) 

Eqn. 5f 

Eqn. 6c 

Between 0 and d/2 along the rod antenna, the electric 

field from the image wire contributes a potential given by 

The potential induced along any curve due to an electric 

field impinging upon it is given in general by 

Eqn. 6a 

where the integral is understood to be a line integral, 

with electric field in the direction of the curve at every point 

being summed over the length of the curve. 

In the case of the rod antenna, we are integrating over its 

length, starting at the base and ending at the tip 1.04 meters 

above it. We can calculate the potential from the above 

ground wire, and then separately calculate the potential due 

to the image wire, and then, carefully taking into consideration 

the signs, combine the different contributions to arrive 

at the net potential induced in the rod. In order to perform 

the integration, the various expressions for the electric field 

from the above ground wire (equation 5b) and the image wire 

(equations 5e when x≥d/2 and equation 5f when 0 < x < d/2) 

are substituted for E in equation 6a, and dx substitutes for 

dl. Because the vertical components of the electric field are 

parallel to the rod, the dot product of equation 6a becomes 

a simple scalar multiplication. 

In addition to separate expressions for the electric field 

from the image wire according to whether x is either less 

than or greater than d/2, the signs of the fields must be properly 

treated. From 0 to d/2, the contributions from the wire 

and its image add because the vertical component of each 

field is downwards. Above d/2, the vertical components are 

oppositely directed, and they subtract from each other. In 

the case of the MIL-STD-461F set up, with part of the rod 

below the ground plane, there is a short region below the 

ground plane where the field contributions from wire and 

image again subtract, but the signs of each contribution are 

opposite what they are when x > d/2 above the ground plane. 

It is also important to note that the range of integration is not 

based on the rod antenna as an absolute, but in relationship 

to where the radiating wire is. The radiating wire closest to 

the zone of integration is the zero point for integrating. Thus 

in some cases we integrate up from some point along the 

rod, and down the other direction from that point. 


field from the wire above the ground plane contributes a 

potential given by 

Eqn. 6d 

Between d/2 (5 cm) and 1.04 meter along the rod antenna, 

the electric field from the image wire contributes a 

potential given by 

Integrals of the form 

Eqn. 6e 

Equation 6b simplifies to 

with x running 

from 0 to d/2. 

Eqn. 6f 

Equation 6c simplifies to equation 6f with a change of 

sign out front. 

with x running from 

d/2 to 1.04 meters. 

Eqn. 6g 

Equation 6d simplifies to 

with x running 

from 0 to d/2. 

Eqn. 6h 

Equation 6e simplifies to 

with x running from 

d/2 to 1.04 meters. 

Eqn. 6i 

Three problems of interest are the “traditional” or MIL- 

STD-461E set-up, MIL-STD-461F, and a variation on the 

traditional approach where the antenna electronics box at 

the base of the rod sits on top of the counterpoise instead 

of below it. We use equations 6f – i to calculate all the various 

potentials from the wire above ground and its image. 

Then we sum all the contributions. This represents the open 

circuit potential between the rod base and tip and also the 

effective field intensity. Half this calculated potential is the 

open circuit potential on the rod, loaded and then amplified 

by the rod antenna base and presented into 50 Ohms. 

“Traditional” or MIL-STD-461E calculation - Solve for 

the potential on the rod antenna from the radiating wire 

when the base of the rod antenna is the same height as the 

ground plane, and one meter away (Figure 3a). 


JAVOR 


field from the wire above ground contributes an induced potential 

on the rod between 0 and d/2 of -3.6 uV (equation 6f). 


field from the image wire contributes a potential given by 

equation 6h of -15.4 uV (equation 6h). 

Thus the total potential induced from 0 to 5 cm is -19 uV. 

Equation 6g yields a potential of 938 uV induced between 

5 cm and 1.04 meters due to the field from the wire above 

ground. 

Equation 6i yields a potential of -1283 uV induced between 

5 cm and 1.04 meters due to the field from the image 

wire. 

The sum of the potentials over the whole rod is -364 uV, 

or 51.2 dBuV. Per above discussion, this means the effective 

field intensity is 51.2 dBuV/m and the unloaded potential 

appearing at the base of the rod to be amplified is 45.2 dBuV. 

Because the Ailtech 95010-1 rod antenna used in this effort 

loads the open-circuit potential by 2 dB, then provides 0 dB 

voltage gain, the output to an EMI receiver would be 43.2 

dBuV, or -63.8 dBm. 

This is what we expect to measure when configured as 

in Figure 3a. We also have independent verification that 

this value is in the right ballpark. The rationale appendix 

of MIL-STD-461D/E/F cites a relationship between rf potential 

on a 2.5 meter wire below 30 MHz and the radiated 

quasi-static electric field intensity. The transfer function is 

stated to be that the electric field intensity is 40 dB down 

from the rf potential. In the set-up used in this investigation, 

the wire is only 1.1 meter long, therefore we expect the 

transfer function to be 4.25 dB less efficient based on the 

wire length dependence of equation 1a, or 44.25 dB down. 

Starting with a wire potential of 97 dBuV, we expect a field 

intensity of 52.75 dBuV/m. The 51.2 dBuV/m calculation 

agrees within 1.55 dB. 

A similar calculation is performed when analyzing rod 

antenna performance for the Figure 3b MIL-STD-461F 

set-up. Only the limits of integration differ because of the 

relative position of the rod antenna and the radiating wire, 

per drawings 2c and d. 

Referring to drawing 2d, the region 1 analysis is the 

same as that previously for x greater than d/2. Vertical 

components of the electric field from the wire and its image 

are opposite in sense and therefore subtract. In region 2, 

vertical components of the electric field from both wires are 

equal in magnitude and reinforce downwards. In region 3, 

the situation is as in region 1, but the sense of the vectors is 

reversed. Integration limits given with the rod base as zero, 

but to integrate properly, the closest radiating wire position 

is the zero point, as previously discussed. 

In region 1, limits of integration are d/2 to the rod tip 

(0.27 m to 1.04 m referenced to the base of the rod as 

ground). The contribution from the above ground wire 

evaluates equation 6g with these limits of integration to 

yield 657 uV. The contribution from the image wire evaluates 

equation 6i with these limits of integration to yield -966 

uV. So the net potential induced in the rod from 5 cm above 

standards 

tabletop to the tip of the rod is -309 uV. 

In region 2, the limits of integration are –d/2 to d/2, and 

there is symmetry making the problem easier to handle. 

The contribution from both the above ground wire and its 

image are equal and in the same sense, which is negative. 

So our computation is twice the result of the above ground 

wire equation 6f with limits of integration 17 to 27 cm and 

a change in sign. This comes to -30 uV. 

In region 3, the limits of integration are x running from 

the rod base (68 cm above the floor ) to -d/2 (85 cm above 

the floor), with the bench-top ground plane at 90 cm above 

ground. The sense of the contributions is opposite from region 

1: the vertical electric field component from the above 

ground wire points downwards (negative), and the vertical 

electric field component from the image wire points up, positive. 

Further, equation 6g which was derived for the above 

ground wire now applies to the image wire, and equation 

6i, which was derived for the image wire now applies to the 

above ground wire. The contribution from the above ground 

wire evaluates equation 6i with these limits of integration to 

yield -122 uV. The contribution from the image wire evaluates 

equation 6g with these limits of integration to yield 43 

uV. These sum to yield -79 uV. 

Drawing 2c. MIL-STD- 

461F rod antenna set-up. 

Drawing 2d. Geometry 

for limits of integration of 

drawing 2c. 

The sum of the potentials induced in regions 1 – 3 is 

-418 uV, or 52.4 dBuV, so the effective field intensity is 52.4 

dBuV/m. That translates to -62.5 dBm at the EMI receiver. 

This is about 1 dB higher than that predicted for the MIL- 

STD-461E case where the rod antenna base is level with the 

ground plane, and is within 0.5 dB of the 40 dB relationship 

cited in the MIL-STD-461F RE102 appendix. 

There is one final wrinkle to be analyzed. MIL-STD-461F 

precisely controls the height of the rod by stating its center 

point is 120 cm above the floor. But the earlier technique 

doesn’t control the rod height, because some rod bases are 

designed to fit under the counterpoise, which is generally 

level with the tabletop ground plane, and some rod antenna 

bases, such as that used in this investigation, are designed 

to mount on top of the counterpoise, thus boosting the 

rod height by the height of the road antenna base. The rod 

antenna base used in this investigation was 12 cm tall, and 

in the author’s experience, is about as tall as they come. The 

effect of using this base on top of the counterpoise is now 


standards 


Figure 4a. Rf potential on radiating wire 

loaded by 50 Ohms. Span is 2-32 MHz, 

reference is 10 dBm, 10 dB per division 

(-10 dBm = 97 dBuV). 

Figure 4b. Radiated signature using Figure 3a antenna configuration, scanning 2-32 MHz, 

reference level is – 30 dBm. For picture on left, coax connection to chamber was 12 feet, on the 

right it was 24 feet. Uncorrected data; field intensity would be 8 dB higher than levels shown. 

analyzed. The analysis follows that for the traditional set-up, 

except that the limits of integration are from the base of the 

rod 12 cm above ground to 1.04 meter above that – there is 

no need to break the integral into different parts, because 

the vectors now all have the same sense with respect to each 

other over the entire rod length. 

Per drawing 2e we integrate directly from the base at 12 

cm above ground to the top of the rod at 1.04 meters plus 

12 cm. Note that this makes the limits of integration 7 cm 

to 1.04 meters plus 7 cm, because our zero point is the wire 

above ground height of 5 cm. 

50.7 dBuV/m, and the EMI receiver will read -64.3 dBm. 

Analytical results for the three measurements of the same 

radiating wire are compared to measurements presented in 

section IV. Analytical and measured results for all methods 

agree well, except for resonances, which is why the MIL- 

STD-461F approach came about. 

Drawing 2e. More exact simulation 

of Figure 3a. 

Equation 6g evaluates the contribution from the above 

ground wire as 938 uV. Equation 6i evaluates the contribution 

from the image wire as -1282 uV. The net result is -344 

uV, or 50.7 dBuV. This means an effective field intensity of 

*antenna base on top of ground plane 

**from section IV measurements section 

*** absent resonances 

Table 1. Comparison of analytical and measured results. 

The analytical results make the following issues clear: 

the calculation of rod-coupled potential does not depend on 

counterpoise configuration. It was not discussed previously, 

but the only purpose of the counterpoise is to achieve the 10 

pF source impedance of the 1.04 meter rod. Absent a counterpoise, 

that value decreases markedly. A counterpoise is a 

reference against which the rod antenna induced potential 

Figure 4c. 

Counterpoise potential 

and rod antenna 

output super-imposed. 

Ground plane potential 

is the curve that is 

lower at the low end 

and higher after 14 

MHz (2-32 MHz sweep, 

17 MHz at center). 

Figure 4d. Impedance 

between floor 

and counterpoise 

of MIL-STD-461F 

configuration w/o rf 

sleeve. 


JAVOR 

is measured. Since the potential at the 

base of the rod is taken with respect to 

the counterpoise, if the counterpoise potential 

is disturbed, the measurement 

will be off. This is key in designing the 

proper set-up. The proper counterpoise 

configuration is the main subject of the 

following section. 

EXPERIMENTAL VERIFICATION 

First, the problem. The traditional 

Figure 3a set-up yields the cable length 

(and chamber size) dependent resonances 

of Figure 4b. Figure 4a is the 

rf potential on the radiating wire for 

comparison (stimulus vs. response). 

Since the source potential is constant 

with frequency, we expect the 

measured radiated field to be likewise, 

based on the analytical section. Therefore 

we recognize that the Figure 4b 

performance is indicative of a problem 

with the test set-up. This observation 

and the description of the traditional 

set-up point out two problems with [4]. 

[4] doesn’t show the radiating source 

potential, only the radiated fields. 

Departures from a flat response are 

observed over the entire 2-30 MHz 

band. It is not clear in [4] how much of 

the peaks are due to problems in the 

rod antenna set-up vs. problems in the 

radiating element. Secondly, Weston in 

[4] uses ferrite sleeve lining over the 

coax connection in both the -461E and 

-461F set-ups. None of the other the 

other standards besides MIL-STD- 

461F require such treatment. Weston 

displays a knowledge of the problems 

with MIL-STD-461E in so doing, 

but for the purposes of comparing 

and contrasting MIL-STD-461E and 

MIL-STD-461F methods, one cannot 

use ferrite sleeve lining in the MIL- 

STD-461E set-up because there is no 

requirement to do so. 

The source of the resonance problem 

is the reactive impedance between 

counterpoise and chamber 

ground. This consists of the capacitance 

between the counterpoise and 

the chamber surfaces, as well as the 

parallel inductance of the coaxial 

transmission line shield acting as a 

standards 

ground strap between counterpoise 

and chamber. Both the capacitance 

and inductance will be chamber specific. 

The counterpoise is one plate of 

a capacitor working mainly against 

the floor; the effective plate size is the 

arithmetic average of the counterpoise 

area and the floor area. Since the size 

of chambers is uncontrolled (above 

some minimum), the capacitance will 

be larger than some minimum value, 

but otherwise unconstrained. Note 

that the capacitance depends mainly on 

the floor size; even if the counterpoise 

area approaches zero, the floor size 

sets the effective plate size. The length 

of coax cable interconnect is clearly 

dependent on room size and layout, 

and is even less controlled than the 

capacitance. Measurements made in 

the EMC Compliance chamber showed 

capacitance of 50 pF and inductance 

close to 0.5 uH. And that was using the 

MIL-STD-461F configuration less the 

rf sleeve; the inductance would have 

been much higher with a long length 

of coax. For the values measured, the 


standards 


Figure 5a. MIL-STD-461F-type rf sleeve 

resonance detuning. Analyzer settings same 

as for Figure 4b. 

Figure 5b. Impedance plots of Fair-Rite part 

0431176451. 

parallel resonance (open-circuit) is at 

31.8 MHz. This is just above the range 

of resonances seen at most facilities; a 

longer cable and larger floor area would 

have dropped the resonance below 30 

MHz, where it is normally found. Figure 

4c shows the actual potential on 

the MIL-STD-461F counterpoise with 

an rf sleeve to dampen the resonance. 

The potential measured out of the rod 

antenna base is also superimposed. 

Regardless of what the rod output is, it 

is measured with respect to the counterpoise, 

and the effect is very clear in 

Figure 4c. Figure 4d is a network analyzer 

measurement of the impedance 

between floor and counterpoise in a 

full-sized MIL-STD-461 test chamber. 

The inductive nature of the coax 

ground connection (less rf sleeve) and 

the resonance with capacitance is quite 

clear. Again, a longer coax connection 

to ground (“traditional”) configuration, 

would have moved the resonance to a 

lower frequency. 

In Figure 5a, the plot is for the MIL- 

STD-461F configuration, Figure 3b, 

using an rf sleeve solution that meets or 

exceeds MIL-STD-461F requirements. 

That solution, shown lying on the floor 

in Figure 6a, consists of four Fair-Rite 

0431176451 sleeves, with a wire running 

through them that connects to 

a 270 Ohm resistor. The inductive 

reactance of these four sleeves (Figure 

5b) in series is much greater than 270 

Ohms, and the sleeves act as a transformer, 

with the 270 Ohm resistance 

being the impedance of the coaxial 

ground connection at and above 20 

MHz. The total assembly is shown in 

Figure 6a. 

Finally, the optimal solution, which 

is a totally floated counterpoise. A 

Mini-Circuits FTB1-6 balun was used 

as an isolation transformer to isolate 

the counterpoise from chamber 

ground, as shown in Figure 6a. Figure 

6b shows the rod antenna set-up. Figure 

6c shows the resultant plot. 

At this point it is reasonable to ask 

how Figure 6c results stack up against 

“reality.” “Reality” defined as the set-up 

of Figure 7a, with all elements working 

against the floor of the chamber. 

Figure 7b shows the results which are 

about 2 dB lower than the Figure 6c results, 

for the reason that the rod starts 

off 12 cm above the floor, as detailed 

in the theory section. Agreement with 

theory is within 0.2 dB at the mid-point 

frequency. 

THE EFFECT OF GROUNDING 

THE COUNTERPOISE 

Imagine that instead of the typical EMI 

test set-up with a test sample and cables 

on a copper-top bench and a 1.04 meter 

rod antenna spaced a meter away, that 

the rod antenna is between the plates 

of a parallel plate transmission line or 

TEM cell that has enough separation 

between the plates to mount the rod 

antenna with room left over above the 

top of the rod. For specificity, imagine 

the plate to be 2.5 meters tall, with 

the base of the rod antenna resting 

on (ohmically attached to) the bottom 

(ground) plate. Such a plate should 

be well behaved at frequencies up to 

the 2.5 meter height representing a 

tenth wavelength, or 12 MHz. If an rf 

potential, V, is applied to the top plate 

relative to the bottom plate, then the 

Figure 6a. Rf sleeves and resistor that place 

270 Ohms between counterpoise and floor 

above 20 MHz, and isolation transformer that 

floats counterpoise. 

Figure 6b. MIL-STD-461F configuration using 

isolation XFMR visible near floor ground point. 

Assembly to the right is the rf sleeve network 

that gave the plot of Figure 5a. 

Figure 6c. Resultant plot from set-up of 

Figure 6b. Note close agreement with 

theory (-62.5 dBm). 

electric field near the middle of the 

plate (ignoring fringing) will be [V/2.5] 

Volts per meter straight up and down 

perpendicular to the area of the plates. 

The rod antenna output, corrected for 

antenna factor, should yield this same 

electric field. Now imagine that the rod 


JAVOR 

standards 

Figure 7a. “Reality” check configuration. 

Separation of radiating line from back wall the 

same as when on table-top ground plane. 

antenna base is raised off the bottom 

plate about 60 cm, the approximate 

height as required by MIL-STD-461F. 

What will the rod antenna indicate 

the field to be in this new position? We 

know the field is constant, so we should 

get the same answer. The integration 

along the rod will yield the same 

result, because the field is constant. 

If the rod antenna base and attached 

counterpoise is floated, then indeed we 

will ge t the same answer, because the 

rod potential is measured against its 

base, and all that has happened is that 

the rod top and base are at different 

potentials with respect to the ground 

plate, but the potential difference between 

top and base has not changed. 

But if we connect the antenna base/ 

counterpoise to the ground plate, we 

are now creating a new ground 60 cm 

higher than previously, and that means 

the electric field is now the potential 

on the top plate divided by 2.5 meters 

less 60 cm, or [V/1.9] V/m. Clearly the 

electric field intensity has increased, 

and we will read this new value. Figure 

3 of [4] includes supporting data. 

Measurements made above a floated 

counterpoise using a balanced antenna 

in lieu of a rod where the rod would 

normally be are much flatter and lower 

than with the counterpoise grounded. 

It seems reasonable based on this 

model, that floating the counterpoise 

perturbs the field less than grounding 

it, and on this basis a floated counterpoise 

appears the best solution. 

CONCLUSION 

The 1.04 meter rod is an electric field 

probe, not an antenna. The analytical 

section demonstrates this by performing 

a static computation of the output 

of such a rod when exposed to a welldefined 

source field. Close correlation 

with experimental results establishes 

the probe-like nature of the rod “antenna.” 

A key point is made that the 

measured potential induced in the 

rod is compared to the potential of 

the counterpoise. If the counterpoise 

potential is different than the ground 

of the measurement facility, errors 

ensue. Further, if the counterpoise 

ground connection disturbs the field 

being measured, the act of measuring 

then disturbs what is being measured. 

Three typical set-ups for measuring 

electric field intensity with a 1.04 meter 

rod antenna have been described. 

Of the three techniques discussed, 

a floated counterpoise is the best 

overall solution. The MIL-STD-461F 

solution comes in second, and indeed 

is very close if the rf sleeve makes the 

coaxial ground connection resistive 

rather than inductive. The “traditional” 

technique connecting the counterpoise 

to the table-top ground plane and using 

a ground connection of indeterminate 

length (coax connection) between the 

antenna base and chamber ground 

causes unacceptable resonances. 

ACKNOWLEDGMENTS 

The author would like to thank Mr. 

John Zentner for advice and consultation 

during the investigation which 

culminated in this report. Mr. Zentner 

is retired from Wright-Patterson Air 

Force Base, Dayton, Ohio. During his 

tenure there, he chaired the Tri-Service 

Working Group that generated MIL- 

STD-461E. Before that, he was an Air 

Force representative to the Tri-Service 

Working Group that generated MIL- 

STD-461D and MIL-STD-462D. Mr. 

Tim Travis of ERC, Inc. at the Redstone 

Technical Test Center E3 Test Group 

(Redstone Arsenal, Huntsville, Alabama) 

provided detailed critiques of 

the work in progress that culminated 

in this report. The author is grateful 

for the many suggestions Mr. Travis 

made. Mark Nave made many useful 

Figure 7b. “Reality” check data plot. Level 

within 2 dB of the MIL-STD-461F configuration 

(Figure 6c). 

suggestions relating to the presentation 

of the analysis. Robert Scully, lead 

over EMC at NASA’s Johnson Space 

Center, made suggestions pertaining 

to the calculation of wire capacitance. 

These suggestions resulted in closer 

agreement between analytical and experimental 

results. Any errors are the 

sole responsibility of the author. 

REFERENCES 

• [1] Jensen, Steve, “Measurement Anomalies 

Associated with the 41 Inch Rod Antenna 

when Used in Shielded Enclosures,” July 17, 

2000, . 

• [2] Turnbull, Luke, “The Groundplane Resonance: 

Problems with Radiated Emissions 

Measurements below 30 MHz.” Automotive 

EMC Conference 2007. 

• [3] Javor, Ken, “History of 41 Inch Rod Antenna 

Use in EMI Testing,” . 

• [4] Weston, David, “1.04 m Rod, Antenna 

Factor and Received Level in MIL-STD- 

462/461E Compared to MIL-STD-461F Test 

Set Up,” Interference Technology EMC Test 

and Design Guide, November 2010: 8-13. 

• [5] Barnes, John, “Electronic Systems Design 

Interference and Noise Control Techniques,” 

Prentice-Hall, 1987: 175-178. Print. 

Ken Javor has worked full time in the field of 

military and aerospace EMC since 1980. He is an 

industry representative to the DoD Tri-Service 

Working Groups that write MIL-STD-464 and 

MIL-STD-461. He founded EMC Compliance in 

1992, providing EMC expertise to government 

and industry both in running EMC control programs, 

providing training on E3-related topics, 

and testing and solving problems. n 


shielding / cables & connectors 

Num e ric a l S o l u t i o n of C o mpl e x EMC Probl e m s 

Numerical Solution of Complex EMC 

Problems Involving Cables with Combined 

Field / Transmission Line Approach 

Marlize Schoeman 

Ulrich Jakobus 

EM Software & Systems – S.A. (Pty) Ltd 

Stellenbosch, South Africa 

Many problems of electromagnetic 

compatibility and interference 

involve cables, which either radiate 

through imperfect shields and cause coupling 

into other cables, devices or antennas, 

or which receive (irradiation) external electromagnetic 

fields (radiated from antennas 

or leaked through other devices) and then 

cause disturbance voltages and currents 

potentially resulting in a malfunctioning 

of the system. 

From the background that in modern 

systems cables play such a dominant role 

(e.g. in the automotive environment a car 

these days has several kilometers of cables) it 

is crucial that already in the design process 

of electromagnetic systems such coupling 

Figure 1. Generic car model including a cable path. 

/ radiation / irradiation effects involving 

cables are taken into account from an EMC 

perspective. A simple example for this is 

shown in Figure 1 (cable bundle inside a car). 

Shortened design cycles do not leave time 

to perform extensive measurements and 

correct the system, rather designs are done 

using CAD without physical models and 

only final verification / compliance measurements 

are done. To this end, we review 

in this article the solution of combined electromagnetic 

field / cable problems and their 

numerical solution with computer simulation 

techniques. All the formulations and 

examples presented in this paper are based 

on FEKO [1], which in its Suite 6.1 release 

provides such integrated cable modeling 

facilities in both the computational kernel 

and the user interface (traditionally FEKO 

has been a field computation package with 

interfaces to various other cable modeling 

codes). 

COMPUTATION OF 

ELECTROMAGNETIC FIELDS 

The central aspect of modeling both the 

radiation and irradiation of cables in a 

complex environment (e.g. Figure 1 cable 

in an automotive environment) is, besides 

the cable modeling as such, the ability to 

compute electromagnetic fields. 

An example of such an electromagnetic 

field problem (without cable) is shown in 

Figure 2 where a log-per EMC measurement 

antenna is radiating and exciting electromagnetic 

fields which interact with the 




Figure 2. Log-per antenna radiating electromagnetic fields which interact with the device under test (here a car body) and cause 

an interference pattern. 

device under test (here a car) and the near-field depicted in 

this figure shows the resulting interference pattern. 

To solve such problems, FEKO is based on the Method 

of Moments (MoM) [2]. Metallic surfaces are discretized 

into triangular patch elements and wires are meshed into 

segments (with mesh elements being small compared to 

the wavelength), and then with certain basis functions the 

currents and charges are represented on this mesh with 

unknown complex coefficients. A procedure similar to the 

classic implementation of Rao, Wilton, and Glisson (RWG) 

in [3] is followed to obtain these unknown coefficients by 

solving a system of linear equations, which for open bodies 

(i.e. with holes / apertures) is derived from the electric field 

integral equation. 

As compared to this traditional formulation (the RWG 

basis functions celebrate their 30th birthday this year), many 

improvements have been made over the years. For instance, 

in FEKO not only metallic but also dielectric bodies can 

be handled, special formulations for shielding from finite 

conducting material are available, a fast frequency sweep 

based on adaptive interpolation techniques, using current 

computer technologies like multi-core, parallel cluster 

processing or also GPU computing, or special solution 

techniques exist for integrated windscreen antennas [4] 

(common in many modern cars). 

Despite this, one might find the solution of high frequency 

problems with the MoM is too challenging even 

on modern computers (due to memory and run-time constraints). 

To overcome this problem, we have hybridized 

the MoM with special high frequency techniques (such as 

Physical Optics or Diffraction Theory), and have accelerated 

the MoM leading to the Multilevel Fast Multiple Method 

(MLFMM) [5] or using Adaptive Cross Approximation 

(ACA) [6]. For complex problems involving multiple media 

also a full bi-directional FEM/MoM hybrid method is available 

[7] (FEM = Finite Element Method). 

SOLUTION OF COMPLEX CABLE PROBLEMS 

Multi-Conductor Transmission Line (MTL) Theory 

In principle, the methods presented in the previous section 

(MoM, MLFMM, FEM etc.) can solve arbitrary problems, 

which also include cables. For such a solution, then all 

the details would have to be included in the model and 

discretized (e.g. multiple wires in a cable bundle, all the 

dielectric insulations, shields etc.). For practical problems, 

this is not possible (for simple problems it is possible and 

will be done later for some validation examples). In the 

following we give a review of the Multi-Conductor Transmission 

Line (MTL) Theory which can solve complex cable 

problems very efficiently. 

In many ways transmission line theory bridges the gap 

between full wave solutions and basic circuit theory. As 

such, the phenomenon of wave propagation on transmission 

lines can be approached from an extension of circuit theory 

or from a specialization of Maxwell’s equations. 

As shown in Figure 3 an incremental length of a twoconductor 

transmission line can be described by the Telegrapher’s 

equations [8] 

Figure 3. Distributed parameters for an incremental length of 

transmission line. 




Entry Analytical [pF/m] FEM Solver [pF/m] Relative Error [%] 

C11 14.9395 14.9718 0.22 

C12 -6.0894 -5.5062 9.58 

C22 18.8111 18.7565 0.29 

C13 -1.6117 -1.4734 8.58 

C23 -6.0894 -5.5069 9.56 

C33 14.9395 14.9710 0.21 

Figure 4. Selection of some of the cable types supported in FEKO. 

Figure 5. Parameters for the computation of the per unit length 

inductances of widely separated wires above a ground plane. 

Table 1. Transmission line per unit length capacitance matrix entries 

for three widely spaced conductors above ground: Comparison of 

analytical values with the numerical static FEM solution. 

the cross sectional dimension information about a specific 

line is contained in these parameters. 

Under the fundamental transverse electromagnetic field 

structure assumption, the per unit length parameters of 

inductance, capacitance, and conductance are determined 

as a static solution to Laplace’s equation 2 (x,y)=0 in the 

two-dimensional cross sectional (x,y) plane of the line. 

The determination of the per unit length parameters can 

be simple or very difficult depending on whether the cross 

sections of the conductors are circular or rectangular, and 

whether the conductors are surrounded by a homogeneous 

or an inhomogeneous dielectric medium. 

In fact, there are very few transmission lines for which 

the cross sectional fields can be solved analytically to give 

simple formulas for the per unit length parameters. To illustrate, 

the self-inductance and mutual inductance terms 

of n widely spaced cores above an infinite ground (see Figure 

5) can be derived as [9] 

Figure 6. Field excitation of a transmission line using only voltage 

sources (Agrawal method). 

where x denotes the longitudinal direction and parameters 

Z and Y are the per unit length impedance and admittance 

parameters of the line 

Z = jωL + R 

Y = jωC + G. 

As a generalization to the two-conductor system, a multiconductor 

transmission line model is simply a distributed 

parameter network for an arbitrary cable cross section (see 

Figure 4) where the voltages and currents can vary in magnitude 

and in phase over its length. 

Per Unit Length Cable Parameters 

The per unit length parameters of inductance, capacitance, 

resistance and conductance are essential ingredients in the 

determination of transmission line voltages and currents 

from the solution of the transmission line equations. All of 

where r wi 

is the wire radius, h i 

is the wire height above 

ground and s ij 

is the center to center spacing between wires. 

If however these cores are surrounded by an insulation 

medium or the separation is not wide, one has no alternative 

but to employ approximate, numerical methods. In 

FEKO a 2D static FEM solver to Laplace’s equation is used. 

Table 1 compares the analytic to the numerical per unit 

length capacitance matrix entries for 3 wires above ground 

(r w1 

=r w3 

=1.0 mm, r w2 

= 1.5 mm, h 1 

=h 3 

=52 mm, h 2 

=50 mm, 

s 12 

=s 23 

=15.13 mm, s 13 

=30 mm. The 2D FEM solution is based 

on minimizing the stored field energy per unit length. The 

self-capacitance matrix entries are a direct function of the 

total energy in the system, and hence these terms agree 

very well with those of the analytic prediction. The mutual 

capacitance matrix entries are derived from the FEM solution 

(integration over -) and as such use a lower order approximation, 

also explaining the larger differences between 

the analytic and numerical solutions. 


S c h o e m a n, Ja k o bu s 


Figure 7. Braided cable showing different weave parameters. 

Coupling of External Fields into Cables 

Transmission lines can be excited by electromagnetic fields 

where their effect is to induce currents and voltages on the 

line and in the load impedances at the ends. There are three 

approaches for describing the coupling of an external field 

to a line using transmission line theory: the Taylor approach 

[10], the Agrawal method [11] and the Rashidi method [12]. 

Each of these coupling formulations gives the same response 

for the transmission line, although there are subtle differences 

in these techniques. 

In FEKO the coupling of external fields into cables is 

considered with the scattered voltage formulation described 

by Agrawal. The problem can be considered to be an electromagnetic 

scattering process in which the tangential 

incident electric field along the conductors can be viewed 

as distributed voltage sources exciting the transmission 

line (see Figure 6). 

Treatment of Cable Shields 

In transmission line theory, the conductors in a cable 

bundle can be grouped into outer and inner circuits, each 

of which is coupled with a mutual conductor called a shield. 

The outer and inner circuits are completely separated by 

this shield, except that they are connected by current- and 

voltage-controlled sources (there should be no other connection 

between outer and inner circuits). The shield coupling 

parameters defining these controlled sources are termed 

transfer impedance Z T 

and transfer admittance Y T 

, which 

may be formally defined as follows 

where I s 

, V s 

and I i 

, V i 

are the currents and voltages on the 

outer shield and inner conductor of the separate circuits. 

Both Z T 

and Y T 

are basically dependent on the geometric 

and physical properties of the conductor system and as such 

are valid for both solid and braided shields. 

For a solid tubular shield, the Schelkunoff model [13] is 

typically used 



Figure 8. Combination of a transmission line (TL) and method of 

moments (MoM) code for solving the irradiation problem. 


where D=[I 1 

(γb) K 1 

(γa)-I 1 

(γa) K 1 

(γb)] and γ=√jωμ(σ+jωε), 

while a and b are the inner and outer radius of the shield 

respectively. The electrostatic shielding is much greater than 

the magnetostatic shielding, and as a result, the transfer 

impedance term dominates at low frequencies. This fact has 

led many investigators to neglect the transfer admittance 

term in EMC coupling problems. 

For braided shields as in Figure 7, the model proposed 

by Kley [14] is very popular. The coupling mechanism 

giving rise to the transfer impedance and admittance are 

enhanced, due to the field penetration through the shield 

apertures. At low frequencies, the electrostatic shielding of 

the braid is much better than the magnetic field shielding 

(Y T 



distribution in the vicinity of the bundle and conducting 

surface, which is valid only when the gap is small. Stated 

differently, when there is no external conducting surface 

close to the cable path the external problem cannot be solved 

using cable theory. 

In FEKO a MoM/MTL combined approach was introduced 

to avoid this problem. As shown in Figure 9, a shielded 

cable bundle may now follow an arbitrary path, with the ends 

connected at two points on a metal structure. The method 

relies on the assumption that the exterior (structure and 

Figure 11. FEKO model of a monopole antenna close to an RG58 coaxial 

cable above ground. 

or CRIPTE as cable modeling tools, see Figure 8 for a flow 

chart), or can also be integrated into one code (such as 

FEKO Suite 6.1) allowing for a better user experience (one 

common user interface, no data export / import). 

This standard MTL approach does pose some challenges, 

e.g. that common mode currents and radiation loss cannot 

be modeled. One of the main limitations is that a cable 

bundle must run close to a conducting surface, typically 

with less than λ/5 spacing [16]. The reason for this restriction 

is that the formulation is derived assuming a TM field 

Figure 12. Magnitude of the induced voltages at the cable end closest 

to the antenna. 

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Figure 13. FEKO model for an L-shaped single conductor cable over a 

ground shape. 

shield) and interior (cable bundle) problems only couple 

weakly through the transfer impedance. A very similar 

approach has been proposed in [17]. 

The steps of the irradiating case of the analysis method 

are shown in Figure 10 and are as follows: 

1. Set up the problem geometry and cable analysis request. 

The metallic structure will be meshed with triangular 

elements. The exterior of the cable path will be included 


in the full-wave analysis with the MoM using thin shell 

wire segment elements of which the radius, thickness 

and material properties are the same as that of the shield. 

2. Solve the external MoM system to obtain the shield (wire 

segment) exterior current. The MoM solution yields the 

total current flowing on the shield exterior. 

3. Use the transfer impedance of the shield to convert the 

exterior shield current to a distributed voltage source 

exciting the multi-conductor transmission line interior 

problem. 

4. Solve the internal problem using multi-conductor transmission 

line circuit analysis. 

In a similar manner also the radiating case can be dealt 

with. 

VALIDATION AND APPLICATION EXAMPLES 

Although the techniques presented in this paper can be 

applied to complex real-world problems (e.g. cable harness 

running in a car), we present in the following rather simple 

validation and application examples. These examples have 

the advantage that full wave MoM solutions (i.e. discretizing 

the cable into MoM wire segments) exist as reference 

to compare to the combined MoM/MTL technique, or 

measurements / reference results from literature based on 

other techniques or other implementations available. 

RG58 Coaxial Cable Close to Monopole Antenna 

(Irradiation) 

A monopole antenna of 10 m height is fed by an input power 

of 10 W and is radiating in the neighborhood of an RG58 

coaxial cable which forms a U-shaped loop of length 24.24 

m. The axis of the cable is assumed to be 10 mm above a PEC 

ground with both shield ends short-circuited to ground. 

The coaxial core is terminated in 50 Ω to the shield and 

the shield transfer impedance is available from a measurement 

database. The frequency range extends from 1 MHz 

to 35 MHz. Figure 11 shows the configuration setup while 

Figure 12 compares the FEKO solution to reference results 

[18] for the voltage at the cable end closest to the antenna 

(Port 1). The results from [18] are based on a standard MTL 

/ MoM combination which is only applicable to cables 

Figure 14. Magnitude of the induced current in the load at CCend. 




running close to ground, which is the 

case here, thus one can consider [18] as 

independent reference here. 

Single L-Shaped Conductor Line 

above Finite Ground (Irradiation) 

In Figure 13, the geometry setup of a 

single wire cable (radius 2 mm) over 

a finite size ground plane with side 

walls is shown. Both ports are terminated 

in high impedance (15 kΩ). The 

excitation is by a right-hand circular 

polarized plane wave (magnitude 3 

V/m; polarization angle 450). Figure 14 

compares the induced current in the 

load at CCend using different methods 

available in FEKO (full MoM reference 

solution in green, MoM for the plate 

and standard MTL for the cable in blue, 

and the combined MoM/MTL method 

where the outer cable problem is also 

solved with MoM in red). All these results 

agree very well. The two MTL results 

agree very well to the standalone 

MoM result, which can be considered 

a reference solution (see our comments 

above, such a full wave MoM solution is 

accurate, but can be obtained only for 

simple configurations due to the effort 

with regards to memory and run-time). 

Shielded RG58 Cable above 

Ground Plane with Gap 

(Radiation) 

In this example radiation from an 

RG58 C/U coaxial cable to a nearby 

antenna is computed. Two different 

ground plane arrangements were investigated 

(see Figure 15): (a) common 

ground between the cable source at 

CC_Port1 and load at CC_Last; (b) 

separate grounds (2 cm apart) between 

the cable source and load leaving a gap. 

The presence of separate ground 

structures for the configuration (b) 

restricts the usage of standard MTL 

techniques. The outer problem can no 

longer be solved using cable theory as 

there is no return path for the current 

to flow below the cable path. However, 

when using the unique MoM/MTL 

combined approach in FEKO, the 

current on the cable shield exterior is 

solved using MoM where there is no 

limitation regarding the cable path 

w.r.t. the surrounding geometry. 

As this is not a single wire but a real 

Figure 15. FEKO model for the geometry setup 

of a shielded RG58 cable above different 

ground plane arrangements: (a) one single 

ground plane under the cable and (b) two 

separated ground planes with a slot inbetween. 

RG 58 cable, a simple MoM reference 

solution without involving MTL is not 

possible here. Also as explained the 

standard MTL (without MoM combination) 

cannot be used, thus the only 

available validation here are measurement 

results (obtained independently 

from our calculations). Figures 16 and 

17 compare the FEKO MoM/MTL 

combined approach to measurement 

results for the two different ground 

plane arrangements, and for both 

configurations (with and without gap 

in the ground plane) the agreement is 

again very good. 

CONCLUSIONS 

We gave an overview on how modern 

electromagnetic simulation techniques 

can handle combined field / cable 

problems, both for radiation and irradiation. 

The different approaches to 

handle such problems were summarized, 

and we introduced in particular 

a combination of MTL and MoM where 

the outer transmission line problem 

(shield and ground) is solved with 

MoM which enables one to solve cable 

problems where there is no distinct 

nearby ground plane (e.g. ground far 




Figure 16. S-parameter comparison for shielded RG58 cable above 

common ground plane, configuration (a). 

Figure 17. S-parameter comparison for shielded RG58 cable above 

ground plane with gap, configuration (b). 

away, or ground with holes / slots). 

Several examples were presented and 

solved with the computer code FEKO, 

demonstrating the successful application 

of these techniques. 

REFERENCES 

• [1] FEKO, www.feko.info 

• [2] R.F. Harrington, “Field Computation by 

Moment Methods,” Macmillan Company, 

New York, 1968. 

• [3] S.M. Rao, D.R. Wilton, and A.W. Glisson, 

“Electromagnetic Scattering by Surfaces of 

Arbitrary Shape,” IEEE Transactions on 

Antennas and Propagation, Vol. 30 No. 3 

May 1982: 409-418. Print. 

• [4] U. Jakobus, and M. Schoeman, “Effiziente 

Analyse von Integrierten Scheibenantennen,“ 

5. GMM Fachtagung Elektromagnetische 

Verträglichkeit in der Kfz-Technik, 

BMW-Welt München, Oct. 2009. Print. 

• [5] U. Jakobus, J. van Tonder, and M. Schoeman, 

“Advanced EMC Modeling by Means 

of a Parallel MLFMM and Coupling with 

Network Theory,” IEEE International Symposium 

on Electromagnetic Compatibility, 

Detroit, Mich. USA Jul. 2008. Print. 

• [6] S. Rjasanow, and O. Steinbach, “The Fast 

Solution of Boundary Integral Equations,” 

Springer, New York, 2007. 

• [7] F.J.C. Meyer, D.B. Davidson, U. Jakobus, 

and M. Stuchly, “Human Exposure Assessment 

in the Near Field of GSM Base Station 

Antennas using a Hybrid Finite Element 

/ Method of Moments Technique,” IEEE 

Transactions on Biomedical Engineering, 

Vol. 50 Feb. 2003: 224-233. Print. 

• [8] F. Tesche, M. Ianoz, and T. Karlsson, 

“EMC Analysis Methods and Computational 

Models,” Wiley-Interscience, 1997. 

• [9] C. Paul, “Analysis of Multiconductor 

Transmission Lines,” Wiley-Interscience, 

Second Ed., 2008. 

• [10] C.D. Taylor, R.S. Satterwhite, and C.W. 

Harrison, Jr., “The Response of a Terminated 

Two-Wire Transmission Line Excited by a 

Nonuniform Electromagnetic Field,” IEEE 

Transactions on Antennas and Propagation, 

Vol. AP-13 No. 6 Nov. 1965: 987-989. Print. 

• [11] A.K. Agrawal, H.J. Price, and S.H 

Gurbaxani, “Transient Response of Multiconductor 

Transmission Lines Excited 

by a Nonuniform Electromagnetic Field,” 

IEEE Transactions on Electromagnetic 

Compatibility, Vol. EMC-22 No. 2 May 1980: 

119-129. Print. 

• [12] F. Rashidi, “Formulation of Field-to- 

Transmission Line Coupling Equations in 

Terms of Magnetic Excitation Field,” IEEE 

Transactions on Electromagnetic Compatibility, 

Vol. EMC-35, No. 3 Aug. 1993: 

404-407. Print. 

• [13] S.A. Schelkunoff, “The Electromagnetic 

Theory of Coaxial Transmission Lines and 

Cylindrical Shields,” Bell Syst. Tech. Journal, 

Vol. 13, 1934: 522-579. Print. 

• [14] T. Kley, “Optimierte Kabelschirme – 

Theorie und Messung,” Ph.D. dissertation, 

Swiss Fed. Inst. Tech., Zürich, 1991. 

• [15] C.A. Nucci, and F. Rachidi, “On the 

Contribution of the Electromagnetic Field 

Components in Field-to-Transmission Line 

Interaction,” IEEE Transactions on Electromagnetic 

Compatibility, Vol. 37 Nov. 1995: 

505-508. Print. 

• [16] G. Andrieu, L. Kone, F. Bocquet, B. 

Demoulin, and J.-P. Parmantier, “Multiconductor 

Reduction Technique for Modeling 

Common-Mode Currents on Cable Bundles 

at High Frequency for Automotive Ap- 

plications,” IEEE Transactions on Electromagnetic 

Compatibility, Vol. 50 Feb. 2008: 

175-184. Print. 

• [17] S. Helmers, H.-F. Harms, and H.-K. 

Gonschorek, “Analyzing Electromagnetic 

Pulse Coupling by Combining TLT, MoM, 

and GTD/UTD,” IEEE Transactions on 

Electromagnetic Compatibility, Vol. 41 Nov. 

1999: 431-435. 

• [18] H.-D. Brüns, and H. Singer, “Computation 

of Interference in Cables Close to Metal 

Surfaces,” IEEE International Symposium 

on EMC, Denver, Col. 1998: 981-986. Print. 

Marlize Schoeman received the B.Eng-M. 

Sc.Eng and PhD degrees in Electronic and 

Computer Engineering from the University of 

Stellenbosch, South Africa, in 2003 and 2006, 

respectively. There she has been involved with 

research activities concerning computational 

electromagnetics and rational function interpolation 

and approximation techniques. Since 

July 2006 she has been with EM Software & 

Systems, Stellenbosch, South Africa, where she 

is doing research and development on the kernel 

of the FEKO code. 

Ulrich Jakobus received the diploma, PhD 

and Habilitation (venia legendi) degrees in 

Electrical Engineering from the University of 

Stuttgart, Germany, in 1991, 1994, and 1997, 

respectively. There he has been actively involved 

in research on numerical techniques for the solution 

of electromagnetic problems with special 

emphasis on EMC, and this research lead to the 

computer code FEKO. Since October 2000 he 

is with EM Software & Systems, Stellenbosch, 

South Africa, with the roles of Director, FEKO 

Product Manager, and team leader of the FEKO 

kernel team. n 


adiated emissions 

G o ing from A n a l o g t o Digi ta l 

Going from Analog to Digital 

Radiated emissions performance of a 

nuclear plant control system from 10 kHz to 6 GHz 

Philip F. Keebler 

EMC Group, Electric Power Research Institute 

Knoxville, Tennessee USA 

Stephen Berger 

TEM Consulting, LLC 

Georgetown, Texas USA 

Nuclear power plants (NPPs) in the 

United States have been undergoing 

upgrades from analog instrumentation 

and control (I&C) equipment to digital 

equipment over the past several years. Upgrades 

have been occurring on the plant 

floor for systems such as generator controls, 

turbine supervisory controls, and chiller 

controls as well as control systems in the 

plant control room. Plant events involving 

electromagnetic interference (EMI) continue 

to occur with existing analog equipment 

and with some digital equipment. Because 

of the increased focus on safety and efforts 

to eliminate plant events, electromagnetic 

compatibility (EMC) is still a growing concern. 

The migration from analog I&C equipment 

to digital I&C equipment warrants the 

need to investigate the EMC characteristics 

of changing electromagnetic environments. 

These characteristics have been identified 

through Electric Power Research Institute 

(EPRI) research by conducting long-term 

emissions measurements before analog 

I&C systems are removed, and then again 

after new digital I&C systems were installed 

and operational. This paper presents the 

first-of-its-kind analysis of a complete set of 

radiated emissions measurement data from 

100 Hertz to 6 GHz as part of an upgrade 

inside a control room to replace an analog 

control system with a digital control system 

for one operating unit of a nuclear plant in 

the United States. 

Keywords- Digital upgrade, control 

room, radiated emissions, electromagnetic 

interference 

INTRODUCTION 

Electromagnetic characterization of spaces 

where electrical and electronic equipment 

must coexist is a necessary function of EMC 

for reasons discussed below. These spaces 

include areas inside and outside facilities 

that serve residential, commercial, industrial, 

and specialty needs such as healthcare 

and power plants. Operations of equipment 

in these spaces create the overall electromagnetic 

environment (EME). 

Diverse Equipment Designs and 

Design Changes 

About the only commonality between electronic 

equipment in today’s modern world, 

including digital I&C equipment used to 

upgrade older analog I&C equipment in 

existing power plants, is the need for equipment 

to use AC or DC power to operate. 

With rapidly changing semiconductor 

technologies, the growing use of new digital 

devices, and the proliferation of software 

development and its embedded use to 

enhance the I&C functions of NPPs, I&C 

equipment manufacturers are developing 

new types of I&C equipment. The need for 

smaller more efficient equipment with faster 

processing speeds and increased network 

connectivity with higher reliability causes 

an increase in radiated and conducted 

emissions. Although filtering and shielding 



technologies are getting better, manufacturers still only use 

the amount of filtering and shielding needed to pass EMC 

regulatory tests. Designers are not keeping pace with the 

new mitigation technologies for controlling emissions. I&C 

designs are moving faster into digital than EMC mitigation 

devices are being used to control emissions generated by 

the digital devices. Regardless of which type of electronic 

device is brought into a plant, one can rest assured that 

the plant’s EME will include its emissions characteristics. 

Moreover, emissions characteristics are more additive than 

subtractive, resulting in cumulative emissions increases over 

time as existing power plants continue to install new equipment. 

Manufacturers are focused on producing equipment 

designs that meet existing critical US Nuclear Regulatory 

Commission (NRC) requirements. In some cases where 

NRC requirements for digital I&C equipment have not yet 

been developed or are not yet mature, manufacturers are 

working with plant engineers, the NRC and EPRI to develop 

new requirements. 

Changes in Equipment Shielding Characteristics 

Shielding provides a two-way function for EMC performance—helping 

to protect equipment from external emissions 

(e.g., from cell phones and walkie-talkie radios) and 

helping to reduce emissions generated inside equipment 

(e.g., from power supplies and microprocessors). Shielding 

manufacturers and users have no formal method of determining 

the shielding effectiveness of shields smaller than a 

two-meter cube. Thus, small shields that are used in portable 

radio devices and digital I&C equipment, for example, may 

not be performing as manufacturers expect. However, the 

Institute of Electronic and Electrical Engineers (IEEE) is 

presently sponsoring a project (IEEE P299.1) to develop a 

new standard describing new test methods for measuring the 

shielding effectiveness of shields having dimensions between 


0.1 and 2 meters. This standard will be published in 2011. 

Changes in Design and Use of Portable Radio 

Devices 

Rapid development of sophisticated devices (e.g., cell phones, 

wireless headsets, electronic book readers, etc.) has increased. 

Networks (i.e., the tower) can initiate changes in radio power 

to ensure connectivity resulting in increased power levels. 

The increased use of portable radios and radio applications 

results in the increased difficulty in controlling use. 

Changes in Definition, Use, and Management of 

Electromagnetic (Radio) Spectrum 

Increased use of stationary and portable electronic equipment 

combined with additional radio and television (digital) 

broadcast towers and wireless services results in more complex 

spectrum. Increased use of high-speed data communications 

in NPPs will also impact the spectrum. Changes 

in the use and management of spectrum will be seen in the 

future with new rulings by the US Federal Communications 

Commission (FCC). Changes in other countries may also 

occur that will affect use of the spectrum and it energy 

in NPPs abroad. Composite effects of each additive electromagnetic 

energy source needs to be identified as NPPs 

continue to change before NPPs reach a plateau where new 

EMI problems begin to surface. 

Use of Spectral Data 

It is a reasonable, standardized, and customary practice to 

collect spectral data from EMEs, especially when industries 

can report that EMI problems continue to occur, present 

serious plant operations, and that equipment environments 

are changing. In the NPP industry, this is a two-fold 

problem. First, in existing plants, digital upgrade projects 

continue in growing numbers as plants meet planned needs 

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and identify new needs to replace older analog I&C equipment. 

For various reasons, some plants plan and request 

limited-scope surveys at the point-of-installation (POI). 

Surveys are carried out to gain additional knowledge regarding 

the EME prior to the upgrade and how the installation 

of the new equipment affected the EME. Of the surveys that 

EPRI has carried out between 2001 and 2010, unexpected 

knowledge regarding the EME was always learned after the 

survey. Utility customers reported after their review with 

the NRC regarding their digital upgrade projects that the 

initiative taken to do the survey and the information gained 

from doing it were positive steps in helping the plant, the 

NRC, and the NPP industry to understand more about 

EMC concerns and help achieve enhanced EMC for digital 

upgrade projects. 

Secondly, utility engineers engaged in the design of 

advanced NPPs have expressed the importance of having 

POI surveys carried out prior to actually constructing new 

advanced plants. One might ask, “How can this be done?” As 

part of the design process, a pre-operational demonstration 

is built for the digital I&C equipment planned for use in new 

plants. Survey activities can be carried out in these areas 

for each utility planning an advanced plant. Measurements 

to characterize the low-frequency radiated magnetic fields 

and low- and high-frequency radiated electric fields can 

be made. Conducted emissions measurements of low- and 

high-frequency can also be made. In fact, there is technical 

benefit to making these measurements in these areas away 

from the cluttered EMEs of advanced plants after they are 

built. Data from such measurements will be useful in the 

development of an emissions analysis database and can be 

used to compare to the emissions captured during EMC 

certification of digital I&C equipment, emissions from analog 

I&C equipment, from historical surveys in existing plants, 

recent surveys in existing plants and emissions captured 

when advanced plants are completed as well as emissions 

captured during an EMI investigation. 

radiated emissions 

If requested as a part of the survey, conducted emissions 

could have been measured along power and data cables on 

the existing analog control system. This in situ study on a 

DCS is the first of its kind. Only the electric field emissions 

from 10 kHz to 6 GHz are reported in this paper. 

Once the DCS was set up for testing and training in the 

TTF facility, a second visit was made to the site. The same 

groups of measurements were made but with the DCS 

mounted only in wooden racks without any metallic system 

cabinets in place. (These measurements are not provided 

here.) After the DCS was installed and operational, the next 

visit was made to the site where emissions measurements 

(discussed in this paper) were again made in the control 

room at the same antenna positions. Measurements were 

also taken with selected system cabinet doors open for 

comparison but are also not included in this paper. A new 

automated emissions measurement system, developed by 

EPRI was used to capture the emissions data and is further 

described in Section III. B. 

MEASUREMENT METHODS FOR COLLECTING 

RADIATED EMISSIONS DATA 

The NRC NUREG 1.180 (Rev. 1) 2003 and the 

EPRI TR-102323 (Rev. 3) 2004 Documents 

The document, “Guidelines for Evaluating Electromagnetic 

ABOUT THE ORIGINAL SURVEY PROJECT FOR 

DCS UPGRADE 

As a part of the digital control system (DCS) upgrade program 

for Units 1 and 2, a major US nuclear power plant 

requested that a survey for radiated magnetic and electric 

fields be conducted in three areas: 1) Control Room – near 

the system cabinets in the control room where the existing 

analog control system is to be retrofitted with the new 

digital control system for Units 1 and 2, 2) the Operator 

Assist Computer (OAC) Computer Room area for Units 1 

and 2, and 3) the Testing and Training Facility (TTF) Facility 

where the DCS was set up for testing. A survey plan 

was designed to investigate the radiated EME in each areas. 

The investigation was carried out by conducting a partial 

EMC survey measuring the radiated emissions for Unit 1 

and 2 for electric fields from 10 kHz to 6 GHz and for magnetic 

fields from 20 Hz to 100 kHz with the analog control 

system in place and operational. A full EMC survey would 

entail measuring both radiated and conducted emissions. 




and Radio-Frequency Interference in 

Safety-Related Instrumentation and 

Control Systems”, U.S. Nuclear Regulatory 

Commission (NRC) Regulatory 

Guide, NUREG 1.180 (October 2003) 

Rev. 1 was developed and published 

by the NRC. The purpose of this 

document is “to provide guidance to 

licensees and applicants on additional 

methods acceptable to the NRC staff 

for complying with the NRC’s regulations 

on design, installation, and testing 

practices for addressing the effects 

of electromagnetic and radio-frequency 

interference (EMI/RFI) and power 

surges on safety-related instrumentation 

and control (I&C) systems.” This 

guidance document focuses heavily on 

acceptable test methods to measure 

emissions generated by safety-related 

I&C equipment and to determine its 

immunity to man-made emissions and 

disturbances. 

The survey presented in this article 

was not conducted to provide any guidance 

as to where the system cabinets 

or the DCS in the cabinets should be 

located in the control room as that information 

was already pre-determined 

by the customer as part of their upgrade 

program for the plant’s control 

system. This survey was conducted 

to determine if any of the POI areas 

(without and with the DCS installed) 

have emissions characteristics that 

violate specific emissions envelopes 

currently in use by the NPP industry. 

These include the bounded envelope 

for plant emissions limits defined in 

the EPRI TR-102323-2004 (Rev 3) 

guidance document, “Guidelines for 

Electromagnetic Interference Testing 

in Power Plants” and the susceptibility 

line at 140 dBμV/m (10 V/m) defined in 

the NUREG 1.180 (Rev 1). These limits 

lines are included in the radiated emissions 

graphs presented later in this 

article for reference. 

The NUREG 1.180 was also carefully 

reviewed along with the appropriate 

emissions measurement procedures 

included in MIL-STD-461E and the 

IEEE 473-1985 (R1991), “IEEE Recommended 

Practice for an Electromagnetic 

Site Survey (10 kHz to 10 GHz).” 

In addition, the research, data, and recommendations 

developed in published 

in EPRI TR-102323 were also carefully 

reviewed before this survey was carried 

out. Before the survey was conducted, 

two applicable survey methods—one 

based on MIL-STD-461E and the other 

based on IEEE 473—were reviewed. 

(For a comparative discussion on 

these methods, please see the article, 

“Measuring and managing electromagnetic 

interference: selecting the right 

antenna for your E3 program” which 

appeared in ITEM’s EMC Directory 

and Design Guide 2006, pp. 36-51.) 

In an effort to closely characterize 

the location area of interest in the 

Control Room of this major US nuclear 

power plant, the following EMC measurement 

equipment was used: two 

461E antennae—one broadband discone 

antenna with a frequency range 

100 Hz to 1 GHz for radiated electric 

field measurements and one large loop 

magnetic field antenna with a frequency 

range 20 Hz to 5 MHz for radiated 

magnetic field measurements, one mini 

directional antenna with a frequency 

range 1 GHz to 6 GHz for radiated 

electric fields above 1 GHz, and two 

measurement methods were employed. 

The use of a single broadband discone 

antenna was applied with the use of 

an automated emissions measurement 

system as a more appropriate technique 

to improve the measurement 

process for high-frequency radiated 

electric fields. The IEEE 473 method 

was also attractive given the use of an 

automated emissions measurement 

system discussed below in the next 

section of this paper. 

Emissions Measurement and 

Data Storage System Used 

The traditional measurement system 

used for conducting surveys in the 

past has been the spectrum analyzer 

with minimal on-board data storage. 

Although spectrum analyzers have 

continued to develop over the years 

to provide for hundreds of on-board 

functions necessary for radio and EMC 

engineering and spectral analysis, little 

has been done regarding their ability to 

program long-term scans for surveys 

and to provide for large amounts of 

data storage. Limitations associated 

with the use of a traditional spectrum 




Figure 1. Location of antenna positions adjacent to system cabinets for plant control system. 

analyzer include: 

• Inability to program long-term cycling 

emissions tests across multiple 

frequency ranges 

• Difficulty in capturing enough 

sweeps to properly represent the 

needed characteristics of an EME 

without having to dedicate a large 

number of man hours at the site 

• Difficulty in capturing emissions 

sweeps associated with transients 

produced by the operation of devices 

such as relays, solenoids, valves, 

etc. 

• Lack of proper data storage space 

on board the analyzer to store data 

from sweeps 

• Inability to record sweeps in realtime 

and play them back on the 

screen if a review of emissions data 

is needed 

• Difficulty associated with conducting 

mathematical operations on 

a limited set of emissions data to 

determine characteristics associated 

with a long-term recording of sweeps 

to support emissions analysis 

To address the limitations listed 

above and several others, EPRI developed 

an automated emissions measurement 

system. This system utilizes a 

custom written program supporting a 

series of algorithms placed on a laptop 

computer that is interfaced to a spectrum 

analyzer through the IEEE 488 

buss. Once activated, the computer 

program takes over the operation of the 

analyzer, allowing the EMI investigator 

to program exactly how the survey 

should be carried out. A total survey 

time of a few minutes up to a week can 

be selected. Once the survey emissions 

tests are simply programmed into the 

computer, the investigator clicks the 

“Start” button, closes up the access 

panel, locks the cabinet door, and walks 

away. The programmability and flexibility 

of this system allows the EMI 

investigator to set up emissions tests 

using a customer graphical user interface 

and determine when those tests 

would start and stop. The EMI investigator 

can also specify how much time 

would be spent on a specific frequency 

band and if emissions above a certain 

amplitude should be ignored among 

other custom settings. The system 

program also contains a data analysis 

package, which allows the investigator 

to conduct statistical analyses on the 

data, capture any trace or set of traces, 

and replace any range of traces or the 

whole data record upon command. 

Histogram analyses can also be carried 

out on the recorded data. 

The system was built specifically for 

conducting surveys in critical areas 

where the location of emissions sources 

is unknown, where sources of transient 

emissions may be present and could 

cause severe malfunction of critical 

electronic equipment, where increasing 

the statistical confidence of the data 

would further improve the validity of 

the survey data, and where antenna 

size could possibly place constraints 

on the survey process thus limiting the 

amount of data collected. This system 

has already been used in other critical 

facilities including hospitals and com- 




data record of emissions traces that the system creates when 

a survey or set of emissions measurements is carried out. 

This type of emissions record keeping will be beneficial 

when EPRI develops an on-line emissions database. Such 

a database can provide researchers and customers with 

access to historical and recent emissions data. Data from 

past surveys may even be converted to digital data which 

can be uploaded to the database. 

Figure 2. Radiated electric field spectra, 10 kHz to 1 GHz, antenna 

position 1 in control room (Unit 1). 

munications facilities, and to date collected emissions data 

for more than ten digital upgrade projects in NPPs. Data 

gathered during this survey process furthered the understanding 

of the EMC for the DCS project at this major US 

nuclear power plant. 

This automated system continues to be used to conduct 

POI surveys in NPPs and other types of facilities where 

surveys are needed or where EMI problems persist. One of 

the primary benefits of using this system is the permanent 

MEASUREMENT DATA 

Antenna Positions 

Figure 1 illustrates the location of the three antenna positions 

near the system cabinets that now contain the new 

digital control system. These same cabinets previously contained 

the analog control system. All three antennae were 

used at these positions during the emissions measurements. 

High-Frequency Radiated Emissions Data – 

Electric Fields: 10 kHz – 1 GHz 

1) Antenna Position 1 

Figure 2 illustrates the final radiated emissions trace (i.e., 

the maxima of each measurement point in this frequency 

band occurring among several thousand traces during the 

collection of data at this antenna position) for electric fields 

taken at Antenna Position 1 from 10 kHz to 1 GHz adjacent 

to one of the system cabinets for the plant control system. 

Figure 1 contains the data for both the analog control system 

(green trace) and the digital control system (blue trace). 

From the trace, one can see that a few characteristics of the 

analog control are that it peaks at 1.34 MHz at 99.2 dBμV/m 

and at the high-frequency end at 928 MHz at 76.6 dBμV/m. 

The blue trace from digital control system has a similar 

signature starting from 10 kHz but lower amplitude and 

does not contain the 1.34 MHz peak. From 2.31 to 3.51 

MHz, the radiated energy from the DCS is higher than that 

of the analog control system (ACS). From 6.71 MHz out to 1 

GHz, the radiated energy from the DCS is just about always 

higher than that of the ACS. There are two distinctive peaks 

that are present on the DCS trace, which are not present on 

the ACS trace. These are at 468 MHz (71.6 dBμV/m) and 

826 MHz (94.5 dBμV/m). One of the peaks at the higher 

frequency area at 928 MHz peaked at 113.5 dBμV/m, which 

is 36.9 dBμV/m higher when the DCS system was installed. 

Two limit lines are placed on the plot as well. One is 

the 140 dBμV/m limit line (red line)—a susceptibility limit 

line defined in NUREG 1.180 (Rev 1) and also in EPRI TR- 

102323. The second limit line (yellow line) is the highest 

composite plant emissions envelope limit, originally defined 

in EPRI TR-102323 (Rev 1) in 1997. While there is more than 

an 8 dB safety margin between the peak of either trace and 

the 140 dBμV/m limit line, one will notice that the emissions 

from the DCS equipment at 928 MHz are near the allowable 

plant emissions limit line. 

Two other limits are also placed on the graph of Figure 2. 

These are equipment emissions limit lines. One is the limit 

line defined in NURED 1.180. The other is also an equipment 

emissions limit line defined in EPRI TR-102323 (Rev. 




slated for use in the new plants will provide much needed 

emissions guidance and aid in the prevention of future EMI 

problems. 

Figure 3. Radiated electric field spectra, 10 kHz to 1 GHz, antenna 

position 2 in control room (Unit 1). 

3). Although these limit lines are intended to determine if 

the emissions from a single piece of equipment or system 

are too high, the emissions from both the ACS and the DCS 

equipment do exceed these limit lines. 


Figure 3 illustrates the final radiated emissions trace for 

electric fields taken at Antenna Position 2 from 10 kHz to 

1 GHz adjacent to one of the system cabinets for the plant 

control system. This trace contains the data for both the 

analog control system (red trace) and the digital control 

system (blue trace). From Figure 2, one can see that a few 

characteristics of the analog control are that it peaks at 

1.04 MHz at 99.3 dBμV/m and again at 4.55 MHz at 88.5 

dBμV/m. Again, these two traces cross the NUREG 1.180 

and EPRI TR-102323 equipment emissions limit lines for 

high frequency radiated emissions. 

While the radiated emissions in the region between 139 

kHz and 2.61 MHz have dropped as a result of converting 

the plant control system from analog to digital, there are 

other regions (e.g., A, B, and C) that have increased in amplitude. 

132 These three example areas have experienced 

amplitude increases ranging from a few dB to as much as 

high as over 40 dB. With the nature of radiated emissions 

being cumulative with increasing digital devices in areas 

such as Control Rooms, areas such as A, B, and C will 

experience significant growth in amplitude more closely 

approaching the plant emissions limit line (yellow line) 

defined by EPRI TR-102323. 

As additional digital control equipment is installed in 

the Control Room, these emissions levels will grow. Moreover, 

with the new advanced nuclear plants presently under 

design (some under early construction), I&C engineers can 

expect new concerns regarding higher emissions levels and 

new EMI problems as digital I&C controls are brought on 

line. This is an area that deserves careful consideration in 

efforts to lower the risk of allowing an EMI problem to occur 

in the fleet of advanced nuclear plants built and placed 

on the grid over the next ten years. Efforts put into place 

to gather emissions data for new digital I&C equipment 

High-Frequency Radiated Emissions – 

Electric Fields: 1 – 6 GHz 


Figure 4 illustrates the radiated emissions trace for electric 

fields taken at Antenna Position 1 from 1 to 6 GHz adjacent 


This trace contains the data for both the analog control 

system (red and blue traces) and the digital control system 

(purple trace only). 

From red and blue (upper) traces, one can see that there 

are no significant peaks associated with the analog control 

system. However, with the digital control system there are 

peaks at 1.35 GHz at 49.9 dBμV/m, 1.88 GHz at 50.5 dBμV/m, 

1.92 GHz at 53.4 dBμV/m, 2.41 GHz at 76.3, 2.46 GHz at 

54.4 dBμV/m, and 5.82 GHz at 60.6 dBμV/m. Some of these 

spectral components are higher at Antenna Position 1 than 

at Antenna Position 2. 

From increases in the usage of digital equipment in other 

mission-critical environments where surveys have been 

carried out, it is reasonable to predict that the above components 

will experience a growth in amplitude in addition 

to the development of new components with faster proces- 




Equipment Susceptibility Level 

ACS - Peak, Horizontal 

ACS - Peak, Vertical 

DCS Peak, Vertical 

80 

70 

60 

Electric (dBuV/m) 

50 

40 

30 

20 

10 

0 

1.00E+09 

Frequency (Hz) 

1.00E+10 

Figure 4. Radiated electric field spectra, 1 - 6 GHz, antenna position 1 in 

control room (Unit 1). 

sors (and using more switch-mode power supplies) as more 

digital I&C systems are installed in the control room and 

other areas supporting the control room. The control rooms 

of the new advanced plants are, of course, no exception. 

They will also experience higher levels of radiated emissions 

in this frequency range and also extending up to 10 GHz. 


Figure 5. Radiated electric field spectra, 1 - 6 GHz, antenna position 2 in 

control room (Unit 1). 

Figure 5 illustrates the radiated emissions trace for electric 

fields taken at Antenna Position 2 from 1 to 6 GHz adjacent 


This trace contains the data for both the analog control system 

(green trace) and the digital control system (blue trace). 

From the trace, one can see that there are no significant 

peaks associated with the analog control system. However, 

with the digital control system there are peaks at 1.17 GHz 

at 48.8 dBμV/m, 1.92 GHz at 48.9 dBμV/m, 2.42 GHz at 57.7 

and 61.2 dBμV/m, and 5.82 GHz at 50.9 dBμV/m. Only data 

from Antenna Position 1 and 2 are included in this paper. 

Emissions data at Antenna Position 3 was similar to that 

of Antenna Position 1 and 2. 

STANDARDS DEVELOPMENT 

Presently, the nuclear power plant industry relies on the 

EPRI guidance document (TR-102323 (Rev. 3)) and the 

NUREG 1.180 to plan and conduct EMC qualifications 

testing for I&C equipment (analog and digital). EPRI is 

leading the effort in developing new standards for the NPP 

industry with the first standards project focusing on immunity 

testing of I&C equipment. An update on this standards 

development effort will also be presented at the conference 

as part of this presentation. 

CONCLUSION 

Project engineers responsible for digital I&C upgrades 

at the this major US nuclear power plant took the right 

step in having the two areas of concern—Control Room 

(near cabinets in Unit 1 where DCS was installed), OAC 

Computer Room, involving the completion of the digital 

control system (DCS) project—survey for radiated emissions. 

The DCS equipment is primarily digital (instead of 

analog) and its radiated emissions signatures were different 

than its analog counterparts. It is well known in the 

EMC industry that EMC surveys provide valuable insight 

as to the electromagnetic conditions of an environment in 

question, especially one as critical as a Control Room in 

a nuclear power plant. An analysis of the emissions and 




immunity test results and witness immunity testing of 

these proposed digital systems should be conducted prior 

to installation. Due to the critical nature of he DCS, simple 

proof of acceptable EMC compliance for this equipment 

should not be accepted as complete with regards to EMC. 

Further consideration of electromagnetic compatibility 

combined with a well-designed EMC installation practice 

and the results of this survey will further help to ensure 

that these systems are not interrupted by emissions from 

the electromagnetic environment in question. Digital I&C 

equipment slated for use in the advanced plants will also 

benefit from pre-op surveys in areas where some of the EME 

conditions can be controlled. These components can be 

integrated into an Electromagnetic Environmental Effects 

(E3) program should this power plant elect to establish such 

a program to maintain EMC throughout the plant. Further 

information regarding this type of program can be provided 

upon request. 

REFERENCES 

• [1] “Adding Up Emissions”, Keith Armstrong, Conformity Magazine, 

[1] Armstrong, Keith, “Adding Up Emissions,” Conformity Magazine, 

June 2002. Print. 

• [2] “Electromagnetic Emission and Susceptibility Requirements for 

the Control of Electromagnetic Interference,” MIL-STD-461C, U.S. 

Department of Defense 1986. 

• [3] “Electromagnetic Emission and Susceptibility Requirements for 

the Control of Electromagnetic Interference,” MIL-STD-461D, U.S. 

Department of Defense 1993. 

• [4] “Guidelines for Electromagnetic Interference Testing in Power 

Plants,” EPRI TR-102323, Rev 1, Electric Power Research Institute, 

Palo Alto, Calif. 1996. 

• [5] “Guidelines for Electromagnetic Interference Testing in Power 

Plants,” Revision 2 to EPRI TR-102323, TR-1000603, Electric Power 

Research Institute, Palo Alto, Calif. 2000. 

• [6] “Guidelines for Electromagnetic 

Interference Testing in Power Plants,” 

Revision 3 to EPRI TR-102323, TR- 

1003697, Electric Power Research 

Institute, Palo Alto, Calif. 2004. 

• [7] “Guidelines for Evaluating Electromagnetic 

and Radio-Frequency 

Interference in Safety-Related Instrumentation 

and Control Systems,” 

Regulatory Guide (R.G.) 1.180, U. S. 

Nuclear Regulatory Commission 1996. 

• [8] “IEEE Guide for Instrumentation 

and Control Equipment Grounding in 

Generating Stations,” IEEE Std 1050, 

Institute of Electrical and Electronics 

Select Fabricators, Inc. 

Engineers 1996. 

EMI/RFI shielding 

• [9] “IEEE Recommended Practice for 

Test Enclosures 

an Electromagnetic Site Survey (10 

Pouches 

Curtains 

kHz to 10 GHz),” IEEE Std 473-1985, 

Special Applications 

Institute of Electrical and Electronics 

Select-fabricators.com 

Engineers 1991. 

+1.888.599.6113 

• [10] “Measurement of Electromagnetic 

© 2011 Select Fabricators, Inc. 

Interference Characteristics,” MIL-STD-462D, U.S. Department of 

Defense 1993. 

• [11] P. D. Ewing, and R. T. Wood, “Recommended Electromagnetic 

Operating Envelopes for Safety-Related I&C Systems in Nuclear Power 

Plants,” NUREG/CR-6431, U. S. Nuclear Regulatory Commission 1999. 

• [12] S. W. Kercel, K. Korash, P. D. Ewing, and R. T. Wood, “Electromagnetic 

Compatibility in Nuclear Power Plants,” 1996. 

Philip F. Keebler manages the Lighting and Electromagnetic Compatibility 

(EMC) Group at EPRI where EMC site surveys are conducted, 

end-use devices are tested for EMC, EMC audits are conducted and EMI 

solutions are identified. Keebler has conducted System Compatibility 

Research on personal computers, lighting, medical equipment, and 

Internet data center equipment. The lighting tasks were associated 

with characterizing electronic fluorescent and magnetic HID ballasts, 

electronic fluorescent and HID ballast interference, electronic fluorescent 

and HID ballast failures, and electronic fluorescent and HID 

lamp failures. Keebler has drafted test protocols and performance 

criteria for SCRP tasks relating to PQ and EMC. He served as editor 

developing a new EMC standard for power line filters, IEEE 1560. 

Stephen Berger is president of TEM Consulting, an engineering services 

and consulting firm dealing in regulatory compliance, wireless, voting 

equipment and EMC. Berger was the convener and founding chair of IEEE 

SCC 41, Dynamic Spectrum Access Networks and immediate past chair of 

the IEEE EMC Society Standards Development Committee. He is a past 

president of the International Association of Radio and Telecommunications 

Engineers (iNARTE), a professional certification agency. Currently 

he works with ANSI ACLASS as a lab assessor and on issues of conformity 

assessment. Before forming TEM Consulting, Berger was a project manager 

at Siemens Information and Communication Mobile, in Austin, Texas, 

where he is responsible for standards and regulatory management. He 

has provided leadership in the development of engineering standards for 

30 years, including five which have been adopted and incorporated into 

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surge & transients 

A Risk A s s e s s m e n t f o r L i g h t ning Prote c t i o n S y s t e m 

A Risk Assessment for Lightning 

Protection System (LPS) 

Bryan Cole 

Figure 1. Power quality pyramid. 

Technology Research Council 

Nichols, New York USA 

Many articles, papers, and standards 

have been written and/or developed 

documenting proper application 

of surge protection devices (SPDs), 

identification of SPD performance characteristics, 

proper SPD safety requirements, 

etc. However, there are minimal articles on 

describing when an engineer should specify 

SPDs to be applied to an electrical distribution 

system. 

SPDs are installed to protect against 

transient overvoltage and overcurrents from 

affecting the electrical systems and processes 

within a facility. Transients occur from 

environmental and human factors. Protection 

of the facility, the electrical system and 

the processes contained within the facility 

are the second most important item to be 

considered in the power quality pyramid; 

preceded only by grounding and bonding 

for the safety of personnel (Figure 1). 

There are numerous environmental 

causes that can disrupt the facility, the electrical 

system, or the processes within the 

structure. These factors include hurricanes, 

tornados, floods, lightning, etc. 

Transients from environmental causes 

include those from direct and indirect 

lightning strikes. To protect a facility from 

lightning induced transients, a lightning 

protection system is needed. When protecting 

a structure from direct lightning strikes, 

standards require that SPDs be installed 

whenever a lightning protection system is 

installed [1]. 

In the design of an optional, legally 

required standby, or emergency power 

system, a risk assessment of the interaction 

between environment and human factors is 

not mandated by the National Electric Code 

(NEC) [2]. In the design of a critical operating 

power system, the NEC requires that a 

risk assessment be conducted [2]. Even if 

not required by the NEC, a risk assessment 

of environment and human factors for all 

power systems should be considered in the 

design or redesign of every facility. 

There are many factors to be considered 

in the risk assessment. Lightning risk assessments 

are described in US and international 

standards [2,3]. This article will 

focus on a risk assessment to determine 

if a lightning protection system and SPDs 

should be installed using the National Fire 

Protection Association standard on Lightning 

Protection Systems, NFPA 780. Annex 

L of NFPA 780 describes methods for simplistic 

and complex risk assessment. This 

article focuses on a simple risk assessment. 

LIGHTNING RISK ASSESSMENT 

Performing a risk assessment to determine 

if the facility needs a lightning protection 




Figure 2. U.S. lightning flash density map. (Map provided by Vaisala-GAI. Lightning data provided 

by the U.S. National Lightning Detection Network.) 

Surrounding Environment 

Structure surrounded by 

similar sized structures 

Structure surrounded by 

smaller sized structures 

Coefficient 

0.25 

0.5 

Isolated structure – level ground 1.0 

Isolated structure – hilltop 3.0 

Eqn. 2 

Where L is the length of the structure, 

W is the width of the structure, 

and H is the height of the structure. 

The surrounding environment of 

the facility has an integral affect on if 

and how lightning is going to strike a 

structure. Isolated structures located 

on a hilltop or mountain top are more 

vulnerable to lightning strikes than a 

structure located amongst similar sized 

structures. Determining the surrounding 

environment coefficient is done by 

choosing the appropriate values from 

Table 1. 

The final parameter needed to calculate 

the environmental factors associated 

with the facility is the lightning flash density. The 

lightning flash density is the amount of lightning flashes 

that occur per year per kilometer. This value can be obtained 

through a variety of sources. However, it is important to 

understand that averages can change over time. Therefore, 

one should obtain not only the average of an extended period, 

e.g. ten years, but also maximum and minimal values 

over a short period of time, e.g. three months. A lightning 

flash density map is shown in Figure 2. 

The tolerable risk of the facility (Nc) is determined by 

equation EQ3 and is dependent on the type of structure 

(C2), the contents within the structure (C3), the structure 

occupancy (C4), and the consequence of the loss of operations 

of the structure (C5). 

Table 1. Coefficients of surrounding environment (C1). 

Eqn. 3 

system requires the engineer to compare environmental 

factors (Nd) to the tolerable risk factors (Nc). Comparison 

is conducted by a ratio between the environmental factors 

and the tolerable risk. If the calculated ratio is 1.0 or greater, 

then a lightning protection system, which includes SPDs, 

is required. If the calculated ratio is less than 1.0, then a 

lightning protection system is not required. 

The environmental factors are calculated using the equation 

of Eqn. 1. 

Eqn. 1 

The environmental factors consist of the collective area 

of the facility (Ae), its surrounding environment (C1) and 

the lightning flash density (Ng) of the area. There are different 

equations to determine the collective area of the facility 

based on the type of structure: standard rectangular structure, 

rectangular structure with prominent riser, rectangular 

structure with small riser. The collective area for a standard 

rectangular structure is calculated using equation Eqn. 2. 

The type of structure is either metal with a non-metallic 

roof or metal with a metallic roof. Structures with other 

construction are not considered in this risk assessment. The 

coefficients for the type of structure are shown in Table 2. 

The content of the structure is the second parameter 

to be determined. The structure contents range from low 

value, nonflammable contents to those of exceptional value, 

irreplaceable cultural items. The coefficients associated with 

each parameter are denoted in Table 3. 

The occupancy of the structure is the third parameter 

that is determined. The definition of structure occupancies 

are: unoccupied; normally occupied; or difficult to evacuate. 

The coefficients associated with each parameter are 

denoted in Table 4. 

The consequence of an interruption of service as a result 

of lightning is the fourth parameter to be determined. The 

definitions are: continuity of service is not required, no 

environmental impact; the continuity of service is required, 

no environmental impact; or the there are consequences 

to the environment. The coefficients associated with each 


C o l e 


Structure Type 

Coefficient 

Metal with metallic roof 0.5 

DD 

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modules packed with 

functionality 

Metal with non-metallic roof 1.0 

Table 2. Structure type. 

Structure Contents 

Coefficient 

Low value and nonflammable 0.5 

Standard value and nonflammable 0.5 

High value and moderate 

flammability 

Exceptional value, flammable 

(electronics) 

Exceptional value, irreplaceable 

cultural items 

2.0 

3.0 

4.0 

Table 3. Structure contents. 

Structure Occupancy 

Coefficient 

Unoccupied 0.5 

Normally occupied 1.0 

Difficult to evacuate or risk of panic 3.0 

Table 4. Structure occupancy. 

parameter are denoted in Table 5. 

The result of the lightning risk assessment will provide 

insight into whether a lighting protection system, which 

includes SPDs, should be installed. If the calculated value 

of the environmental factors is equal to or exceeds the calculated 

value of the tolerable risk, which results in a Nd/Nc 

ratio of 1.0 or greater, then a lightning protection system, 

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Structure Operations 

Coefficient 

Parameters 

Coefficient 

Continuity of services not required, 

no environmental impact 

Continuity of services required, 

no environmental impact 

1.0 

5.0 

Collective area (A e 

) 

26,762 m2 

Consequences to the environment 10.0 

Surrounding environment (C 1 

) 0.5 

Table 5. Consequence of interruption of service to the structure. 

Lightning flash density (N g 

) 

16 flashes/yr/km 

and SPDs, should be installed. If the Nd/Nc ratio is less 

than 1.0, then a lightning protection system is not required. 

LIGHTNING RISK ASSESSMENT EXAMPLE 

In this example, we need to determine if a new structure that 

we are designing should have a lightning protection system 

based on the following parameters: 

1. Structure size – 100 meters long, 60 meters wide, 

15 meters tall 

2. The structure is the tallest structure in the vicinity 

3. The location of the facility is in St. Petersburg, FL 

4. The structure is metal with a metallic roof 

Structure type (C 2 

) 0.5 

Structure contents (C 3 

) 3.0 

Structure occupancy (C 4 

) 3.0 

Table 6. Parameters and calculations for lightning risk assessment 

example. 

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C o l e 


5. The structure contains and data center for a regional 

bank 

6. The structure is normal occupied with more than 

300 people 

Based on these conditions, the values and coefficients 

have been determined and are located in Table 6. 

The environmental factor for the structure (Nd) is calculated 

as 0.42819. The tolerable risk factor (Nc) is calculated as 

0.00017. Dividing the environmental factor by the tolerable 

risk factor returns a value of 2569. Any number of 1.0 or 

greater indicates that a lightning protection system should 

be installed, whereas a number less than 1.0 indicates that 

lightning protection system is not required. 

CONCLUSION 

A lightning protection system is an important component 

in protecting a structure, electrical systems and critical 

business processes. Surge protective devices (SPDs) are 

an important component of a lightning protection system 

and are required by U.S. and international standards to be 

installed if a lightning protection system is installed. 

Knowing when to and when not to apply a lightning 

protection system is important analysis that an engineer 

must examine when design a new structure or updating an 

existing structure. Using a lightning risk assessment is a tool 

that an engineer can use to determine whether a lightning 

protection system and associated SPDs are required. 

The lightning risk assessment should take into account parameters 

associated with the structure and its surrounds, the 

lightning flash density of the location, and the importance of 

the facility and its processes to the business, the community, 

and the environment. While the NEC only mandates that 

critical operating power systems be subjected to a lightning 

risk assessment, this requirement should be extended to all 

legally required and emergency power systems. 

REFERENCES 

• [1] National Fire Protection Association (2011), “Lightning Protection 

System,” NFPA 780, Quincy, MA USA. 

• [2] National Fire Protection Association (2011), “National Electric 

Code,” NFPA-70 Quincy, MA USA. 

• [3] International Electrotechnical Commission, “Protection against 

Lightning – Part 3: Physical Damage to Structure and Life Hazard,” 

IEC 62305-3. 

Bryan Cole is the president/owner of Technology Research Council. Cole 

has more than 20 years experience in the design, development, application, 

and product safety of power quality equipment, aviation instrumentation, 

and various low-voltage distribution equipment. He is an IEEE member, a 

number of UL Standard Technical Panels, and has assisted in the development 

of more than 30 national and international standards related to 

Electrical Power Systems. n 

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filters 

A c c ur at e F e e d t hr o u g h C a pa c i t o r Me a s ur e m e n t s at Hi g h Frequencies 

Accurate Feedthrough Capacitor 

Measurements at High Frequencies 

Critical for Component Evaluation and 

High Current Design 

A shielded measurement chamber allows accurate assessment 

and modeling of low pass filters 

George M. Kauffman 

NexTek, Inc. 

Westford, Massachusetts USA 

The shunt capacitor is the critical element 

in almost all low pass filters. 

Feed-through capacitors are configured 

as a center electrode passing through 

a grounded housing, which contains the 

desired capacitance from the electrode 

to the grounded housing, and practically 

eliminates lead inductance. This article 

will explain the importance of feedthrough 

capacitors, and provide improved methods 

for testing the high frequency performance 

of these critical components. Testing the 

insertion loss performance of feedthrough 

capacitors in a repeatable fixture is necessary 

to evaluate components for design, 

application qualification, and incoming 

inspection or quality audits. High current 

and high performance filters represent 

unique challenges for component testing. 

High current here refers to current ratings 

of significantly over 30 Amperes, up to 

and exceeding 400 Amperes. High performance 

generally refers to insertion losses 

of greater than 30dB at frequencies up to 

at least 1GHz. 

Lower frequency performance may 

require series inductors with the shunt 

capacitor. For example, these components 

could be arranged according to Butterworth 

criteria to reduce the cut-off frequency and 

maximize slope of the insertion loss curve. 

For example, the ever popular filter with 

a 16 kHz -3dB cutoff frequency, and 60dB 

per decade roll-off would consist of the 

components shown in Figure 2. 

While the value of an inductor has a 

constant relationship of H = 5 x F for 

an optimized filter; in many cases the 

inductor is a lower value than optimum 

during actual use due to weight, size, or cost 

constraints. The inductor can be susceptible 

to saturation at high current, thereby 

reducing the inductance value further. The 

other benefits of a series inductance is to 

increase the high frequency performance 

above the level achievable from a capacitor 

alone. The feedthrough capacitor is substantially 

immune from any effects of through 

current, and usually only has minor and 

predictable changes with applied voltage. 

For the lowest cost and size, and to eliminate 

through current performance variations, 

the feedthrough capacitor alone is the preferred, 

or initial, solution for high current 

and high frequency filtering requirements. 

There have been several articles written 

regarding improved methods for measuring 

the low frequency performance of filters. 

A useful recommendation, particularly at 

frequencies below 100kHz, is to use current 

injection according to IEEE 1560 Method 

10.5 at full current. Since high performance 

feedthroughs are functional well over 

100MHz, measuring the component ac- 


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filters 


Figure 1. Typical feedthrough installation 

example. 

curately is an important part of qualification. 

This article will address some 

of the concerns regarding measuring 

high frequency insertion loss of filters, 

particularly well above 30 MHz, while 

also accounting for high current levels. 

An industry standard insertion loss 

measurement set-up is shown in Figure 

3. This circuit has been successfully 

used in the bands from about 300kHz 

Figure 2. 16 kHz Pi filter. 

to over 30MHz. The challenge with 

this test set-up is the use at currents 

exceeding 30 amperes or greater, and 

at greater than 100MHz. Even though 

the test circuit is on a ground plane, 

the high frequency coupling across the 

power taps can have significant effects 

on the results. This high frequency 

coupling is shown in Figure 4. 

The "open" DUT (Device Under 

Test) zone can cause measurement 

limitations at high frequencies. This 

is particularly true for high current 

filters, as the geometry of the end electrodes 

and attaching wiring can extend 

for 2.0" (50mm) or more on either side. 

As frequencies usually exceed 30MHz 

the parasitic capacitance across the 

filter (from one side of the capacitor 

to the other) can cause significant 

coupling around the filter. Consider 

that the feedthrough capacitor effectively 

shunts the center of the through 

conductor to ground, resulting in what 

are essentially opposing linear Beverage 

antennas. 

The coupling around a filter can 

be modeled as either capacitance or 

antenna coupling. The parasitic capacitance 

shown in Figure 4 couples higher 

frequencies around the filter shown in 

the center of the figure. The parasitic 

capacitance is proportional to several 

factors, including exposed areas, and 

inversely related to separation of the 

two sides of the filter. Antenna-type 

coupling around the filter is related to 

several factors including, principally, 

separation and exposed length. The 

free path loss is inversely proportional 

to the square of the separation and 

frequency, which is the coupled signal 

reduction with distance. The antenna 

efficiency of the radiating surface is 

complex and improves to a maximum 

at /4 and harmonics thereof. This factor, 

and several others, can combine to 

produce a maximum value of coupling 

at an array of frequencies. In order to 

get an estimate of this coupling effect, 

Figure 3. Insertion loss test set-up according to MIL-STD-220B with load current and buffer networks. 

Figure 4. Coupling across a DUT, when measuring insertion loss. 


K auf f m a n 

filters 

Figure 5. Grounded DUT hook-up test leads. 

the connection wires to a DUT shown in Figure 5 were 

measured for isolation. This figure shows two test leads, 

both coaxially aligned with shields and ends shorted to an 

aluminum ground plane. The exposed lengths are about 

50mm (2.0") long, and the distance above the ground plane 

is about 13mm (1/2)". If we measure the isolation between 

these wires, we get a rough estimate of the lead-in and 

lead-out coupling around a feedthrough capacitor. Figure 6 

shows the isolation for the grounded wires shown in Figure 

5. Frequencies below 1 MHz have over 70 dB of isolation. 

Above 1 MHz a noticeable reduction in isolation occurs, 

with 50 dB indicated at 13 MHz. The isolation tends to reduce 

to about 30 dB at 100 MHz . The isolation maintains 

a value of about 30 dB up to 1Ghz, where a further drop in 

isolation occurs. This effectively means that "open leads" 

to the DUT could produce a noise floor at about 30 dB at 

high frequencies. MIL-STD-220B is effective at measuring 

the lower frequency performance including the effects of 

Figure 6. Isolation between grounded DUT hook-up leads. 

voltage and current, but measurements at frequencies above 

10MHz can be compromised by the "noise floor" due to this 

interlead coupling. 

NexTek has developed a line of compact high current 


filters 


Figure 7. Feedthrough capacitor shielded test fixture. 

feedthrough filter capacitors. Since the insertion loss of a 

C-type feedthrough is substantially unaffected by through 

current levels, it is advantageous to accurately evaluate the 

performance of a high current filter using less-than- fullscale 

test techniques. NexTek has also developed a method 

of accurately measuring the insertion loss at the component 

level with no load current being required and very accurate 

high frequency results. 

The high frequency performance of capacitors requires 

a fully shielded enclosure for testing, including shielding of 

one side of the filter from the other. A fixture such as this 

is shown in Figure 7, and can be found at www.nexteklight 

ning.com/FilterTestFixture.html). 

The TEM cell inspired test fixture has an outer shield tube 

that is fashioned from a convenient diameter of metal pipe 

or tubing to fit around the largest expected filter. The inside 

will generally have to be precision turned and polished, 

and the inside entry edges should be well rounded. There 

are three internal sliders, which are piston shaped objects. 

Good results have been obtained with sliders and tubes 

made from nickel plated aluminum. The end sliders have 

coaxial connectors for connection to a network analyzer 

or source and detector. The coaxial connectors might have 

small springs, pogo pins or discs soldered onto the inner side 

of the center pins to make contact to the Device Under Test 

(DUT). The DUT slider should keep the capacitor centered 

by having a tapered face on one side, and/or a through hole 

which just fits the component. All three sliders have outer 

circumferential grooves, to hold ground cord in position, 

with holes through to the ID of the pistons, for securing the 

ends of the ground cord ends. With the adequate groove 

depth and width, and a small gap between the sliders and 

inside diameter of the shield tube, at least two complete 

circumferential shield grounds can be established between 

the sliders and the shield tube. Successful results have been 

obtained with both spiral and knit mesh type ground cord; 

however, silicone foam core with double layer SnCuFe mesh 

seems to work best. The ground cord effectively isolates left 

side from the right side of the middle slider, and the internal 

region of the test fixture from the external environment. 

The feedthrough capacitor is mounted on the middle slider, 

which is inserted near the midpoint of the shielding tube. 

The end sliders are inserted and advanced until contact is 

made with the end electrodes of the filter, when measurements 

can be taken. 

Figure 8. An HPR Filter being installed in test fixture. 

Figure 9. Comparison of various filter capacitors. 


K auf f m a n 

filters 

Figure 10. Maximum insertion loss versus ESR. 

Figure 8 shows an HPR 140 Ampere filter, which is secured 

to the DUT mounting slider, being slid into the outer 

shield tube. One ground mesh ring has passed into the outer 

shield tube, while a second mesh is close to entering. The 

end slider is shown with spiral ground cord, and would be 

installed after the DUT slider is inserted to approximately 

the midpoint of the outer shield tube. The N connector on 

each end would be connected into a through-calibrated 

Figure 11. .22µF/40µH/.22µF Filter Insertion Loss. 

network analyzer to measure the insertion loss of the filter 

with very high accuracy. 

Tips on measuring filtering performance 

A. The performance of different filtering technologies 

can be assessed. For example, a leaded capacitor can be 

compared to a ceramic or metalized plastic feedthrough. 

Figure 9 shows that the leaded component has a resonance 


filters 


Figure 12. .22µF/160nH/.22µF filter insertion. 

at about 3.3MHz. This equates to an ESL of about 10nH. 

The metalized film capacitor has an insertion loss dip at 

about 20 MHz. This dip can be more pronounced for higher 

capacitance values. 

B. Estimating capacitor parasitic properties. 

Feedthrough capacitors approach an insertion loss plateau 

at high frequencies. The Equivalent Series Resistance (ESR) 

of a capacitor limits the continued improvement of shunting 

performance of a real capacitor at ever higher frequencies. 

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www.curtisind.com cisales@curtisind.com 

Curtis Industries 

A Div. of Powers Holdings, Inc. 

FILTER NETWORKS 

A Curtis Industries Company 

ISO 9001: 2008 

Registered 

The level of the plateau relates strongly to the ESR of the 

capacitor, through the curve shown in figure 10. The metalized 

film capacitor has an ESR of about .075 Ohms. The 

ceramic feedthrough capacitor has an ESR of about 0.03 

Ohms. This value of ESR can be used to assess dissipation 

or other parameters at high frequency. 

C. Coordination of filtering with shielding. The same 

coupling effects across the filter that compromise filter 

performance measurement can also affect the measured 

application level isolation of an enclosure. A general rule 

of thumb is that coupling between axially aligned wires is 

about -30dB. Note that the level of coupling is frequency 

dependent, and -30dB begins to be a good estimate at wire 

lengths greater than /20. Therefore, the shielding effectiveness 

of the enclosure could be somewhat less than the 

values of the filter insertion loss and still preserve isolation. 

If the shielding is 30 dB less than the filter insertion loss, 

the resulting two equal value paths might have a reduction 

of isolation of about 3dB. 

D. Modeling of filters with series inductors. Some applications 

require filter performance to be increased by use 

of series inductors. Accurately modeling the feedthrough 

capacitors and series inductors can yield predictable and 

accurate results. There are two commonly used inductors 

at high current; the wound type and the ferrite throughhole 

type. Wound type inductors generally have higher 

inductance and thus better low frequency performance; 

at the expense of size, weight and cost, and the electrical 

characteristics of self resonance. A simple but useful circuit 

analysis model of a wound inductor is a parallel inductor and 

capacitor. When the self resonance frequency is measured, 

the value of the capacitor can be estimated. In addition, 

the reduced inductance at full load current should be used, 

instead of the nominal. The parameters of the capacitor and 

inductor can be modeled quite accurately. Figure 11 shows 

the model of a 220nF/40uH/220nF filter. The characteristics 

of the capacitors are ceramic as shown in Figure 9; and the 

wound inductor self resonant frequency of 23 MHz corresponds 

to a shunt capacitance of 1.2pF, and the inductance 

drops to 30uH at peak current. 

Ferrite bead inductors are compact, low cost, easier to 

install on high current conductors, and tend to be dissipaters 

of RF power. The dissipation can turn significant portions 

of the unwanted RF energy into heat, instead of reflecting 

or circulating the energy within the system. However, 

these benefits are at the expense of substantial inductance 

reduction at full current, due to saturation, and generally 

less inductance to start with. The saturation effects can be 

minimized by gapping techniques, but this makes a more 

stable but further reduced inductance. If the inductor is a 

ferrite bead type, then the circuit analysis model would be 

an inductor in parallel with a resistor. Figure 12 shows the 

modeled performance of a filter with the same capacitors 

as in the previous example, and a ferrite bead 28A5131-0A2. 

This ferrite bead measures 160 nH with a 0.4mm (.016") gap 

at full load. 

Not only does the accurate measurements of insertion loss 


K auf f m a n 

filters 

allow better high frequency modeling, 

but lower frequency modeling is virtually 

error free, provided that full current 

inductance parameters are used. 

E. It is always good to perform 

a through and isolated test for the 

test fixture. An example of these test 

results for a test fixture with an inside 

diameter of 51mm (2.0") and two 

75mm (3.0") long chambers on either 

side of the middle DUT slider is shown 

in Figure 13. 

Note that this curve covers from 

3MHz to 6GHz. The top curve represents 

the insertion loss of a wire connection 

through a hole in the middle 

DUT slider. Since the impedance of a 

through wire is far higher than 50, a 

departure from a very low insertion 

loss is expected at about 500 MHz, 

and harmonics thereof. The measured 

insertion loss may be overstated 

somewhat at about 500MHz. The 

first problematic resonance seems to 

occur at about 3.7GHz. The lower 

curve is isolation, with a solid middle 

slider. This insertion loss responds to 

the resonance of the chambers, the 

shielding of the sliders and attaching 

cables (and analyzer), and the length 

of the internal connection leads. The 

isolation with short leads, of approximately 

25mm (1") in length, shows high 

levels of isolation to almost 2GHz, with 

reasonable isolation at 3.5 GHz. The 

first problematic isolation level is at 

about 4 GHz. This shows that the test 

fixture of this geometry is capable of 

accurately measuring insertion loss to 

more than 2GHz. 

• [2] Phipps, Keebler, and Connatser, "Improving 

the Way We Measure Insertion Loss" 

Item Publications Nov., 2008. Print. 

George M. Kauffman, PE, holds a BSME 

and MS in Engineering Management from the 

Figure 13. 

Example of 

calibration 

results for test 

chamber. 

University of Massachusetts at Amherst. He 

leads NexTeks design and engineering team. 

Kauffman has extensive EMC and microwave 

design experience. He holds several patents in 

RF protection and related technology. He can 

be reached at engineering@nexteklightning.com. 

Conclusion 

Accurate feedthrough insertion loss 

measurements, particularly at high 

frequency, are vital to understand 

component parameters, measure filtering 

performance, and/or design a filter. 

The shielded chamber presented has 

been used to over 1GHz, and is easy to 

fabricate and use. 

References 

• [1] The Engineering Handbook, Richard C. 

Dorf, CRC Press, 2005 Section 113.5 provides 

a good overview of the low frequency 

short comings of MIL-STD-220-B, and 

explains IEEE P1560, Method 10.5 


filters 

M e a s ur e m e n t s a b o v e 1 GHz in Time-Domain 

Measurements above 1 GHz in 

Time-Domain: Theory and Application 

Christian Hoffmann 

Technische Universität München, Lehrstuhl 

für Hochfrequenztechnik, Munich, Germany 

Stephan Braun 

GAUSS Instruments GmbH, Munich, Germany 

Arnd Frech 

GAUSS Instruments GmbH, Munich, Germany 

Peter Russer 

Technische Universität München, Lehrstuhl 

für Nanoelektronik, Munich, Germany 

Time-domain electromagnetic interference 

(EMI) measurement systems 

are widely used, especially for the 

measurement of non-stationary signals. 

The newest CISPR 16-1-1 Ed. 3 Am. 1 [1] 

adds specifications like gapless acquisition 

for such instruments. Such instruments 

are called FFT-based measuring instruments. 

Several publications focused on the 

frequency range up to 1 GHz exist on this 

topic e.g. [2]. Broadband emissions below 

1 GHz are typically generated by switching 

processes caused by devices like household 

appliances or industrial equipment. 

Above 1 GHz, there are devices that 

exhibit broadband non-stationary emissions. 

In order to protect modern communication 

systems above 1 GHz like 

Wi-Fi, such devices have to be measured, 

weighted and compared to limit lines. A 

particular point of interest in this respect 

is industrial, scientific and medical (ISM) 

equipment according to CISPR 11 [3]. Currently 

such measurements are carried out 

by using a spectrum analyzer in repetitive 

sweeps and applying the max hold function. 

If the peak level is above the limit 

line, the measurement is repeated with a 

video bandwidth of 10 Hz, which corresponds 

to a logarithmic average detector. 

Other discussions focus on the use of the 

amplitude probability density (APD) function 

for measurements of ISM equipment 

above 1 GHz. However, as the traditional 

EMI receivers can only observe the signal 

at one frequency at the same time, and 

the emission is changing over periods of 

several seconds, those receivers are not 

well suited to measure non-stationary 

EMI with reasonable scan times. Timedomain 

EMI measurements systems, using 

an FFT-based bank of receivers allow to 

make such measurements faster, and allow 

also to optimize the components of ISM 

equipment to obtain compliance according 

to CISPR 11. 

In [4], a time-domain EMI measurement 

system up to 18 GHz is presented. 

In this paper, an overview of the theory 

of operation and the practical application 

of such a measurement system is shown. 

The system presented in this paper allows 

for EMI measurements, fully compliant to 

CISPR 16-1-1. Measurements have been 

carried out in the frequency range up to 18 

GHz in a full anechoic room. These measurements 

show as an example the emission 

of a microwave oven in the ISM band 

at 2.45 GHz with real-time spectrograms 

of the fundamental and a subharmonic of 

the microwave oven’s magnetron. 


filters 


 

 

 

 

 

 

 

 

 

 

 

 

Figure 1. Heterodyne EMI receiver. 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Figure 3. Digital down-conversion. 

 

 

Figure 2. Time-domain EMI measurement system. 

HETERODYNE MEASUREMENT RECEIVERS 

Since the beginning of the 20th century, measurement 

receivers based on the heterodyne principle have been 

predominantly used to characterize EMI. As an example, 

companies like General Electric and Siemens have started 

the development of such systems in the 1920s [5][6]. 

The block diagram of a heterodyne measurement receiver 

is shown in Figure 1. The EMI input signal is bandpass 

filtered by a variable preselection filter. Thus, the dynamic 

range is increased by attenuating out-of-band narrowband 

and transient broadband interference signals. The preselection 

typically consists of several selectable bandpass filters 

that are tunable within a certain frequency range. By means 

of a variable attenuator, the level of the input signal to the 

mixer is set in order not to overdrive the mixer and minimize 

distortion of the IF-signal. Every considered frequency is 

then consecutively down-converted to a fixed IF frequency. 

The IF-signal is filtered by the chosen IF-filter. Thereby it is 

assured, that only a specific band of the IF signal is reaching 

the detector input. CISPR 16-1-1 dictates the use of 

several IF-filters of different bandwidths that have to fulfill 

the given critical masks. The output signal is evaluated by 

a given set of detectors for the selected dwell-time. The average, 

CISPR-Average, peak, quasi-peak and rms detectors 

are used to measure EMI signals according to CISPR 16-1-1. 

The amplitude spectrum is displayed. 

Heterodyne EMI receivers offer high dynamic range 

through a complex preselection, high sensitivity through 

low-noise preamplifiers and are commonly available up 

to millimeter wave frequencies. The major drawback of 

this technology are the long scan times. The scan time can 

easily reach hours or days, when wide measurement bands 

shall be measured with high frequency resolution and high 

sensitivity. 

TIME-DOMAIN MEASUREMENT SYSTEM 

The block diagram of the time-domain EMI measurement 

system is shown in Figure 2. The EMI input signal in the 

frequency range from 9 kHz-1.1 GHz is low-pass filtered to 

ensure Shannon’s theorem is fulfilled. The filtered signal 

is sampled by a floating-point analog-to-digital converter 

(ADC) [2]. The spectrum is calculated by the Fast-Fourier- 


H o f f m a nn, Br aun, Frech, Rus s e r 

filters 

Transform (FFT) and weighted by digital 

detectors like peak, quasi-peak, average or 

rms. The calculated amplitude spectrum 

is displayed. 

 

 

 

 

 

Spectral Estimation 

Discrete spectral estimation is performed 

by the Discrete-Fourier-Transform (DFT). 

A fast algorithm for the computation 

of the DFT is the FFT. The FFT exploits 

symmetry and repetition properties and 

is defined as [7] 

X[k] = 

N−1 

∑ 

n=0 

x[n]e −j2πkn 

N , 

 

 

where X[k] is the discrete amplitude spectrum of the discrete 

time signal x[n]. 

The Short-Time-Fast-Fourier-Transform (STFFT) is 

defined as an FFT over a limited time-interval. A Gaussian 

window function w[n] is applied, corresponding to 

the IF-filter of a conventional measurement receiver. By 

application of the STFFT, a spectrogram is calculated. The 

spectrogram is a FFT of a time-interval of the sampled timedomain 

signal. It depends on the discrete time coordinate 

of the window and the discrete frequency k. The STFFT is 

calculated by [7] 

X[τ, k] = 

N−1 

∑ 

n=0 

x[n + τ]w[n]e −j2πkn 

N . 

(1) 

(2) 

 

 

 

 

 

Figure 4. Floating-point analog-to-digital converter. 

 

 

 

sample is taken from the ADC that shows the maximum 

not clipped value. By the multiresolution ADC-system, the 

necessary dynamic range is achieved to fulfill the requirements 

of CISPR 16-1-1. In comparison to the requirement 

for sinusoidal signals, for the measurement of transient 

signals, the input stage has to handle signals which require 

additionally 50 dB higher dynamic range, regarding the 

amplitude range. As an example the notch filter test, as 

described in CISPR 16-1-1 Section 4.6 has been carried 

out to verify the spurious-free dynamic range for pulses. A 

notch filter with an attenuation of at least 40 dB at around 

300 MHz was connected to the system input and a pulse 

generator fed a pulse with a pulse width of 300 ps to the 

Digital Down-Conversion 

In order to process the signal continuously and to enable the 

calculation of a real-time spectrogram, the frequency range 

from DC to 1.1 GHz is subdivided into eight subbands with 

a bandwidth of 162.5 MHz each. Every subband is digitally 

down-converted to the baseband and the subbands are processed 

sequentially [2]. The block diagram is shown in Figure 

3. A polyphase decimation filter is used for the inphase and 

quadrature channel to reduce the sampling frequency and to 

fulfill the Nyquist criterion. The output sampling frequency 

is 325 MHz, while the bandwidth is 162.5 MHz. 

Multiresolution Time-Domain EMI Measurement 

System 

In Figure 4, the block diagram of the floating point ADC, 

which is comprised of several ADCs, is shown [2]. The input 

signal is distributed into three channels by an asymmetrical 

power splitter. Each channel consists of a limiter, a low-noise 

amplifier, and an ADC. While the first channel digitizes the 

amplitude range from 0 to 1.8 mV, the third channel digitizes 

the amplitude range from 0 to 5 V. The second channel is 

used to digitize the intermediate amplitude range from 

0 to 200 mV. The signal is recorded in all three channels 

simultaneously. 

A floating-point representation is calculated from the 

data of all three ADCs. The values are take in a way that the 


filters 

 

 

 

 

 

 

 

 

 

 

 

Figure 5. Notch filter test. 

system. The required notch response is 36 dB. According 

to Figure 5, the time-domain measurement system shows 

a notch response of better then 38 dB. 

MULTI-STAGE BROADBAND DOWN-CONVERTER 

As illustrated in Figure 2, a multi-stage broadband downconverter 

was added to enable measurements above 1.1 


GHz. For measurements from 1.1-6 GHz, the EMI input 

signal is down-converted to the range below 1.1 GHz, where 

it is sampled by the floating-point ADC. The amplitude 

spectrum is displayed. 

For measurements from 6-18 GHz, an additional mixer 

stage down-converts the input frequency band to the 

frequency range from 1.1-6 GHz. Subsequently, it is downconverted 

and processed like described above. A basic prototype 

of the time-domain EMI measurement system up to 

18 GHz was presented in [4]. In comparison, the presented 

system is fully compliant to CISPR 16-1-1, enabling full 

compliance measurements from 9 kHz-18 GHz. 

1.1 - 6 GHz Down-Converter 

Because of the nonlinear characteristics of mixers, a large 

number of mixing products are generated at its output. 

These frequencies f IF 

are determined by [8] 

f m,±n 

IF 

= |m · f LO ± n · f RF | , m, n ∈ N, (3) 

where f RF 

is the RF input frequency and f LO 

is the local 

oscillator frequency. 

If only the fundamental frequencies of f LO 

and f RF 

are 

taken into consideration, i.e. m, n = 1, we obtain two frequency 

components f RF 

1,2 according to (3) 

f RF 1,2 = |f LO ± f IF |. (4) 

The frequency conversion yields two sidebands. The image 

frequency signal is converted to the same intermediate 

frequency as the desired signal. 

To avoid this, a two-stage mixer system is used in the 

1.1 - 6 GHz down-converter [9]. The block diagram of the 

1.1 - 6 GHz down-converter is shown in Figure 6. The input 

band is divided into 14 subbands with a bandwidth of 325 

MHz each. Each of those bands is sequentially up-converted 

to a first high intermediate frequency band which is located 

above the input frequency band. A second mixer downconverts 

the IF-band to the range below 1.1 GHz, where it is 

sampled by the floating-point ADC. A fixed bandpass-filter 

is sufficiently suppressing the image band, because the input 

band and the image band do not overlap spectrally. This 

preselection filter also enhances the spurious-free dynamic 

range of the system by preventing the LNA and mixers being 

driven into saturation by high-level narrowband and 

broadband out-of-band EMI. 

6 - 18 GHz Down-Converter 

To extend the upper frequency limit of the time-domain- 

EMI measurement system to 18 GHz, a third mixer stage is 

added. The block diagram of the 6 - 18 GHz down-converter 

is shown in Figure 7. For measurements above 6 GHz, the 

preselection is dividing the input band into three ultrabroadband 

subbands: band 1 from 6 - 9 GHz, band 2 from 

9 - 13 GHz and band 3 from 13 - 18 GHz. The switching 

between these bands is done via broadband, low-loss, singleinput, 

triple-output (SP3T) PIN-diode switches. These ultra- 



filters 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Figure 6. 1.1 - 6 GHz down-converter. 

broadband subbands are consecutively down-converted 

to the 1.1-6 GHz band via broadband, low-conversion loss 

mixer and fed to the input of the 1.1 - 6 GHz down-converter. 

HARDWARE IMPLEMENTATION 

As most of the EMI in the frequency range above 1 GHz, e.g. 

higher harmonics of communication systems, is low-level in 

nature, high sensitivity is mandatory for frequencies above 1 

GHz. Increased attenuation of cable assemblies above 1 GHz 

in common test environments aggravates the problem. A low 

noise figure of the input stage is critical for high sensitivity. 

This correlates with a low attenuation of the first stages of 

the multi-stage broadband down-converter, as (5) for the 

calculation of the noise figure F of a cascaded system with 

N stages [10] implies 

F = 1 + F 1 + F 2 − 1 

+ F 3 − 1 

+ ... + F N − 1 

, 

G 1 G 1 G N−1 

2 ∏ 

G k 

k=1 

(5) 

where G i 

is the available power gain of stage i and F i 

is 

the noise figure of stage i. 

In the presented measurement system, high-gain, lownoise 

InGaP/GaAs MMIC preamplifiers yield a system 

noise figure of around 6-8 dB, rendering the use of external 

amplifiers unnecessary. To further increase the system’s 

sensitivity and dynamic range, low-noise double balanced 

mixers with low conversion loss and high 1 dB compression 

point are used. 

The switching between the bands from 6-18 GHz is accomplished 

by broadband low insertion loss, single-input, 

tripleoutput (SP3T) PIN-diode switches. The low diode 

junction capacitance in reverse polarity yields an excellent 

isolation of -55 dB to -35 dB in the OFF-state. The switches 

achieve a low insertion loss of -1.5 dB to -2 dB in the range 

from 6-18 GHz. 

EMISSION MEASUREMENTS 

Electric household appliances radiate considerable spectral 

energy density in the frequency range above 1 GHz. A 

commonly found example is the microwave oven. A magnetron 

generates high-power microwave energy at around 

2.5 GHz. In order to characterize the radiated emission of 

a microwave oven, the oven was placed in a full anechoic 

chamber. An ultra-broadband quad-ridged horn antenna 

with a bandwidth from 1.7-20 GHz [11] was placed in a 

Figure 7. 6 - 18 GHz down-converter. 

distance of 3 m to the device under test. To compensate 

for cable losses and to give the electric field strength of the 

EMI, the corresponding transducer factors and the antenna 

factor were applied. 

In Figure 8, the measured emission spectrum from 2-18 

GHz is presented. The spectrum shows the magnetron’s 

strong fundamental at around 2.45 GHz and several higher 

harmonics up to 18 GHz. The scan time using an IF-filter 

bandwidth of 9 kHz and a frequency resolution of 50 kHz 

was around 120 s, while around 320 000 frequency points 

were calculated. 

The emission of the microwave oven is not stationary. 

The amplitude spectrum cannot give any insights into the 

time-behavior of the radiated emission. The time-domain 

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µ 

 

 

 

 

 

 

 

 

 

 

yielding a total frequency shift of 

δf = 6 · 10 MHz = 60 MHz (9) 

for the 6th harmonic. 

CONCLUSION 

The theory and application of time-domain EMI measurement 

systems according to CISPR 16-1-1 have been presented. 

Such measurement systems allow to reduce test time, and 

to perform investigations of the emission of ISM equipment 

above 1 GHz. As such emission measurement systems allow 

for real-time measurements over large frequency bands, the 

non-stationary behavior of the electromagnetic interference 

can be measured and weighted. 

 

 

 

Figure 8. Emission spectrum of a microwave oven. 

system’s real-time capability allows for the examination of 

the time-behavior of the magnetron’s fundamental. The 

spectrogram is shown in Figure 9. The microwave oven 

was set to a medium power level, where the magnetron is 

periodically turning on and off. After a short broadband 

switching pulse, the magnetron turns on at around 3 s in 

time and turns off at around 9 s. The magnetron’s output 

frequency changes by about 10 MHz over this time-period, 

as the oscillator is freerunning. 

The microwave oven’s magnetron exhibits a non-linear 

transfer function and therefore, higher harmonics can be 

seen in the radiated emission spectrum. Figure 10 shows a 

spectrogram of the microwave oven’s emission at the 6th 

harmonic, located at around 14.74 GHz. The maximum 

electric field strength of the microwave oven’s radiated 

emission is about 70 dBμV/m at this frequency. With its 

ultra-low system noise floor and the corresponding high 

sensitivity, the time-domain EMI measurement system is 

able to measure this low-level emission in real-time. 

The frequency shift of the free-running oscillator’s 

6th harmonic equals around 60 MHz. The microwave 

oven’s magnetron can be described as a non-linear system 

[12]. Thus, the output signal y(t) contains harmonics 

of the sinusoidal input signal which can be described as 

y(t) = A n · cos(n2πft), n = 1, 2, ... . 

(6) 

The frequency shift of the magnetron’s fundamental resembles 

a frequency modulation of the output signal y(t) 

according to 

y(t) = A · cos[2πt(f + δf)]. 

(7) 

Thus, the frequency modulated magnetron’s harmonics can 

be described as 

y(t) = A n · cos[n2πt(f + δf)], n = 1, 2, ... , 

(8) 

REFERENCES 

• [1] CISPR 16-1-1, Ed. 3.1 Am. 1, "Specification for Radio Disturbance 

and Immunity Measuring Apparatus and Methods Part 1-1: Radio 

Disturbance and Immunity Measuring Apparatus – Measuring Apparatus," 

International Electrotechnical Commission, 2010. 

• [2] S. Braun, T. Donauer, and P. Russer, "A Real-Time Time-Domain 

EMI Measurement System for Full-Compliance Measurements According 

to CISPR 16-1-1," IEEE Transactions on Electromagnetic 

Compatibility, Vol. 50 No. 2 May 2008: 259 - 267. Print. 

• [3] CISPR 11, Ed. 5.1, "Industrial, Scientific and Medical Equipment 

–Radio-Frequency Disturbance Characteristics – Limits and Methods 

of Measurement," International Electrotechnical Commission, 2010. 

• [4] C. Hoffmann, S. Braun, and P. Russer, "A Broadband Time-Domain 

EMI Measurement System for Measurements up to 18 GHz," EMC 

Europe 2010, Wroclaw, Poland, pp. 34 - 37, 2010. Print. 

• [5] C.R. Barhydt, "Radio Noise Meter and its Application," General 

Electric Rev., Vol. 36 1933: 201-205. Print. 

• [6] K. Hagenhaus, "Die Messung von Funkstörungen," Elektrotechnische 

Zeitschrift, Vol. 63 1942: 182-187. Print. 

• [7] J. G. Proakis, and D. G. Manolakis, "Digital Signal Processing, Third 

Edition," Pearson Prentice Hall, 1996. Print. 

• [8] G. D. Vendelin, A. M. Pavio, and U. L. Rohde, "Microwave Circuit 

Design using Linear and Nonlinear Techniques, Second Edition," John 

Wiley & Sons, 2005. Print. 

• [9] S. Braun, C. Hoffmann, and P. Russer, "A Realtime Time-Domain 

EMI Measurement System for Measurements above 1 GHz," IEEE 

EMC Society Symposium on Electromagnetic Compatibility, Austin, 

USA, 2009. 

• [10] W. B. Davenport, and D. L. Root, "An Introduction to the Theory 

of Random Signals and Noise," John Wiley & Sons, 1987. Print. 

• [11] RF Spin, “Broadband Quad-Ridged Horn Antenna QRH20,” Data 

Sheet. 

• [12] W. Sansen, "Distortion in Elementary Transistor Circuits," IEEE 

Transactions on Circuits and Systems II: Analog and Digital Signal 

Processing, Vol. 46 No. 3 March 1999: 315 - 325. Print. 

Christian Hoffm ann was born in Ulm/Donau , Germany. 

He received the Dipl.-Ing. degree in Electrical Engineering from 

the Technische Universität München (TUM), Munich, Germany, 

in 2008. He is currently working towards the Dr.-Ing. degree at 

the Institute for High-Frequency Engineering at TUM, Germany. 



filters 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Figure 9. Spectrogram of the fundamental of a microwave oven. 

Figure 10. Spectrogram of the 6th harmonic of a microwave oven. 

His research interests include measurement techniques in the microwave 

and millimeter wave regime, microwave and millimeter wave 

passive and active circuits and digital signal processing. His research is 

focused on the investigation of electromagnetic compatibility in timedomain 

above 1 GHz. Hoffmann is a member of the IEEE and VDE. 

Stephan Braun studied Electrical Engineering at Munich University 

of Technology (TUM), and received his Dipl.-Ing. Degree in 2003. From 

2003-2009 he was research assistant at the Institute for High-Frequency 

Engineering, where he received his Dr.-Ing. degree in 2007. Dr. Braun is now 

managing director of GAUSS Instruments. His research interests are EMC 

and microwave measurement technology, as well as RF-circuits and digital 

signal processing. Further interests are fast digital circuits and configurable 

digital logic. Dr. Braun is Member of the VDE and IEEE. He is the author 

of more than 50 papers and inventor of several patents. 

für Höchstfrequenztechnik, Berlin. From 1997 to 1999, Russer was dean of 

the Department of Electrical Engineering and Information Technology of 

the Technische Universität München. In 1990, he was visiting professor at 

the University of Ottawa; in 1993 he was visiting professor at the University 

of Victoria and from August to October 2009 he was visiting scientist at the 

Institut Supérieur de l’Aéronautique et de l’Espace in Toulouse. n 

LCR-F-11146 Filters ad (R)_LCR-F-11146 4/11/11 3:25 PM Page 1 

Arnd Frech was born in Bruchsal, Germany, in 1981. He studied electrical 

engineering at the Technische Universität München (TUM), Munich, 

Germany with focus on high-frequency engineering and electronic systems. 

He received the Bachelor of Science and the Dipl.-Ing. degree both from 

the Technische Universität München in 2005 and 2006, respectively. After 

finishing his diploma thesis in the field of near-infrared spectroscopy at 

the Swiss Federal Institute of Technology, Zurich, Switzerland, he joined 

the Institute for High-Frequency Engineering at the Technische Universität 

München as a research assistant working towards the Dr.-Ing. degree. He 

is co-founder and managing director of GAUSS INSTRUMENTS GmbH, 

working in the field of EMC and RF measurement instrumentation and 

high-speed digital signal processing. 

Peter Russer received the Dipl.-Ing. (M.S.E.E.) degree in 1967 and the Dr. 

techn. (Ph.D.E.E.) degree in 1971, respectively, both from the Vienna University 

of Technology, Austria. In 1971 he joined the Research Institute of AEG- 

Telefunken in Ulm, Germany. With his research group he realized in 1978 

the first optical fiber transmission link for 1 Gbit/s worldwide. From 1981 

to 2008, Russer was professor and head of the Institute for High Frequency 

Engineering at the Technische Universität München, Germany. From October 

1992 to March 1995, he was director of the Ferdinand-Braun-Institut 

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design 

EMI Sources and Their Most Significant Effects 

Electromagnetic Interference Sources and 

Their Most Significant Effects 

The increasing number of EMI sources is creating greater 

challenges for those responsible for maintaining the interoperability 

of products and systems 

Anthony A. DiBiase 

Spec-Hardened Systems 

Rochester, New York USA 

As the density of the electromagnetic 

environment (EME) continues to 

increase the concern for its effects 

from sources producing EMI also increases. 

Advances in technology and the number of 

products produced, is having a significant 

effect on the efforts aimed at maintaining 

the required operation and inter operability 

of products and systems used in our society. 

These events have added challenges for 

those who are responsible for keeping pace 

with the effort required in maintaining the 

required level of electromagnetic compatibility 

(EMC) in these products and systems. 

SOURCES 

EMI sources both natural and man made 

that compose the EME can be categorized 

into several primary categories. Some of 

these classifications of sources are listed 

below. 

(1) Ambient EME that is composed of 

numerous sources of which the most significant 

are: 

• Television transmissions both analog and 

digital 

• Radio AM, FM, and Satellite 

• Solar Magnetic Storms which peak on a 

eleven year cycle 

• Lightning which occurs as a very high 

voltage and high current event 

• Utility power grid transmission lines 

which have high voltage, low current, 

and low frequency characteristics. In this 

category is also the new technology of 

Broadband over Power Lines (BPL) digital 

signals. 

• Other ambient EME sources include airport 

port radar, telecom transmissions, 

electrostatic discharge (ESD), and white 

noise. Also in this category is the earth’s 

magnetic field flux which has a value of 

about 500 milligauss. 

• Some other major product and system’s 

emissions sources include switching 

mode power supplies, arc welders, motor 

bushes, and electrical contacts 

(2) High Powered Electromagnetic Pulse 

(HEMP) threats which are intended to disable 

electrical and electronic equipment. 

These sources are designed to be utilized 

by terrorist and military organizations. 

Currently existing HEMP devices include 

the following: 

• Intentional Electromagnetic Interference 

(IEMI) source – a high powered pulse 

device utilized by combat, sabotage and 

terrorist organizations 

• High Altitude Nuclear Electromagnetic 

Pulse (HNEMP) – produced by the detonation 

of a nuclear device high above the 

earth’s atmosphere 

• High Powered Microwave Weapon (HPM) 

– a device utilized by the military as a 

combat weapon 

• E-Bomb – a HEMP weapon employed by 


design 

EMI Sources and Their Most Significant Effects 

the military to disrupt an enemy’s intra structure that is 

delivered by an aircraft. 

• EMP Cannon – a military tactical weapon 

(3) Power Quality degradation factors can effect the 

operation of equipment that is powered by a mains power 

source. These mains degradation factors include: 

• Voltage surges, sages, dips, spikes, and high and low 

voltage 

• Brownouts and blackouts 

• Power line faults 

• Electrical Fast Transitions (EFT) 

• Electrical noise superimposed on the mains power line 

These power quality degradation factors can occur simultaneously 

or independently, during any time interval. 

(4) Railroad and Mass Transit Systems have some unique 

types of EMI source problems. These include: 

• Propulsion system’s high voltage and high current operational 

mode emissions 

• Train signaling systems and their associated computer 

operating codes 

• Third rail shoes arcing broadband emissions 

• High voltage contact switching arcing broadband emissions 

• Train control system’s emissions 

• Track train control circuits 

• Right away emission sources 

(5) Medical equipment utilized in medical facilities has 

numerous EMI sources. Some of the more prominent of 

these are listed below: 

• Life support equipment such as ventilators, cardiac defibrillators, 

infusion pumps, etc. 

• Patient telemetry and assistance equipment which includes 

electrocardiographs and motorized wheelchairs 

• Electrical surgical units and their associated support 

equipment 

• Magnetic Resonance Imagine (MRIs) systems 

• X-ray units, both therapeutic and diagnostic 

• Gamma Beam Electron Accelerators and Therapeutic 

equipment 

SOURCES AND THEIR MOST SIGNIFICANT 

EFFECTS 

(1) Ambient (EME) – Can affect sensitive electronic equipment 

in the vicinity of the EMI sources. The closer the 

sensitive electronic equipment is to the EMI source, the 

higher the source’s radiated power level, and its in-band 

frequency the greater is the probability that the EMI will 

cause an interference problem. 

In the case of the effects of ESD on sensitive electronic 

systems it can cause upsets, burn outs, and latch-ups in 

these units. 

(2) High Powered Electromagnetic Pulse effects – High 

powered electromagnetic sources can totally destroy an 

electrical and electronic equipment’s function. 

As an example, an HNEMP device detonation above 

the earth’s atmosphere of the United States can totally immobilize 

the whole of the continental United State’s infrastructure. 

IEMI, HPM, E-Bombs, and EMP Cannons can be 

utilized to disable electronic systems at specific locations. 

(3) Power Quality distortions and transits that are 

present on the power main systems can affect the normal 

operation of the equipment that it supplies power. Transits 

such as power surges are capable of destroying interface 

electronic circuits. EFTs can cause electronic circuit upset 

conditions. 

(4) Railroad and Mass Transit Systems have one primary 

source of EMI and that is the transit and railroad engine’s 

propulsion systems, which operates with high voltages, 

currents, and magnetic field levels. They have been known 

to affect other facilities that contain sensitive electrical 

equipment that are located near the railroad or mass transit 

systems right away. These propulsion systems have had EMI 

associated problems with other elements of their systems. 

Train control electronics can be affected by EMI sources 

such as third rail and other broadband frequency arcing 

sources if they are not adequate designed for EMC. 

(5) Medical equipment and facilities sources include 

patient monitoring systems 

Those are very susceptible to EMI interactions. The human 

body signals that they monitor are very weak. They are 

measured in unites of microvolts and micro-amps. Among 

other devices that are susceptible to EMI are hearing aids, 

wireless patient monitoring systems, magnetic resonance 

imaging systems, implantable cardiovascular devices, drug 

pumps, and portable diagnostic meters. As new technologies 

are developed and enter the marketplace at a fast pace 

the list will grow. 

CONCLUSIONS 

As new devices and new technologies enter the marketplace, 

many operating at lower power levels and higher frequencies 

that make will make these devices more susceptible 

to EMI effects. This will also increase the number of EMI 

sources in the EME. The Functional Safety of a product (a 

hazard resulting from an EMI induced failure in the operation 

of a product) becomes of increasing concern. EMI 

factors are important consideration that must be taken 

into account when evaluating the reliability and quality 

assurance status of electrical and electronic products and 

systems. 

Fortunately the steady pace in the evolution of harmonized 

globally based EMC regulatory certification compliance 

requirements is resulting in the minimizing of the 

increase in the new generation of safety hazards and their 

associated safety risks as the density of the EME increases. 

EMC Engineers have the responsibility of insuring that 

electrical and electronic products placed on the market are 

safe and their EMC design requirements have been met. 

Anthony A. DiBiase is the president of Spec-Hardened Systems, an EMC 

and Product Safety consulting company. He is a graduate of the Rochester 

Institute of Technology and holds a BSEE. He has presented seminars on 

EMC topics and has written several articles on that subject. He can be 

reached at SHSESC@aol.com n 


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EMC Design ................................................... 90 

Filters ...............................................................61 

Lightning, Transients &ESD ............................68 

Sheilded Conduits ............................................82 

Shielding ............................................................82 

Standards ........................................................106 

Testing & Test Equipment ...............................10 

Company Directory .........................................162 

Consultant Services .......................................128 

Government Directory ....................................146 

Products & Services Index ...........................152 

Professional Societies ....................................138 

Standards Recap ............................................129 

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Automotive ........................................................32 

Medical ..............................................................32 

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Telecom..............................................................32 

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ecap 

standards recap 

Compliance with standards makes or breaks the marketing of any new product. This section recaps new and revised national and 

international EMC standards. The information below has been featured in our weekly Interference Technology eNews. Just go to 

InterferenceTechnology.com, subscribe to the eNews, and you’ll be updated on important changes in EMC standards weekly. 

International Electrotechnical 

Commission (IEC) 

IEC 61000-4-3-am2 ed3.0 Amendment 2 

Publication Date: March 10, 2010 

Electromagnetic compatibility (EMC) - Part 4-3: 

Testing and measurement techniques - Radiated, radiofrequency, 

electromagnetic field immunity test 

IEC 60512-24-1 ed1.0 — Connectors 

for electronic equipment 


The International Electrotechnical Committee released 

IEC 60512-24-1, a new testing and measurement 

standard for electronic equipment connectors’ residual 

magnetism. IEC 60512-24-1:2010 when required by the 

detail specification, is used for testing connectors within 

the scope of technical committee 48. It may also be used 

for similar devices when specified in a detail specification. 

The object of this standard is to detail a standard 

method to measure the residual magnetism of a connector 

after exposure to a specified magnetic field. 

IEC 62132-2 ed1.0 — Integrated circuits 

- Measurement of electromagnetic 

immunity 



a TEM cell electromagnetic immunity standard, 

IEC 62132-2. This international standard specifies a 

method for measuring the immunity of an integrated 

circuit to radio frequency radiated electromagnetic disturbances. 

The frequency range of this method is from 

150 kHz to 1 GHz, or as limited by the characteristics of 

the TEM cell. 

IEC 61000-4-18-am1 ed1.0 — Testing and 

measurement techniques 

Publication Date: April 22, 2010 

IEC 61000-4-18-am1 Amendment 1 - Electromagnetic 

compatibility (EMC) - Part 4-18: Testing and measurement 

techniques - Damped oscillatory wave immunity 

test, an EMC standard for damped oscillatory wave immunity 

testing and measurement techniques. 

IEC 61000-4-3 ed3.2 Consol. with am1&2 

- Testing and measurement techniques 


IEC 61000-4-3:2006+A1:2007+A2:2010 is applicable 

to the immunity requirements of electrical and electronic 

equipment to radiated electromagnetic energy. It 

establishes test levels and the required test procedures. 

The object of this standard is to establish a common 

reference for evaluating the immunity of electrical and 

electronic equipment when subjected to radiated, radiofrequency 

electromagnetic fields. 

IEC/TR 62153-4-1 ed2.0 — Metallic 

communication cable test methods 

Publication Date: May 12, 2010 

IEC/TR 62153-4-1:2010(E) gives a brief introduction 

to basic concepts and terms trying to reveal the common 

features of apparently different test methods. It should 

assist in correct interpretation of test data, and in the 

better understanding of screening (or shielding) and 

related specifications and standards. This second edition 

cancels and replaces the first edition published in 2007. 

The significant change is a new clause on the background 

of the shielded screening attenuation test method. 

IEC 62599-2 ed1.0 — Alarm systems 


IEC 62599-2:2010 for immunity requirements applies 

to the components of the following alarm systems, 

intended for use in and around buildings in residential, 

commercial, light industrial and industrial environments: 

- access control systems, for security applications; 

- alarm transmission systems; 

- CCTV systems, for security applications; 

- fire detection and fire alarm systems; 

- intruder and hold-up alarm systems; 

- social alarm systems. 

IEC 62615 ed1.0 — Electrostatic 

discharge sensitivity testing 


IEC 62615:2010 defines a method for pulse testing to 

evaluate the voltage current response of the component 

under test and to consider protection design parameters 

for electro-static discharge (ESD) human body model 

(HBM). This technique is known as transmission line 

pulse (TLP) testing. This document establishes a methodology 

for both testing and reporting information associated 

with transmission line pulse (TLP) testing. The 

scope and focus of this document pertains to TLP testing 

techniques of semiconductor components. This document 

should not become alternative method of HBM 

test standard such as IEC 60749-26. The purpose of the 

document is to establish guidelines of TLP methods that 

allow the extraction of HBM ESD parameters on semiconductor 

devices. This document provides the standard 

measurement and procedure for the correct extraction of 



HBM ESD parameters by using TLP. 

IEC 62479:2010 — Low-Power Electronic 

Equipment and Human Exposure to 

EM Fields 

Publication Date: June 16, 2010 

IEC 62479:2010 provides simple conformity assessment 

methods for low-power electronic and electrical 

equipment to an exposure limit relevant to electromagnetic 

fields (EMF). If such equipment cannot be shown to 

comply with the applicable EMF exposure requirements 

using the methods included in this standard for EMF 

assessment, then other standards, including IEC 62311 or 

other (EMF) product standards, may be used for conformity 

assessment. 

IEC 60939-1 ed3.0 — Passive filter units 

for electromagnetic interference 

suppression 

Publication Date: July 29, 2010 

IEC 60939-1:2010 relates to passive filter units for 

electromagnetic interference suppression for use within, 

or associated with, electronic or electrical equipment and 

machines. Both single and multi-channel filters within 

one enclosure are included within the scope of this generic 

specification. This generic specification establishes 

standard terms, inspection procedures and methods of 

test for use in sectional and detail specifications within 

the IECQ-CECC system for electronic components. 

IEC 61000-4-15 ed2.0 — Flickermeter - 

Functional and design specifications 

Publication Date: Aug. 24, 2010 

IEC 61000-4-15:2010 gives a functional and design 

specification for flicker measuring apparatus intended to 

indicate the correct flicker perception level for all practical 

voltage fluctuation waveforms. Information is presented 

to enable such an instrument to be constructed. 

A method is given for the evaluation of flicker severity on 

the basis of the output of flickermeters complying with 

this standard. The flickermeter specifications in this part 

of IEC 61000 relate only to measurements of 120 V and 

230 V, 50 Hz and 60 Hz inputs. Characteristics of some 

incandescent lamps for other voltages are sufficiently 

similar to the values in Table 1 and Table 2, that the 

use of a correction factor can be applied for those other 

voltages. Some of these correction factors are provided 

in the Annex B. Detailed specifications for voltages and 

frequencies other than those given above, remain under 

consideration. 

IEC 62041 Ed. 2.0 b:2010 — Safety of 

transformers, reactors, power 

supply units 


IEC 62041 Ed. 1.0 b:2003 has been replaced by by IEC 

62041 Ed. 2.0 b:2010, Safety of transformers, reactors, 

power supply units and combinations thereof - EMC 

requirements. IEC 62041:2010 applies to transformers, 

reactors, power supply units and combinations thereof 

covered by the IEC 61558 series of standards. This 

standard deals with the electromagnetic compatibility 

requirements for emission and immunity within the 

frequency range 0 Hz - 400 GHz. No measurement needs 

to be performed at frequencies where no requirement is 

specified. This second edition cancels and replaces the 

first edition published in 2003. It constitutes a technical 

revision. This edition includes the following significant 

technical changes with respect to the previous edition: 

- the frequency range for tests according to IEC 

61000-4-3 has been extended above 1 GHz according to 

technologies used in this frequency area; 

- the testing requirements according to IEC 61000-4- 

11 have been amended significantly; 

- the inclusion of a clause on tests in series production; 

- the inclusion of a new clause on measurement uncertainly, 

and 

- the inclusion of requirements on DC power ports 

and telecommunication ports. 

IEC 61000-4-20 ed2.0 — Emission and 

immunity testing in transverse 

electromagnetic (TEM) waveguides 


IEC 61000-4-20:2010 relates to emission and immunity 

test methods for electrical and electronic equipment 

using various types of transverse electromagnetic (TEM) 

waveguides. These types include open structures (for 

example, striplines and electromagnetic pulse simulators) 

and closed structures (for example, TEM cells). 

These structures can be further classified as one-, two-, 

or multi-port TEM waveguides. The frequency range 

depends on the specific testing requirements and the 

specific TEM waveguide type. The object of this standard 

is to describe: 

- TEM waveguide characteristics, including typical 

frequency ranges and EUT-size limitations; 

- TEM waveguide validation methods for EMC tests; 

- the EUT (i.e. EUT cabinet and cabling) definition; 

- test set-ups, procedures, and requirements for radiated 

emission testing in TEM waveguides and 

- test set-ups, procedures, and requirements for radiated 

immunity testing in TEM waveguides. 

IEC 61000-4-22 ed1.0 — Radiated 

emissions and immunity measurements 

in fully anechoic rooms 

Publication Date: Oct. 27, 2010 

IEC 61000-4-22:2010 considers immunity tests and 

emission measurements for electric and/or electronic 

equipment. Only radiated phenomena are considered. It 

establishes the required test procedures for using fully 

anechoic rooms for performing radiated immunity test- 



ing and radiated emission measurements. IEC 61000- 

4-22:2010 establishes a common validation procedure, 

equipment under test (EUT) set-up requirements, and 

measurement methods for fully anechoic rooms (FARs) 

when both radiated electromagnetic emission measurements 

and radiated electromagnetic immunity tests 

will be performed in the same FAR. As a basic measurement 

standard, this part of IEC 61000 does not intend to 

specify the test levels or emission limits to be applied to 

particular apparatus or system(s). Its main goal is to provide 

general measurement procedures to all concerned 

product committees of IEC or CISPR. Specific product 

requirements and test conditions are defined by the responsible 

product committees. The methods described in 

this standard are appropriate for radiated emission measurements 

and immunity tests in the frequency range of 

30 MHz to 18 GHz. IEC 61000-4-22:2010 has the status 

of a basic EMC publication in accordance with IEC 

Guide 107, Electromagnetic compatibility - Guide to the 

drafting of electromagnetic compatibility publications. 

IEC 61000-6-3-am1 ed2.0 

IEC 61000-4-21 ed2.0 — Reverberation 

chamber test methods 

Publication Date: Jan. 27, 2011 

IEC 61000-4-21:2011 considers tests of immunity and 

intentional or unintentional emissions for electric and/or 

electronic equipment and tests of screening effectiveness 

in reverberation chambers. It establishes the required 

test procedures for performing such tests. Only radiated 

phenomena are considered. The objective of IEC 61000- 

4-21:2011 is to establish a common reference for using 

reverberation chambers to evaluate the performance of 

electric and electronic equipment when subjected to radio-frequency 

electromagnetic fields and for determining 

the levels of radio-frequency radiation emitted from electric 

and electronic equipment. IEC 61000-4-21:2011 does 

not intend to specify the tests to be applied to a particular 

apparatus or system. Its main aim is to give a general 

basic reference to all concerned product committees of 

the IEC. The product committees should select emission 

limits and test methods in consultation with CISPR. The 

product committees remain responsible for the appropriate 

choice of the immunity tests and the immunity test 

limits to be applied to their equipment. Other methods, 

such as those covered in IEC 61000-4-3, CISPR 16-2-3 

and CISPR 16-2-4 may be used. This second edition cancels 

and replaces the first edition published in 2003. 

IEC 61000-6-3 ed2.1 Consol. with am1 — 

Emission standard 

Publication Date: Feb. 17, 2011 

IEC 61000-6-3:2006+A1:2010 This part of IEC 61000 

for EMC emission requirements applies to electrical 

and electronic apparatus intended for use in residential, 

commercial and light-industrial environments. Emission 

requirements in the frequency range 0 Hz to 400 GHz 

are covered. No measurement needs to be performed at 

frequencies where no requirement is specified. This generic 

EMC emission standard is applicable if no relevant 

dedicated product or product-family EMC emission standard 

exists. This standard applies to apparatus intended 

to be directly connected to a low-voltage public mains 

network or connected to a dedicated DC source, which is 

intended to interface between the apparatus and the lowvoltage 

public mains network. This standard applies also 

to apparatus which is battery operated or is powered by a 

non-public, but non-industrial, low-voltage power distribution 

system if this apparatus is intended to be used in 

the locations described below. The environments encompassed 

by this standard are residential, commercial and 

light-industrial locations, both indoor and outdoor. 

IEC 61000-6-4 ed2.1 Consol. with am1 

— Emission standard for industrial 

environments 

Publication Date: Feb. 23, 2011 

IEC 61000-6-4:2006+A1:2010 This part of IEC 61000 

for EMC emission requirements applies to electrical 

and electronic apparatus intended for use in industrial 

environments as described below. Emission requirements 

in the frequency range 0 Hz to 400 GHz are covered. 

No measurement needs to be performed at frequencies 

where no requirement is specified. This generic EMC 

emission standard is applicable if no relevant dedicated 

product or product-family EMC emission standard exists. 

IEC 61000-4-4 ed2.1 Consol. with am1 

— Electrical fast transient/burst 

immunity test 

Publication Date: March 30, 2011 

IEC 61000-4-4:2004+A1:2010 Establishes a common 

and reproducible reference for evaluating the immunity 

of electrical and electronic equipment when subjected to 

electrical fast transient/bursts on supply, signal, control 

and earth ports. The test method documented in this 

part of IEC 61000-4 describes a consistent method to 

assess the immunity of an equipment or system against a 

defined phenomenon. 

IEC 60118-13 ed3.0 - Electroacoustics - 

Hearing aids - Part 13: EMC 

Publication Date: April 11, 2011 

IEC 60118-13:2011 in principle covers all relevant 

EMC phenomena for hearing aids. Hearing aid immunity 

to high frequency electromagnetic fields originating 

from digital wireless devices operating in the frequency 

ranges 0,8 GHz to 0,96 GHz and 1,4 GHz to 2,48 GHz is 

currently identified as the only relevant EMC phenomenon 

regarding hearing aids. 



International Organization for 

Standardization (ISO) / IEC 

ISO/IEC 17043: 2010, Conformity 

assessment — General requirements 

for proficiency testing 

Publication Date: Jan. 29, 2010 

ISO/IEC 17043 specifies general requirements for the 

competence of providers of proficiency testing schemes 

and for the development and operation of proficiency 

testing schemes. Proficiency testing involves use of 

interlaboratory comparisons in the determination of a 

laboratory’s performance and, more specifically, in its 

on-going competence. Laboratories demonstrate their 

competence by complying with ISO/IEC 17025, General 

requirements for the competence of testing and calibration 

laboratories, and the need for additional confidence 

in their results is achieved through their participation 

in interlaboratory comparisons managed by proficiency 

testing provider operating in accordance with ISO/IEC 

17043. The new standard addresses management, planning, 

design and personnel of the proficiency testing 

provider. 

ISO/IEC TR 29125:2010 — Information 

technology 

Publication Date: Sept. 22, 2010 

The International Organization for Standardization 

(ISO) / International Electrotechnical Commission (IEC) 

Technical Report, 29125:2010, targets the support of 

applications that provide remote power over balanced 

cabling to terminal equipment; covers the transmission 

and electrical parameters needed to support remote 

power over balanced cabling; covers various installation 

scenarios and how these may impact the capability of 

balanced cabling to support remote powering; specifies 

design and configuration of cabling as specified in International 

Standards ISO/IEC 11801, ISO/IEC 15018, ISO/ 

IEC 24702 and ISO/IEC 24764; provides requirements 

and guidelines that will enable the support of a wide 

variety of extra low voltage (ELV) limited power source 

(LPS) applications using remote power supplied over balanced 

cabling. 

ISO/IEC TR 18047-6:2011 — Radio 

frequency identification device 

conformance test methods 


ISO/IEC TR 18047-6:2011 defines test methods for 

determining the conformance of radio frequency identification 

(RFID) devices (tags and interrogators) for item 

management with the specifications given in ISO/IEC 

18000-6, but does not apply to the testing of conformity 

with regulatory or similar requirements. 

The test methods require only that the mandatory 

functions, and any optional functions which are implemented, 

be verified. This can, in appropriate circumstances, 

be supplemented by further, application-specific 

functionality criteria that are not available in the general 

case. 

The interrogator and tag conformance parameters in 

ISO/IEC TR 18047-6:2011 are the following: 

* type-specific conformance parameters including nominal 

values and tolerances; 

* parameters that apply directly affecting system functionality 

and inter-operability. 

The following are not included in ISO/IEC TR 18047- 

6:2011: 

* parameters that are already included in regulatory test 

requirements; 

* high-level data encoding conformance test parameters 

(these are specified in ISO/IEC 15962). 

International Special Committee 

on Radio Interference (CISPR) 

Implications of CISPR 16-1-1 Update to 

Include EMI 

Publication Date: Jan. 28, 2010 

Thanks to the release by the International Electrotechnical 

Commission of Edition 3 of the CISPR 16-1-1 

standard, otherwise known as CISPR 16-1-1:2010, the 

world of electromagnetic interference measurement is 

undergoing a review. CISPR 16-1-1 specifies the characteristics 

and performance of equipment for measuring 

radio disturbance in the 9kHz to 18GHz frequency 

range, as well as providing requirements for specialized 

equipment for discontinuous disturbance measurements. 

The reason for the review is that the 2010 version of this 

standard now allows spectrum analyzers to be used to 

test EMI, in addition to dedicated, but more costly, EMI 

receivers. 

IEC Updates CISPR 11 Standard 



an amendment to CISPR 11 – the radio-frequency 

EMC standard for industrial, scientific and medical 

equipment operating in the frequency range 0 Hz to 400 

GHz and to domestic and similar appliances designed to 

generate and/or use locally radio-frequency energy. This 

consolidated version consists of the 2009 fifth edition 

and a 2010 amendment. This standard covers emission 

requirements related to radio-frequency (RF) disturbances 

in the frequency range of 9 kHz to 400 GHz. Measurements 

need only be performed in frequency ranges where 

limits are specified in Clause 6. For ISM RF applications 

in the meaning of the definition found in the ITU Radio 

Regulations, this standard covers emission requirements 

related to radio-frequency disturbances in the frequency 

range of 9 kHz to 18 GHz. Requirements for ISM RF 



lighting apparatus and UV irradiators operating at frequencies 

within the ISM frequency bands defined by the 

ITU Radio Regulations are contained in this standard. 

Equipment covered by other CISPR product and product 

family emission standards are excluded from the scope of 

this standard. 

CISPR 22 ed6.0 corrigendum 


Interpretation Sheet 2 - Information technology 

equipment - Radio disturbance characteristics - Limits 

and methods of measurement. At the CISPR SC I plenary, 

held on the 27th October 2007, a decision was taken 

to set the maintenance date for CISPR 22, Edition 6 to 

2012. As a result the work identified within CISPR/I/279/ 

MCR will not be started for the time being. At the subsequent 

meeting of CISPR SC I WG3 it was decided that 

3 items within the MCR would benefit now from further 

clarification and an interpretation sheet would be helpful 

to users of the standard, with the intent of including this 

information in a future amendment to the standard. 

CISPR 16-1-4 ed3.0 — Specification for 

radio disturbance and immunity 

measuring apparatus and methods 


CISPR 16-1-4:2010 specifies the characteristics and 

performance of equipment for the measurement of 

radiated disturbances in the frequency range 9 kHz to 

18 GHz. Specifications for antennas and test sites are 

included. The requirements of this publication apply at 

all frequencies and for all levels of radiated disturbances 

within the CISPR indicating range of the measuring 

equipment. Methods of measurement are covered in 

Part 2-3, and further information on radio disturbance is 

given in Part 3 of CISPR 16. 

CISPR 16-2-3 ed3.0 — Specification 

for radio disturbance and immunity 



CISPR 16-2-3:2010 specifies the methods of measurement 

of radiated disturbance phenomena in the frequency 

range of 9 kHz to 18 GHz. The aspects of measurement 

uncertainty are specified in CISPR 16-4-1 and 

CISPR 16-4-2. This third edition of CISPR 16-2-3 cancels 

and replaces the second edition published in 2006. It is a 

technical revision. 

CISPR 11 ed5.1 Consol. with am1 — 

Industrial, scientific and medical 

equipment 


CISPR 11:2009+A1:2010 applies to industrial, scientific 

and medical electrical equipment operating in 

the frequency range 0 Hz to 400 GHz and to domestic 

and similar appliances designed to generate and/or use 

locally radio-frequency energy. CISPR 11:2009 covers 

emission requirements related to radio-frequency (RF) 

disturbances in the frequency range of 9 kHz to 400 

GHz. Measurements need only be performed in frequency 

ranges where limits are specified in Clause 6. For ISM 

RF applications in the meaning of the definition found 

in the ITU Radio Regulations (see Definition 3.1), this 

standard covers emission requirements related to radiofrequency 

disturbances in the frequency range of 9 kHz 

to 18 GHz. Requirements for ISM RF lighting apparatus 

and UV irradiators operating at frequencies within the 

ISM frequency bands defined by the ITU Radio Regulations 

are contained in this standard. 

CISPR 16-2-3-am1 ed3.0, Amendment 1 


Amendment 1 - Specification for radio disturbance 

and immunity measuring apparatus and methods - Part 

2-3: Methods of measurement of disturbances and immunity 

- Radiated disturbance measurements 

CISPR/TR 18-1 ed2.0 — Radio 

interference characteristics of 

overhead power lines 


CISPR 18-1:2010(E), which is a technical report, applies 

to radio noise from overhead power lines and highvoltage 

equipment which may cause interference to radio 

reception. The scope of this publication includes the 

causes, measurement and effects of radio interference, 

design aspects in relation to this interference, methods 

and examples for establishing limits and prediction 

of tolerable levels of interference from high voltage 

overhead power lines and associated equipment, to the 

reception of radio broadcast services. The frequency 

range covered is 0,15 MHz to 300 MHz. Radio frequency 

interference caused by the pantograph of overhead railway 

traction systems is not considered in this technical 

report. This second edition cancels and replaces the first 

edition published in 1982. It is a technical revision. 

CISPR/TR 18-2 ed2.0 — Methods of 

Measurement and procedure for 

determining limits 


A general procedure for establishing the limits of the 

radio noise field from the power lines and equipment is 

recommended, together with typical values as examples, 

and methods of measurement. The clause on limits concentrates 

on the low frequency and medium frequency 

bands and it is only in these bands where ample evidence, 

based on established practice, is available. No examples 

of limits to protect radio reception in the frequency band 

30 MHz to 300 MHz have been given, as measuring 

methods and certain other aspects of the problems in 

this band have not yet been fully resolved. Site measurements 

and service experience have shown that levels of 



noise from power lines at frequencies higher than 300 

MHz are so low that interference is unlikely to be caused 

to television reception. The values of limits given as 

examples are calculated to provide a reasonable degree of 

protection to the reception of broadcasting at the boundary 

of the recognized service areas of the appropriate 

transmitters in the radio frequency bands used for a.m. 

broadcasting, in the least favourable conditions likely to 

be generally encountered. These limits are intended to 

provide guidance at the planning stage of the line and national 

standards or other specifications against which the 

performance of the line may be checked after construction 

and during its useful life. The measuring apparatus 

and methods used for checking compliance with limits 

should comply with the respective CISPR specifications, 

as e.g. the basic standards series CISPR 16. This second 

edition cancels and replaces the first edition published in 

1986. It is a technical revision. 

CISPR/TR 18-3 ed2.0 — Code of practice 

for minimizing the generation of radio 

noise 


CISPR 18-3:2010(E), which is a technical report, applies 

to radio noise from overhead power lines and highvoltage 

equipment which may cause interference to radio 

reception, excluding the fields from power line carrier 

signals. The frequency range covered is 0,15 MHz to 300 

MHz. This second edition cancels and replaces the first 

edition published in 1986. It is a technical revision. 

CISPR 16-2-2 ed2.0 — Specification 




CISPR 16-2-2:2010 specifies the methods of measurement 

of disturbance power using the absorbing clamp in 

the frequency range 30 MHz to 1 000 MHz. This second 

edition cancels and replaces the first edition (2003), 

its Amendment 1 (2004) and Amendment 2 (2005). It 

constitutes a technical revision. It includes the following 

significant technical changes with respect to the previous 

edition: provisions for the use of spectrum analyzers 

for compliance measurements (Annex D) and the use of 

FFT-based test instrumentation (Clauses 3, 6 and 8) are 

now included. CISPR 16-2-2:2010 has the status of a basic 

EMC publication in accordance with IEC Guide 107, 

Electromagnetic compatibility - Guide to the drafting of 

electromagnetic compatibility publications. 

CISPR 16-2-1-am1 ed2.0 — Specification 




The International Electrotechnical Commission 

recently launched the CISPR 16-2-1-am1 ed 2.0 specification 

covering the methods of measurement of disturbances 

and immunity - conducted disturbance measurements. 

CISPR/TR 16-3 ed3.0 — Specification 




CISPR/TR 16-3:2010(E) is a collection of technical 

reports that serve as background and supporting information 

for the various other standards and technical 

reports in CISPR 16 series. In addition, background 

information is provided on the history of CISPR, as well 

as a historical reference on the measurement of interference 

power from household and similar appliances in the 

VHF range. Over the years, CISPR prepared a number 

of recommendations and reports that have significant 

technical merit but were not generally available. Reports 

and recommendations were for some time published 

in CISPR 7 and CISPR 8. At its meeting in Campinas, 

Brazil, in 1988, CISPR subcommittee A agreed on the 

table of contents of Part 3, and to publish the reports 

for posterity by giving the reports a permanent place 

in Part 3. With the reorganization of CISPR 16 in 2003, 

the significance of CISPR limits material was moved to 

CISPR 16-4-3, whereas recommendations on statistics of 

disturbance complaints and on the report on the determination 

of limits were moved to CISPR 16 4-4. The contents 

of Amendment 1 (2002) of CISPR 16-3 were moved 

to CISPR 16-4-1. This third edition of CISPR 16-3 cancels 

and replaces the second edition published in 2003, and 

its Amendments 1 (2005) and 2 (2006). It is a technical 

revision. The main technical change with respect to the 

previous edition consist of the addition of a new clause 

to provide background information on FFT instrumentation. 

CISPR 24 ed2.0 — Information 

technology equipment 


CISPR 24:2010 applies to information technology 

equipment (ITE) as defined in CISPR 22. The object of 

this publication is to establish requirements that will 

provide an adequate level of intrinsic immunity so that 

the equipment will operate as intended in its environment. 

The publication defines the immunity test requirements 

for equipment within its scope in relation to 

continuous and transient conducted and radiated disturbances, 

including electrostatic discharges (ESD). Procedures 

are defined for the measurement of ITE and limits 

are specified which are developed for ITE within the 

frequency range from 0 Hz to 400 GHz. For exceptional 

environmental conditions, special mitigation measures 

may be required. Owing to testing and performance 

assessment considerations, some tests are specified in defined 

frequency bands or at selected frequencies. Equipment 

which fulfils the requirements at these frequencies 

is deemed to fulfil the requirements in the entire fre- 



quency range from 0 Hz to 400 GHz for electromagnetic 

phenomena. The test requirements are specified for each 

port considered. This second edition cancels and replaces 

the first edition published in 1997, and its Amendments 

1(2001) and 2(2002). It is a technical revision. 

CISPR 16-1-1 ed3.1 Consol. with am1 — 

Specification for radio disturbance 

and immunity measuring apparatus 

and methods 

Publication Date: Nov. 10, 2010 

CISPR 16-1-1:2010+A1:2010 specifies the characteristics 

and performance of equipment for the measurement 

of radio disturbance in the frequency range 9 kHz to 18 

GHz. In addition, requirements are provided for specialized 

equipment for discontinuous disturbance measurements. 

The specifications in this standard apply to EMI 

receivers and spectrum analyzers. This third edition 

cancels and replaces the second edition published in 

2006, and its Amendments 1 (2006) and 2 (2007). It is 

a technical revision. This main technical change with 

respect to the previous edition consists of the addition 

of new provisions for the use of spectrum analyzers for 

compliance measurements. CISPR 16-1-1:2009 has the 

status of a basic EMC publication in accordance with IEC 

Guide 107, Electromagnetic compatibility - Guide to the 

drafting of electromagnetic compatibility publications. 

CISPR 16-2-1 Ed. 2.1 b:2010 — 

Specification for radio disturbance 

and immunity measuring apparatus 

Publication Date: Dec. 16, 2010 

CISPR 16-2-1:2008+A1:2010 specifies the methods 

of measurement of disturbance phenomena in general 

in the frequency range 9 kHz to 18 GHz and especially 

of conducted disturbance phenomena in the frequency 

range 9 kHz to 30 MHz. 

This second edition of CISPR 16-2-1 cancels and 

replaces the first edition (2003) and its Amendment 

1 (2005) and constitutes a technical revision. CISPR 

16-2-1:2008 includes significant technical changes with 

respect to the previous edition. In general, this new edition 

aims at reducing compliance uncertainty in correspondence 

with findings in CISPR 16-4-1. Guidelines are 

given on 

- resonance-free connection of the AMN to reference 

ground, 

- avoidance of ground loops, and 

- avoidance of ambiguities of the test setup of EUT 

and AMN with respect to the reference ground plane. 

In addition, terms are clarified, a new type of ancillary 

equipment (CVP) is applied, and a clarification for the use 

of the AAN and AMN on the same EUT is provided. 

European Telecommunications 

Standards Institute (ETSI) 

New Versions of EMC and Radio 

Spectrum Matters Standards 

Publication Date: Feb. 12, 2010 

ETSI EN 300 330-1 V1.7.1 and ETSI EN 300 330-2 

V1.5.1, regarding radio equipment in the frequency range 

9 kHz to 25 MHz and inductive loop systems in the frequency 

range 9 kHz to 30 MHz, discuss technical characteristics 

and test methods (Part 1) and harmonized EN 

covering the essential requirements of article 3.2 of the 

R&TTE Directive (Part 2). 

ETSI EN 302 645 V1.1.1 — 

Electromagnetic compatibility and 

Radio spectrum Matters 


ETSI EN 302 645 V1.1.1 applies to GNSS repeaters. 

GNSS pseudolites as well as GNSS Receivers are not 

covered by the present document. GNSS repeaters are 

devices designed to re-transmit GNSS signals unchanged 

inside buildings in order to provide a usable signal for 

GNSS receivers that are out of sight of the GNSS satellite 

constellation or that they are unable to connect to GNSS 

signal simulators. A number of potential uses for such 

devices have been identified, such as the provision of a 

signal for test and development purposes and avoiding 

the need for receivers in emergency vehicles to re-acquire 

lock upon leaving a garage. 

ETSI EN 301 025-1 V1.4.1 — 

Electromagnetic compatibility and 

Radio spectrum Matters 


ETSI EN 301 025-1 V1.4.1 covers the minimum 

requirements for general communication for shipborne 

fixed installations using a VHF radiotelephone operating 

in certain frequency bands allocated to the maritime 

mobile service using 25 kHz or 25 kHz and 12,5 kHz 

channels and associated equipment for DSC - class D. 

These requirements include the relevant provisions of the 

ITU Radio Regulations, appendix 18 [1], ITU-R Recommendations 

M.493-12 [3] (where class D is defined), 

M.825-3 [i.5] and incorporate the relevant guidelines of 

the IMO as detailed in IMO Circular MSC/Circ-803 [i.2]. 

The present document also specifies technical characteristics, 

methods of measurement and required test results. 

ETSI TR 102 799 — Electromagnetic 

compatibility and Radio spectrum 

Matters 

Publication Date: June, 2010 

ETSI TR 102 799 analyses the various possible techniques 

for spectrum access systems for PMSE technologies 

and for the guarantee of a high sound production 



quality on selected frequencies utilizing cognitive interference 

mitigation techniques and recommends a specific 

method. 

ETSI EN 301 442 V1.2.1 — New ETSI 

Standard on EMC and Radio Spectrum 

Matters 


The present document applies to the following Short 

Range Device major equipment types: 

1) Generic Short Range Devices, including alarms, 

telecommand, telemetry, data transmission in general, 

etc.; 

2) Radio Frequency Identification (RFID); 

3) Radiodetermination, including detection, movement 

and alert applications. These radio equipment types 

are capable of operating in the permitted frequency 

bands within the 1 GHz to 40 GHz range: 

• either with a Radio Frequency (RF) output connection 

and dedicated antenna or with an integral antenna; 

• for all types of modulation; 

• with or without speech. 

ETSI Standard on EMC and Radio 

Spectrum Matters 


The European Telecommunications Standards Institute 

released a six-part standard on electromagnetic 

compatibility and radio spectrum matters (ERM); peerto-peer 

digital private mobile radio. They include: 

ETSI TS 102 587-1 V1.3.1: Part 1: Conformance testing; 

Protocol Implementation Conformance Statement 

(PICS) proforma 


Test Suite Structure and Test Purposes (TSS&TP) 

specification 

ETSI TS 102 587-3 V1.3.1: Part 3: Requirements catalogue 


Abstract Test Suite (ATS) 

ETSI TS 102 587-5 V1.3.1: Part 5: Interoperability 

testing; Interoperability Test Suite Structure and Test 

Purposes (TSS&TP) specification 

ETSI TS 102 587-6 V1.2.1: Part 6: Interoperability 

testing; Test Descriptions (TD) 

ETSI TR 102 704 V1.1.1 - Electromagnetic 

compatibility and Radio spectrum 

Matters 

Publication Date: Dec. 2, 2010 

The present document describes the spectrum requirements, 

technical characteristics and application 

scenarios for mobile and infrastructure radio location 

applications in the frequency range of 76 GHz to 77 

GHz. The present document provides a proposal for the 

introduction of the planned applications for surveillance 

radar for operating in the 76 GHz to 77 GHz band and 

defines characteristics and operation modes for fixed or 

quasi fixed installation, industrial, airborne/space and 

for ground vehicular applications in order not to impair 

the operation of the existing automotive vehicle SRRs 

operating in the same frequency range as well as for 

applications in adjacent bands. The present document excludes 

radar sensor for level and tank level probing [i.8]. 

The present document also analyses the current ECC 

decision ECC(02)01 [i.2] and proposes to revise the ECC 

decision for sharing the new intended surveillance radar 

application with the EN 301 091 [i.1] type equipment in 

same frequency band. 

Institute of Electrical and 

Electronics Engineers (IEEE) 

Distributed Network Protocol 

Standard Set to Benefit Smart Grid 

Publication Date: July 1 2010 

IEEE ratified its IEEE 1815 Distributed Network 

Protocol (DNP3) standard for electric power systems 

communications. The new standard, which improves 

device interoperability and strengthens security protocols, 

was fast-tracked for completion and was delivered 

in only seven months. Scheduled for final publication 

in July 2010, IEEE 1815 is expected to play a significant 

role in the development and deployment of Smart Grid 

technologies. 

New IEEE 802.11 Amendment Covers 

Vehicular Environments 


The latest IEEE 802.11 standard covers wireless 

LANs in vehicular environments. The standard is IEEE 

802.11p, “IEEE Standard for Information Technology — 

Telecommunications and information exchange between 

systems — Local and metropolitan area networks — 

Specific requirements---Part 11: Wireless LAN Medium 

Access Control (MAC) and Physical Layer (PHY) specifications---Amendment 

6: Wireless Access in Vehicular 

Environments.” IEEE 802.11p is the groundwork for 

Dedicated Short Range Communications (DSRC), a U.S. 

Department of Transportation project looking at vehiclebased 

communication networks, particularly for applications 

such as toll collection, vehicle safety services, and 

commerce transactions. 

Latest Version of IEEE 1641 — Signal 

and Test Definition 


The latest revision to IEEE 1641, “IEEE Standard for 

Signal and Test Definition,” continues the trend of making 

the standard more rigorous, according to IEEE StandardsWire. 

IEEE 1641 provides the means to define and 

describe signals used in testing. It also provides a set of 



common basic signals, built upon formal mathematical 

specifications so that signals can be combined to form 

complex signals usable across all test platforms. 

IEEE 802.22.1-2010 — Information 

Technology 

Publication Date: Nov. 1, 2010 

IEEE Standard for Information Technology--Telecommunications 

and information exchange between systems-- 

Local and metropolitan area networks--Specific requirements 

Part 22.1: Standard to Enhance Harmful Interference 

Protection for Low-Power Licensed Devices Operating 

in TV Broadcast Bands defines the protocol and data 

formats for communication devices forming a beaconing 

network that are used to protect low-power, licensed devices 

operating in television broadcast bands from harmful 

interference generated by license-exempt devices, 

such as Wireless Regional Area Networks (WRAN), 

intended to operate in the same bands. The devices being 

protected are devices licensed as secondary under Title 

47, Part 74, Subpart H in the USA and equivalent devices 

in other regulatory domains. 

IEEE to Develop Standard for Energy 

Storage in Smart Grids 


A new project from IEEE will develop guidelines to 

help facilitate the wide-scale and consistent implementation 

of energy storage systems to support the power 

infrastructure of the smart grid. The project, IEEE 

P2032.2, “Guide for the Interoperability of Energy Storage 

Systems Integrated with the Electric Power Infrastructure,” 

is being developed by the IEEE Standards 

Association Standards Board and its SCC21 - Fuel Cells, 

Photovoltaics, Dispersed Generation, and Energy Storage 

Committee. 

Updated Standard Covers Analog-to- 

Digital Converters 


The IEEE 1241 standard covering analog-to-digital 

converters has been updated to address conflicts with 

other standards. IEEE 1241-2010, “IEEE Standard for 

Terminology and Test Methods for Analog-to-Digital 

Converters,” incorporates many corrections and new 

information. It also contains revised language that is 

more consistent with IEEE 1057 and other standards. 

IEEE 1241 provides common terminology and test methods 

for the testing and evaluation of analog-to-digital 

converters. 

IEEE 1036 — First Revision to Shunt 

Power Capacitors Guide 


IEEE has published a revision to IEEE 1036, “IEEE 

Guide for Application of Shunt Power Capacitors.” This 

is the first revision to the standard since 1992. IEEE 1036 

applies to the use of 50 and 60 Hz shunt power capacitors 

rated 2400 Vac and above, and assemblies of capacitors. 

It includes guidelines for the application, protection, and 

ratings of equipment for the safe and reliable utilization 

of shunt power capacitors. The guide also covers applications 

that range from simple unit utilization to complex 

bank situations. 

IEEE EMC Society Withdraws From 

Power Line Communications Committee 

Citing concerns about parts of its technical content, 

the IEEE EMC Society Standards Development Committee 

(SDCom) voted to withdraw as the cosponsor of IEEE 

Standard for Power Line Communication Equipment 

-- Electromagnetic Compatibility (EMC) Requirements 

-- Testing and Measurement Methods (IEEE Standard 

1775-2010). 

VCCI Council 

Japan VCCI: Compliance with Limits on 

Radiated Disturbance Above 1GHz 

VCCI Council will start enforcement of conformity 

with limits on radiated disturbance above 1GHz of 

products subject to conformity verification report filing 

on and after Oct. 1, 2010. However, it is up to each member 

to decide if he will opt in conformity assessment tests 

above 1GHz until September 2011. 

Nevertheless, however, let us ask you to positively 

go ahead and ship products conforming to the 1GHz+ 

requirement by filing conformity verification reports on 

and after October 1, 2010 as if there were no 1-year grace 

period because VCCI runs its operation based on CISPR 

standards transposed to Japanese standard by the Information 

and Communication Committee, and July 2007 

Japanese standard says implementation of 1GHz+ should 

start in 2010. 

Other News 

European Commission Urges Harmony 

on Radio Spectrum 

The European Commission adopted in May harmonized 

technical rules for member states on the allocation 

of radio frequencies, aimed at avoiding interference 

and boosting its efforts to improve the deployment of 

high-speed wireless Internet services. 

Europe Wants Unified System for 

Recharging Electric Cars 

European Union nations agreed on the need to 

develop a standardized system for recharging electric 

cars throughout Europe by next year. The union’s 27 

industry ministers, meeting in Brussels in May, said the 

standardization is important for a number of reasons, 



including to address safety risks and electromagnetic 

compatibility issues. 

FCC ALlows Additional 25 MHz of 

Spectrum for Mobile Broadband Use 

The Federal Communications Commission on May 

20 adopted WT Docket No. 07-293, new rules allowing 

for an additional 25 megahertz of spectrum to be available 

for mobile broadband service in much of the United 

States, while protecting adjacent satellite radio and aeronautical 

mobile telemetry operations. The rules adopted 

amend the Wireless Communications Service (WCS) 

rules to immediately make 25 megahertz of spectrum 

available for mobile broadband services. The FCC also 

adopted enhanced build-out requirements for WCS licensees, 

to ensure that the promise of mobile broadband 

is realized. These requirements are designed to spur investment 

that will promote the deployment of innovative 

mobile broadband services across the country. 

FCC Opens Access to White Spaces 

Spectrum 

The U.S. Federal Communications Commission 

voted to open unused spectrum in the television band to 

unlicensed wireless broadband devices, a move that will 

give U.S. residents access to “super Wi-Fi.” The five-member 

FCC voted unanimously to allow the use of so-called 

“white spaces” between TV stations to deliver broadband 

connections that can function as “super Wi-Fi,” as the 

agency is calling the new technology. The agency is hoping 

to see devices with the technology start to appear 

within a year. 

European Union Publishes New List of 

Harmonized Standards 

Commission communication in the framework of 

the implementation of Directive 2004/108/EC of the 

European Parliament and of the Council of 15 December 

2004 on the approximation of the laws of the Member 

States relating to electromagnetic compatibility and 

repealing Directive 89/336/EEC. 

European Standards Groups Agree on 

Micro-USB 

European standardization bodies CEN-CENELEC 

and ETSI have agreed to make micro-USB the standard 

interface port for smartphones in Europe. The standards 

allow for interoperability, i.e. the common charger is 

compatible with data-enabled mobile telephones of different 

brands. They also take account of safety risks and 

electro-magnetic emissions and ensure that common 

chargers have sufficient immunity to external interference. 

This is the most recent development in the process 

towards a global common mobile phone charger initiated 

by the European Commission. It follows the June 

2009 agreement of 14 leading mobile phone producers to 

harmonize chargers for data-enabled mobile phones (i.e. 

that can be connected to a computer) sold in the European 

Union. 

Jedec to Create Standards for 

Smaller SSDs 

JEDEC Solid State Technology Association announced 

that its JC-64.8 Subcommittee for Solid State 

Drives will target the development of standards for SSDs 

in applications beyond conventional disk drive form 

factors. According to Jedec (Arlington, Va.), the interest 

in developing standards for unconventional form factor 

SSDs is being driven by rising demand for smaller consumer 

electronics devices. 

International Groups Advance Global 

Electric Vehicle Roll-Out 

The International Electrotechnical Commission 

(IEC) and e8, a global organization of 10 electricity 

companies, for the first time, brought together all major 

stakeholders that need to collaborate to accelerate the 

global roll-out of electric vehicles (EVs). At this international 

round table that took place on Jan. 19 in Washington 

D.C., USA, and which represents a milestone in the 

future growth of these vehicles, all participants confirmed 

that the IEC’s existing and proposed International 

Standards for EV charging satisfy their global needs. The 

objective of the round table was to determine priorities 

for the development of EV-related standards, to define 

future needs, and to accelerate the broad adoption of the 

relevant international standards that will enable global 

interoperability and connectivity. Follow-up meetings 

are being planned. 

FCC Steps Up Cell Phone, GPS Jamming 

Enforcement Efforts 

The FCC Enforcement Bureau announced new efforts 

to clamp down on the marketing, sale, and use of 

illegal cell phone and GPS jamming devices. Jamming 

devices are radio frequency transmitters that intentionally 

block, jam, or interfere with lawful communications, 

such as cell phone calls, text messages, GPS systems, 

and Wi-Fi networks. A single violation of the jamming 

prohibition can result in tens of thousands of dollars 

in monetary penalties, seizure of the illegal device, and 

imprisonment. The Bureau released two Enforcement 

Advisories and a downloadable poster on cellphone and 

GPS jamming that warn consumers, manufacturers, and 

retailers (including online and Web-only companies) that 

the marketing, sale, or use of cell, GPS, and other jamming 

devices is illegal. These steps highlight a new outreach 

phase of the Bureau’s continuing effort to halt the 

distribution and proliferation of illegal jamming devices 

in the United States. In the last two weeks, the Bureau 

issued warnings to four well-known online retailers – 

including the company that markets the TxTStopperTM 

– directing them to cease marketing jamming devices to 

customers in the U.S. or face stiff fines. 


societies 

professional societies 

IEEE Electromagnetic Compatibility 

Society (S-27) 

Headquarters: 

IEEE Operations Center 

445 Hoes Lane, P.O. Box 1331 

Piscataway, NJ 08855-1331 

Phone: (732) 981-0060 

www.ewh.ieee.org 

President: Francesca Maradei, fr.maradei@ieee.org 

The Institute of Electrical & Electronics Engineers 

(IEEE), the world’s largest professional engineering society, is a 

global organization of individuals dedicated to improving the 

understanding of electrical and electronics engineering and its 

applications to the needs of society. The parent organization 

has over 360,000 members, approximately 70 percent of whom 

belong to technical groups such as the EMC Society. 

Membership in the IEEE is on a qualified basis, with a 

basic annual fee of between $140.00 and $180.00 depending 

on the region of the world. The U.S. fee is $180.00. The Institute 

offers major medical and life insurance at low group 

rates, and each member receives a copy of the monthly 

publication, Spectrum. Affiliate, associate, and student 

memberships are available for those who do not qualify for 

regular membership; and special arrangements are provided 

for those temporarily out of work. Members may join 

one or more of the 39 technical societies by paying the additional 

individual society fee(s). The EMC Society has an 

annual fee of $25.00. Student memberships are $13.00. 

The EMC Society, which enjoys a membership of over 

5000, functions through a Board of Directors elected by 

the Society membership. The Board includes 20 membersat-large 

who serve staggered 3-year terms. The Executive 

Board consists of the President, President-Elect, Immediate 

Past President, Secretary, Treasurer, and five Vice Presidents, 

who oversee the activities of standing and technical 

committees. The officers are elected by the Board of 

Directors. The annual IEEE International Symposium on 

Electromagnetic Compatibility is sponsored by the Board 

of Directors, which also coordinates activities of standing 

technical and ad hoc committees. 

EMC Society publications include Transactions on 

EMC, a quarterly journal which features state-of-the-art 

papers on interference technology and EMC, and the EMC 

Society Newsletter, a quarterly newsletter of society activities, 

industry developments, practical papers, and notices 

of meetings, regulations, and new publications. 

The EMC Society also has a group of distinguished lecturers 

who are available to present talks to IEEE and other 

organizations. The Society subsidizes the lecturers’ expenses, 

and organizations are encouraged to contact the society 

for further details. 

Chairmen of these committees welcome assistance and 

indications of interest in committee activities from the EMC 

Society membership. EMC Society activities are provided by 

54 chapters with members in 61 countries worldwide. 

A Committee Directory, listing officer, board, committee, 

and chapter contacts’ names, addresses, and telephone 

numbers, is available on the IEEE EMC Society website at 

www.emcs.org. 

The EMC Society is also active in technical conferences 

and symposia through its sponsorship of the annual International 

Electromagnetic Compatibility Symposium and 

participation in other worldwide symposia. Symposia and 

conferences are announced in the EMC Society Newsletter. 

The IEEE Symposium on Electromagnetic Compatibility 

will be held in Long Beach, Calif. USA from August 14-19, 

2011. Visit the Symposium website at www.emc2011.org. 

The EMC Society has published a number of standards. 

For information on EMC Society and other IEEE standards, 

contact the IEEE Operations Center, 445 Hoes Lane, P.O. 

Box 1331, Piscataway, NJ 08855-1331; Phone: (732) 981-0060. 

IEEE Product Safety 

Engineering Society 

While product safety had been addressed in 

various committees over the years, there was never a professional 

society or symposium solely devoted to product 

safety engineering as a discipline until recently. The IEEE 

Product Safety Engineering Society (PSES) began operation 

on 1 January 2004. 

The field of interest of the Society is the theory, design, 

development and implementation of product safety engineering 

for electronic and electro-mechanical equipment 

and devices. This includes the theoretical study and practical 

application of analysis techniques, testing methodologies, 

conformity assessments, and hazard evaluations. 

The Society’s mission is to strive for the advancement of 

the theory and practice of applied electrical and electronic 

engineering as applied to product safety and of the allied 

arts and sciences. 

The Society provides a focus for cooperative activities, 

both internal and external to IEEE, including the promotion 

and coordination of product safety engineering 

activities among IEEE entities. In addition, the Society will 

provide a forum for product safety engineering professionals 

and design engineers to discuss and disseminate 

technical information, to enhance personal product safety 

engineering skills, and to provide product safety engineering 

outreach to engineers, students and others with an 

interest in the field. The Society is accepting members at 

any time during the calendar year, both full IEEE members 

and affiliate members. Membership is available at www. 

ieee.org/services/join/. 

The IEEE Product Safety Engineering Society works closely 

with various IEEE Societies and Councils that also include 

product safety engineering as a technical specialty. Currently 

there are 14 chapters with more in the formation process. 



Every year, the PSES hosts a Symposium on Product 

Compliance Engineering. The next conference will be in 

San Diego, California, USA on 10-12 October 2011. The 

Symposium will consist of Technical Sessions, Workshops, 

Tutorials and Demonstrations specifically targeted to the 

compliance engineering professional. Attendees will have 

the opportunity to discuss problems with vendors displaying 

the latest regulatory compliance products and services. 

For more information, visit http://www.ieee-pses.org/symposium/. 

Past papers from the Symposia are available in 

IEEE Xplore or on CD (for a fee). 

In addition to hosting an annual conference, the PSES 

provides the opportunity for product safety engineers to 

publish technical papers in a newsletter. See http://www. 

ieee-pses.org/newsletters.html. For further information 

and details on the Society, including becoming an author, 

please visit the website at www.ieee-pses.org. 

dB Society 

This unique, interesting, and exclusive fraternity 

of EMC engineers was founded in 1975 by 10 eminent EMC 

engineers. The purpose of the dB Society is to open doors 

within the EMC community. Its primary objectives are to 

greet and to welcome new engineers, suppliers, vendors, 

and manufacturers to the EMC community and to assist 

them in establishing contacts in the EMC field. 

The following membership requirements are unique and 

rigidly enforced: 

• Ten years of service to the EMC community, 

• Five years of service to a recognized professional, EMC 

organization, 

• Sponsorship by two Duo-Decade members, 

• Favorable recommendations by three other recognized 

individuals in the EMC community, and 

• Acceptance by the Admissions Board. 

Business meetings and informal, relaxed get-togethers 

take place during major EMC functions. A formal evening 

social function is the highlight of each year and is usually 

conducted during the IEEE EMC Symposium. All meetings 

are for members only. 

U.S. membership is limited to 100 EMC engineers. 

There are Society affiliates in the United Kingdom, India, 

and Israel. Qualified candidates are invited to write to: 

The dB Society 

22117 NE 10th Place 

Sammamish, WA 98074 

FAX: (425) 868-0547 

E-mail: j.n.oneil@ieee.org 

ESD Association 

Headquarters: 

ESD Association 

7900 Turin Road, Building 3 

Rome, NY 13440-2069 

phone: 315-339-6937 

fax: 315-339-6793 

email: info@esda.org 

website: www.esda.org 

Founded in 1982, the ESD Association is a professional 

voluntary association dedicated to advancing 

the theory and practice of electrostatic discharge (ESD) 

avoidance. From fewer than 100 members, the Association 

has grown to more than 2,000 members throughout the 

world. From an initial emphasis on the effects of ESD on 

electronic components, the Association has broadened its 

horizons to include areas such as textiles, plastics, web processing, 

cleanrooms, and graphic arts. To meet the needs 

of a continually changing environment, the Association is 

chartered to expand ESD awareness through standards development, 

educational programs, local chapters, publications, 

tutorials, certification, and symposia. 

ELECTROSTATIC DISCHARGE (ESD) TECHNOLOGY 

ROADMAP 

In the late 1970s, electrostatic discharge, or ESD, became a 

problem in the electronics industry. Low-level ESD events 

from people were causing device failures and yield losses. 

As the industry learned about this phenomenon, both 

device design improvements and process changes were 

made to make the devices more robust and processes more 

capable of handling these devices. With devices becoming 

more sensitive through the year 2010, it is imperative that 

companies begin to determine the ESD capabilities of their 

handling processes. The ESD Technology Roadmap can be 

downloaded at: www.esda.org 

ANSI/ESD S20.20 CONTROL PROGRAM 

STANDARD AND CERTIFICATION 

A primary direction for the association is the continued 

implementation of a facility certification program in conjunction 

with ISO registrars. With the association’s ESD 

control program standard, ANSI/ESD S20.20: Protection 

of Electrical and Electronic Parts, Assemblies and Equipment 

(Excluding Electrically Initiated Explosive Devices), 

the Association offers a means of independently assessing 

a company’s ESD control program and of issuing a formal 

ANSI/ESD S20.20 certification. 

The ANSI/ESD S20.20 standard covers the requirements 

necessary to design, establish, implement, and maintain 

an ESD control program to protect electrical or electronic 

parts, assemblies and equipment susceptible to ESD damage 

from Human Body Model (HBM) discharges greater than 

or equal to 100 volts. Developed in response to the Military 



Standardization Reform Act, ANSI/ESD S20.20 has been 

formally adopted for use by the U.S. Department of Defense. 

Although ESD programs have been part of some ISO 

9000 audits in the past, the assessment frequently has been 

cursory and actual judgment of the program has been left 

to the individual auditor. ANSI/ESD S20.20 provides a 

formal, consistent process standard that can be audited. It 

provides a single, auditable ESD standard for OEM’s, suppliers, 

and contractors. To date, there are approximately 

132 facilities in 13 countries that have become ANSI/ESD 

S20.20 certified. 

Accredited registrars conduct the actual assessments of 

the companies. The association has developed a training 

program for the registrars and supervises registrar witness 

audits. This independent assessment of a company’s ESD 

control program could be performed as part of the company’s 

ISO 9000 surveillance audit or as a separate audit. 

Currently, there are 161 trained auditors in 13 countries who 

have been certified to conduct ANSI/ESD S20.20 audits. 

In addition, the ESD Association offers an ESD program 

documentation review service. For a fee of $1,500 (US), 

members of the ESD Association’s Facility Certification 

committee will review your ESD program documentation 

and will compare it to the requirements listed in ANSI/ 

ESD S20.20-2007. Facilities that choose to become certified 

will use the ANSI/ESD S20.20-2007 standard as the 

basis for their certification. A report will be provided that 

describes the areas that need to be improved for documentation 

to be compliant with ANSI/ESD S20.20-2007. This 

service should be considered a MUST for any company that 

is preparing for facility certification based on ANSI/ESD 

S20.20-2007. 

SYMPOSIA, TUTORIALS, AND PUBLICATIONS 

As part of its commitment to education and technology, 

the association holds the annual EOS/ESD Symposium, 

which places major emphasis on providing the knowledge 

and tools needed to meet the challenges of ESD. Scheduled 

for Sept. 11-16, 2011, at the Disneyland Hotel, in Anaheim, 

Calif., USA, the annual Symposium attracts attendees and 

contributors from around the world. Technical sessions, 

workshops, authors’ corners, seminars, tutorials, and 

technical exhibits provide a myriad of opportunities for 

attendees to expand their knowledge of ESD. 

In addition to tutorials and seminars, the association 

offers a number of publications and reference materials for 

sale. These range from proceedings of past EOS/ESD Symposia 

to textbooks written by experts in the field of ESD. 

TechAmerica 

Electromagnetic Compatibility Committee 

(G-46) Headquarters 

TechAmerica 

1401 Wilson Blvd., Suite 1100 

Arlington, VA 22209 

Phone: (703) 248-5326 

www.TechAmerica.org 

TechAmerica is the association that was created 

by the merger of AeA and ITAA. Earlier in 2008, 

ITAA and GEIA merged. The result of these mergers is an 

organization that is the leading voice for the U.S. technology 

industry, which is the driving force behind productivity 

growth and jobs creation in the United States. TechAmerica 

is the technology industry’s only grassroots-to-global 

advocacy network. With nearly 1200 member companies, 

20 regional councils and offices in Beijing and Brussels, the 

association represents the full spectrum of the technology 

industry. 

TechAmerica is the technology industry’s only grassroots-to-global 

advocacy network. The organization has 

expanded initiatives in areas such as: information Assurance 

/ Information Security, Identity Management, Cloud 

Computing, Global Sourcing / Globalization, Intelligence 

agencies, Department of Defense & NASA, and State & Local 

programs and public policy advocacy. 

TechAmerica provides programs for business development, 

networking and market intelligence in the Federal 

arena, dealing with government entities such as Department 

of Defense, Homeland Security, Federal Communications 

Commission, Federal Trade Commission,, Congress, 

as well as with state and local governments. 

TechAmerica has a team of public policy professionals 

at state, federal and international levels, that allow the organization 

to successfully influence legislative and regulatory 

issues that affect member companies. 

In addition, TechAmerica offers an active standards 

development program to provide industry with proven 

solutions to business process challenges. The program is 

nationally and internationally recognized for its leadership 

and expertise in the development of standards. Configuration 

Management, Systems Engineering, Systems 

Safety, Earned Value Management, Logistics, Reliability 

and Electromagnetic Compatibility (EMC) area where 

TechAmerica is involved in standard. 

The Electromagentic Compatibility (EMC) Committee 

(formally known as G-46) deals with the system-oriented 

discipline that ensures electromagnetic compatibility in 

electronics design. The Committee develops technical criteria 

and procedures to guide the design engineer. Its work 

also includes spectrum management and conservation; 

secure communications; and electromagnetic emissions, 

susceptibility, control, and characterization. 

The EMC Committee was established to provide an 

industry/user position on government specifications, regulations, 

and standards. Participation has expanded to include 

G-46 representation on the various committees drafting 

government specifications and standards. For example, G-46 

participated on the working committees for MIL-STD-464A 

and MIL-STD-461E and provided update recommendations 

to MIL-STD-461F. The scope of G-46 activities has expanded 

to foster and facilitate the EMC discipline for the benefit 



of TechAmerica member companies. 

Committee activities include spectrum management 

and conservation; personnel safety; and health care electronics 

design, usage and installation in terms of regulated 

and non-regulated electromagnetic (EM) emissions and 

immunity. Inter- and intra-environmental areas as they 

affect systems, subsystems and equipment, subassemblies, 

and components are also areas of concern. In addition to 

other activities, committees: 

• Review, assess, advise, and coordinate related activities 

of organizations/individuals in government, industry, 

and technical societies. 

• Assure that EMC legislation, regulations, specifications, 

standards, requirements, and evaluation procedures are 

adequate for procurement and application. 

• Assure that EMC legislation, regulations, specifications, 

standards, requirements, and evaluation procedures are 

harmonized with their commercial counterparts to the 

maximum extent practical for procurement and application. 

• Propose and recommend action and provide support to 

other organizations, as deemed desirable. 

• Coordinate and promulgate information to facilitate 

advancement of the state-of-the-art. 

Additional information on TechAmerica and the EMC 

Committee (G-46) can be obtained from Phyllis Call at 

(703) 284-5315, phyllis.call@techamerica.org, or via the 

GEIA website at http://www.geia.org. 

Society of Automotive Engineers 

Committee AE-4, Committee Headquarters: 


400 Commonwealth Drive 

Warrendale, PA 15096-0001 

Phone: (724) 776-4841 

SAE International is a professional society of 

engineers dedicated to a broad spectrum of engineering 

disciplines within the aerospace and automotive fields. 

Under the SAE Aerospace Council, technical standards 

committees address disciplines ranging from electrical 

power to multiplex signal characteristics—and from fiber 

optic data transmission to electromagnetic compatibility. 

The many elements of EMC are handled by SAE Committee 

AE-4, Electromagnetic Compatibility, which was organized 

in 1942 under the Aerospace Council. The committee 

is composed of technically qualified members, liaison 

members, and consultants—all of whom are responsible for 

writing standards on electromagnetic compatibility. 

Committee AE-4 provides assistance to the technical 

community through standardization, improved design and 

testing methodology, and technical forums for the resolution 

of mutual problems. Engineering standards, specifications, 

and technical reports are developed by the Committee and 

are issued by the Society for industry and governments worldwide. 

Objectives of Committee AE-4 are to advance the state 

of technology, to stabilize existing technology, to obtain a uniformity 

of EMC requirements among government agencies, 

and to further the interests of the EMC technical community. 

The theme of “design before the fact” for EMC is a guiding 

concept. Special attention is given to maintenance of EMI 

control requirements consistent with the rapidly advancing 

state-of-the-art. 

The following is a partial list of documents that have 

been issued to assist in implementing SAE objectives. For a 

complete list, visit the SAE website at www.sae.org or call 

SAE Customer Service at (724) 776-4841. 

Aerospace Recommended Practices (ARPs) 

ARP 935A Control Plan/Technical Construction File 

ARP 936A Capacitor, 10 mF for EMI Measurements 

ARP 958C Electromagnetic Interference Measurement Antennas, 

Standard Calibration Method 

ARP 958D Electromagnetic Interference Measurement Antennas, 

Standard Calibration Method 

ARP 1172 Filters, Conventional, EMI Reduction, Specifications 

for 

ARP 1173 Test Methods for EMI Gasketing 

ARP 1267 EMI Measurement of Impulse Generators, Standard 

Calibration Requirements and Techniques 

ARP 1481A Corrosion Control and Electrical Conductivity in 

Enclosure Design 

ARP 1705 Coaxial Test Procedure to Measure the RF Shielding 

Characteristics of EMC Gasket Materials 

ARP 1870 Aerospace Systems Electrical Bonding and Grounding 

for Electromagnetic Compatibility and Safety 

ARP 1972 Recommended Practices and Procedures for EMC 

Testing 

ARP 4043A Flightline Bonding and Grounding of Aircraft 

ARP 4242 Electromagnetic Compatibility Control Requirements, 

Systems 

ARP 4244 Recommended Insertion Loss Test Methods for EMI 

Power Line Filters 

Aerospace Information Reports (Airs) 

AIR 1147 EMI on Aircraft from Jet Engine Charging 

AIR 1209 Construction and Calibration of Parallel-Plate Transmission 

Lines for EMI Susceptibility Testing 

AIR 1221 EMC System Design Checklist 

AIR 1255 Spectrum Analyzers for EMI Measurements 

AIR 1394A Cabling Guidelines for Electromagnetic Compatibility 

AIR 1404 DC Resistivity vs. RF Impedance of EMI Gaskets 

AIR 1423 EMC on Gas Turbine Engines for Aircraft Propulsion 

AIR 1425A Methods of Achieving EMC of Gas Turbine Engine 

Accessories, for Self-Propelled Vehicles 

AIR 1499 Recommendations for Commercial EMC Susceptibility 

Requirements 

AIR 1662 Minimization of Electrostatic Hazards in Aircraft 

Fuel Systems 



AIR 1700A Upper Frequency Measurement Boundary for 

Evaluation of Shielding Effectiveness in Cylindrical 

Systems 

AIR 4079 Procedure for Digitized Method of Spark Energy 

Measurement 

SAE AE-4 Electromagnetic Environmental 

Effects (E3 or EMC) Committee 

The SAE AE-4 E3 Committee provides a technical, coordinating, 

and advisory function in the field of E3. The focus 

is on problem areas in which committee expertise can be 

effectively applied at the national and international levels. 

Electrical and electronic accessories are studied for compatibility 

within systems and with various communications 

media. Engineering standards, specifications, and technical 

reports are developed and are issued for the general information 

of industry and government. 

In the past, subcommittees have included AE-4R, Aircraft 

Radiated Environments, and AE-4H, High Power RF 

Simulators and Effects. AE-4 E3 holds national meetings in 

conjunction with the IEEE EMC Society Symposium, usually 

held in August at various locations. Additional information 

about meetings or more specific information on the 

activities of the Committee can be obtained by contacting: 

Dorothy Lloyd 

Aerospace Standards Specialist 


400 Commonwealth Drive 

Warrendale, PA 15096-0001 

Phone: (724) 776-4841 

dlloyd@sae.org 

or the Chairman, Gary Fenical, gfenical@lairdtech.com. 

Visit the SAE’s Technical Standards Committee Forum 

website at http://forums@sae.org. 

iNARTE 

iNARTE, Inc. (The International Association for 

Radio, and Telecommunications and Electromagnetics, 

Inc.) was founded as a non-profit membership/certification 

organization in 1982. With the advent of deregulation and 

the Federal Communications Commission’s “encouragement/urging” 

private industry to establish certification 

standards to fill the licensing void, iNARTE initiated and 

developed a comprehensive certification program for telecommunications 

engineers and technicians. 

In 1988, a Command of the United States Navy, seeking 

a credible and respected certification entity, selected 

iNARTE as the administrative agent for the certification of 

engineers and technicians in the field of electromagnetic 

compatibility (EMC). 

In 1993, iNARTE, certified by the Federal Communications 

Commission (FCC) as a Commercial Operators 

License Examination Manager (COLE Manager), was 

authorized to administer all examination elements for FCC 

licensure (formally an FCC responsibility). 

In 1994, the ESD Association selected NARTE to implement 

and administer a certification program for Electrostatic 

Discharge Control Engineers and Technicians. 

During 1997, two nations, China and Japan, requested 

iNARTE assistance in the establishment of specific incountry 

certification programs comparable to and able to 

meet iNARTE certification standards. 

In 2000, iNARTE established the Unlicensed Wireless 

Systems Installer certification to identify fully qualified design 

and installation personnel. This certification accredits 

professionals who design and install wireless systems that 

do not require a license from the FCC—including information 

systems, security systems, and transportation systems. 

In 2001, iNARTE developed an Agreement with the 

IEEE EMC Society for the co-promotion of awareness and 

education in EMC/EMI fields. Today the EMC Society is 

the keeper of the body of knowledge from which the iN- 

ARTE examinations are derived. 

In 2003 iNARTE, together with specialist partners, developed 

the Product Safety certification program. The Product 

Safety program accredits professionals who use hazard-based 

analysis to identify and develop solutions to eliminate or 

minimize safety hazards. In 2004 iNARTE signed an Agreement 

with the IEEE Product Safety Engineering Society, PSES, 

to co-promote awareness and education in Product Safety. 

Today, technical experts within the PSES assist iNARTE in 

the development of the examination question pools. 

In 2006 iNARTE executed Agreement with ANSI ASC 

63, the Accredited Standards Committee on EMC, for the 

purposes of joint cooperation and promotion in education 

and technical achievement in EMC engineering. 

By 2007, the global interest and participation in iN- 

ARTE Certification programs had resulted in almost one 

quarter of members being from overseas countries. In 

recognition of this, the iNARTE Board of Directors voted 

unanimously to change the Association name to the, 

“International Association for Radio. Telecommunications 

and Electromagnetics, iNARTE.” 

As iNARTE, an agreement of mutual support and cooperation 

was signed with the ESD Association in 2007. The 

ESDA will assist iNARTE in formulating and maintaining 

the question pools from which certification examinations 

are derived. 

ACIL—The American Council of 

Independent Laboratories 

The American Council of Independent Laboratories 

(ACIL) is the trade association representing independent, 

commercial engineering, and scientific laboratory, testing, 

consulting, product certifying, and R&D firms; manufacturers’ 

laboratories; related non-profit organizations; and 

consultants and suppliers to the industry. The organization 

was founded in 1937. All ACIL activities focus on its mission: 

to enhance members’ success by providing advocacy, 



education, services, and mutual support and by promoting 

ethics, objectivity, independence, and free enterprise. 

ACIL is a voluntary, non-profit membership organization. 

Programs are determined by members, administered by an 

elected Board of Directors, and supported by a professional 

staff operating from headquarters in Washington, D.C. 

ACIL’s Conformity Assessment Section 

ACIL’s Conformity Assessment Section consists of firms 

with wide and varied interests, all performing testing, 

listing, or labeling in accordance with applicable safety 

and performance standards, and/or materials testing and 

resolution of product and structural problems. Several committees 

have evolved within the Section to meet the needs 

of its diverse membership, including the EMC Committee, 

the U.S. Council of EMC Laboratories, and the Third-Party 

Product Certifiers Committee. In January 2005, the Section 

sponsored a booth at the Consumer Electronics Show that 

advocated the advantages of independent third-party testing 

and the capabilities of ACIL member EMC laboratories. 

ACIL’s EMC Committee 

ACIL’s EMC Committee was established in 1996 to address 

the common concerns of the ACIL EMC community. 

The Committee sponsors educational sessions 

at ACIL meetings that include both technical and 

policy issues such as mutual recognition agreements 

(MRAs). The Committee updates members on the 

latest developments, upcoming requirements, and 

activities in the field—both domestic and international. 

In January 2002, ACIL published a 143-page 

document, Technical Criteria for the Accreditation 

of Electromagnetic Compatibility (EMC) and Radio 

Testing Laboratories, a checklist to assist both assessors 

and laboratories. 

The Committee also formed the U.S. Council of 

EMC Laboratories (USCEL) in an effort to aid U.S. 

laboratories in addressing technical issues arising 

from the U.S./EU MRA and other global concerns. 

As the USCEL Secretariat, ACIL provides staff and 

supports volunteers active in this important area. 

Over the past several years, ACIL has administered 

round robin proficiency testing programs with 

two artifacts allowing laboratories to make both AC 

line conducted and radiated emissions measurements 

over the frequency range of 0.15–30 MHz 

and 30 MHz–1 GHz, respectively. While continuing 

the round robins in the frequencies noted above, 

ACIL has launched another round robin with a new 

test artifact. This artifact will allow participating 

laboratories to demonstrate proficiency for radiated 

emissions measurements in the frequency range of 

1–18 GHz. Emissions measurements above 1 GHz 

are becoming increasingly common with the advent 

of fast processors and wireless devices in the 2.4- 

and 5-GHz bands. 

ACIL also was instrumental in the formation of the 

Telecommunication Certification Body Council (TCBC). 

New rules establishing TCBs were adopted by the FCC in 

December 1998, providing more options for manufacturers—they 

can now choose to have their product certified 

by either the FCC or a private certification body (TCB). A 

TCB may approve equipment subject to certification (e.g., 

transmitters, telecom terminal equipment, or scanning 

receivers). The TCB Council addresses the specific concerns 

of the TCB community and all constituent bodies are 

permitted to participate. 

U.S. Product Certifiers 

Key U.S. product certifiers are ACIL members and are 

reaping many benefits, such as participation in the ACIL 

Third-Party Product Certifiers Committee (3P²C²). This 

Committee provides a forum for members to discuss and 

to act upon various issues of common interest. This committee 

formed the American Council for Electrical Safety 

to serve as a forum among testing laboratories, regulators, 

and electrical inspectors. n 


government emi/emc directory 

directory of government personnel involved in emi/emc 

T 

he following is a list of the principal U.S., NATO and Canadian Government personnel known to be involved in the interference 

technology field. This list is based upon best available data at the time of publication. Additions, deletions and corrections for any 

facility may be updated at any time by e-mailing your changes to slong@interferencetechnology.com. 

DEPARTMENT OF DEFENSE 

Defense Spectrum Organization 

DSO Director: Ms. Paige R. Atkins........(703) 325-2567 

Paige.Atkins@disa.mil 

DSO Dep Dir: Mr. Ralph Puckett........... (703) 325-2874 

Ralph.Puckett@disa.mil 

Strategic Planning Office (SPO) 

SPO Director: Mr. Steven A. Molina..... (703) 325-0435 

Steven.Molin@disa.mil 

Internat'l Team Lead: Mr. Chris Hofer...(703) 325-2876 

EST Team Lead: Ms. Mary Lin...............(703) 325-0136 

National Team Lead: Mr. Dan O'Neill....(703) 325-2606 

Joint Spectrum Center (JSC) 

2004 Turbot Landing 

Annapolis, MD 21402-5064 

Tel: (410) 293-4957 

Fax: (410) 293-2631 

Commander, JSC (J00): 

COL John J. HICKEY Jr., USA................. (410) 293-2450 

John.Hickey@jsc.mil 

Commander's Group: commander@jsc.mil 

Technical Director (J01): 

Mr. Mike Williams................................. (410) 293-2457 

mike.williams@jsc.mil 

Executive Officer (J02): 

CDR Robert "Jeff" Lamont, USN............ (410) 293-2452 

Jeff.Lamont@jsc.mil 

Operations Division (J3): 

Chief: LTC Kevin T. Laughlin................... (410) 293-9813 

Kevin.Laughlin@jsc.mil 

Senior Engineer: Mr. Robert Lynch........ (410) 293-9816 

robert.lynch@jsc.mil 

RD&A Division (J5): 

Mr. Robert Schneider.............................(410) 293-4958 

robert.schneider@jsc.mil 

Senior Engineer: Mr. Marcus Shellman, Jr..................... 

.................................................................(410) 293-4959 

marcus.shellman@jsc.mil 

Team Lead: Mr. Matthew Grenis...........(410) 293-9264 

matthew.grenis@jsc.mil 

R&D Team Lead: Mr. Serey Thai...........(410) 293-9263 

Serey.Thai@jsc.mil 

Spectrum Management Information Technology 

Division (J6): 

Acting Chief: Mr. Joseph R. Whitworth.......................... 

.................................................................(410) 293-9822 

Plans and Resources Division (J7): 

Chief: Mrs. Joanne F. Sykes................... (410) 293-2356 

joanne.sykes@jsc.mil 

Applied Engineering Division (J8): 

Chief: Aaron Leong, Lt Col, USAF.......... (410) 293-2682 

Aaron.Leong@jsc.mil 

Senior Engineer: Mr. Irving Mager, Jr. (J8)..................... 

................................................................. (410) 293-2103 

irving.mager@jsc.mil 

Chief, DSRMA: Mr. Ted Grove............... (410) 293-2222 

Joint Frequency Management and 

Spectrum Engineering Office, Atlantic 

(JFMO LANT) 

Director JFMO LANT (USJFCOM/J63) 

1562 Mitscher Ave., Ste. 200 

Norfolk, VA 23551-2488 

Tel.: (757) 836-8006 

Fax: (757) 836-8022 

UNITED STATES AIR FORCE 

Aeronautical Systems Center (ASC) 

ASC/ENAD 

2145 Monahan Way 

Wright-Patterson Air Force Base, OH 45433-7101 

Fax: (937) 255-5305 

E3 Technical Advisor 

Mr. Manny Rodriguez............................ (937) 255-8928 

manuel.rodriguez@wpafb.af.mil 

EMI/EMC Tech Specialist 

Mr. Joseph M. DeBoy, (937) 255-9293 

joseph.deboy@wpafb.af.mil 

EMI/EMC Engineer 

Mr. Brian M. Lezanic...............................(937) 255-9051 

brian.lezanic@wpafb.af.mil 

Electromagnetic Environmental Effects (E3) Engineer 

Mr. Jose Pabon Soto..............................(937) 255-0139 

jose.pabon-soto@wpafb.af.mil 


312/326 AE SW (Fighter Bomber Wing) 

702 AE SG (B-2) 

2690 C St., B556 

Wright-Patterson AFB, OH 45433-7424 

Fax: (937) 255-9450 

Mr. Joe Harrington................................ (937) 255-0844 

joseph.harrington@wpafb.af.mil 



702 AE SG (B-2) 

2690 C St., B556 


Dr. Phil Beccue........................................(937) 255-6881 

Philip.Beccue@wpafb.af.mil 



651 AE SS (B-52) 

2690 C St., B556 


FAX (937) 656-4621 

Mr. Jeremy Burns....................................(937) 255-7025 

jeremy.burns@wpafb.af.mil 

HQ Air Force Material Command (AFMC) 

AFMC/EN P 

Bldg. 262/Rm N145/Post116D 

Wright-Patterson AFB, Ohio 45433 

Fax: (937) 656-4183 

Mr. John S. Welch..................................(937) 255-0651 

john.welch@wpafb.af.mil 


516 AE SW (Mobility) 

836 AE SG (Tankers) 

2530 Loop Road West, 

Wright-Patterson AFB, Ohio 45433 

Mr. Robert Rosengarten.........................(937) 255-3451 

Robert.Rosengarten@wpafb.af.mil 

Aeronautical Systems Center 

Special Operations Forces Systems Group 

667 AE SS/EN 

1895 5th St. 


Fax: (937) 255-4018 

Mr. Steven Coffman...............................(937) 255-2860 

steven.coffman@wpafb.af.mil 

Aeronautical Systems Center 

Reconnaissance Systems Wing 

303 AE SG (Global Hawk) 

2640 Loop Road West 


Mr. Dave Osborn..................................... (937) 255-7437 

david.osborn@wpafb.af.mil 

Air Force Research Laboratory, Sensors 

Directorate 

AFRL/ RYRA 

2241 Avionics Circle 

Bldg 620, Rm 1DG106 

Wright-Patterson Air Force Base 45433-7318 

EMI Laboratory 

Mr. John Zentner....................................(937) 904-9024 

john.zentner@wpafb.af.mil 

Air Combat Command (ACC) 

85 Engineering Installation Squadron 

85 EI S/SCYM 

670 Maltby Hall Drive, Ste.234 

Keesler AFB, MS 39534-2633 

85.eis.scym@keesler.af.mil 

Specialized Engineering Flight: 

Mr. George R. McNeer, SCY.................. (228) 377-1037 

Electromagnetics Section Chief: 

Mr. Frederick G. Blache, SCYM..............(228) 377-3926 

frederick.blache@us.af.mil 

E3 Engineers: 

Mr. Randal Blanchard, SCYT.................. (228) 377-1068 

randal.blanchard@us.af.mil 

Captain Micah Coplan............................ (228) 377-1035 

micah.coplan@us.af.mil 

Ms. Kristen M. Corrigan......................... (228) 377-1073 

kristen.corrigan@us.af.mil 

Mr. Edward Crum, SCYM....................... (228) 377-1096 

edward.crum@us.af.mil 

Mr. Stephen L. Dabney............................(228) 377-1074 

stephen.dabney@us.af.mil 

Mr. Tim O. Hillman.................................. (228) 377-1278 

timothy.hillman@us.af.mil 

Mr. Justin L. Johnston............................(228) 377-3041 

justin.johnston@us.af.mil 

Mr. Carlton L. Jones............................... (228) 377-1088 

carlton.jones@us.af.mil 

Mr. James W Laycock............................ (288) 377-1035 

james.laycock@us.af.mil 

Mr. Tom Lipski......................................... (228) 377-1084 

thomas.lipski@us.af.mil 

Captain Arris Pineda................................(228) 377-1126 

arris.pineda@us.af.mil 

Mr. Alton J. Richards III.......................... (228) 377-1079 

alton.richards@us.af.mil 

Captain Jason R. Seyba......................... (228) 377-1085 

jason.seyba@us.af.mil 

Mr. Gregory P. Smith............................... (228) 377-1083 

gregory.smith.7@us.af.mil 

Mr. Jesse L. Thomas III...........................(228) 377-1126 

jesse.thomas@us.af.mil 

Mr. Phi D. Tran........................................ (228) 377-1062 

phi.tran@us.af.mil 

Mr. Truong X. Vu..................................... (228) 377-1866 

truong.vu@us.af.mil 

Mr. Brandon Walker................................ (228) 377-1048 

brandon.walker.1@us.af.mil 



Mr. Robert (Nick) Wilson, Sr. Electronics Engineer........ 

................................................................. (228) 377-1047 

robert.wilson.6@us.af.mil 

UNITED STATES ARMY 

U. S. Army Research, Development and 

Engineering Command (RDECOM) 

Attn.: AMSRD-AAR-AEP-F 

Bldg. 3208 

Picatinny Arsenal, NJ 07806-5000 

Fax: (973) 724-3025 

Mr. Tom Crowley, Supvr.........................(973) 724-5678 

thomas.m.crowley@us.army.mil 

Mr. Derrick Coppin, Proj. Engr................(973) 724-4871 

derrick.coppin@us.army.mil 

Mr. Daniel Gutierrez, Sr. Proj. Engr........(973) 724-4667 

daniel.gutierrez@us.army.mil 

Mr. Paul Lee, Proj. Engr............... (973) 724-4584/4667 

paul.m.lee@us.army.mil 

Army Research, Development, and 

Engineering Command (RDECOM) 

Attn: RDMR-AES-E3 

Building 4488 

Redstone Arsenal, AL 35898-5000 

Fax: (256) 313-3194 

E3 for Army Aircraft Airworthiness 

E3 Branch Chief: 

Mr. Dave Lewey.....................................(256) 313-8464 

dave.lewey@us.army.mil 

E3 Team Lead, Attack/Recon/Cargo Team: 

Ms. Karen Compton................................(256) 313-8437 

karen.compton@us.army.mil 

E3 Team Lead, Utility/Fixed Wing/SOA Team: 

Mr. Duane Driver ....................................(256) 313-8447 

duane.driver@us.army.mil 

Mr. Dale Heber....................................... (256) 313-2229 

dale.heber@us.army.mil 

Mr. Bruce Hildebrandt........................... (256) 313-8457 

bruce.hildebrandt@us.army.mil 

Mr. Elliot Croom..................................... (256)842-5387 

Elliot.croom@amrdec.army.mil 

Mr. Abner Merriweather........................(256) 313-8470 

abner.merriweather@us.army.mil 

Mr. Brian Smith,iNCE, iNCT...................(256) 313-8484 

brian.smith42@us.army.mil 

Mr. John Trp............................................ (256) 313-3148 

john.trp@us.army.mil 

Mr. Mike Dreyer......................................(256) 313-6384 

michael.dreyer@us.army.mil 

Mr. Dan Hinton........................................(256) 313-8497 

daniel.w.hinton@us.army.mil 

Mr. David Alan Landrith..........................(256)313-9102 

david.landrith@amrdec.army.mil 

Mr. Roy Lawson......................................(256) 313-8454 

roy.lawson@us.army.mil 

Attn.: AMSAM-RD-MG-SD 

SC Functions 

Mr. Dave Smith....................................... (256) 876-1688 

wayne.d.smith2@us.army.mil 

Army Test and Evaluation Command (ATEC) 

Redstone Technical Test Center (RTTC) 

E3 Test Branch 

Attn.: CSTE-DTC-RT-E-EM 

Redstone Arsenal, AL 35898-8052 

Supervisor: Mr. James L. Zimmerman............................ 

.................................................................(256) 876-6386 

jzimmerman@us.army.mil 

Mr. Jeff Craven...................................... (256) 842-2952 

jeffery.d.craven@us.army.mil 

Mr. David Anconetani.............................(256) 876-0981 

danconetani@us.army.mil 

Mr. David Elkins......................................(256) 876-3965 

delkins@us.army.mil 

Mr. Jarrod Fortinberry............................(256) 876-3505 

jfortinberry@ us.army.mil 

Ms. Jennifer Oberle................................(256) 955-6140 

joberle@us.army.mil 

Mr. Joe Reyenga.....................................(850) 833-2837 

gerald.reyenga@eglin.af.mil 

Dr. Tom Shumpert...................................(256) 876-9974 

tshumpert@us.army.mil 

Mr. Andrew Smilie.................................. (256) 876-9512 

asmilie@us.army.mil 

Mr. Lee Stucker....................................... (256) 876-1790 

lstucker@us.army.mil 

Dr. Mark Waller.......................................(256) 313-6970 

mwaller@us.army.mil 

Dr. Ken Whigham....................................(256) 313-0257 

kwhigham@us.army.mil 

Army Center for Health Promotion & 

Preventive Medicine (CDR USACHPPM) 

Radiofrequency/Ultrasound Program 

Attn.: MCHB-TS-ORF 

5158 Blackhawk Road 

Aberdeen Proving Ground, MD 21010-5403 

Mr. John J. DeFrank...............................(410) 436-3353 

Bureau of Medicine and Surgery (M3F72) 

2300 E. St., N.W. 

Washington, DC 20372-5300 

Fax: (202) 762-0931 

LTJG Jamaal Whitmore..........................(202) 762-3448 

jawhitmore@us.med.navy.mil 

Army Engineer Research and Development 

Center 

Construction Engineering Research Laboratory 

Attn.: CEERD-CF-F 

P.O. Box 9005 

Champaign, IL 61826-9005 

Dr. William J. Croisant............................ (217) 373-3496 

william.j.croisant@erdc.usace.army.mil 

Army Electronic Proving Ground 

Test Engineering Directorate 

Laboratory Division 

Attn.: TEDT-EP-TEL 

Fort Huachuca, AZ 85613-7110 

Div. Chief Mr. Rafael Anton..................(520) 538- 4916 

rafael.anton@us.army.mil 

E3 Test Facility/Blacktail Canyon 

Technical Lead: Mr. Johnny Douglas.... (520) 533-5819 

johnny.douglas@us.army.mil 

Mr. James Smith.....................................(520) 538-5188 

james.a.smith4@us.army.mil 

Ms. Rachel Blake................................... (520) 538-2818 

rachel.m.blake@us.army.mil 

Mr. David Seitz....................................... (520) 533-5819 

david.seitz3@us.army.mil 

Antenna Test Facility 

Technical Lead: Mr. Doug Kremer........ (520) 533-8170 

douglas.kremer@us.army.mil 

Army Intelligence and Security Command 

G-4, Technical Support Division 

Attn.: IALO-T 

8825 Beulah St. 

Ft. Belvoir, VA 22060-5246 

Tel.: (703) 428-4479 

Fax: (703) 428-4911 

Ms. Anne Bilgihan 

ambilgi@mi.army.mil 

Army Nuclear and Chemical Agency 

(USANCA) 

7150 Heller Loop, Ste. 101 

Springfield, VA 22150-3198 

Mr. R. Pfeffer......................................... (703) 806-7862 


United States Army Aberdeen Test Center (ATC) 

Electromagnetic Interference Test Facility (EMITF) 

Attn.: CSTE-DTC-AT-SL-V-EMI 

400 Colleran Road, Building 456 

Aberdeen Proving Ground, MD 21005-5059 

Fax: (410) 278-0579 

EMITF Supervisor: 

Mr. Michael C. Geiger............................ (410) 278-2598 

michael.c.geiger@us.army.mil 

Electrical Engineer: 

Mr. Clinton Sienkiewicz..........................(410) 278-9340 

cliftin.sienkiewicz@us.army.mil 

Electronic Technicians: 

Mr. Duane Buono....................................(410) 278-9340 

duane.buono@us.army.mil 

Mr. Keith Deitz....................................... (410) 278-9339 

keith.deitz@us.army.mil 

Mr. Christopher Dennison..................... (410) 278-9340 

c.dennison@us.army.mil 

Mr. JR Gildeleon..................................... (410) 278-9339 

john.gildeleon@us.army.mil 

Mr. Todd Holman.................................... (410) 278-9340 

richard.t.holman@us.army.mil 

Mr. Tom Martin...................................... (410) 278-9340 

thomas.j.martin@us.army.mil 

Mr. Brian Savage................................... (410) 278-4851 

brian.c.savage@us.army.mil 

Mr. Gary Stotts...................................... (410) 278-9340 

gary.stotts@us.army.mil 

Mr. Dennis Wanzer.................................(410) 278-4832 

dennis.wanzer@us.army.mil 


Survivability Division 

Attn.: TEAE-SZN 

Bldg. 1660 

1660 Jeb Stuart Road 

Ft. Bliss, TX 79916-6812 

Fax: (915) 568-4404 

Mr. Joe Reza...........................................(915) 568-6539 

jose.reza@us.army.mil 

White Sands Test Center 

Attn.: TEDT-WSV-E (S Jesson) 

Building 21225 

White Sands Missile Range, NM 88002-5158 

Ms. Stephanie Jesson............................(575) 678-6107 

Stephanie.jesson@us.army.mil 

Ms. Janet Danneman ............................(575) 678-6307 

Janet.danneman@us.army.mil 

Mr. John Chavarria................................. (575) 678-1993 

John.chavarria@us.army.mil 

UNITED STATES MARINE CORPS 

Marine Corps Operational Test and 

Evaluation Activity (MCOTEA) 

3035 Barnett Ave. 

Quantico, VA 22134 

Chief of Test........................................... (703) 432-0927 

Marine Corps Systems Command (MCSC) 

Attn.: Mr. Praful Bharucha (C4II/ACENG) 

2000 Lester Street 

Quantico, VA 22134-5010 

E3 Control Program Sponsor 

Mr. Praful Bharucha ...............................(703) 432-3806 

praful.bharucha@usmc.mil 



UNITED STATES NAVY 

MID-LANT Area Frequency Coordination 

Office 

Naval Air Warfare Center Aircraft Division 

Code 5.2.2.2 

23013 Cedar Point Road, Unit 4, Building 2118 

Patuxent River, MD 20670-1183 

Fax: (301) 342-1200 

Mr. Mikel R. Ryan................................... (301) 342-1532 

mikel.ryan@navy.mil 

Naval Air Systems Command (NAVAIR) 

Electromagnetic Environmental Effects (E3) 

Division 

AIR 4.1.13 

48142 Shaw Road, Building 3197, Suite 1040 

Patuxent River, MD 20670 

E3 Div. Hd.: Mr. Mike Squires................ (301) 342-1660 

michael.squires@navy.mil 


Air Systems EMI Corrective Action Program (ASEMICAP) 

Ms. Angela Partin................................... (301) 342-7813 

angela.partin@navy.mil 

Mr. Steve Rhoten................................... (301) 995-2712 

steven.rhoten@navy.mil 

E3 Aircraft Engineering Branch AIR 4.1.13.1 

Br. Head: Mr. Ted Rothman.................. (301) 342- 9223 

theodore.rothman@navy.mil 

Ms. Carrol Basanez................................. (301) 757-2451 

carrol.basanez@navy.mil 

Mr. Paul Belusko.................................... (301) 757-2446 

paul.belusko@navy.mil 

Mr. Jon Bergmann................................. (301) 995-3832 

jon.bergmann@navy.mil 

Mr. John Besanceney............................ (301) 757-2445 

john.besanceney@navy.mil 

Ms. Pamela Crispell............................... (301) 342-8629 

pamela.crispell@navy.mil 

Mr. Ken Deans........................................ (301) 757-2447 

kenneth.deans@navy.mil 

Mr. William DePasquale........................ (301) 757-6961 

william.depasquale@navy.mil 

Mr. Travis Flanagan............................... (301) 342-7771 

travis.flanagan@navy.mil 

Mr. Frederick Heather............................ (301) 342-6975 

frederick.heather@navy.mil 

Mr. Reggie Hope.................................... (301) 342-6975 

lionel.hope@navy.mil 

Mr. DJ Jardine........................................ (301) 757-2451 

david.jardine@navy.mil 

Mr. Joe Kmetz........................................ (301) 757-2361 

joseph.kmetz@navy.mil 

Mr. Gene Kuhn....................................... (301) 757-6545 

gene.kuhn@navy.mil 

Mr. Jay Lees........................................... (301) 342-0350 

jay.lees@navy.mil 

Mr. Jason Mackowiak........................... (301) 342-8344 

jason.mackowiak@navy.mil 

Mr. Felipe Nazario................................... (301) 342-1662 

felipe.nazario@navy.mil 

Ms. Jennifer Nguyen............................. (301) 995-7671 

jennifer.nguyen@navy.mil 

Mr. Luke Onachila................................... (301) 757-2420 

luke.onachila@navy.mil 

Mr. Steve Salisbury............................... (301) 342-2255 

steven.salisbury@navy.mil 

Mr. John Schultz.................................... (301) 757-2456 

john.schultz@navy.mil 

Mr. Craig Simmons................................. (301)342-4907 

craig.simmons@navy.mil 

Mr. Michael Skrabacz............................ (301) 342-5805 

michael.skrabacz@navy.mil 

Mr. Robert Tate...................................... (301) 342-8632 

robert.d.tate1@navy.mil 

Mr. John Tonello..................................... (301) 342-2158 

john.tonello@navy.mil 

Mr. Thierry Wandji................................. (301) 342-3297 

ketchiozo.wandji@navy.mil 

NAVAL AIR WARFARE CENTER AIRCRAFT 

DIVISION 

Electromagnetic Interference Lab, 5.4.4.9 

Patuxent River, MD 

Fax: (301) 342-5390 

EMI Lab 

Branch Hd.: Mr. Lance Pearce ............... (301) 342-0851 

lance.pearce@navy.mil 

Mr. Kenneth Brezinski........................... (301) 342-0848 

kenneth.brezinski@navy.mil 

Mr. Tom Dennehey................................. (301) 342-0832 

thomas.dennehey@navy.mil 

Mr. Richard Harvan................................ (301) 342-0847 

richard.harvan@navy.mil 

Ms. Diane Kempf ...................................(301) 342-0850 

diane.kempf@navy.mil 

Ms. Pam Lumsden ..................................(301) 342-0852 

pamela.lumsden@navy.mil 

Mr. Patrick Mills..................................... (301) 995-4148 

patrick.n.mills@navy.mil 

NAVAIR Aircraft Division, Lakehurst 

AIR 4.1.13.1 

Hwy. 547, Bldg. 355-2 

Lakehurst, NJ 08733-5112 

Fax: (732) 323-1844 

EMI Lab 

Mr. Richard Del Conte........................... (732) 323-2085 

richard.delconte@navy.mil 

Mr. David Fetzer..................................... (732) 323-2085 

david.fetzer@navy.mil 

NAVAIR Weapons E3 Engineering 

China Lake Site 

41M200D 

1900 Knox Road, Stop 6622 

China Lake, CA 93555-6001 

Fax: (760) 939-1065 

Br. Head: Mr. John Brandt..................... (760) 939-1625 

john.brandt@navy.mil 

Mr. Chinh Dang...................................... (760) 939-9435 

chinh.dang@navy.mil 

Mr. Luke Dawson................................... (760) 939-7565 

luke.dawson@navy.mil 

Mr. Fernando Garcia.............................. (760) 495-2622 

fernando.m.garcia1@navy.mil 

Ms. Patricia Siegel................................. (760) 939-4637 

patricia.siegel@navy.mil 

Mr. Stephen Tanner............................... (760) 939-4669 

stephen.tanner@navy.mil 

Mr. Gabriel Waliser............................... (760) 939-8997 

gabriel.waliser@navy.mil 

NAVAIR Weapons Targets Division 

Point Mugu Site 

41M200E 

575 I Ave., Ste. 1 

Point Mugu, CA 93042-5049 

Fax: (805) 989-3826 

Ld. Engr.: Mr. Les Jue............................ (805) 989-7884 

leslie.jue@navy.mil 


Orlando 4.1.M 

12350 Research Parkway 

Bldg Deflorez Floor 3 Rm 3C6H 

Orlando, FL 32826 

Mr. John Mock....................................... (407) 380-4476 

john.mock@navy.mil 

NAVAIR, Aircraft Division 

48202 Standley Rd. 

Unit 5,Ste. 3B 

Patuxent River, MD 20670-1910 

Integrated Battlespace Simulation & Test Department 

AIR 5.4.4 ICE 

Fax: (301) 342-6982 

Div. Head: Mr. Kurt Sebacher.................(301) 342-1664 

Kurt.Sebacher@navy.mil 

Dep. Div. Head: Mr. Brian Woode......... (301) 995-2331 

brian.woode@navy.mil 

Mr. Vern Panei........................................ (301) 342-6150 

vern.panei@navy.mil 

Electromagnetic Compatibility Branch (5.4.4.5 EMC) 

Hd.: Mr. Mark Mallory ............................(301) 342-1663 

mark.mallory@navy.mil 

Mr. Paul Achtellik................................... (301) 342-7820 

paul.achtellik@navy.mil 

Mr. Omar Ali............................................ (301) 342-7814 

omar.ali@navy.mil 

Mr. Rich Andrusko ...................................(301) 342-7810 

richard.andrusko@navy.mil 

Mr. Mike Clelland....................................(301) 342-8605 

michael.clelland@navy.mil 

Mr. Russ Danaher...................................(301) 342-0020 

russell.danaher@navy.mil 

Mr. John Finley....................................... (301) 342-4855 

john.finley@navy.mil 

Mr. Xuyun Gan........................................ (301) 342-8725 

xuyun.gan@navy.mil 

Mr. Scott Graham .................................. (301) 342-7809 

scott.graham@navy.mil 

Mr. Matt Griffith..................................... (301) 757-9414 

matt.griffith@navy.mil 

Mr. Remash Guyah ................................. (301) 342-8681 

remash.guyah@navy.mil 

Mr. Scott Halt.......................................... (301) 342-7575 

scott.halt@navy.mil 

Mr. Ryan Hanks....................................... (301) 342-7785 

ryan.hanks@navy.mil 

Mr. Danny Johnson .................................(301) 342-7811 

daniel.r.johnson@navy.mil 

Mr. James Lewis.................................... (301) 342-5845 

james.g.lewis@navy.mil 

Ms. Alexis Martin.................................. (301) 342-0199 

alexis.martin@navy.mil 

Mr. Jeffrey Miller.................................. (301) 757-0019 

jeffrey.c.miller@navy.mil 

Mr. Tim Moynihan .................................. (301) 342-7846 

timothy.moynihan@navy.mil 

Mr. Mike Nahaj.......................................(301) 342-3554 

michael.nahaj@navy.mil 

Mr. Sam Niebauer .................................. (301) 757-0016 

samuel.niebauer@navy.mil 

Mr. Donn Rushing................................... (301) 342-7848 

donn.rushing@navy.mil 

Mr. Chris Theofolis..................................(301) 342-1667 

chris.theofolis@navy.mil 

Ms. Virginia Wines (Sec.) ...................... (301)757-2507 

virginia.wines@navy.mil 

Electromagnetic Environments (EME) Branch 

AIR 5.4.4.6 EME 

Fax: (301)757-3611 (Bldg. 2105) 

(301) 342-3786 (Bldg. 2100) 

Branch Hd.: Mr.Alan Mazuc.................. (301) 757-3609 

alan.mazuc@navy.mil 

Mr. Dave Brown......................................(301) 342-4597 

dave.a.brown@navy.mil 

Mr. John Crim.......................................... (301) 757-3612 

john.crim@navy.mil 

Mr. Fabrizio Donis .................................. (301) 757-3604 

fabrizio.donis@navy.mil 

Mr. Jack Farren...................................... (301) 342-0507 

jack.farren@navy.mil 



Ms. Jack Faulkner ..................................(301) 995-2350 

jack.faulkner@navy.mil 

Mr. Miikka Holso.................................... (301) 757-3604 

miikka.holso@navy.mil 

Mr. Charles Joseph ................................ (301) 757-3608 

charles.joseph@navy.mil 

Mr. Bruce McClure.................................. (301) 342-0511 

bruce.mcclure1@navy.mil 

Mr. Mike Orloske................................... (301) 757-3604 

mark.orloske@navy.mil 

Mr. Fulton Preston ................................. (301) 342-6979 

fulton.l.preston@navy.mil 

Mr. Mike Whitaker.................................. (301) 757-3604 

mike.whitaker@navy.mil 

Aircraft Information Security (TEMPEST) Branch 

AIR 5.4.4.7 TEMPEST 

Fax: (301)342-4593 

Branch Hd.: Ms. Margaret Orr.............. (301) 995-2433 

margaret.orr@navy.mil 

Mr. Scott Anderson ...............................(301) 342-6066 

scott.t.anderson@navy.mil 

Mr. Tom Dorrie....................................... (301) 342-6065 

thomas.dorrie@navy.mil 

Mr. Dan Lemanski ..................................(301) 342-6086 

daniel.lemanski@navy.mil 

Mr. Jimmy Lyon...................................... (301) 342-6129 

james.lyon@navy.mil 

Ms. Kim Wooden.................................... (301) 342-2194 

kimberly.wooden@navy.mil 

Naval Air Warfare Center Training Systems 

Division (NAWCTSD) 

Code 6.7.2.3 

12350 Research Parkway 

Orlando, FL 32826-3275 

Mr. Allen D. Parker, NCE........................ (407) 380-4920 

allen.parker@navy.mil 

Space and Naval Warfare Systems Center, 

Charleston 

(SPAWAR SYSCEN, Charleston) 

P.O. Box 190022 

North Charleston, SC 29419-9022 

Fax: (843) 218-4238 

Electromagnetic Environmental Effects (E3) 

Branch, Code 5610 

Branch Hd.: Mr. Wayne Lutzen............. (843) 218-5723 

Wayne.lutzen@navy.mil 

E3 Engineers 

Reco Baker............................................. (843) 218-3988 

Reco.baker@navy.mil 

Mr. Frederic Duffy ..................................(843) 218-4363 

Frederic.duffy@navy.mil 

Mr. Michael Hanna ................................(843) 218-4039 

Michael.a.hanna@navy.mil 

Mr. Guillermo Leiva................................ (843) 218-7129 

Guillermo.leiva@navy.mil 

Mr. Thomas Sessions ............................(843) 218-6331 

Thomas.sessions@navy.mil 

Space and Naval Warfare Systems Center 

Pacific, Pacific C4ISR Department 

(SSC PAC, PAC C4ISR DEPT) 

2293 Victor Wharf Access Road 

Pearl City, HI 96782-3356 

Fax: (808) 474-5511 

Ms. Candice Saka.................................. (808) 471-4028 

Candice.saka@navy.mil 

Mr. Jack Munechika............................... (808) 471-1976 

Jack.munechika@navy.mil 

Mr. Randy Yamada................................. (808) 474-6061 

Randy.yamada@navy.mil 

Mr. Lloyd Hayashida.............................. (808) 474-1967 

Lloyd.hayashida@navy.mil 

Mr. Laine Murakami.............................. (808) 471-0366 

laine.murakami@navy.mil 

SPAWAR Systems Center - Pacific 

(SSC-Pacific) 

53560 Hull St. 

San Diego, CA 92152-5001 

Fax: (619) 553-3791 

Applied Electromagnetics Branch, Code 5541 

Branch Hd.: Dr. John Meloling.............. (619) 553-2134 

john.meloling@navy.mil 

Mr. Jeffrey C. Allen ...............................(619) 553-6566 

jeffrey.allen@navy.mil 

Ms. Carol Becker.................................... (619) 553-1033 

carol.becker@navy.mil 

Mr. David C. Dawson .............................(619) 553-4075 

david.c.dawson@navy.mil 

Mr. David Hurdsman.............................. (619) 553-4261 

david.hurdsman@navy.mil 

Mr. Lance Koyama..................................(619) 553-3784 

lance.koyama@navy.mil 

Mr. Ahn Lee............................................ (619) 553-3426 

ahn.lee@navy.mil 

Mr. P. Michael McGinnis....................... (619) 553-5092 

mike.mcginnis@navy.mil 

Ms. Nazia Mozaffar............................... (619) 553-2593 

nazia.mozaffar@navy.mil 

Mr. Rick Nielsen..................................... (619) 553-6015 

rick.nielsen@navy.mil 

Ms. Jeanne Rockway ............................(619) 553-3886 

jeanne.rockway@navy.mil 

Mr. Kianoush Rouzbehani ...................... (619) 553-3134 

kian.rouzbehani@navy.mil 

Raquel Sanchez-Karem..........................(619) 553-5876 

raquel.sanchez-karem@navy.mil 

Ricardo Santoyo-Mejia.......................... (619) 553-6139 

ricardo.santoyomejia@navy.mil 

Anirudha Siripuram................................ (619) 553-8749 

anirudha.siripuram@navy.mil 

Ron Thompson........................................(619) 553-0457 

ron.thompson@navy.mil 

Electromagnetics Technology Branch, Code 5542 

Branch Head: Matt Osburn ...................(619) 553-5941 

matthew.osburn@navy.mil 

Dr. Rich Adams....................................... (619) 553-4313 

rich.adams@navy.mil 

Mr. Jim Birkett....................................... (619) 553-3586 

jim.birkett@navy.mil 

Mr. Jose L. Chavez .................................(619) 553-5075 

jose.chavez@navy.mil 

Dr. Will Cronyn....................................... (619) 553-5084 

will.cronyn@navy.mil 

Mr. Chris Dilay........................................ (619) 553-3794 

chris.dilay@navy.mil 

Mr. Vincent V. Dinh ................................ (619) 553-7255 

vincent.v.dinh@navy.mil 

Ms. Silvia Goodman, Secretary ............(619) 226-5953 

silvia.goodman@navy.mil 

Mr. David Hilton..................................... (619) 553-2666 

david.r.hilton@navy.mil 

Mr. Carl P. Kugel..................................... (619) 553-3066 

carl.kugel@navy.mil 

Ms. Wendy Massey ............................... (619) 553-9711 

wendy.massey@navy.mil 

Mr. Daniel Meeks.................................. (619) 553-6753 

daniel.meeks@navy.mil 

Dr. John D. Rockway...............................(619) 553-5438 

john.rockway@navy.mil 

Mr. Alberto Rodriguez........................... (619) 553-5697 

alberto.rodriguez2@navy.mil 

Advanced Electromagnetic Technology Branch, Code 

5546 

Branch Hd.: Jodi McGee .......................(619) 553-3778 

jodi.mcgee@navy.mil 

Diana Arceo............................................ (619) 553-6344 

diana.arceo@navy.mil 

Lam T. Bui............................................... (619) 553-6038 

lam.bui@navy.mil 

Jennifer Edwards....................................(619) 553-5428 

jennifer.edwards@navy.mil 

Daniel R. Gaytan.................................... (619) 553-7461 

daniel.gaytan@navy.mil 

John L. Hunter........................................ (619) 553-5086 

john.hunter@navy.mil 

Lillie Jackson, Secretary .......................(619) 553-5076 

lillie.jackson@navy.mil 

Dr. Burt Markham...................................(619) 553-6082 

burt.markham@navy.mil 

Mr. Marcus Maurer.................................(619) 553-3797 

marcus.maurer@navy.mil 

Mr. Aldo Monges................................... (619) 553-6129 

aldo.monges@navy.mil 

Mr. Filemon Peralta................................(619) 553-3043 

filemon.peralta@navy.mil 

Mr. Hoa Phan.......................................... (619) 553-0148 

hoa.phan@navy.mil 

Mr. Randall Reeves................................ (619) 553-1032 

randall.reeves@navy.mil 

Mr. Anthony Ton..................................... (619) 553-5428 

anthony.ton@navy.mil 

Mr. Daryl W. Von Mueller ......................(619) 553-6527 

daryl.vonmueller@navy.mil 

Mr. Benton Wong................................... (619) 553-3043 

benton.wong@navy.mil 

Chief of Naval Operations 

Code NC-1, PT-5451, N6F13 

2000-Navy Pentagon 

Washington, DC 20350-2000 

Fax: (703) 601-1323 

Spectrum Electromagnetic Environmental Effects (E3) & 

EMP Policy & Programs 

Head: Mr. Dave D. Harris.......................(703) 601-3968 

dave.harris@navy.mil 

Naval Ordnance Safety and Security 

Activity (NOSSA) 

NAVORDSAFSECACT INDIAN HEAD 

Electrical Explosives Safety 

Code N84 

Farragut Hall, Bldg. D323 

23 Strauss Ave. 

Indian Head, MD 20640-5035 

Fax: (301) 744-6088 

Weapons Assessment (N8) 

Director: Charles Denham......................(301) 744-4447 

charles.denham@navy.mil 

Naval Research Laboratory 

Code 5348 

4555 Overlook Ave., S.W. 

Washington, D.C. 20375-5320 

Tel.: (202) 404-7726 

Mr. Larry Cohen 

Lawrence.Cohen@nrl.navy.mil 

Naval SeaSystems Command (NAVSEA) 

Force Electromagnetic Environmental Effects (E3) 

and Spectrum Management Warfare Systems 

Engineering Directorate (SEA 06) 

1333 Isaac Hull Ave., S.E., Stop 5011 

Washington Navy Yard, DC 20376-5011 

Fax: (202) 781-4568 

Force E3 and Spectrum Management Branch 

Branch Head: Mr. J. Don Pierce............ (202) 781-4214 

james.d.pierce@navy.mil 

Naval Surface Warfare Center, Crane 

Division (NSWC Crane) 

Code GXS 

300 Highway 361, Bldg. 3287E 

Crane, IN 47522 

Fax: (812) 854-3589 



Mr. Larry McKibben ............................... (812) 854-5107 

Lawrence.McKibben@navy.mil 

Naval Surface Warfare Center 

Dahlgren Division 

5493 Marple Road, Suite 156 

Dahlgren, VA 22448-5153 

Electromagnetic Effects Division, Code Q50 

Div. Hd: Mr. Marshall Baugher...............(540) 653-3416 

marshall.baugher@navy.mil 

Electromagnetic Effects Division 

Chief Engineer: Mr. Jason Bardine....... (540) 653-7450 

Jason.bardine@navy.mil 

NAVSEA E3 Technical Warrant Holder: 

Mr. Kurt Mikoleit.................................... (540) 653-3425 

Kurt.mikoleit@navy.mil 

E3 Spectrum Supportability Branch, Code Q51 

Branch Head: Mrs. Amy Sunshine Smith-Carroll........... 

.................................................................(540) 653-1694 

amy.smith-carroll@navy.mil 


Operations and Spectrum Support Group Lead: Mr. 

Mark Flenner ..........................................(540) 653-7892 

Mark.l.fleener@navy.mil 


Spectrum Engineering Group Lead: Ms. Margaret 

Neel....................................................... (540) 653-8021 

Margaret.neel@navy.mil 


Electromagnetic Pulse Group Lead: Mr. Blaise Corbett. 

.................................................................(540) 653-2104 

Blaise.corbett@navy.mil 

E3 Assessment & Evaluation Branch (Q52) 

Branch Head: Mr. William T. Lenzi...... (540) 653-3444 

william.lenzi@navy.mil 


EMC/EMV Evaluation Group Lead: Mr. James 

McGinniss .............................................. (540) 653-0489 

james.mcginniss@navy.mil 


RADHAZ Program Manager: Mr. Richard Magrogan..... 

............................................................... (540) 653-3445 

richard.magrogan@navy.mil 


Weapons System E3 Group Lead: Mr. Michael Miller . 

................................................................ (540) 653-3460 

michael.d.miller4@navy.mil 


HERO Systems Certification Group Lead: Mr. Andrew 

Rash........................................................ (540) 653-1368 

andrew.a.rash@navy.mil 


EMI/461 Lab Group Lead:Mr. Carl Hager....................... 

............................................................... (540) 653-9501 

carl.hager@navy.mil 


Test Operations Group Lead: Mr. Matthew Curtis ........ 

................................................................ (540) 653-3439 

matthew.a.curtis@navy.mil 


Science & Technology Applications Group Lead: Mr. 

Michael Slocum..................................... (540) 653-2212 

michael.slocum@navy.mil 


RADHAZ Environment Characterization Group Lead: 

Ms. Tamera Hay ..................................... (540) 653-1419 

tamera.hay@navy.mil 


Surface Maritime Sensors Group Lead: Mr. Michael 

Workman............................................... (540) 653-4646 

michael.l.workman@navy.mil 

E3 Platform Integration Branch (Q53) 

Branch Head: Mr. Kenneth D. Larsen.............................. 

................................................................ (540) 653-3476 

kenneth.d.larsen@navy.mil 


Senior Scientist: Dr. Greg Balchin................................... 

............................................................... (540) 653-6037 

gregory.a.balchin@navy.mil 


MAAC Group Lead: Mr. Greg Brobjorg............................ 

.................................................................(540) 653-7075 

greg.brobjorg@navy.mil 


Combatant Group Lead:Mr. Reza Biazaran..................... 

............................................................... (540) 284-0595 

reza.biazaran1@navy.mil 


CVN Group Lead: Mr. Tim Baseler........ (540) 653-0741 

timothy.baseler@navy.mil 


Computational Electromagnetics Group Lead: Mr. 

Bryan Wagaman................................... (540) 653-3430 

bryan.wagaman@navy.mil 

E3 Systems Interoperability Branch, Code Q54 

Branch Head: Mr. Rich Link................... (540) 653-8907 

rich.link@navy.mil 


Shipboard EMC Improvement Program Lead: Mr. Mark 

Hamer......................................................(540) 284-0711 

mark.hamer@navy.mil 


Force E3 Interoperability Group Lead: Mr. John "Bart" 

Barbee................................................... (540) 653-3483 

john.s.barbee@navy.mil 


Communication Systems E3 Interoperability Group 

Lead:Mr. Cris Lake................................. (540) 653-5087 

cristopher.lake@navy.mil 


Radar Systems E3 Interoperability Group Lead:Mr. Al 

Pitts....................................................... (540) 653-6268 

albert.pitts@navy.mil 


Electronic Warfare Systems E3 Interoperability Group 

Lead:Mr. Brad Conner........................... (540) 653-0610 

bradley.conner@navy.mil 

Naval Undersea Warfare Center (NUWC) 

1176 Howell St. 

Newport, RI 02841-1708 

Fax: (401) 832-7423 

Submarine Electromagnetic Environmental Effects (E3) 

Branch, Code 3431 

Branch Head: Mr. Craig F. Derewiany...(401) 832-5542 

craig.derewiany@navy.mil 

Mr. Scott Albert..................................... (401) 832-4122 

scott.albert@navy.mil 

Mr. Jon Bond.......................................... (401) 832-6480 

jon.bond@navy.mil 

Mr. Michael J. Carpenter.......................(401) 832-5540 

michael.j.carpenter@navy.mil 

Mr. Douglas L. DeAngelis...................... (401) 832-5872 

douglas.deangelis@navy.mil 

Mr. Jamie A. Donais.............................. (401) 832-3603 

jamie.donais@navy.mil 

Mr. Anthony Francis.............................. (401) 832-5493 

anthony.francis1@navy.mil 

Mr. Edward R. Javor.............................. (401) 832-5546 

edward.javor@navy.mil 

Mr. Alan T. McHale................................ (401) 832-5635 

alan.mchale@navy.mil 

Mr. Michael P. Martin............................ (401) 832-5630 

michael.p.martin@navy.mil 

Mr. Paul D. Opperman........................... (401) 832-4092 

paul.opperman@navy.mil 

Mr. Fredric A. Stawarz.......................... (401) 832-5550 

fredric.stawarz@navy.mil 

Mr. John L. Thibeault............................. (401) 832-5551 

john.thibeault@navy.mil 

Mr. Richard L. Thibeault........................ (401) 832-5552 

richard.thibeault@navy.mil 

Mr. Oleg Volchansky.............................. (401) 832-5399 

oleg.volchansky@navy.mil 

Mr. Oscar R. Zelaya............................... (401) 832-5597 

oscar.zelaya@navy.mil 

EMC Laboratory..................................... (401) 832-5554 

OPNAV N2N6F1221 

Spectrum Management and Electromagnetic Environmental 

Effects Office Net-Centric Capabilities/Strategic 

and Tactical Communications Branch Information 

Dominance Directorate 

2511 Jefferson Davis Highway 

Arlington, VA 22244-0001 

Tel: (703) 601-1414; Fax: (703) 601-1323 

Director: Mr. D. Mark Johnson ..............(703) 601-1414 

david.m.johnson4@navy.mil 

OTHER UNITED STATES AGENCIES 

Dept. of Health & Human Services 

Food and Drug Administration 

Center for Devices and Radiological Health 

12725 Twinbrook Pkwy. (HFZ 133) 

Rockville, MD 20852 

Tel.: (301) 827-4944 

Electrophysics Branch, Div. Physical Sciences 

Mr. Howard I. Bassen, Chief 

Mr. Paul S. Ruggera 

Mr. Donald Witters 

U.S. Environmental Protection Agency 

(EPA) 

Office of Radiation and Indoor Air (ORIA) 

Radiation Protection Division (6608J) 

1200 Pennsylvania Ave., N.W. 

Washington, DC 20460 

Fax: (202) 343-3204 

Director: Mr. Jonathan Edwards.......... (202) 343-9437 

edwards.jonathan@epa.gov 

Mr. Norbert Hankin................................ (202) 343-9235 

hankin.norbert@epa.gov 

HQ, Federal Aviation Administration 

ATC Spectrum Engineering Services, AJW-6 

800 Independence Avenue, S.W. 


Dir.: VACANT 

Spectrum Assignment & Engineering Office, AJW-932 

Manager: Mr. Jerrold B. Sandors......... (202) 267-9720 

Jerrold.Sandors@faa.gov 

Spectrum Planning & International Office, AJW-933 

Manager: Mr. Robert A. Frazier............ (202) 267-9722 

Robert.Frazier@faa.gov 

Federal Aviation Administration 

FAA Aviation Safety (AMN-110N) 

1601 Lind Ave. S.W. 

Renton, WA 98057 

Fax: (425) 917-6590 

Chief Scientific & Technical Advisor, EMI & Lightning: 

Mr. David Walen..................................... (425) 917-6586 

dave.walen@faa.gov 

Federal Communications Commission 

445 12th Street, SW 


Office of Engineering & Technology 

Tel.: (202) 418-2470 

Chief: Julius P. Knapp 

Deputy Chief.: Mr. Ira Keltz 

Deputy Chief: Ronald Repasi 

Deputy Chief: Alan Stillwell 

Associate Chief: Bruce Romano 

Policy & Rules Division 

Tel.: (202) 418-2472 



Chief: Geraldine Matise 

Deputy Chief: Mark Settle 

Spectrum Policy Branch 

Chief: Mr. Jamison Prime 

Technical Rules Branch 

Chief: Ms. Karen Ansari 

Spectrum Coordination Branch 

Chief: VACANT 

Electromagnetic Compatibility Division 

Tel: (202) 418-2475 

Chief: Walter Johnston 

Technical Analysis Branch 

Chief: Mr. Robert Weller 

Experimental Licensing Branch 

Chief: Mr.James Burtle 

Federal Communications Commission 

Laboratory 

7435 Oakland Mills Rd. 

Columbia, MD 21046 

FCC Laboratory Division 

Dr. Rashmi Doshi, Chief ......................... (301) 362-3011 

Mr. Jim Szeliga...................................... (301) 362-3051 

Mrs. Pat Wright..................................... (301) 362-3001 

Equipment Authorization Branch 

Mr. Joe Dichosco, Chief ........................ (301) 362-3024 

Ms. Evelyn Cherry ..................................(301) 362-3022 

Mr. Steve Dayhoff................................. (301) 362-3027 

Mr. Tim Harrington ................................(301) 362-3039 

Mr. Andrew Leimer................................ (301) 362-3049 

Mr. Stanley Lyles................................... (301) 362-3047 

Ms. Diane Poole..................................... (301) 362-3034 

Audits and Compliance Branch 

Mr. Raymond Laforge, Chief ................. (301) 362-3041 

Mr. David Galosky...................................(301) 362-3290 

Ms. Katie Hawkins.................................(301) 362-3030 

Ms. Phyllis Parrish..................................(301) 362-3045 

Mr.Martin Perrine................................... (301) 362-3025 

Mr. Richard Tseng...................................(301) 362-3054 

Mr.Samuel Uganzenwoko......................(301) 362-3033 

Technical Research Branch 

Mr. William Hurst, Chief........................ (301) 362-3031 

Mr. Kwok Chan....................................... (301) 362-3055 

Mr. James Drasher................................. (301) 362-3047 

Mr. Steve Jones......................................(301) 362-3056 

Mr. Steve Martin................................... (301) 362-3052 

Mr. Tom Phillips...................................... (301) 362-3044 

Mr. George Tannahill .............................(301) 362-3026 

Customer Service Branch 

Mrs. Sandy Haase, Chief........................ (301) 362-3013 

Ms. Bessie Bordenave............................(301) 362-3046 

Ms. Linda Elliott......................................(301) 362-3032 

Mr. Tim Jamerson .................................. (301) 362-3014 

Mr. Ken Reitzel....................................... (301) 362-3015 

Ms. Bette Taube..................................... (301) 362-3028 

Mrs. Joycelyn Walls............................... (301) 362-3017 

Goddard Space Flight Center 

Greenbelt, MD 20771 

Code 565 Electrical Systems Branch 

Mr. Steven Graham, EMC Engr............. (301) 286-3248 

Steven.M.Graham.1@nasa.gov 

Code 549.0, Electromagnetic Systems Engineering 

Mr. Todd Bonalsky, PhD, lead engineer........................... 

................................................................ (301) 286-1008 

Todd.M.Bonalsky@nasa.gov 

National Aeronautics and Space 

Administration 

Kennedy Space Center 

Kennedy Space Center, FL 32899 

EMC Engineers 

Team Lead: Ms. Dawn Trout (VA-F3),... (321) 867-5366 

dawn.h.trout@nasa.gov 

Mr. Ron Brewer (Analex)....................... (321) 867-5329 

ronald.w.brewer-1@nasa.gov 

Mr. Kevin Clinton (VA-F3) ...................... (321) 867-5314 

kevin.j.clinton@nasa.gov 

Mr. Tung Doan........................................ (321) 867-5330 

tung.m.doan@nasa.gov 

Mr. Paul Edwards ................................... (321) 867-8927 

paul.edwards@nasa.gov 

Ms. Catherine C. Lewis........................... 216-433-3806 

Catherine.c.lewis@nasa.gov 

Mr. Noel Sargent (Analex).................... (216) 433-3395 

noel.b.sargent@nasa.gov 

Mr. James Stanley.................................. (321) 867-1991 

james.e.stanley@nasa.gov 

Mr. Jarek Tracz....................................... (321) 867-2780 

jarek.a.tracz@nasa.gov 

EMC Test Engineer Manager:Mr. Jack Cowras (VB-E1). 

................................................................. (321) 867-2914 

john.cowras-1@nasa.gov 



Langley Research Center 

5 North Dryden St., Bldg. 1202 

Hampton, VA 23665 

Fax: (757) 864-9884 

EMC Test Facility (MS 130) 

Ms. Courtney Rollins ............................. (757) 864-7814 

c.h.rollins@larc.nasa.gov 

HIRF Laboratory (MS 130) 

Mr. Jay J. Ely.......................................... (757) 864-1868 

j.j.ely@nasa.gov 

Mr. Truong X. Nguyen ............................ (757) 864-7528 

t.x.nguyen@larc.nasa.gov 

EMI/EMC Analysis and Troubleshooting (MS 488) 

Dr. Arthur T. Bradley ..............................(757) 864-7343 

arthur.t.bradley@nasa.gov 



John H. Glenn Research Center 

21000 Brookpark Road 

Cleveland, OH 44135 

EMC Engineer 

Mr. Tesfahunei T. Tecle.......................... (216) 433-6620 

tesfahunei.t.tecle@grc.nasa.gov 



Lyndon B. Johnson Space Center 

2101 NASA Rd. 

Houston, TX 77058-3696 

Avionics Systems Test Branch (EV4) 

Branch Chf.: Ms. Linda Bromley............. (281) 483-0129 

Analysis Grp. Ldr.: Ms. C. Sham............ (281) 483-0124 

EMC Grp. Ldr.: Mr. Robert Scully.......... (281) 483-1499 

robert.c.scully@nasa.gov 

EMC Test Laboratory 

Facility Mgr: Mr. Rod Robinson............. (281) 483-1465 

Electronic Systems Test Laboratory 

Facility Mgr: Mr. Ned Robinson............ (281) 483-0130 



George C. Marshall Space Flight Center 

Marshall Space Flight Center, AL 35812 

Spectrum Manager: Terry Luttrell........ (256)544-0130 

Terry.Luttrell@nasa.gov 

EMC Engineers (M/S ES42/4708) 

Division Chief: Mr. Tony Clark............... (256) 544-2394 

Tony.Clark@nasa.gov 

Branch Chief: Mr. Jeff Wesley............. (256) 544-3393 

Jeff.Wesley@nasa.gov 

Team Lead: Mr. Mark Krome................. (256) 544-5635 

Mark.Krome@nasa.gov 

Mr. Michael Crane (ERC)....................... (256) 544-7259 

Michael.G.Crane@nasa.gov 

Mr. Tim Dew (ERC)................................. (256) 544-3718 

Timothy.M.Dew@nasa.gov 

Mr. Ross Evans (Dynetics) ..................... (256) 961-2305 

Ross.W.Evans@nasa.gov 

Ms. Tammy Flowers............................... (256) 961-0508 

Tammy.D.Flowers@nasa.gov 

Mr. Truman Glasscock (Triumph).......... (256) 544-5318 

Truman.G.Glasscock@nasa.gov 

Mr. Kenneth Gonzalez (Qualis).............. (256) 544-1658 

Kenneth.P.Gonzalez@nasa.gov 

Mr. Steve R Jones................................. (256) 544-4373 

Steve.Jones@nasa.gov 

Mr. Steve Linthicum (Dynetics) ............(256) 544-5312 

Steven.E.Linthicum@nasa.gov 

Mr. Jonathan Mack .............................. (256) 544-3599 

Jonathan.D.Mack@nasa.gov 

Mr. Matthew McCollum ........................(256) 544-2351 

Matt.Mccollum@nasa.gov 

Mr. Matthew McGrath (Dynetics)........ (256) 544-3051 

Matthew.M.McGrath@nasa.gov 

Mr. Tom Perry (Jacobs).......................... (256) 544-0744 

Thomas.A.Perry@nasa.gov 

Mr. Glenn Shelby................................... (256) 544-0694 

Glenn.Shelby@nasa.gov 

EMI Test Facility.................................... (256) 544-8121 

National Institute of Standards and 

Technology 

Electromagnetics Division 

Boulder, CO 80305 

Div. Chief: Dr. Perry Wilson....................(303) 497-3406 

pfw@boulder.nist.gov 

Secretary: Ms. Willa Mayns................. (303) 497-3132 

RF Fields Group 818.02 

Group Leader: Mike Francis.................. (303) 497-5873 

francis@boulder.nist.gov 

Secretary: Mr. Gian Aparicio................ (303) 497-3321 

aparicio@boulder.nist.gov 

Antenna Metrology (818.02 project) 

Mr. Jeffrey Guerrieri............................. (303) 497-3863 

guerrieri@boulder.nist.gov 

Reference Fields & Probes 

Mr. Dennis Camell ................................. (303) 497-3214 

dennis.camell@boulder.nist.gov 

Field Parameters and EMC Applications (818.02 project) 

Galen Koepke......................................... (303) 497-5766 

koepke@boulder.nist.gov 

Metrology for Wireless Systems, Project Leader 

Kate Remley........................................... (303) 497-3652 

kate.remley@nist.gov 

Quantum Electrical Metrology Division, 817 

Gaithersburg, MD 20899 

Div. Chief: Dr. Michael H. Kelley........... (303) 497-4736 

michael.kelley@nist.gov 

National Telecommunications and 

Information Administration (NTIA) 

U.S. Department of Commerce 

1401 Constitution Ave., N.W. 


(202) 482-1850 

Emergency Planning Subcommittee Chairman 

Chief: Mr. Stephen R. Veader................ (202) 482-4417 

sveader@ntia.doc.gov 

Spectrum Planning Subcommittee Chairman 

Chief: Mr. Stephen Butcher.................... (202) 482-4163 

sbutcher@ntia.doc.gov 

Institute for Telecommunications Sciences 

(ITS) 

325 Broadway 

Boulder, CO 80305-3328 

Exec. Officer: Mr. Brian Lane.................(303) 497-3484 

blane@its.bldrdoc.gov 

Director: Mr. Al Vincent ........................(303) 497-3500 

avincent@its.bldrdoc.gov 

Spectrum & Propagation Measurements Division 



Mr. Eric D. Nelson............................................................. (303) 497-7410 

enelson@its.bldrdoc.gov 

Telecommunications & Information Technology Planning Division 

Mr. Jeffrey R. Bratcher..................................................... (303) 497-5132 

jbratcher@its.bldrdoc.gov 

Telecommunications Engineering, Analysis & Modeling Division 

Ms. Patricia Raush............................................................ (303) 497-3568 

praush@its.bldrdoc.gov 

Telecommunications Theory Division 

Mr. Frank Sanders............................................................. (303) 497-7600 

fsanders@its.bldrdoc.gov 

TEMPEST CONTACTS 

Army Electronic Proving Ground Test Engineering Directorate 

RF Test Division 

Attn.: CSTE-DTC-EP-TR 

Electromagnetic Environmental Effects/TEMPEST & Antenna Division 

Attn.: TEDT-EP-SEA 

2000 Arizona Street, Fort Huachuca, AZ 85613-7110 

Div. Chief:Mr. Johnny Douglas........................................ (520) 533-5819 


E3 Test Facility/Blacktail Canyon 

Technical Lead: Mr. Johnny Douglas............................... (520) 533-5819 


Mr. James Smith............................................................... (520) 538-5188 

james.a.smith4@us.army.mil 

Mr. David Seitz.................................................................. (520) 533-5819 

david.seitz3@us.army.mil 

Mr. Garrett Rude............................................................... (520) 533-2818 

Garrett.rude@us.army.mil 

Mr. Fulton Woo................................................................. (520) 533-5819 

Fulton.woo@us.army.mil 

Antenna Test Facility 

Technical Lead: Mr. Doug Kremer................................... (520) 533-8170 

douglas.kremer@us.army.mil 

Mr Anthony Sanchez........................................................ (520) 533-9874 

anthony.c.sanchez@us.army.mil 

BELGIUM 

Belgian Naval Headquarters 

Project Office, Kwartier Koningin Elisabeth 

1 Everestraat, 1140 Brussels, Belgium 

Tel.: +32-2-7013334, Fax: +32-2-7014786 

CANADA 

Aerospace Engineering Test Establishment (DND) 

PO Box 6550, Cold Lake, AB T9M 2C6, Canada 

Tel.: (780) 840-8000 

Mr. Serge Couture............................................................ ext. 7511 

serge.couture@forces.gc.ca 

ITALY 

Ministry of Defense 

Centro Interforze Studi per le Applicazioni Militari (CISAM) 

Via della Bigattiera 10, San Piero a Grado, 56010 San Piero a Grado (Pisa), Italy 

Fax: +39 050-961001 

Director:Amm. Isp. Giordano Cottini............................... +39 050-964200 

Scientific Coordinator:Silvio Zotti Martelli..................... +39 050-964200 

silvio.zotti@cisam.it 

MARITELERADAR 

Instituto per le Telecomunicazioni e l'Elettronica della Marina Militare 

"Giancarlo Vallauri", Viale Italia, 72-57126 Livorno, Italy 

E-mail: mariteleradar@marina.difesa.it 

EMC Dept. 

Ric. Ing. Giancarlo Misuri ................................................ + 00-39-0586-238208 

EMC Section/Laboratory 

Cdr. Roberto Desideri....................................................... +00-39-0586-238153 

C.T.E.R. Salvatore Trovato................................................ +00-39-0586-238153 


products & services index 


Interference Technology's 2011 EMC Products & Services Index contains approximately 200 different categories to help you find the equipment, 

components, and services you need. Locate additional product information by consulting the Advertiser Index on page 176. Full details of all the suppliers 

listed within each category can be found in the Company Directory, starting on page 159. To list your company in the index or to update a listing, go to 

the Products & Services Directory on www.InterferenceTechnology.com. 

Absorber Clamps 

DNB Engineering, Inc. 

ETS-Lindgren 

Fischer Custom Communications 

Absorptive Filters 

Dontech Incorporated 

Instruments For Industry (IFI) 

Intermark (USA) Inc. 

TMD Technologies Ltd 

Active Filters 

LCR Electronics, Inc. 

Schaffner EMC Inc. 

AMplifiers 

Advanced Test Equipment Rentals 

AE Techron, Inc. 

Amber Technologies 

AR RF/ Microwave Instrumentation 

CAP Wireless 

Comtech PST Corporation 

CPI (Communications & Power 

Industries) Satcom Div. 

dB Control 


MCL, Inc., A MITEQ Company 

MILMEGA Ltd. 

Noise Laboratory Co., Ltd. 

NP Technologies, Inc. 

OPHIR RF 

Pasternack Enterprises 

Power Products International Ltd. 

Quarterwave Corp. 

Silicon Labs 

Teseq 

Anechoic Chamber 

Calibration to ieC 80-3 

D.A.R.E!! Calibrations 

ETS-Lindgren 

Panashield, Inc. 

Anechoic Chamber Testing 



Electronics Test Centre (Kanata) 

ETS-Lindgren 

F-Squared Laboratories 

MET Laboratories, Inc. 

National Technical Systems 

Radiometrics Midwest Corp. 

Retlif Testing Laboratories 

TUV SUD America Inc. 

Anechoic Chambers 


Albatross Projects GmbH 

Braden Shielding Systems 

ETS-Lindgren 


Anechoic Chambers – 

Fire Protection 

ETS-Lindgren 


Anechoic mAterials 

ETS-Lindgren 

Fair-Rite Products Corp. 


Antenna Filters 

Captor Corporation 

Fotofab 

ETS-Lindgren 

Spectrum Advanced Specialty 

Products 

ETS-Lindgren 

WEMS Electronics 

Antennas 


A.H. Systems, Inc. 

Applied Electromagnetic 

Technology (AET) LLC 


ARA Technologies 

ASR Technologies, Inc. 

Beehive Electronics 


Com-Power Corp. 

Dynamic Sciences International, 

Inc. 

ETS-Lindgren 

Fotofab 


Liberty Labs, Inc. 

Lubrizol Conductive Polymers 

Macton 


Q-par Angus Ltd 


Products 

Sunol Sciences Corporation 

TDK Corp. 

TDK RF Solutions, Inc. 

Teseq 

TMD Technologies Ltd. 

Antistatic Coatings 


Lamart Corporation 

Swift Textile Metalizing LLC 

Antistatic mAterials 

ACL, Inc. 

Seal Science 


Architectural Shielding 

Products 

Alco Technologies, Inc. 

Kemtron Limited 

Metal Textiles Corp. 


Audio bAnd Power 

Amplifiers 


Automotive Testing 

D.L.S. Electronic Systems, Inc. 

Elite Electronic Engineering, Inc. 

Eurofins Product Service GmbH 




Teseq 

Backshells, Shielded 

Assemblies, Terminations 


Northern Technologies Corp. 

Bellcore Testing 

(see Telcordia) 





BiconiCAl Antennas 


ETS-Lindgren 




Teseq 


BiDirectional Couplers 


board level shields 

3Gmetalworx World 

Device Technologies, Inc. 


Mech-Tronics 

Photofabrication Engineering Inc. 

Precision Photo-Fab, Inc. 

Schlegel Electronic Materials 


Tech-Etch, Inc. 

W. L. Gore & Associates, Inc. 

Books 



ITEM Publications 

Kimmel Gerke Associates, Ltd. - AZ 

Lightning Technologies, Inc 

Montrose Compliance Service, Inc. 

Braid 


Calmont Wire & Cable, Inc. 




Zero Ground LLC 

Broadband emi Detectors 


Agilent Technologies, Inc. 

ETS-Lindgren 

Cabinetry & hArdware 

FIBOX Enclosures 

Fotofab 

Cables & connectors 


Amphenol Industrial Operations 

CONEC Corporation - USA 

Electri-Flex Company 

Fotofab 

GTN Kommunikations- und 

Sicherungssysteme GmbH & Co. 

KG 

Hi-Tech Controls 

Hi-Voltage & EMI Corp 

ITT Interconnect Solutions 

Ja-Bar Silicone Corp 

Laird Technologies 

Lamart Corp. 

PennEngineering 

Positronic Industries 

PSC Electronics 

Qualtek Electronics Corp. 

RIA CONNECT 

Schurter Inc. 

Sealcon 


Products 


Synergistic Technology Group, Inc. 

Teledyne Reynolds 

Wilicoxon Research 

Wurth Electronics Midcom Inc 

Calibration Services 


Austest Laboratories 


ETS-Lindgren 



LTI Metrology 


Pearson Electronics, Inc. 



Teseq 


Calibration Testing 




CertifiCAtion Services 

Braco Compliance Ltd 







MET Laboratories 





Coaxial Filter Connectors 

Curtis Industries/ Filter Networks 

EMC Eupen, A Div. of I2R Corp. 


Soshin Electronics Europe GmbH 


Products 

Competent/Certified 

ACCrediting Bodies Testing 




MET Laboratories 


Computer-Aided Analysis 

Services 

Apache Design Solutions 


ETS-Lindgren 



Visron Design, Inc. 

Conductive Adhesives, 

Caulks, Epoxies, & 

Elastomers 


ARC Technologies, Inc. 

Creative Materials, Inc. 



Ja-Bar Silicone Corp. 



Leader Tech, Inc. 

Master Bond Inc. 


Seal Science 

Silicone Solutions 

Sunkyoung S.T. 


Conductive Cloth 












Conductive Coatings 


ALX Technical 

Conductive Compounds Inc. 






Conductive ContAiners 


MuShield Company, Inc. 




Conductive lAminates 








Conductive MAteriAls 

3M Electrical Markets Division 

Adhesives Research, Inc. 

Alchemetal 


Antistatic Industries of Delaware 


Caprock Mfg. 

Desco Industries Inc. 



Eeonyx Corp. 





LGS Technologies 

Marktek 

MTI - Microsorb Technologies 

Mueller Corporation 

Oak-Mitsui Technologies 

Potters Industries, Inc. 

Progressive Fillers International 


Seal Science 

Sealing Devices Inc. 

Sulzer Metco (Canada) Inc. 


Syscom Advanced Materials 


THEMIX Plastics, Inc. 

Venture Tape Corp 

Conductive PAint 





ConductivePArtiCles 


Conductive plAstiCS 

CAPLINQ Corporation 

Dexmet Corp. 



Conductive plAting 






Conductive tApes 


Bystat International Inc. 




ITW/Pressure Sensitive Adhesives 

& Components 







Conduit, ElectriCAl, 

Shielded, mAgnetic & RF 





Seal Science 


Consultants 

BorderWatch Compliance 

Services LLC 



Don HEIRMAN Consultants 


EMC Compliance 

EMC Management Concepts 

EMCCons Dr. Rasek GmbH 

EMITEMC 

EM Software & Systems- 

SA Pty. Ltd 

Equipment Reliability Institute 

ERA Technology Ltd trading as 

Cobham Technical Services 

ETS-Lindgren 


Gaddon Ltd. 









Mooser Consulting GmbH 

NewPath Research L.L.C. 

Power & Controls engineering Ltd. 

Power Standards Lab (PSL) 




Coupling-Decoupling 

Networks 

Haefely EMC 

Crt Electro-OptiCAl 

Shields 



Current Probes 


ETS-Lindgren 


Ion Physics Corporation 


Design Software 



SA Pty. Ltd. 

ETS-Lindgren 

FEKO 

Moss Bay EDA 

Sonnet Software, Inc. 

Die Cut Shielding mAterial 

APEX Die & Gasket Inc. 


Identification Products Corp 

Insul-Fab, A Division of Concote 

Corp. 



M&C Specialties Co. 


Orion Industries Inc. 

Seal Science 

Spira Manufacturing Corporation 




Direct Lightning Testing 





E-Field Antennas 




ETS-Lindgren 






(esd) Generators 


EMC Partner 

EM Test USA 





(esd) Simulators 



EM Test USA 



HV Technologies, Inc. 






(esd) Testing 





L-3 Communications Cincinnati 





EMI gAskets 

ACS Industries, Inc. 

Boyd Corporation 

CGS Technologies 

China EMI Shielding Materials 

Co., LTD 

GETELEC 





Plastic-Metals Technology Inc. 

Seal Science 


Stockwell Elastomerics, Inc. 

United Seal and Rubber Co., Inc. 




EMI Receivers 



ETS-Lindgren 

EMI Test Antennas 




ETS-Lindgren 

Fotofab 


Macton 


Emissions Testing 








maturo GmbH 

Mitsubishi Digital Electronics 

America Inc 



Partnership for Defense Innovation 

(PDI) 




V-COMM, LLC 

EMP Generators 

EM Test USA 




Montena EMC 

EMP Simulators 


EM Test USA 





EMP, sgemp System 

Assessment 





EMP/Lightning eFFects 

Testing 










Teseq 


Environmental Testing 





(PDI) 



European CertifiCAtion 

Testing 




EU Compliance Services, Inc. 


INTERTest Systems, Inc. 

ITL Israel 








FACilities & Shielded 

Enclosure Services 

Compac Development Corp 


ETS-Lindgren 

Rittal Corporation 

FCC pArt 15 & 18 Testing 












FCC pArt 68 Test Equipment 


EM Test USA 




FCC pArt 68 Testing 







Feed-Through Filters 



EMI Filter Company 

Genisco Filter Corp 


Radius Power, Inc. 

RF Immunity Ltd. 

Schaffner EMC, Inc. 


Products 

Syfer Technology Limited 

Tri-Mag, Inc. 


Ferrite Beads & Cores 

Cosmo Ferrites Limited 


Ferronics Inc. 





National Magnetics Group, Inc. 

THORA Elektronik GmbH 

Würth Elektronik eiSos 

GmbH & Co. KG 

Ferrite Suppression 

Components 








Products 

Ferrites 

Adams Magnetic Products Co. 


Dexter Magnetic Technologies 

EMC Component Group, Inc. 






Products 

Taiyo Yuden (U.S.A.) Inc. 

Fiber Optic Cables 

ETS-Lindgren 

Lamart Corp. 

Fiber Optic Systems 

Accurate Controls Ltd. 

D.A.R.E!! Instruments 


Field Intensity Meters 

EMC Test Design 

ETS-Lindgren 


SRICO, Inc. 

Filter Arrays 


Fotofab 




Products 



Filter CapACitors 

Beijing Tempest Electronics 

Technologies Co. Ltd. 




Fotofab 






Products 





X2Y Attenuators LLC 

Filter Chokes 



Datatronics 





Schaffner EMC, Inc 

Schurter Inc. 


Filter Coils 


Communication Coil, Inc. 






Schurter Inc. 


Filter Connectors 

AEF Solutions 

Filter Networks 

Glenair Inc. 

Heilind Electronics 


Schurter Inc. 


Products 


Filter Modules 





Schurter Inc. 


Products 


Filter Pin Connectors 





Products 

Filter Pins 




Products 


Filter seAL inserts 

Lamart Corp. 

Filtered Power Entry 

Modules 

Americor Electronics Ltd. 






Schurter Inc. 


Products 

Tri-Mag, Inc. 

Filters 

Advanced Monolythic Ceramics, 

Inc. 

Aerodev Electronmagnetic Tech 


Amphenol Canada Corp. 

API Delevan 

Arcotronics, Inc. 

Aries Electronics 

Capcon International, Inc. 


Cre8 Associates Ltd. 


EEMCCOIMEX 

EESeal 

Electrocube, Inc. 


EMI Solutions 

EPCOS, Inc. 

Fil-Coil 

Filtronica, Inc. 

Fotofab 

Fuss-EMV 


Gowanda Electronics 

High & Low Corp. 


Integrated Microwave Corp. 


JiangSu WEMC Technology., Ltd. 

Johanson Dielectrics, Inc. 



MPE 

Murata Electronics North 

Oxley Developments Company Ltd 

Pacific Aerospace & Electronics, 

Inc. 

Panasonic Electronic Components 

Quell Corporation 



RFI Corporation 

Roxburgh EMC 

Sabritec 


Schurter Inc. 

Souriau PA&E 


Products 

Supression Devices 


Texas Spectrum Electronics 

Tyco Electronics 

View Thru Technologies, Inc. 

Vishay Intertechnology, Inc. 

VPT, Inc. 

V Technical Textiles, Inc. 


Fingerstock 





Ground Resistance 

Testers 

AEMC Instruments 

Grounding Rods 



Grounding Services 



Grounding Systems 


Lightning Eliminators & 

Consultants, Inc. 


GTEM Cells 

ETS-Lindgren 




H-Field Antennas 



ETS-Lindgren 




Harnesses 

Helmholtz Coils 

ETS-Lindgren 


High Voltage Pulse 

Transformers 


Honeycomb Shielding 

ETS-Lindgren 







Horn Antennas 




ETS-Lindgren 



Teseq 


Immunity Testing 








LEDE-SIECIT 




Teseq 


Impulse Generators 


EM Test USA 






Induced Current Meters 

& Probes 



ETS-Lindgren 

Inductors 

BI Technologies 



Frontier Electronics, Corp. 


Micrometals, Inc. 


Schurter Inc. 

Insertion Loss Test 

Networks 


Interference Generators 



Iron Core Powdered 

mAgnetic mAterials 


ISO 9000 Testing 




Isotropic Field Sensors 


ETS-Lindgren 


Lightning Generators 

EM Test USA 









Lightning Simulators 

EM Test USA 







Lightning Strike Testing 








Log Periodic Antennas 




ETS-Lindgren 





Magnetic Field Meters 

Combinova AB 


Magnetic Field Probes 


ETS-Lindgren 


Langer EMV –Technik GmbH 

Magnetic Shielding 

gAskets 



Microwave Absorbers 


ETS-Lindgren 



Seal Science 

Microwave Filters 

Cobham Microwave 


Fotofab 



Products 


Microwave Power 

Amplifier 



Giga-tronics/Ascor Incorporated 



MIL-std 188/125 Testing 





Mil-std 461 / 462 Testing 




Harris GCSD EMI EMC TEMPEST 

Test Lab 




(PDI) 




Mobile Shielded Rooms 



Monopole Antennas 

ETS-Lindgren 




MRI Shielding 


ETS-Lindgren 



Select Fabricators Inc. 

NAvlAP / A2LA Approved 

Testing 

Bay Area Compliance Labs Corp. 












Network Analyzers 


Parallel Plate Line 

Test Set 

ETS-Lindgren 


Portable Test Equipment 


ETS-Lindgren 




Prostat Corporation 

Power Line Disturbance 

Monitor 

Voltech Instruments Ltd. 

Power Line Filters 


Delta Electronics 

Delta Products Corp. 


Emission Control, Ltd. 

Filter Concepts Inc. 

JINAN Filtemc Electronic 

Equipment Co., Ltd. 




Schurter Inc. 


Tri-Mag, Inc. 


Printed Circuit Board (PCB) 

Filters 





Schurter Inc. 


Products 


Tri-Mag, Inc. 


Product sAFety Testing 









RAdhAZ Testing 



Radiation hAzard Meters 

ETS-Lindgren 

Radiation hAzard Probes 

ETS-Lindgren 


REtrofit Filters & 

Connectors 




Schurter Inc. 


RF Power Amplifiers 






Teseq 


RF Power Components 

EM Test USA 

MKS Instruments 

RF Power Meters 


ETS-Lindgren 

RF Shielding gAskets 






Seal Science 





RF Shielding mAterial 

Cybershield 

Dexmet Corp. 





Seal Science 




TWP Inc 



RS03 > 200 V / Meter Testing 









RTCA do-160 Testing 









(PDI) 

Radiometrics Midwest Corp 



SCIF Design Construction 

& mAintenance 

ETS-Lindgren 



Shielded Air Filters 

ETS-Lindgren 







Shielded Buildings 

ETS-Lindgren 

Shielded Bus bArs 


Shielded Cabinets & 

hArdware 




Shielded Cable Assemblies 

& hArnesses 


Fotofab 

Lamart Corp. 

Lapp USA 


MegaPhase LLC 


The Phoenix Company of Chicago 



Shielded Components 


Schurter Inc. 




Shielded Conduits 


Lamart Corp. 


Shielded Connectors 

Binder-USA 


Kycon 

Lamart Corp. 

Schurter Inc. 

Southwest Microwave, Inc. 


Shielded Doors 


ETS-Lindgren 


Shielded Enclosures 

ALTECH 

AR Tech 

ClickFold Plastics 

Electrorack Enclosure Products 

IMS/AMCO Engineered Products 


Modpak, Inc. 


Shielded Fans 

ETS-Lindgren 



Shielded Fuse Holders 

Schurter Inc. 

Shielded Room Filters 




ETS-Lindgren 

Fotofab 




Shielded Rooms 

EMP-tronic 

ETS-Lindgren 

I. Thomas GmbH 


Shielded Rooms, 

ACCessories 

Ad-Vance Magnetics, Inc. 


EMI Technologies, Inc. 

ETS-Lindgren 

Gaven Industries Inc. 





Seal Science 

Shielding Resources Group, Inc. 



Shielded Rooms & 

enclosures 


Allied Moulded Products, Inc. 

Braden Shielding Systems 

Bud Industries 


Comtest Eng. 

E & C Anechoic Chambers Asia 

Ltd. 

ETS Lindgren 

Fotofab 

Frankonia 


Global EMC Ltd 


Kform, Inc. 




ORBIT Advanced 

Electromagnetics, Inc. (AEMI) 


Rainford EMC Systems Ltd. 

Seal Science 



Stahlin Non-Metallic Enclosures 


V Technical Textiles, Inc. 

VitaTech Engineering, LLC 

Shielded Rooms, Leak 

Detectors / Monitors 

ETS-Lindgren 

Shielded sCAns, 

Monitors & Crts 


Shielded Switches 

Schurter Inc. 

Shielded Transparent 

Windows 


Instrument Plastics LTD 



Tempest Security Systems Inc. 

Shielded Tubing 




Lamart Corp. 




Shielding 

3M Electrical Markets Division 

A&R Tarpaulins, Inc. 


Amuneal Manufacturing Corp. 

ARC Technologies, Inc 

Autosplice, Inc.. 

Axonics, Inc. 

Bal Seal Engineering, Inc. 

Brim Electronics, Inc. 

Central Coating Company 

Chomerics, Div. of Parker Hannifin 

Corp. 

Cima NanoTech, Inc. 

Connors Company 


Dexmet Corp. 


East Coast Shielding 

Ed Fagan Inc. 


Emerson & Cuming Microwave 

Products, Inc. 

ETS-Lindgren 

FEUERHERDT GmbH 

Field Management Services 

Fotofab 

HFC Shielding Prod. Co. Ltd. 

Holland Shielding Systems BV 



JEMIC Shielding Technologies 

JRE Test, LLC 



Littlefuse Inc. 

Lutze Inc. 

Magnetic Radiation Laboratories 

Magnetic Shield Corp. 

MAJR Products Corp. 

Metal Textiles Corps. 

MH&W International Corp 


Nolato Silikonteknik 

Orbel Corporation 

P&P Technology Ltd. 

Roxtec 

Rubbercraft 

Saint-Gobain High Performance 

Seals 

SAS Industries, Inc. 

Schurter, Inc. 

Seal Science 


Soliani EMC SRL 

Specialty Silicone Products 


Products 




Universal Air Filter 

Vanguard Products Corp. 

Vermillion, Incorporated 

VTI Vacuum Technologies Inc. 

WaveZero, Inc. 


Zippertubing Co. 

Zuken 

Shielding eFFectiveness 

Testing 






ETS-Lindgren 






Shielding Foils 





Tapecon, Inc. 

Shielding mAterial, 

mAgnetic Field 



Less EMF Inc. 



VacuumSchmelze GmbH & Co. KG 



Signal Generators 






York EMC Services Ltd. 

Signal Line Filters 




ETS-Lindgren 




Products 



Site Attenuation Testing 




ETS-Lindgren 







Site Survey Services 




Elite Electronic Engineering Inc. 

ETS-Lindgren 






Solid State Amplifiers 




Spectrum Analyzers 


spread spectrum 

products 

Mercury United Electronics Inc. 

Standards Translations 

Advanced Programs, Inc. 

ANDRO Computational Solutions, 

LLC 


Static Control mAterials 

& Equipment 



Suppressors 






Surge & trAnsients 

ACL Staticide 


Alltec Corporation 

Amstat Industries, Inc. 


CITEL Inc. 

EM Test 

EM Test USA 





Kikusui America Inc. 

L. Gordon Packaging 



Nextek 


Okaya Electric America, Inc. 


RTP Company 

Schurter Inc. 

Seal Science 


Transtector Systems Inc. 

Zero Surge Inc. 

Surge Protection 

Bourns Inc. 

Metatech Corporation 

Phoenix Contact 

Schurter Inc. 

Telcordia Testing 





TelecommuniCAtions Test 

Networks 




TEM Cells 

ETS-Lindgren 




Tempest Filters 







Products 



Tempest Suppressed 

Products 


Tempest Test Equipment 



Tempest Testing 




Test ACCessories 



EM Test USA 


EMCO Elektronik GmbH 

ETS-Lindgren 




TDK-Lambda Americas 

Test Antennas 




Electro-Metrics Corp. 


Macton 

Teseq 

Test CapACitors 


Test Equipment, 

Leasing & Rental 






Michigan Scientific Corp. 

Test Equipment, 

Repair & Calibration 



Electronic Instrument Associates 


ETS-Lindgren 




test instrumentation 

Aaronia 



Aeroflex 


All-Spec Industries 

Alltest Instrument, Inc. 

Anritsu Company 

Apogee Labs Inc. 

APREL Laboratories 


Barth Electronics, Inc. 

Bird Technologies Group / TX RX 

Systems 

Circuit Insights LLC 

CST - Computer Simulation 

Technology AG 

DARE!! Instruments 

Ecliptek Corp. 


SA Pty. Ltd. 

EMSCAN Corporation 

EM Test 

EM Test USA 


EMSS Consulting PTY (LTD) 

emscreen GmbH 

emv- Elektronische Meßgeräte 

Vetriebs GmBh 

ETS Lindgren 


Fotofab 





Laplace Instruments Ltd. 



Narda Safety Test Solutions S.r.l. 

NEDC Fabricating Solutions 



PPM (Pulse Power & 

Measurement) Ltd 

Praxsym, Inc. 

Protek Test and Measurement 

Ramsey Electronics 

Rohde & Schwarz, Inc. 

Saelig Company 

Safe Engineering Services & 

Technologies, Ltd. 

Safety Test Technology Co., Ltd 

Sensor Products, Inc. 

Shanghai Empek Electromagnetic 

Technology Ltd. 

SIEMIC Testing and Certification 

Services 

SILENT Solutions 

SimLab Software GmbH 

SiTime Corp. 

Solar Electronics Co. 

Suzhou 3CTEST Electronic Co.,Ltd. 

TE Connection Asia 

Teseq 

Test & Measurement Australia Pty 

Limited 

Test Equipment Connection 

Thermo Fisher Scientific 

TREK, INC. 

Wavecontrol 

Test Software 

Averna 


ETS-Lindgren 

NEXIO 

Testing 

3C Test Ltd 

Acme Testing Company 

Advanced Compliance Solutions, 

Inc. 

Aero Nav Laboratories 



AHD EMC Lab / Amber Helm 

Development L.C. 


American Environments Co., Inc. 

Applied Physical Electronics, L.C. 

ATLAS Compliance & Engineering 

BEC Incorporated 

Blackwood Labs 

Blue Guide EMC Lab 

Bureau Veritas (formerly Curtis- 

Straus) 

Cascade TEK 

CertifiGroup 

CETECOM Inc. 

CKC Laboratories, Inc. 

Communication Certification 

Laboratory 

Compatible Electronics, Inc. 

Compliance Certification Services 

Compliance Engineering Ireland 

Ltd. 

Compliance Testing, LLC 

Compliance Worldwide 

Core Compliance Testing Services 

Cranage EMC Testing Ltd. 

Criterion Technology, Inc. 

CSA International 

Custom Assembly LLC 


Dayton T. Brown, Inc. 

dBi Corporation 

Diversified T.E.S.T Technologies 



E-LABS Inc. 

E.F. Electronics Co. 

ElectroMagnetic Investigations, 

LLC 

Electro-Metrics Corp. 

Electronics Test Centre 

Electro Rent Corp. 



SA Pty. Ltd. 

EMC Integrity, Inc. 

EMC MCC Bv 

EMC Technologies Pty Ltd. 

EMC Tempest Engineering 

EMC Testing Laboratories, Inc. 

EMField 

EMF Testing USA 

EMITECH 

Enerdoor Inc. 

Engineered Testing Systems 

Environ Laboratories, LLC 


Global Advantage 

Global Certification Laboratories, 

Ltd. 

Global Testing 

Green Mountain Electromagnetics 

Harris Corp. EMI/TEMPEST Lab 

Hermon Laboratories 

iNARTE, Inc. 

Ingenium Testing, LLC 

International Certification 

Services, Inc. 

International Compliance 

Laboratories 

Intertek Testing Services 

IQS, a Division of Degree Controls 

ITC Engineering Services, Inc. 

Jacobs Technology Inc. 

JS Toyo 

Keystone Compliance 

Kimmel Gerke Associates, Ltd. 

L F Research EMC 


L.S. Research 

Laboratory Testing Inc. 





Little Mountain Test Facility 

Mesago 


MIRA Ltd. 


NAVAIR Advanced Warfare 

Technologies 

NAWC Aircraft Division - E3 

Branch Code 5.4.4.5 

NCEE Labs 

Nemko Inc. 

Northwest EMC, Inc. 

Paladin EMC 

Parker EMC Engineering 

Peak Electromagnetics Ltd. 


Percept Technology Labs, Inc. 

Philips Applied Technologies - 

EMC Center 

Philips Innovation Services-EMC 

center 

Pioneer Automotive Technologies, 

Inc. - EMC Lab 

Power-Electronics Consulting: DC, 

AC, and RF 

Product Safety Engineering Inc. 

Protocol Data Systems Inc. 

Pulver Laboratories 

QinetiQ 

Qualtest Inc. 


Remcom Inc. 

Restor Metrology 


RF Exposure Lab, LLC 

RFTEK 

Rhein Tech Laboratories, Inc. 

Rogers Labs, Inc. 

Rubicom Systems, A division of 

ACS 

SAE Power 

Seibersdorf Laboratories 

Seven Mountains Scientific, Inc. 

(ENR) 

SGS 

Source1 Solutions 

Southwest Research Institute 

Sypris Test and Measurement 

Tempest Inc. 

TESEO 

Teseq 

Test Site Services 

The Compliance Management 

Group 

Timco Engineering, Inc. 

TRaC Global 

Trialon Corporation 

TUV Rheinland of North America, 

Inc. 


Ultratech Group of Labs 

Underwriter's Laboratories Inc. 

Videon Central, Inc. 

Walshire Labs, LLC 

Washington Laboratories, Ltd. 

White Sands Missile Range 

Willow Run Test Labs, LLC 

Yazaki Testing Center 

Testing lAboratories 

AT4 Wireless 

Cranage EMC & Safety 

D.A.R.E!! Consultancy 






Laboratories, LLC 







NU Laboratories, Inc. 


(PDI) 

Professional Testing (EMI), Inc. 



RMV Technology Group, LLC 

SDP Engineering, Inc. 

Sprinkler Innovations 

TRaC 

Tranzeo EMC Labs Inc. 

TUV SUD Senton GmbH 

TUV Product Service Ltd. 

Stork Garwood Laboratories Inc. 

World Cal, Inc. 


Training, Seminars & 

Workshops 

A2LA - American Assoc. for 

Laboratory Accred. 

Andre Consulting, Inc. 

Cherry Clough Consultants 



EMC Engineering and Safety 

EMC Goggles 

EMCMCC bv 


Fotofab 



Integrated Engineering Software 

Jastech EMC Consulting, LLC 




Montrose Compliance Services, 

Inc. 


QEMC 


Simberian Inc. 

spec-hardened systems 

Stephen Halperin & Associates 

Ltd. 

Teseq 


Transient Detection & 

Measuring Equipment 




Transient Generators 


EM Test USA 







Teseq 

Transient Specialists, Inc. 

Transient Suppressors 


Littlefuse Inc. 


Traveling wAve Tube (twt) 

Amplifiers 

Applied Systems Engineering, Inc. 



Quarterewave Corp. 


ETS-Lindgren 

Micronor Inc. 

Turntables 

Uninterrupted power 

system 

APC by Schneider Electric 

Voltage Probes 



Wire & Cable Filters 



Products 

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See for yourself. 


company directory 


Manufacturers, consultants, and service organizations active in the interference tech nology field are listed in this directory. All companies 

shown are advertisers in this issue—the page numbers of their advertisements are shown with their listings, and their U.S. and International 

sales offices are also given. To learn how to be included in this directory, please e-mail info@interferencetechnology.com. 

a 

A&R Tarpaulins, Inc. ................................................ 

16246 Valley Blvd., Fontana, CA 92335 USA; 909-829- 

4444; jessica@artech2000.com; www.artarps.com 

A.H. Systems, Inc. ............................................ 7, 41 

9710 Cozycroft Ave., Chatsworth, CA 91311 USA; 818- 

998-0223; Fax: 818-998-6892; 

sales@ahsystems.com; www.AHSystems.com; Arthur C. 

Cohen, Pres.; Travis Samuels, Ops. Dir. 

AL T & M Solutions..................................................770-973-7492 

AR Southwest Electronic Ind., Inc..........................972-523-0017 

GA T & M Solutions..................................................770-973-7492 

LA Southwest Electronic Ind., Inc..........................972-523-0017 

OK Southwest Electronic Ind., Inc..........................972-523-0017 

TN 

TX 

T & M Solutions..................................................770-973-7492 

Richardson, Southwest Electronics Ind..........972-523-0017 

INTERNATIONAL 

AUS Sydney, Test & Measurement Australia PTY Limited 

............................................................................61-2-4739-9523 

AUT Ludwigsburg, ProNova Elektronik GmbH...49-7141-2858-20 

BEL Lelystad, EEMCCoimex.................................. 31-320-295-395 

BGR Sofia, Test Solutions.........................................359 2 970 1990 

BOL Alianza S.E.T........................................................305-767-4000 

CHE Ludwigsburg, ProNova Elektronik GmbH....49-7141-285820 

CHN Beijing, EMC Technology Ltd...................... 86-10-8267-5757 

Beijing, Compliance Direction Systems, Inc............................. 

86-10-6846-0592 

COL Alianza S.E.T........................................................305-767-4000 

CRI Alianza S.E.T........................................................305-767-4000 

DEU Ludwigsburg, Pro Nova Elektronik GmbH..49-7141-2858-20 

ECU Alianza S.E.T........................................................305-767-4000 

ELS Alianza S.E.T........................................................305-767-4000 

FRA Gennevilliers, AR France................................. 33-147-91-7530 

GRB Bedfordshire, SystemWare Europe.............44-1462-734777 

GRC Vector Technologies Ltd. ............................ 30-210-68-58008 

GUA Alianza S.E.T........................................................305-767-4000 

HND Alianza S.E.T........................................................305-767-4000 

IDN Singapore Technologies Electronics LTD.........65-6413-3119 

IND TTL Technologies Pvt. Ltd. ........................91-022-292-07691 

ISR Kfar-Saba, Wave Technologies....................972-9-764-4878 

ITA Segrate,Narda Safety Test Solutions ....... 39-02-26998702 

Druento, Teseo S.p.A...................................011-39-99-41-911 

JPN Tokyo, Techno Science Japan Corp. ........... 81-3-5717-6130 

KOR Seoul, Taehung Trading Inc..................................02-541-2825 

LUX EEMCCoimex................................................... 31-320-295-395 

MYS Singapore Technologies Ltd...............................65-6413-3119 

NCA Alianza S.E.T. ......................................................305-767-4000 

NLD Lelystad, EEMCCoimex.................................. 31-320-295-395 

PAN Alianza S.E.T........................................................305-767-4000 

POL Warszawa, AM Technologies .......................48 22 532 28 01 

ROU Bucharest, Celesta Comexim SRL................ 4021-410-30-64 

RUS Moscow, Sernia Ltd....................................... 7 495 225 40 14 

SGP Singapore Technologies Ltd...............................65-6413-3119 

SWE Ageto MTT AB ............................................ 46-0-8-446-7730 

THA Singapore Technologies Ltd...............................65-6413-3119 

TUR Izmir, Norana..................................................90-232-464-0011 

TWN Xizhi City, Superlink Technology Corp.......886-2-2698-3456 

VZL Alianza S.E.T........................................................305-767-4000 

A2LA - American Assoc. for Laboratory 

Accreditation .............................................................. 

5301 Buckeystown Pike, Suite 350, Frederick, MD 21704 

USA; 301-644-3248; Fax: 301-662-2974; Adam Gouker, 

agouker@A2LA.org; www.A2LA.org 

Aaronia AG................................................................... 

Gewerbegebiet Aaronia AG, Strickscheid, DE-54597 

Euscheid, Germany; +49 (0) 6556 93033; Fax: +49 (0) 

6556 93034; www.aaronia.de 

Accurate Controls Ltd. ............................................ 

25 Cowley Road, Nuffield Industrial Estate, Poole, 

Dorset, United Kingdom; +44 (0) 1202 678108; 

mspreadbury@accurate-controls.ltd.uk; 

www.accurate-controls.ltd.uk 

ACL Inc. ......................................................................... 

1960 E. Devon Ave., Elk Grove Village, IL 60007 USA; 

847-981-9212; 800-782-8420; 

marykay@aclstaticide.com; www.aclstaticide.com 

ACL Staticide............................................................... 

840 W. 49th Place, Chicago, IL 60609; 847-981-9212; 

info@aclstaticide.com; www.aclstaticide.com 

Acme Testing Company .......................................... 

2002 Valley Highway, Acme, WA 98220 USA; 360-595- 

2785; 888-226-3837; Fax: 360-595-2722; acmetest@ 

acmetesting.com; www.acmetesting.com 

ACS Industries, Inc. .................................................. 

One New England Way, Lincoln, RI 02865 USA; 401-769- 

4700; Fax: 401-333-2294; jbuckler@acsind.com; 

www.acsindustries.com/products/industrialapplications/EMI-RFI_Shielding/default.html 

Adams Magnetic Products Co. ............................. 

807 Mantoloking Road, Suite 203, Brick NJ 08723 USA; 

732-451-0123; 800-275-6312; 

amartin@adamsmagnetic.com; 

www.adamsmagnetic.com 

Adhesives Research, Inc. ....................................... 

400 Seaks Run Road, P.O. Box 100, Glen Rock, PA 17327 

USA; 717-235-7979; 800-445-6240; Fax: 717-235-8320; 

jgumerlock@arglobal.com; www.adhesivesresearch.com 

Ad-Vance Magnetics, Inc. ..................................... 

625 Monroe St., P. O. Box 69, Rochester, IN 46975 USA; 

574-223-3158; Fax: 574-223-2524; 

rick@advancemag.com; www.advancemag.com 

Advanced Compliance Solutions, Inc. ............... 

5015 B.U. Bowman Drive, Buford, GA 30518 USA; 770- 

831-8048; 770-831-8598; sproffitt@acstestlab.com; 

www.acstestlab.com 

Advanced Monolythic Ceramics, Inc. ................ 

3101 Constitution Ave., Olean, NY 14760 USA; 716-372- 

5225; Fax: 716-372-5467; info@sc.rr.com; 

www.amccaps.com 

Advanced Programs, Inc......................................... 

7125 Riverwood Drive, Columbia, MD 21046; 800-445- 

6240; 410-312-5800; Fax: 410-312-5850; 

service@advprograms.com; www.advprograms.com 

Advanced Test Equipment Rentals ................ 21 

10401 Roselle St., San Diego, CA 92121 USA; 888-554- 

ATEC(2832); Fax: 858-558-6570; Chris Reed, 

rentals@ATECorp.com; www.ATECorp.com 

Central North, Mark Bohuslav.................................... 800-404-2832 

Central South, Chris Reed........................................... 800-404-2832 

North East, Kevin Croppo............................................ 800-404-2832 

North West, Patrick Kennedy..................................... 800-404-2832 

South East, Greg Johnson........................................... 800-404-2832 

South West, Jim Tighe................................................ 800-404-2832 

Advanced Testing Services ................................... 

9420 San Mateo Blvd. NE, Suite C, Albuquerque, NM 

87113 USA; 505-292-2032; 877-292-2031; Fax: 505-237- 

8430; sales@advanced-testing.com; 

www.advanced-testing.com 

AE Techron, Inc........................................................... 

2507 Warren St., Elkhart, IN 46516 USA; 574-295-9495; 

Jim Bumgardner, sales@aetechron.com; 

www.aetechron.com 

AEF Solutions.............................................................. 

33 Mitchell Point Ensign Way, Southampton, Hamble 

SO31 4RF United Kingdom; +44 1227 711455; 

www.aefsolutions.com 

AEMC Instruments, Inc. .......................................... 

200 Foxborough Blvd., Foxborough, MA 02035 USA; 

508-698-2115; Fax: 508-698-2118; www.aemc.com 

AERO NAV Laboratories ......................................... 

14-29 112 St., College Point, NY 11356 USA; 718-939- 

4422; 800-680-6608; Fax: 718-539-3719; 

SLevine_sales@aeronavlabs.com; 

www.aeronavlabs.com 

Aerodev Electronmagnetic Tech.......................... 

19525 Talavera Lane, Edmond, OK 73012 USA; 405-760- 

6064; Fax: 405-285-6572; usa@aerodev.com; 

www.aerodev.com 

Aeroflex ........................................................................ 

35 South Service Road, P.O. Box 6022, Plainview, NY 

11803 USA; 516-694-6700; 800-843-1553; Fax: 516-694- 

2562; info-test@aeroflex.com; www.aeroflex.com 

Agilent Technologies, Inc. ................................ 31 

5301 Stevens Creek Blvd., Santa Clara, CA 95051 USA 

800-829-4444; Jim McCord, jim_mccord@agilent.com; 

www.agilent.com 

AHD EMC Lab / 

Amber Helm Development L.C. ............................. 

92723 Michigan Hwy 152, Sister Lakes, MI 49047 USA; 

269-429-8352; 888-847-8027; Fax: 269-429-9016; 

ghelm@ahde.com; www.ahde.com 

Albatross Projects GmbH ....................................... 

Daimlerstraße 17, 89564 Nattheim, Germany; +49 7321 

730510; Fax: +49 7321 730590; 

info@albatross-projects.com; 

www.albatross-projects.com 



Alchemetal .................................................................. 

3327 80 St., Suite 2, New York, NY 11372 USA; 917-297- 

3560; egreenwood@alchemetal.com; 

www.alchemetal.com 

Alco Technologies, Inc. ........................................... 

1815 W. 213th St. #175, Torrance, CA 90501 USA; 310- 

328-4770; Fax: 310-328-1262; Susan Lea Lopez, 

susie@alcotech.com; www.alcotech.com 


R&B Laboratory.......................................................... 

20 Clipper Road, West Conshohocken, PA 19428 USA; 

610-825-1960; Fax: 610-825-1684; 

splastino@alionscience.com; http://rb.alionscience.com 

All-Spec Industries................................................... 

5228 US Hwy 421 N, Wilmington, NC 28401 USA; 800- 

537-0351; 910-763-5664; sales@allspec.com; 

www.all-spec.com 

Allied Moulded Products, Inc. .............................. 

222 North Union St., Bryan, OH 43506 USA; 419-636- 

4217; sales@alliedmoulded.com; 

www.alliedmoulded.com 

Alltec Corp. .................................................................. 

64 Catalyst Drive, Canton, NC 28716 USA; 828-646- 

9290; Fax: 828-646-9527; ift@allteccorp.com; 

www.allteccorp.com 

Alltest Instrument, Inc. ............................................ 

1310 S. Roller Road, Ocean, NJ 07712 USA; 732-695- 

0800; 800-251-0706; Fax: 732-695-0801; 

harvey@alltest.us; www.alltest.us 

ALX Technical............................................................. 

630 Rivermede Road, Unit 9, Concord, Ontario, L4K 2H7 

Canada; 905-761-0370; www.alxtechnical.com 

Amber Technologies................................................. 

4 Oxford Las, Smithtown, NY 11787 USA; 631-724-4619; 

Fax: 631-361-4836; rsjaniec@aol.com 

American Environments Co., Inc. ........................ 

17 Commercial Blvd., Medford, NY 11763 USA; 631-736- 

5883; Fax: 631-736-5272; wmiller49@optonline.net; 

www.aeco.com 

Americor Electronics, Ltd. ..................................... 

675 S. Lively Blvd., Elk Grove Village, IL 60007 USA; 800- 

830-5337; Fax: 847-956-0300; info@americor-usa.com; 

www.americor-usa.com 

Amphenol Canada Corp. ......................................... 

20 Melford Drive, Scarborough, Ontario M1B 2X6, 

Canada; 416-291-4401; Fax: 416-292-0647; 

sales@amphenolcanada.com; 

www.amphenolcanada.com 

Amphenol Industrial Operations.......................... 

40-60 Delaware Ave., Sidney, NY 13838 USA; 800-678- 

0141; Fax: 607-563-5157; www.amphenol-industrial.com 

AMS................................................................................ 

9119 Cross Park Drive, Knoxville, TN 37923 USA; 865- 

691-1756; Fax: 865-691-9344; brad@ams-corp.com; 

www.ams-corp.com 

Amstat Industries, Inc. ............................................ 

3012 N. Lake Terrace, Glenview, IL 60026 USA; 847-998- 

6210; Fax: 948-998-6218; larry@amstat.com; 

www.amstat.com 

Amuneal Manufacturing Corp. ............................. 

4737 Darrah St., Philadelphia, PA 19124 USA; 215-535- 

3000; 800-755-9843; Fax: 215-743-1715; 

info@amuneal.com; www.amuneal.com 

Andre Consulting, Inc. ............................................. 

12812 NE 185th Court, Bothell, WA 98011-3121 USA; 

206-406-8371; pat@andreconsulting.com; 

http://andreconsulting.com 

ANDRO Computational Solutions, LLC............... 

Beeches Professional Campus, Bldg 2 Suite 1, 7902 Turin 

Road, Rome, NY 13440-2067 USA; 315-334-1163; Fax: 

315-334-1397; androcs@androcs.com; 

www.androcs.com 

Anritsu Company ....................................................... 

1155 East Collins Blvd., Suite 100, Richardson, TX 75081 

USA; 972-644-1777; 800-267-4878; Fax: 972-671-1877; 

gina.varela@anritsu.com; www.us.anritsu.com 

Antistatic Industries of Delaware ....................... 

11 Deerpark Drive, Suite 102 B, Monmouth Junction, NJ 

08852-1923 USA; 732-274-0001; 800-214-7900; Fax: 

732-438-9152; aexstatic@aol.com; 

www.antistaticindustries.com 

Apache Design Solutions ....................................... 

2645 Zanker Road, San Jose, CA 95134 USA; 408-457- 

2000; Fax: 408-428-9569; 

apache_sales@apache-da.com; www.apache-da.com 

APC by Schneider Electric...................................... 

132 Fairgrounds Road, W. Kingston, RI 02892 USA; 800- 

788-1704; www.apc.com 

Apex Die & Gasket Inc. ........................................... 

P.O. Box 1442, Tempe, AZ 85280-1442 USA; 480-894- 

1112; 888-937-3907; dave@apexdc.com; 

www.dieandgasket.com 

API Delevan ................................................................ 

270 Quaker Road, East Aurora, NY 14052 USA; 716- 

652-3600; Fax: 716-652-4814; apisales@delevan.com; 

www.delevan.com 

Apogee Labs Inc. ....................................................... 

210 S. Third St., North Wales, PA 19454 USA; 215-699- 

2060; dhendricks@apogeelabs.com; 

www.apogeelabs.com 

Applied Electromagnetic Technology LLC........ 

P.O. Box 1437, H.G. Trueman Road, Solomons, MD 20688 

USA; 410-326-6728; info@appliedemtech.com; 

www.appliedemtech.com 

Applied Physical Electronics, L.C. ...................... 

P.O. Box 341149, Austin, TX 78734 USA; 512-264-1804; 

Fax: 512-264-1784; rschreib@apelc.com; 

www.apelc.com 

Applied Systems Engineering .............................. 

7510 Benbrook Parkway, Fort Worth, TX 76126 USA; 

817-249-4180; Fax: 817-249-3413; bjostrand@applsys. 

com; www.applsys.com 

APREL Laboratories ................................................. 

17 Bentley Ave., Nepean, Ontario K2E 6T7, Canada; 

613-820-2730; Fax: 613-820-4161; info@aprel.com; 

www.aprel.com 

AR Receiver Systems............................................... 

21434 Osborne St.,Canoga Park, CA 91304-1520; 818- 

882-3977; Fax: 818-882-3981; 

info@ar-worldwide.com; www.ar-worldwide.com. 

Products are purchased through AR RF/Microwave 

Instrumentation. 

AR/RF Microwave Instrumentation.... 3, 29, 57 

160 School House Road, Souderton, PA 18964 USA; 215- 

723-8181; 800-933-8181; info@ar-worldwide.com; 

www.ar-worldwide.com 

AK Syntek 503-614-3403 

AL Brennan Associates...........................................727-445-5006 

AR Testech Sales Engineers....................................972-644-5010 

AZ Technical Marketing Specialists..................... 480-929-0009 

CA Altamont Technical Services............................925-294-9774 

CO Technical Marketing, Inc.................................. 303-488-0220 

CT R.J. Sickles Associates.......................................781-862-5100 

DC Delmarva Engineering........................................410-990-9000 

DE Advanced Technical Marketing........................800-310-8805 

FL Brennan Associates...........................................727-446-5006 

GA Brennan Associates...........................................770-402-2560 

IA Electronic Instrument Associates Inc..............630-924-1600 

ID Syntek...................................................................425-822-7777 

IL Electronic Instrument Associates Inc..............630-924-1600 

IN Delta Technology Solutions..............................419-394-6766 

KS KJS Marketing.................................................... 816-578-4751 

KY Delta Technology Solutions.............................. 513-677-3987 

LA Testech Sales Engineers....................................972-644-5010 

MA R. J. Sickles Associates......................................781-862-5100 

MD Delmarva Engineering........................................410-990-9000 

ME R.J. Sickles Associates.......................................781-862-5100 

MI Delta Technology Solutions..............................419-394-6766 

MN Electronic Instrument Associates Inc..............612-695-4055 

MO KJS Marketing.................................................... 816-578-4751 

MS Brennan Associates...........................................727-446-5006 

MT Syntek...................................................................425-822-7777 

NC Delmarva Engineering........................................410-990-9000 

NH R.J. Sickles Associates.......................................781-862-5100 

NJ Advanced Technical Marketing........................800-310-8805 

NM Technical Marketing Specialists......................505-286-0079 

NV Altamont Technical Services............................925-294-9774 

NY Advanced Technical Marketing........................800-310-8805 

NY GSC Representatives..........................................585-385-1170 

OH Delta Technology Solutions..............................419-394-6766 

OK Testech Sales Engineers.....................................817-282-4471 

OR Syntek. .................................................................503-614-3403 

PA Advanced Technical Marketing........................800-310-8805 

RI R.J. Sickles Associates.......................................781-862-5100 

SC Brennan Associates...........................................770-402-2560 

TN Brennan Associates...........................................770-402-2560 

TX Testech Sales Engineers....................................972-644-5010 

UT Technical Marketing Specialists......................801-944-5605 

VA Delmarva Engineering........................................410-990-9000 

WA Syntek ..................................................................425-822-7777 

WI Electronic Instrument Associates Inc. ............630-924-1600 

INTERNATIONAL 

AUS Faraday Pty Ltd................................................61-3-9729-5000 

AUT EMV GmbH.......................................................49-89-614-1710 

BLR Radiant-Elcom...................................................7495-725-0404 

BLG AR Benelux B.V.................................................. 31-172-423000 

BRA IME LTDA........................................................55-11-3871-2329 

CAN Source Engineering............................................ 519-654-8511 

CHN Corad Technology Ltd. .....................................852-2793-0330 

CZE H Test a.s...........................................................420-235365207 

DNK Erik Blichfeld........................................................45-7552-2020 

FIN Caltest Oy.........................................................358-9-530-6070 

FRA AR France..........................................................33-1-4791-7530 

GER EMV GmbH.......................................................49-89-614-1710 

GRC Vector Technologies Ltd................................30-210-6858008 

HKG Corad Technology Ltd. .....................................852-2793-0330 

HUN H Test a.s. .........................................................420-235365207 

IND Complus Sys. Pvt. Ltd...................................91-80-416-83883 

ISR Erantel Electronics, Ltd....................................972-9-7663478 

ITA Teseo SpA.......................................................39-011-994-1911 

JPN Nippon Automatic Control.............................81-3-5434-1600 

KOR EMC Solution..................................................... 82-22168-3910 

LUX AR Benelux B.V.................................................. 31-172-423000 

MYS Precision Technologies PTE, Ltd.......................65-6-2734573 

MEX Sistemas e Ingenieria de EMC.....................52-55-2168-2148 

NLD AR Benelux B.V.................................................. 31-172-423000 

NZL Faraday Pty Ltd................................................61-3-9729-5000 

NOR Nortelco A/S...................................................... 47-22-57-6100 

PAK Telec Electronics & Machinery Ltd.................92-21-5217201 

POL Urzadzenia Elektroniczne Import......................022-313-1735 

PRT Wavecontrol.................................................... 34-93-320-80-5 

RUS Radiant-Elcom...................................................7495-725-0404 

SGP Precision Technologies PTE, Ltd.......................65-6-2734573 

SAF Protea Technology, Ltd.................................... 27-11-887-2637 

SPA Wavecontrol, S.L............................................ 34-93-320-80-5 

SWE CE-BIT Elektronik AB.........................................46-8-735-7550 

SWZ Emitec AG..........................................................41-41-748-6010 

TAI Evergo Electronics Corp...............................886-2-2752-0767 

THA Anatron Co. Ltd..............................................66-2-732-0902-4 

TUR Orko Mumessillik.......................................... 90-312-438-2213 

UK AR United Kingdom........................................441-908-282766 



AR Tech Engineered Fabric Products............98 

16246 Valley Blvd., Fontana, CA 92335; 909-829-4444; 

Fax: 909-829-0564; www.artech2000.com 

ARA Technologies..................................................... 

P.O. Box 226, Smithtown, NY 11787 USA; 631-724-4619; 

Fax: 631-361-8691; emc@aratech-inc.com 

ARC Technologies, Inc. .........................................9 

11 Chestnut St., Amesbury, MA 01913 USA; 978-388- 

2993; Fax: 978-388-6866; sales@arc-tech.com; 

www.arc-tech.com 

Arcotronics, Inc. ........................................................ 

20-1 Jules Court, Bohemia, NY 11716 USA; 631-563- 

9568; Fax: 631-563-9569; rich@arcotronics.net; 

www.arcotronics.net 

Aries Electronics ....................................................... 

2609 Bartram Road, Bristol, PA 19007 USA; 215-781- 

9956; Fax: 215-781-9845; www.arieselec.com 

ASR Technologies, Inc. ........................................... 

332 Crestview Road, Ottawa, Ontario K1H 5G6, Canada; 

613-737-2026; Fax: 613-737-3098; 

a.podgorski@ieee.org; www.asrtechnologiesinc.com 

AT4 Wireless............................................................... 

C/ Severo Ochoa, 2 PTA Campanillas, Malaga 29590, 

Spain; +34 95 261 91 00; jcasini@at4wireless.com; 

www.at4wireless.com 

ATLAS Compliance & Engineering...................... 

1792 Little Orchard St., San Jose, CA 95125 USA; 408- 

971-9743; Fax: 408-971-9783; info@atlasce.com; 

www.atlasce.com/ 

Austest Laboratories................................................ 

33-35 Alleyne St., ground floor, Chatswood, Sydney 

NSW 2067, Australia; +61 (0)2 9882 6500; Fax: +61 (0)2 

9882 6600; martin@austest.com.au; 

www.austest.com.au 

Autosplice, Inc. .......................................................... 

10121 Barnes Canyon Road, San Diego, CA 92121 USA; 

858-678-3181; Fax: 858-535-0130; 

cmiller@autosplice.com; www.autosplice.com 

Averna............................................................................ 

87 Prince St., Suite 140, Montreal Quebec, Canada H3C 

2M7; 514-842-7577; Fax: 514-842-7573; 

www.averna.com/urt/ 

Axonics, Inc. ............................................................... 

20 Post Lane, North Suffern, NY 10901 USA; 845-228- 

8924; Fax: 845-689-0611; marc@axonics.net; 

www.axonics.net/html/flexisorb.html 

B 

Bal Seal Engineering, Inc. ...................................... 

19650 Pauling, Foothill Ranch, CA 92610 USA; 800-366- 

1006; Fax: 949-460-2300; 

sales@balseal.com; www.balseal.com 

Barth Electronics, Inc. ............................................. 

1589 Foothill Drive, Boulder City, NV 89005 USA; 702- 

293-1576; Fax: 702-293-7024; 

debbie@barthelectronics.com; 

www.barthelectronics.com 

Bay Area Compliance Labs Corp. ........................ 

1274 Anvilwood Ave., Sunnyvale, CA 94089 USA; 408- 

732-9162, ext. 3106; Fax: 408-732-9164; 

www.baclcorp.com 

BEC Inc. ........................................................................ 

970 East High St., Pottstown, PA 19464 USA; 610-970- 

6880; Fax: 610-970-8381; sales@bec-ccl.com; 

www.bec-ccl.com 

Beehive Electronics ................................................. 

8555 Lawrence Lane, Sebastopol, CA 95472 USA; 

707-824-9206; Fax: 707-581-1955; sales@beehiveelectronics.com; 

www.beehive-electronics.com 

Beijing Tempest Electronics 

Technologies Co. Ltd. ............................................... 

Room 321, Zhuanxiu Building No.83, Fuxing Road, Beijing, 

China; 010-66697852; Fax: 010-66699041; 

tempest@public.bta.net.cn; www.chinatpst.com 

BI Technologies.......................................................... 

4200 Bonita Place, Fullerton, CA 92835 USA; 714-447- 

2345; Fax: 714-447-2400; sales@bitechnologies.com; 

www.bitechnologies.com 

Binder-USA.................................................................. 

3903 Calle Tecate, Camarillo, CA 93012 USA; 805-437- 

9925; greg.harter@binder-usa.com; 

www.binder-usa.com 

Bird Technologies Group / TX RX Systems ...... 

30303 Aurora Road, Solon, OH 44139 USA; 440-248- 

1200; 866-695-4569; Fax: 440-248-5426; 

sales@bird-technologies.com; 

www.bird-technologies.com 

Blackwood Labs ........................................................ 

8 Woodfieldside Business Park, Pontllanfraith, Blackwood, 

South Wales NP12 2DG, United Kingdom; + 44 (0) 

1495 229219; test@blackwood-labs.co.uk; 

www.blackwood-labs.co.uk 

Blue Guide EMC Lab.................................................. 

Joseph Cardijnstraat 21, B-9420 Erpe-Mere, Belgium; 

+32 (0) 53 60 16 52; Fax: +32 (0) 53 70 78 99; info@ 

bgemc.com; www.bgemc.com 

Bourns Inc.................................................................... 

1200 Columbia Ave., Riverside, CA 92507-2129 USA; 951- 

781-5500; www.bourns.com 

Boyd Corporation....................................................... 

600 So McClure Road, Modesto,CA 95357 USA; 209- 

236-1111; 800-554-0200; www.boydcorp.com 

Braco Compliance Ltd. ............................................ 

P.O. Box 31188, Ilam, Christchurch, Canterbury 8444, 

New Zealand; +64 21 208 4303; 

admin@bracocompliance.com; 

www.bracocompliance.com 

Braden Shielding Systems................................. 81 

9260 Broken Arrow Expressway, Tulsa, OK 74145 USA; 

918-624-2888, ext. 102; Fax: 918-624-2886; Glen 

Pierandri, Manager of Gov’t. / Commercial Products, 

gpierandri@bradenshielding.com; 

www.bradenshielding.com 

Brim Electronics, Inc. .............................................. 

120 Home Place, Lodi, NJ 07644 USA; 201-796-2886; 

danziba@gmail.com; www.brimelectronics.com 

Bud Industries ............................................................ 

4605 E. 355th St., Willoughby, OH 44094 USA; 440- 

946-3200; Fax: 440-951-4015; saleseast@budind.com; 

www.budind.com 

Bureau Veritas (formerly Curtis-Straus) ........... 

Littleton Distribution Center, One Distribution Center 

Circle, Suite #1, Littleton, MA 01460 USA; 978-486- 

8880; 877-277-8880; Fax: 978-486-8828; 

craig.lazinsky@us.bureauveritas.com; 

www.BureauVeritas.com/EE 

Bystat International Inc. ......................................... 

2630, rue Sabourin, Ville Saint-Laurent Québec, Canada, 

H4S 1M2; 514-333-8880; 800-361-6777; Fax: 514-333- 

8885; static@bystat.com; www.Bystat.com 

C 

Calmont Wire & Cable, Inc..................................... 

420 East Alton Ave., Santa Ana, CA 92707; 714-549- 

0336; www.calmont.com 

CAP Wireless.............................................................. 

3235 Grande Vista Drive, Newbury Park, CA 91320 USA; 

805-499-1818; Fax: 805-499-6649; 

info@capwireless.com; www.capwireless.com 

Capcon International, Inc. ...................................... 

120 Craft Ave., Inwood, NY 11096-1708 USA; 516-371- 

5600; Fax: 516-239-5481; turab@capconemi.com; 

www.capconemi.com 

CAPLINQ Corp. ........................................................... 

957 Snowshoe Crescent, Orléans (Ottawa) Ontario, K1C 

2Y3, Canada; 613-482-2215; Fax: 702-995-1235; 

info@caplinq.com; www.caplinq.com 

Caprock Mfg. .............................................................. 

2303 120th St., Lubbock, TX 79423 USA; 806-745-6454; 

Fax: 806-745-5963; caprock@caprock-mfg.com; 

www.caprock-mfg.com 

Captor Corp. ......................................................... 115 

5040 South County Road 25A, Tipp City, OH 45371 

USA; 937-667-8484; Fax: 937-667-5133; Scott Timms, 

stimms@captorcorp.com; www.CaptorCorp.com; Bob 

Jenks, Sales/Design Engineer; Nathan Miller, Sales/ 

Design Engineer; Joe Otto, Sales/Design Engineer; Brian 

Monnin, Sales/Design Engineer; Scott Timms, BP/GM; 

Ryan Sollmann, Sales/Design Engineer 

CA Fremont, R C Products LLC/Bruce Creedy..............510-656-8490 

Palm Desert, Ramsgate Tech Sls/Don Hosmer.....760-779-5600 

FL Tampa, CBC Electronics/Seth Brock....................... 813-969-1901 

IN CRP Technical Solutions/Chris Platt.........................317-841-7273 

MA New England region, Integral Sales/Neil Reynolds 

.......................................................................................508-533-7732 

TX Wylie, Stewart & Associates/Fred Stewart.........972-442-0336 

WA Lionheart Northwest, Inc./Leo Smale....................425-882-2587 

Cascade TEK................................................................ 

5245-A NE Elam Young Parkway, Hillsboro, OR 97124 

USA; 503-648-1818; 888-835-9250; Fax: 503-648-1798; 

www.cascadetek.com 

Central Coating Company....................................... 

165 Shrewsbury St., West Boylston, MA 01583 USA; 

508-835-6225; Fax: 508-835-6228; 

aaccettullo@centralcoating.com; 

www.centralcoating.com 

CertifiGroup ................................................................. 

901 Sheldon Drive, Cary, NC 27513 USA; 800-422-1651; 

info@ certifigroup.com; www.certifigroup.com 

CETECOM Inc. ............................................................ 

411 Dixon Landing Road, Milpitas, CA 95035 USA; 408- 

586-6200; sales@cetecomusa.com; 

www.cetecomusa.com 

CGS Technologies...................................................... 

1801 W. Parkside Lane, Phoenix, AZ 85027 USA; 

623-869-0600; Fax: 623-582-4813; info@cgstech.com; 

www.cgstech.com 

Cherry Clough Consultants Ltd. ............................ 

9 Bracken View, Brocton, Staffordshire ST17 0TF, Great 

Britain; +44 (0) 1785 660 247; Fax: +44 (0) 1785 660 247; 

Keith Armstrong, keith.armstrong@cherryclough.com; 

www.cherryclough.com 

Chomerics, Div. of Parker Hannifin Corp. .......... 

77 Dragon Court, Woburn, MA 01888 USA; 781-935- 

4850; Fax: 781-933-4318; chomailbox@parker.com; 

www.chomerics.com; 100 Indigo Creek Drive, Rochester, 

NY 14626-5101 USA; 781-939-4158; Fax: 781-935-2758; 

pterilli@parker.com; www.chomericstest.com 

Cima NanoTech, Inc. ................................................ 

1000 Westgate Drive, St. Paul, MN 55114-1067 USA; 

651-646-6266; Fax: 651-646-4161; 

egranstrom@cimananotech.com; 

www.cimananotech.com 

Circuit Insights LLC .................................................. 

3744 Valley Lights Drive, Pasadena, CA 91107 USA; 626- 

201-0488; Fax: 626-466-4448; 

circuit-insights@charter.net; www.LoopSlooth.com 

CITEL Inc. ..................................................................... 

1515 NW 167th St., Suite 6-303, Miami, FL 33169 USA; 

305-621-0022; Fax: 305-621-0766; 

citel@citelprotection.com; www.citelprotection.com 



CKC Laboratories, Inc. ............................................. 

5046 Sierra Pines Drive, Mariposa, CA 95338 USA; 209- 

966-5240; 800-500-4362; Fax: 866-779-9776; 

ckclabs@ckc.com; www.ckc.com 

ClickFold Plastics ..................................................... 

2900 Westinghouse Blvd., Ste. 118, Charlotte, NC 28273 

USA; 866-649-8665, ext. 701; Fax: 866-649-8665; 

info@clickfold.com; www.clickfoldplastics.com 

Cobham Microwave.................................................. 

Stocks Lane,Bracklesham Bay, Chichester, West Sussex, 

United Kingdom; +44 (0) 1243 670711; Fax: +44 (0) 1243 

672907; www.cobham.com/microwave 

Combinova AB............................................................. 

Domkraftsvägen 1,S-197 40, Bro, Sweden; +46-8-627 93 

10; Fax: +46-8-29 59 85; sales@combinova.se; 

www.combinova.se 

Communication Certification Laboratory ......... 

1940 W. Alexander St., Salt Lake City, UT 84119 USA; 

801-972-6146; Fax: 801-972-8432; info@cclab.com; 

www.cclab.com 

Communication Coil, Inc......................................... 

9601 Soreng Ave., Schiller Park, IL. 60176 USA; 847-671- 

1333; Fax: 847-671-9191; info@communicationcoil.com; 

www.communicationcoil.com 

Compac Development Corp. .................................. 

1460 North Clinton Ave., Suite O-15, Bay Shore, NY 

11706 USA; 631-585-3400; Fax: 631-585-3534; 

prao@compac-rf.com; www.compac-rf.com 

Compatible Electronics, Inc. ................................. 

114 Olinda Drive, Brea, CA 92823 USA; 714-579-0500; 

ruby@celectronics.com; www.celectronics.com 

Compliance Certification Services..................... 

47173 Benicia St., Fremont, CA 94538 USA; 510-771- 

1000; Fax: 510-661-0888 

Compliance Engineering Ireland Ltd. ................. 

Raystown, Ratoath Road, Ashbourne, Co. Meath, Ireland; 

+ 353 1 8256722; john.mcauley@cei.ie; www.cei.ie/ 

Compliance Testing, LLC......................................... 

3356 N. San Marcos Place, Suite 107, Chandler, AZ 

85225 USA; 480-926-3100; Fax: 480-926-3598; 

www.compliancetesting.com 

Compliance Worldwide........................................... 

357 Main St., Sandown, NH 03873 USA; 603-887-3903; 

Fax: 603-887-6445; Larry@cw-inc.com; 

http://cw-inc.com 

Com-Power Corp. ...................................................... 

114 Olinda Drive, Brea, CA 92823 USA; 714-528-8800; 

Fax: 714-579-1850; sales@com-power.com; 

www.com-power.com 

Comtech PST Corp. ................................................... 

105 Baylis Road, Melville, NY 11757 USA; 631-777-8900; 

Fax: 631-777-8877; sales@comtechpst.com; 

www.comtechpst.com 

Comtest Eng. ............................................................... 

Industrieweg 12, 2382NV, Zoeterwoude, Netherlands; + 

31 71 5417531; Fax: + 31 71 5420375; 

engineering@comtestnl.com; www.comtestnl.com 

Conductive Compounds Inc. .................................. 

17 Hampshire Drive, Unit 8, Hudson, NH 03051 USA; 603- 

595-6221; Fax: 603-595-6228; 

sales@conductivecompounds.com; 

www.conductivecompounds.com 

CONEC Corp. - USA.................................................... 

343 Technology Drive #1101, Garner, NC 27529 USA; 

919-460-8800; Fax: 919-460-0141; info@conec.com; 

www.conec.com 

Connors Company ..................................................... 

P.O. Box 807 Carver, MA 02330 USA; 508-272-1500; Fax: 

508-866-5393; brian@connorsrep.com; 

www.ConnorsRep.com 

Core Compliance Testing Services ..................... 

79 River Road, Hudson, NH 03051 USA; 603-889-5545; 

khcmacgrath@aol.com; 

www.corecompliancetesting.com 

Cosmo Ferrites Limited............................................ 

Solan, Himachal Pradesh, India; 911792 277231-36; 

www.cosmoferrites.com 

CPI (Communications & Power Industries)...... 

..................................................................................... 15 

Satcom Div., 45 River Drive, Georgetown, ON L7G 2J4, 

Canada; 905-877-0161; Fax: 905-877-5327; 

marketing@cmp.cpii.com; www.cpii.com/cmp; Tom 

Sertic 

AZ R.A.Mayes, Eric Evans.......................................303-761-9447 

CA Redondo Beach, C-WAVE.................................. 310-937-3521 

CA San Jose, MC Microwave, Inc..........................408-446-4100 

CO R. A. Mayes, Eric Evans.....................................303-761-9447 

FL Ft. Lauderdale, TEQSPEC, Bob Leacock..........954-370-5824 

MD M. Lader Co......................................................... 610-825-3177 

NJ PVP Sales, Vince Schiel..................................... 201-841-2293 

NJ Scientific Devices, New England.....................508-528-2458 

NM R.A.Mayes, Eric Evans.......................................303-761-9447 

NY PVP Sales, Vince Schiel..................................... 201-841-2293 

OK Comreps, John Casey......................................... 972-867-7003 

OR Lionheart, Leo Smale.........................................425-882-2587 

PA M. Lader Co......................................................... 610-825-3177 

TX Comreps, John Casey......................................... 972-867-7003 

UT R.A.Mayes, Eric Evans.......................................303-761-9447 

VA M. Lader Co......................................................... 610-825-3177 

INTERNATIONAL 

CHE Zugs, CPI Switzerland.....................................41-41-749-8522 

DEU Munich, CPI Germany.....................................49-89-45-87370 

DNK FA Consulting........................................................... 49-70-8077 

FIN Advancetec OY................................................358-9-3505-260 

GBR Walton-on-Thames, CPI UK........................44-1932-898-080 

IND New Delhi, CPI India.........................................91-11-614-6716 

ISR Tel Aviv, Rapac Electronics............................972-3-920-3456 

ITA Torino, CPI Italy..................................................39-11-771-4765 

JPN Tokyo .................................................................81-3-3639-9814 

NLD Oudstrijdersstraat, CPI Belgium.......................32-14-43-1140 

NOR Hans H. Schive...................................................47-66-76-0513 

SGP CPI Asia, Inc.........................................................65-6225-0011 

SWE Stockholm, Compomill....................................46-31-733-2150 

CPI (Communications & Power Industries) 

Satcom Div..................................................................... 

811 Hansen Way, Palo Alto, CA 94304-1031; USA; 650- 

846-3803; doug.slaton@cpii.com; 

www.cpii.com/product.cfm/4/11 

Cranage EMC Testing Ltd. ...................................... 

Stable Court, Oakley, Market Drayton, Shropshire TF9 

4AG, United Kingdom; +44 1630 658568; Fax: +44 1630 

65821; keith.rich@cranage.co.uk; www.cranage.co.uk 

Cre8 Associates Ltd. ................................................ 

Bruntingthorpe Proving Ground, Bath Lane, Lutterworth, 

Leicestershire, LE17 5QS, United Kingdom; +44 (0)1162 

479787; davidh@cre8-Associates.com; 

www.cre8-associates.com 

Creative Materials, Inc. .......................................... 

141 Middlesex Road, Tyngsboro, MA 01879 USA; 978- 

649-4700; Fax: 978-649-2040; 

info@creativematerials.com; 

www.creativematerials.com 

Criterion Technology, Inc. ...................................... 

1350 Tolland Road, P.O. Box 489, Rollinsville, CO 80474 

USA; 303-258-0100; Fax: 303-258-0775; 

critech@earthlink.net; www.criteriontech.com 

CSA International....................................................... 

178 Rexdale Blvd., Toronto M9W 1R3, Canada; 866-797- 

4272; Fax: 416-747-4149; 

cert.info@csa-international.org; 

www.csa-international.org 

CST - Computer Simulation Technology AG..... 

Bad Nauheimer Str. 19, 64289 Darmstadt, Germany; +49 

6151 73030; Fax: + 49 6151 7303100; info@cst.com; 

www.cst.com 

CST of America, Inc. ...........................................59 

492 Old Connecticut Path, Suite 505, Framingham, MA 

01701; USA; 508-665-4400; Fax: 508-665-4401; 

info@cst.com; www.cst.com 

CA 

CST of America, Inc....................................................650-472-3790 

INTERNATIONAL 

AUS Oxley, RF Shop...........................................................61 7 3375 6767 

BRA CST AG.....................................................................55 11 2645 6470 

CHN Shanghai, CST China Ltd...................................... 86 21 5080 2328 

Beijing, CST China Ltd............................................86 10 8248 3820 

DEU CST Computer Simulation Technology..................49 6151 7303 0 

FRA CST France Eurl.......................................................33 1 45 37 38 25 

GBR Nottingham, CST UK Ltd.......................................44 115 9061 120 

ITA CST AG.....................................................................39 0363 3512 42 

JPN KawasakiCity, AET, Inc............................................81 44 980 0505 

KOR CST of Korea, Inc......................................................82 31 781 6866 

MYS Kuala Lumpur, CST SouthEast Asia.......................6 03 6203 7690 

TWN Hsinchu, Nearson Marketing Group, Inc................886 3 5332541 

IND CST AG......................................................................91 44 32551460 

CZE CST AG, Prague.......................................................420 257 219 488 

Curtis Industries/ Filter Networks................ 112 

2400 S. 43rd St., Milwaukee, WI 53219; 414-649-4200; 

Fax: 414-649-4279; sales@curtisind.com; 

www.curtisind.com; Steven Powers, Pres.; Al Hungsberg, 

Sales Director; Glenn Cummings, Regional Sales 

Manager 

Custom Assembly LLC.............................................. 

600 Wheat Lane, Wood Dale, IL 60191 USA; 630-595- 

4855; 800-323-9562; Fax: 630-595-1666; 

mschuck@phoenixofchicago.com; 

www.customassemblyllc.com 

Cybershield.................................................................. 

308 Ellen Trout Drive, Lufkin, TX 75904 USA; 936-633- 

6387; Fax: 936-633-6398; www.cybershieldinc.com 

d 

D.L.S. Electronic Systems, Inc............................... 

1250 Peterson Dr., Wheeling, IL 60090; 847-537-6400; Fax 

847-537-6488; jblack@dlsemc.com; www.dlsemc.com; 

Brian Mattson, General Manager; Steve Grimes, Sales and 

Applications Engineer; Donald Sweeney, President; Jack 

Black, business development manager 



DARE!! Instruments ................................................. 

Vijzelmolenlaan 7, NL3447GX Woerden , Netherlands; 

+31 (0)348 41 65 92; Fax: +31 (0)348 49 97 32; 

instruments@dare.nl; www.emc-instruments.com 

Datatronics................................................................... 

28151 Highway 74, Romoland, CA; 951-928-7700; Fax: 

951-928-7701; www.datatronics.com 

Dayton T. Brown, Inc. ............................................... 

1175 Church St., Bohemia, NY 11716-5031 USA; 631- 

589-6300; Fax: 631-589-3648; test@dtbtest.com; 

www.dtbtest.com 

dB Control..................................................................... 

1120 Auburn St., Fremont,CA 94538 USA; 510-656- 

2325; Fax: 510-656-3214; solson@dbcontrol.com; 

www.dBControl.com 

dBi Corp. ....................................................................... 

216 Hillsboro Ave., Lexington, KY 40511 USA; 859-253- 

1178; Fax: 859-252-6128; www.dbicorporation.com 

Delta Electronics........................................................ 

Amphur Bangpakong, Chachoengsao, Thailand; +66 

(0)38522480; www.deltaww.com 

Delta Products Corp. ................................................ 

4405 Cushing Parkway, Fremont, CA; 919-767-3860; 

www.deltaww.com 

Desco Industries Inc. ............................................... 

3651 Walnut Ave., Chino, CA 91710 USA; 909-627-8178; 

Fax: 909-627-7449; Dave.Bermani@Desco.com; 

www.DescoIndustries.com 

Device Technologies, Inc. ...................................... 

155 Northboro Road, Unit 8, Southborough, MA 01772 

USA; 508-229-2000; Fax: 508-229-2622; Nick Petri, 

Director of Sales & Marketing, npetri@devicetech.com; 

www.devicetech.com/shielding/default.asp 

Dexmet Corp. .........................................................97 

22 Barnes Industrial Road South, Wallingford, CT 06492 

USA; 203-294-4440; Fax: 203-294-7899; 

sales@dexmet.com; www.dexmet.com 

Dexter Magnetic Technologies............................. 

1050 Morse Ave., Elk Grove Village, IL 60007 USA; 847- 

956-1140; 800-775-3829; Fax: 877-221-5052; 

info@dextermag.com; 

www.dextermag.com/soft-magnetics.aspx 

Diversified T.E.S.T. Technologies ......................... 

4675 Burr Drive, Liverpool, NY 13088 USA; 315-457- 

0245; Fax: 315-457-0428; annelle@dttlab.com; 

www.dttlab.com 

DNB Engineering, Inc. ........................................23 

3535 W. Commonwealth Ave., Fullerton, CA 92833 USA; 

714-870-7781; Fax: 714-870-5081; Tony Piraino, 

tonyp@dnbenginc.com; www.dnbenginc.com; Doug 

Broaddus, Exec. VP 

CA Riverside, Tony Piraino, Sls & Mktg Manager.951-637-2630 

UT Coalville, Les Payne Manager.........................435-336-4433 

Don HEIRMAN Consultants.............................126 

143 Jumping Brook Road, Lincroft, NJ 07738 USA; 

732-741-7723; Fax: 732-530-5695; Don Heirman, 

d.heirman@ieee.org; www.DonHeirman.com 

Dontech Inc. ...........................................................87 

700 Airport Blvd., Doylestown, PA 18902; 215-348-5010; 

Fax: 215-348-9959; info@dontech.com; 

www.dontech.com; Jeff Blake, Vice President - Business 

Development;John Wahl, Director - Engineering; Bill Cusack, 

Eastern Regional Sales Manager; John Vecchione, 

Western Regional Sales Manager 

Dynamic Sciences International, Inc. ................ 

6130 Variel Av., Woodland Hills, CA 91367 USA; 818-226- 

6262; 800-966-3713; Fax: 818-226-6247; 

market@dynamicsciences.com; 

www.dynamicsciences.com 

E 

E&C Anechoic Chambers Asia Ltd. .................... 

Flat/Rm 303, 3/F St. George’s Bldg, 2 Ice House St., 

Central Hong Kong; +852 397 221 73; Fax: + 852 397 222 

11; jtsang@ecanechoicchambers.com; 

www.ecanechoicchambers.com 

E.F. Electronics Co. ................................................... 

217 W. Mill St., Montgomery, IL 60538 USA; 630-897- 

1950; EFEMCTEST@aol.com 

East Coast Shielding ................................................ 

1914 Rt 57, Hackettstown, NJ 07840 USA; 908-227- 

6857; Fax: 908-852-9163; 

mike@eastcoastshielding.com; 

www.eastcoastshielding.com 

Ecliptek Corp. ............................................................. 

3545-B Cadillac Ave., Costa Mesa, CA; 714-433-1200; 

Fax: 714-433-1234; customersupport@ecliptek.com; 

www.ecliptek.com 

Ed Fagan Inc. ............................................................... 

769 Susquehanna Ave., Franklin Lakes, NJ 07417 USA; 

201-891-4003; 800-348-6268; Fax: 201-891-3207; 

sales@edfagan.com; www.edfagan.com 

EEMCCOIMEX............................................................. 

Appoloweg 80, Leylstad, Flevoland 8239DA, Netherlands; 

+31 32 295 395; Fax: +31 32 413 133; 

info@eemc.nl; www.eemccoimex.nl 

Eeonyx Corp. ............................................................... 

750 Belmont Way, Pinole, CA 94564 USA; 510-741-3632; 

Fax: 510-741-3657; info@marktek-inc.com; 

www.eeonyx.com 

EESeal ........................................................................... 

5639 B Jefferson NE, Albuquerque, NM 87109 USA; 

505-243-1423; Fax: 505-243-9772; eeseal@aol.com; 

www.eeseal.com 

E-Labs Inc. ................................................................... 

4007 Leonard Drive, Fredericksburg, VA 22408 USA; 

540-834-0372; Fax: 540-834-0373; 

info@e-labsinc.com; www.e-labsinc.com 

Electri-Flex Company .........................................83 

222 W. Central Ave., P.O. Box 72260, Roselle, IL 60172 

USA; 1-630-529-2920; Fax: 1-630-529-0388; Janelle 

Jones, Marketing Manager, jjones@electriflex.com 

www.electriflex.com 

Electrocube, Inc. ....................................................... 

3366 Pomona Blvd., Pomona, CA 91768 USA; 909-595- 

4037; 800-515-1112; Fax: 909-595-0186; 

esales@electrocube.com; www.electrocube.com 

ElectroMagnetic Investigations, LLC ................. 

20811 NW Cornell Road, Suite 600, Hillsboro, OR 97124 

USA; 503-466-1160; 888-466-1160; Fax: 503-466-1170; 

support@emicomply.com; www.emicomply.com 

Electro-Metrics Corp................................................ 

231 Enterprise Road, Johnstown, NY; 518-762-2600; Fax: 

518-762-2812; sales@emihq.com; 

www.electro-metrics.com 

Electronic Instrument Associates....................... 

P.O. Box 6487, Bloomingdale, IL 60108-6487 USA; 630- 

924-1600; Fax: 630-477-0321; 

frank@electronicinstrument.com; 

www.electronicinstrument.com 

Electronics Test Centre (Kanata) .................... 24 

302 Legget Drive, Suite 100, Kanata K2K 1Y5, Canada; 

613-599-6800; Fax: 613-599-7614; Lynn Diggins, Director 

Business Development, lynn.diggins@etc-mpb.com; 

27 East Lake Hill, Airdrie, Alberta T4A 2K3, Canada; 

403-912-0037; Fax: 403-912-0083; Mala Mediboina, 

General Manager, mmediboina@etc-mpbtech.com; 

www.etc-mpb.com 

Electrorack Enclosure Products........................... 

1443 South Sunkist St., Anaheim, CA; 714-776-5420; 

Fax: 714-776-9683; www.electrorack.com 

Electro Rent Corp. ..................................................... 

6060 Sepulveda Blvd., Van Nuys, CA 91411 USA; 800- 

688-1111; Fax: 818-786-4354; sales@electrorent.com; 

www.electrorent.com 


1516 Centre Circle; Downers Grove, IL 60515-1082; 

800-ELITE-11, 630-495-9770, ext. 119; FAX 630-495-9785; 

sales@elitetest.com; www.elitetest.com; Steve Laya, 

Mktg. Mgr.; John Schmit, Inside Sales Mgr. 

EM Software & Systems-SA (Pty) Ltd. .........79 

P.O. Box 1354, Stellenbosch, 7599, South Africa; +27 

(0)21 880 1880; Fax: +27 (0)21 880 1936; Celeste 

Mockey, info@emss.co.za; www.feko.info 

VA 

Hampton, EM Software & Systems (USA) Inc........................ 

...............................................................................866-419-FEKO 

INTERNATIONAL 

DEU Böblingen, EM Software & Systems GmbH............................. 

................................................................. +49 (0)7031 714 5203 

EM Test ......................................................................... 

Sternenhofstrasse 15, Reinach (BL) 4153, Switzerland; 

+41 (0)61 717 91 91; Fax: +41 (0)61 717 91 99; 

g.taddio@emtest.ch; www.emtest.com 

EM Test USA ..........................................................37 

3 Northern Blvd., Unit A-4, Amherst, NH 03031 USA; 

603-769-3477; Fax: 603-769-3499; Michael Hopkins, 

General Manager, m.hopkins@emtest.com; 

www.emtest.com 



EMC Compliance ....................................................... 

P.O. Box 14161, Huntsville, AL 35815 USA; 256-650-5261; 

ken.javor@emccompliance.com; 

www.emccompliance.com 

EMC Component Group, Inc. ................................. 

2901 Tasman Drive, Suite 211, Santa Clara, CA 95054 

USA; 408-330-9216; Fax: 408-330-0012; 

sales@emccomponent.com; www.emccomponent.com 

EMCCons Dr. Rasek GmbH ..................................... 

Moggast, Boelwiese4-8, 91320 Ebermannstadt, Germany; 

+49-9194-9016; Fax: +49-9194-8125; 

i.helldoerfer@emcc.de; www.emcc.de 

EMC Engineering and Safety................................. 

Haifa, Israel; 972-528396080 

EMC Eupen, A Div. of I2R Corp. ............................. 

5033 Industrial Road, Bldg. 6, Farmingdale, NJ 07727 

USA; 732-919-1100; Fax: 732-919-7196; 

sales@emceupen.com; www.emceupen.com 

EMC Goggles Ltd. ...................................................... 

P.O. Box 130, Cwmbran, Torfaen NP44 9BT, United 

Kingdom; +44 (0) 7506015791; John Davies, 

info@emcgoggles.com; www.emcgoggles.com 

EMC Integrity, Inc. .................................................... 

1736 Vista View Drive, Longmont, CO 80504 USA; 303- 

776-7249; 888-423-6275; www.emcintegrity.com 

EMC Management Concepts................................. 

46603 Kingschase Court, Sterling, VA; 703-864-7023; 

Fax: 801-849-3516; bfarmer@emcmanagement.com; 

www.emcmanagement.com 

EMC MCC Bv................................................................ 

Sedanlaan 13a, Eindhoven, N. Br. 5627MS, Netherlands; 

+31-40-53811242; +31-40-2927490; 

mart.coenen@emcmcc.nl; www.emcmcc.nl 

EMC Partner AG.....................................................53 

Baselstrasse 160, Laufen 4242, Switzerland; +41 61 775 

2030; Fax: +41 61 775 2059; Nicholas Wright, International 

Sales Manager, sales@emc-partner.ch; 

www.emc-partner.com 

international 

AU Sydney, Test & Measurement......................+61 2 4739 9523 

AR Buenos Aires, Mannos................................+54 11 4373 25 85 

BE Berchem-Ste-Agathe, Decatel......................+32 2 469 00 90 

BR Sao Paulo, Test & Measurement............... +55 11 5092 5229 

CA Manassas, HV Technologies.........................+1 703 365 2330 

CN Shanghai, Precision International...............+86 21 6211 5111 

CZ Prague, Tectra.............................................. +420 281 921 650 

DE Iserlohn, H+H..................................................+49 2371 7853-0 

EG Ramadan City, Horus......................................... +20 15 379416 

ES Barcelona, Wavecontrol...............................+34 933 20 80 55 

FI Helsinki, INEL.................................................+358 10 423 7570 

FR Cosnac, EMC Partner...................................+33 5 55 74 31 68 

GB High Wycombe, EMC Partner................... +44 1494 44 42 55 

GR Athens, ACTA...............................................+30 210 600 33 02 

HU Budapest, EL Test............................................+36 1 202 18 73 

IL Petach Tikva, Dan-El.....................................+97 2 3 927 1888 

IT Milan, AFJ Instruments............................ +39 02 91 43 48 50 

JP Tokyo, Nippon Automatic Control............... +81 3 5434 1600 

KR Seoul, Kwang Wha Trading..........................+82 2 2679 39 96 

MX Manassas, HV Technologies.........................+1 703 365 2330 

NL Oosterleek, Rimarck.......................................+31 229 503 478 

PL Poznan, ASTAT...............................................+48 61 849 80 61 

SE Vellinge, ERDE..................................................+46 40 42 46 10 

SG Singapore, Precision Tech............................... +65 6273 4573 

TR Istanbul, Aktif Neser................................... +90 216 577 6999 

TW Taipei, Precision International................... +886 2 8512 4888 

US Manassas, HV Technologies.........................+1 703 365 2330 

ZA Sandton, Protea Electronics......................... +27 11 719 57 00 

EMC Technologies Pty Ltd. .................................... 

176 Harrick Road, Keilor Park, Victoria 3042, Australia; 

+613 9365 1000; Fax: +613 9331 7455; 

melb@emctech.com.au; www.emctech.com.au 

EMC Tempest Engineering...................................... 

2190 East Winston Road, Anaheim, CA 92806 USA; 714- 

778-1726; www.emctempest.com 

EMC Test Design........................................................ 

PO Box 600532, Newton, MA; 508-292-1833; 

exid@emctd.com; www.emctd.com 

EMC Testing Laboratories, Inc. ............................ 

2100 Brandon Trail, Alpharetta, GA 30004 USA; 770- 

475-8819; gbailey@emctesting.com 

EMCO Elektronik GmbH........................................... 

Bunsenstraße 582152, Planegg, Germany; +49-89- 

8955650; Fax: +49-89 -895 90 376; 

www.emco-elektronik.de 

Emerson & Cuming Microwave Products, 

Inc. .................................................................................. 

28 York Ave., Randolph, MA 02368 USA; 781-961-9600; 

800-650-5740; Fax: 781-961-2845; 

sales@eccosorb.com; www.eccosorb.com 

EMF Testing USA........................................................ 

11236 Harrington St., Fishers, IN 46038-3208 USA; 

800-862-9655; sbagley@indoorairsite.com; 

www.EMFTESTING.net 

EMField ......................................................................... 

Rua Nicarágua 962, salas 12/13, CEP 82510-170, Bacacheri, 

Curitiba, PR, Brazil; +55 (0)41 - 3044 0197; Fax: +55 

(0)41 - 3044 0197; www.emfield.com.br 

EMI Filter Company............................................ 116 

12750 59th Way, North Clearwater, FL 33760 USA; 727- 

585-7990; 800-323-7990; Fax: 727-586-5138; sales@ 

emifiltercompany.com; www.emifiltercompany.com; 

Sally Hubbell, Sales Manager; Ted Nordquist, Chief Engineer 

EMI Solutions Inc. ..................................................... 

15 Hammond, Suite 304, Irvine, CA 92618 USA; 949-206- 

9960; Fax: 949-206-9983; bob@4emi.com; 

www.4emi.com 

EMI Technologies, Inc. ............................................ 

2200 North Telshor Blvd., Las Cruces, NM 88011 USA; 

575-532-9190; Fax: 575-532-0884; 

tezak.d@emitechnologies.com; 

www.emitechnologies.com 

Emission Control, Ltd. .............................................. 

12704 W. Arden Place, Butler, WI ; 262-790-0092; Fax: 

262-790-0095 ; sales@emissioncontrol.com; 

www.emissioncontrol.com 

EMITECH ...................................................................... 

Rue des Coudriers, ZA de l’Observatoire, Montigny le BX, 

Ile de France 78180, France; +33 1 30 57 55 55; Fax: 33 1 

30 43 74 48; jm.rogi@emitech.fr; www.emitech.fr 

EMITEMC...................................................................... 

Arroyo de la China 3510 Rio Negro, Bariloche, Argentina; 

+542944527498; hsineiro@emitemc.com; Hernan 

Sineiro 

EMP-tronic................................................................... 

EMP-tronic AB, Box 130 60,250 13, Helsingborg, Sweden; 

464-223-5060; Fax: 042 23 51 82; 

info@emp-tronic.se ;www.emp-tronic.se 

EMSCAN Corp. ........................................................... 

#1, 1715-27 Ave., NE Calgary, Alberta T2E 7E1, Canada; 

403-291 0313; 877-367-2261; Fax: 403-250 8786; 

etickam@emscan.com; www.emscan.com 

emscreen GmbH ........................................................ 

Wallbergstraße 7, Taufkirchen , Bavaria 82024, Germany; 

+49 89 614171-0; Fax: +49 89 61471-71; 

info@emscreen.de; www.emscreen.de 

EMSS Consulting Pty (Ltd.) .................................... 

32 Techno Ave., Technopark, Stellenbosch, Western 

Cape 7600, South Africa; +27 21 880 1880; 

bbosch@emss.co.za; www.emssixus.com 

emv - Elektronische Meßgeräte Vertriebs 

GmbH ............................................................................. 

Wallbergstraße 7, Taufkirchen, 82024, Germany; +49 (0) 

89614243; Fax: +49 (0) 89614282; 

awahrmann@emvgmbh.de; www.emvgmbh.de 

Enerdoor Inc. ............................................................... 

75 Industrial Way, Portland, ME 04103 USA; 207-210- 

6511; 877-778-2875; Fax: 207-210-6512; 

stefano.medved@enerdoor.com; www.enerdoor.com 

Engineered Testing Systems ................................. 

1711 West 15th St., Indianapolis, IN 46202 USA; 317- 

396-0573; Fax: 317-536-8006; 

golten@engineered-testing.com; 

www.engineered-testing.com 

Environ Laboratories, LLC ...................................... 

9725 Girard Ave., South Minneapolis, MN 55431 USA; 

952-567-2302; 800-826-3710; www.environlab.com 

EPCOS, Inc.................................................................... 

186 Wood Ave. S, Iselin, NJ 08830 USA; 732-906-4374; 

Fax: 732-632-5927; inductors-emc.usa@epcos.com; 

www.epcos.com/emc 

Equipment Reliability Institute 

1520 Santa Rosa Ave., Santa Barbara, CA 93109 USA; 

805-564-1260; tustin@equipment-reliability.com; 

www.equipment-reliability.com 

ERA Technology Ltd. Trading as Cobham 

Technical Services.................................................... 

Leatherhead, Surrey, United Kingdom; +44 (0) 1372 

367030; www.cobham.com/technicalservices 

ETS-Lindgren.................................35, Back Cover 

1301 Arrow Point Drive, Cedar Park, TX 78613 USA; 512- 

531-6400; Fax: 512-531-6500; info@ets-lindgren.com; 

www.ets-lindgren.com 

CA Altamont Technical Services....................................925-294-9774 

GA dBm Marketing........................................................... 678-690-5258 

IN Electronic Instrument Associates............................ 317-770-3689 

MA Intersell........................................................................ 603-465-7500 

MD EMC Technologists.....................................................301-668-7002 

MI Delta Technology Solutions, LLC..............................740-881-3883 

MO KJS Marketing, Inc....................................................314-469-4544 

NY GSC Representatives................................................. 585-385-1170 

TX CF Scientific Systems.................................................817-467-0970 

WA Syntek...........................................................................503-871-9590 

INTERNATIONAL 

ARG Precision Electronica SRL...................................+54 11 4735 8814, 

................................................................................+54 11 4708-9384 

ARG Vimelec S.A...........................................................+54 11 4912 3998 

AUS Faraday Pty Ltd....................................................+61 0 3 9729 5000 

AUT MEM.......................................................................... +43 1 943 4254 

AUT Universal Elektronik-Import GmbH.........................+43 1545 1588 

BOL CONATEL..................................................................+598 2902 0314 

BGR Giga Electronics........................................................+359 2 731 498 

BGR Martec Ltd............................................................ +359 898 418 900 

BRA AK Telemedia...........................................................55-11-38150594 

CAN Interfax Systems, Inc........................................416-674-8970 x121 

CHE Emitec AG..................................................................+41 41 7486010 

CHL Dymeq Ltda................................................................+56 2 3392000 

CHL Sistemas de Instrumentacion Ltda.................... +52 0 2 696 0031 

COL High Tec Environmental Ltda..................................+57 1 671 3700 

COL Technical Marketing Specialists.............303 488-0220, ext. 303 

CZE Testovaci Technika s.r.o...................................... +420 274 782 237 

DEU EMCO Elektronik GmbH.................................... +49 89 895 569-23 

DEU Pischzan Technologies......................................... +49 6109 771948 



DNK Metric A/S................................................................+45 43 71 64 44 

ECU Caprotecsa.........................................................+593 59342231875 

EGY Omega Integrated Systems.....................................+20 2 3370501 

ESP ALAVA Ingenieros, S.A............................................+34915679720 

ESP Nusim SA...............................................................+1 3491 535 9640 

EST Arpen Elekter..............................................................+372 671 1947 

FRA M2S Sarl................................................................. +33 4 6881 4952 

GRC Netscope Solutins S.A........................................+30 210 27 24 207 

HKG Euro Tech (Far East) LTD........................................+852 2 814 0311 

HKG MaxTech Instruments Limited..............................+852 27 933591 

HKG PTC International, LTD..........................................+852 2 827 9977 

HUN ProMet Merestechnika Kft.....................................+36 24 521 240 

IND Complus Systems Pvt. Ltd...................................+91 80 23146683 

INA PT Berca Hardayaperkasa.....................................+62 21 3800902 

ISR R.D.T. Equipment & Systems Ltd...........................+972 36450745 

ISR Safe-Tech Ltd.......................................................... +972 4 958 5789 

ITA ASEA SISTEMI S.R.L............................................ +39 011 9963071 

KOR Crezon Corporation...................................................82 31 777 8949 

KOR Will Technology Co Ltd.............................................82 31 3226100 

KSA AMICO (medical only).................................... +0119 662 660 1149 

Latin America Lumur International, Inc.......................+1 787 781-9833 

LAT Moduls Riga.................................................................+371 7070101 

LIB Computer Information Systems.............................. +961 4 410410 

LTU Satela UAB............................................................... +370 699 90743 

MEX Sistemas e Ingenieria de EMC (SI-EMC)......... +52 55 2163 2148 

NED ar Benelux B.V...........................................................+31 172 423000 

NZL Vicom (NZ) Ltd.......................................................... +64 9 379 4596 

NOR Nortelco Electronics AS..........................................+47 22 57 6100 

PAK Telec Electronics & Machinery PVT Ltd...............+92 21 5217201 

PAR CONATEL..................................................................+598 2902 0314 

PER Instrumentos y Complementos S.A.C...................+51 1 2604 926 

PHL Ark One Solutions Inc....................................+63-2-8429090 or 91 

POL Urzadzenia Elektroniczne Import (UIE)................+48 22 313 1735 

RSA Protea Electronics (PTY) Ltd.................................+27 11 719 5700 

RSA Envirocon Instrumentation....................................+27 11 476 7323 

RSA H.A.S.S. Industrial Pty. Ltd................................011 966 2660 1149 

RUS Sernia, Ltd...............................................................+7 495 225 40 14 

RUS SWEMEL Innovation Enterprise............................+7495 154-5181 

SWE Ce-Bit Elektronik AB...............................................+46 87 35 75-50 

SWE Proxitron AB............................................................+1 46 141 580 00 

THA Comfort International Co., LTD............................ +66 02 391 7078 

THA iRC Technologies Limited........................ 66 2717 1400, ext. 2000 

TUR Spark Measurement Technologies....................+90 312 466 8212 

TWN Lintek Corporation...............................................+886 2 2709 0387 

TWN Burgeon Instrument Co, Ltd.......................+886 3 328 0531 (15 L) 

UKR Unitest Ltd.............................................................+380 44 272 6094 

UAE Al-Hayat Pharmaceuticals........................+971 +011-6-559-2481 

UAE Electrocom.............................................................. +971 4 295 7056 

UAE Tamra Electrocom.................................................. +971 4 2233 259 

URU CONATEL..................................................................+598 2902 0314 

VEN Optipro..................................................................... 58 212 257 4434 

VIE Victory Co, LTD...........................................................+84 4 9761586 

ETS-Lindgren (Lindgren RF Enclosures, Inc.) 

............................................................35, Back Cover 

400 High Grove Blvd., Glendale Heights, IL 60139; 630-307- 

7200; Fax 630-307-7571; info@lindgrenrf.com; 

www.ets-lindgren.com 

CA Altamont Technical Services....................................925-294-9774 

GA dBm Marketing........................................................... 678-690-5258 

IN Electronic Instrument Associates............................ 317-770-3689 

MA Intersell........................................................................ 603-465-7500 

MD EMC Technologists.....................................................301-668-7002 

MI Delta Technology Solutions, LLC..............................740-881-3883 

MO KJS Marketing, Inc....................................................314-469-4544 

NY GSC Representatives................................................. 585-385-1170 

TX CF Scientific Systems.................................................817-467-0970 

WA Syntek...........................................................................503-871-9590 

INTERNATIONAL 

ARG Precision Electronica SRL...................................+54 11 4735 8814, 

................................................................................+54 11 4708-9384 

ARG Vimelec S.A...........................................................+54 11 4912 3998 

AUS Faraday Pty Ltd....................................................+61 0 3 9729 5000 

AUT MEM.......................................................................... +43 1 943 4254 

AUT Universal Elektronik-Import GmbH.........................+43 1545 1588 

BOL CONATEL..................................................................+598 2902 0314 

BGR Giga Electronics........................................................+359 2 731 498 

BGR Martec Ltd............................................................ +359 898 418 900 

BRA AK Telemedia...........................................................55-11-38150594 

CAN Interfax Systems, Inc........................................416-674-8970 x121 

CHE Emitec AG..................................................................+41 41 7486010 

CHL Dymeq Ltda................................................................+56 2 3392000 

CHL Sistemas de Instrumentacion Ltda.................... +52 0 2 696 0031 

COL High Tec Environmental Ltda..................................+57 1 671 3700 

COL Technical Marketing Specialists.............303 488-0220, ext. 303 

CZE Testovaci Technika s.r.o...................................... +420 274 782 237 

DEU EMCO Elektronik GmbH.................................... +49 89 895 569-23 

DEU Pischzan Technologies......................................... +49 6109 771948 

DNK Metric A/S................................................................+45 43 71 64 44 

ECU Caprotecsa.........................................................+593 59342231875 

EGY Omega Integrated Systems.....................................+20 2 3370501 

ESP ALAVA Ingenieros, S.A............................................+34915679720 

ESP Nusim SA...............................................................+1 3491 535 9640 

EST Arpen Elekter..............................................................+372 671 1947 

FRA M2S Sarl................................................................. +33 4 6881 4952 

GRC Netscope Solutins S.A........................................+30 210 27 24 207 

HKG Euro Tech (Far East) LTD........................................+852 2 814 0311 

HKG MaxTech Instruments Limited..............................+852 27 933591 

HKG PTC International, LTD..........................................+852 2 827 9977 

HUN ProMet Merestechnika Kft.....................................+36 24 521 240 

IND Complus Systems Pvt. Ltd...................................+91 80 23146683 

INA PT Berca Hardayaperkasa.....................................+62 21 3800902 

ISR R.D.T. Equipment & Systems Ltd...........................+972 36450745 

ISR Safe-Tech Ltd.......................................................... +972 4 958 5789 

ITA ASEA SISTEMI S.R.L............................................ +39 011 9963071 

KOR Crezon Corporation...................................................82 31 777 8949 

KOR Will Technology Co Ltd.............................................82 31 3226100 

KSA AMICO (medical only).................................... +0119 662 660 1149 

Latin America Lumur International, Inc.......................+1 787 781-9833 

LAT Moduls Riga.................................................................+371 7070101 

LIB Computer Information Systems.............................. +961 4 410410 

LTU Satela UAB............................................................... +370 699 90743 

MEX Sistemas e Ingenieria de EMC (SI-EMC)......... +52 55 2163 2148 

NED ar Benelux B.V...........................................................+31 172 423000 

NZL Vicom (NZ) Ltd.......................................................... +64 9 379 4596 

NOR Nortelco Electronics AS..........................................+47 22 57 6100 

PAK Telec Electronics & Machinery PVT Ltd...............+92 21 5217201 

PAR CONATEL..................................................................+598 2902 0314 

PER Instrumentos y Complementos S.A.C...................+51 1 2604 926 

PHL Ark One Solutions Inc....................................+63-2-8429090 or 91 

POL Urzadzenia Elektroniczne Import (UIE)................+48 22 313 1735 

RSA Protea Electronics (PTY) Ltd.................................+27 11 719 5700 

RSA Envirocon Instrumentation....................................+27 11 476 7323 

RSA H.A.S.S. Industrial Pty. Ltd................................011 966 2660 1149 

RUS Sernia, Ltd...............................................................+7 495 225 40 14 

RUS SWEMEL Innovation Enterprise............................+7495 154-5181 

SWE Ce-Bit Elektronik AB...............................................+46 87 35 75-50 

SWE Proxitron AB............................................................+1 46 141 580 00 

THA Comfort International Co., LTD............................ +66 02 391 7078 

THA iRC Technologies Limited........................ 66 2717 1400, ext. 2000 

TUR Spark Measurement Technologies....................+90 312 466 8212 

TWN Lintek Corporation...............................................+886 2 2709 0387 

TWN Burgeon Instrument Co, Ltd.......................+886 3 328 0531 (15 L) 

UKR Unitest Ltd.............................................................+380 44 272 6094 

UAE Al-Hayat Pharmaceuticals........................+971 +011-6-559-2481 

UAE Electrocom.............................................................. +971 4 295 7056 

UAE Tamra Electrocom.................................................. +971 4 2233 259 

URU CONATEL..................................................................+598 2902 0314 

VEN Optipro..................................................................... 58 212 257 4434 

VIE Victory Co, LTD...........................................................+84 4 9761586 

EU Compliance Services, Inc. ............................... 

7580 St. Clair Ave., Mentor, OH 44060 USA; 440-918- 

1425; Fax: 440-918-1476; emcjanki@aol.com; 

www.eucs.com 

Eurofins Product Service GmbH........................... 

Storkower Str. 38C Reichenwalde 15526 Germany; +49 

33631 8880; Fax: +49 33631 888 660; 

jenszimmermann@eurofins.com; http://pt.eurofins.com 

F 

F-Squared Laboratories........................................... 

26501 Ridge Road, Damascus, MD 20872 USA; 301-253- 

4500; 877-405-1580; Fax: 301-253-5179; Ken DeVore, 

kdevore@f2labs.com; www.f2labs.com 

NC Concord........................................................................704-918-4609 

OH Middlefield.................................................................. 440-632-5541 

Fabreeka International, Inc. .................................. 

1023 Turnpike St., P.O. Box 210, Stoughton, MA 02072 

USA; 781-341-3655; Fax: 781-341-3983; 

info@fabreeka.com; www.fabreeka.com 

Fair-Rite Products Corp. .................................. 113 

1 Commercial Row, P. O. Box 288, Wallkill NY, 12589; 

845-895-2055; Fax: 845-895-2629; ferrites@fair-rite. 

com; www.fair-rite.com; James Montgomery, Applications 

Engineer; Paul Zdanowicz, Dir. Sales and Marketing; Jerry 

Barbaro, Area Sales Manager (Western US/Mexico); Bob 

Polhamus, Area Sales Manager (Eastern U.S./Canada) 

AL Huntsville, Millennium Sls..................................256-461-8655 

AZ Phoenix, Arcadia Tech. Sls................................480-956-8144 

CA Anaheim, MFS Marketing Corp.........................714-991-7444 

CA Livermore, Altamont Tech Services ................925-294-9774 

CO Littleton, Chinook Tech. Sls. .............................303-933-9007 

FL Casselberry, CBX Electronics, Inc. ...................407-774-9100 

IL Winfield, Charles D. Atwater Associates ......630-668-2303 

MA West Newbury, FairRep Inc. ............................978-363-5121 

MI Grand Rapids, Urban Associates Inc................616-361-7600 

MN Eagan, Holmes Associates, Inc. ......................651-686-5354 

NJ Upperco, Imagitron Sales, Inc. ....................... 800-638-3592 

OH Cincinnati, StaffCo-Campisano .........................513-574-7111 

TX Keller, DeWitt Manufacturers Rep. ................817-498-4755 

VA Roanoke, A.B. Kreger Co. ................................ 540-989-4780 

WA Bothell, Temco Northwest Inc. ........................425-481-6150 

INTERNATIONAL 

CAN Ontario, Pipe-Thompson Tech, Inc. ................. 905-607-1850 

CAN British Columbia, Temco Northwest Inc.........425-481-6150 

MEX Jalisco, Ciber Electronica..............................52 33 3121-3331 

AUTHORIZED DOMESTIC DISTRIBUTORS 

CA Anaheim, Lodestone Pacific ............................800-694-8089 

CA Costa Mesa, Amidon Inductive Comp. ...........800-898-1883 

IL Elk Grove Village, Dexter Mag. Tech. ........... 800-775-3829 

IL Chicago, Newark Inone......................................800-263-9275 

NY Melville, Arrow Electronics ............................. 800-833-3557 

NY Saugerties, Elna Magnetics .............................800-553-2870 

NJ E.Brunswick, Brothers Electronics...................800-552-2255 

TX Mansfield, Mouser Electronics ....................... 800-346-6873 

VA Roanoke, Kreger Components .........................800-609-8186 

FEKO PO......................................................................... 

Box 1354, Stellenbosch 7599, South Africa; +27 21 

8801880; Fax: +27 21 8801936; celestem@emss.co.za; 

www.feko.info 

Ferronics, Inc............................................................... 

45 O’Connor Road, Fairport, NY 14450; 585-388-1020; 

Fax: 585-388-0036; odavies@ferronics.com; 

www.ferronics.com 

Feuerherdt GmbH....................................................... 

Motzener Str. 26 b, 12277 Berlin, Germany; +49 30 710 

96 45 51; Fax: +49 30 710 96 45 99; clemens.euerherdt@ 

feuerherdt.de; www.shielding-online.com 

FIBOX Enclosures...................................................... 

810 Cromwell Park Drive, Suite R, Glen Burnie, MD 

21061; 410-760-9696; Fax: 410-760-8686; sales@ 

fiboxusa.com; www.fiboxusa.com 

Field Management Services.................................. 

123 N. Laurel Ave., Los Angeles, CA 90048 USA; 323- 

937-1562, ext. 7; Fax: 323-934-2101; james.tidwell@ 

fms-corp.com; www.fms-corp.com 

Fil-coil............................................................................ 

77-18 Windsor Place, Central Islip, NY 11766 USA; 631- 

467-5328; Fax: 631-467-5066; 

sales@custompowersystems.us; 

www.CustomPowerSystem.com 

Filter Concepts Inc. ................................................... 

2624 Rousselle St., Santa Ana, CA 92707 USA; 714- 

545-7003; Fax: 714-545-4607; info@filterconcepts.com; 

www.filterconcepts.com 



Filtronica, Inc. ............................................................ 

607 Brazos St., Suite U, Ramona,CA 92065 USA; 

760-788-4975; 1-888-FILTRONICA; Fax: 760-788-4356; 

peter@filtronica.com; www.filtronica.com 

Fischer Custom Communications.....................11 

20603 Earl St., Torrance, CA 90503 USA; 310-303-3300; 

Fax: 310-371-6268; sales@fischercc.com; 

www.fischercc.com; Allen Fischer, Vice President 

international 

DEU Taufkirchen, emv GmbH..................................49-89-614-1710 

FRA emv, s.a.r.l. (FRANCE).....................................33-1-6461-6329 

GBR emv, Ltd........................................................... 44-1908-566556 

ISR Kfar-Saba, Silram, Ltd.....................................972-9-767-1332 

ITA Savona , PMM......................................................39 0182 5864 

ITA Torino , Teseo......................................................39-011-739651 

JPN Tokyo, Nippon Automatic Control...........81-(0)3-5434-1600 

NLD Comtest Instrumentation, B.V.........................31-71-541-7531 

SWE Stockholm, CE-BIT.............................................46-8-735-7550 

Fotofab...................................................................... 75 

3758 Belmont Ave., Chicago, IL 60618 USA; 773-463- 

6211; Fax: 773-463-3387; sales@fotofab.com; 

www.fotofab.com; James Tankersley, Inside Technical Sales 

Representative; Dan Sima, Sales & Marketing Manager 

Frankonia EMC............................................................ 

Industrie Strasse, 16, Heideck, D-91180, Germany; 49 91 

77-98 500; www.frankonia-emc.com 

Frontier Electronics, Corp....................................... 

667 E. Cochran St., Simi Valley, CA; 805-522-9998; Fax: 

805-522-9989; frontiersales@frontierusa.com; 

www.frontierusa.com 

Fuss-EMV...................................................................... 

Johann-Hittorf-Strasse 6, 12489 Berlin, Germany; +49 

30-4044004; stefan.weber@fuss-emv.de; 

www.fuss-emv.de 

G 

Gaddon Ltd. .................................................................. 

18 New Royd Millhouse Green , Sheffield, South Yorkshire 

S36 9NW, United Kingdom; +44 1226766999; 

ian.white@gaddon.co.uk; www.gaddon.co.uk 

Gaven Industries Inc................................................. 

6655 North Noah Drive, Saxonburg, PA ; 724-352-8100; 

Fax: 724-352-8121; www.gavenindustries.com 

Genisco Filter Corp............................................. 119 

5466 Complex St. #207, San Diego, CA 92123 USA; 858- 

565-7405; Fax: 858-565-7415; Dick Guerena, 

sales@genisco.com; www.genisco.com 

GETELEC........................................................................ 

375, rue Morane Saulnier, 78530, Buc, France; (33) 1 39 

20 42 42; Fax: (33) 01.39.20.42.43; info@getelec.com; 

www.getelec.com 

Giga-tronics/Ascor Inc. .......................................... 

4650 Norris Canyon Road, San Ramon, CA 94583 USA; 

925-328-4650; Fax: 925-328-4700; 

dkwok@gigatronics.com; www.gigatronics.com 

Glenair Inc. .................................................................. 

1211 Air Way, Glendale, CA 91201-2497 USA; 818-247- 

6000; Fax: 818-500-9912; mKaufman@glenair.com; 

www.glenair.com 

Global Advantage ..................................................... 

180 Brodie Drive, Richmond Hill, ON L4B 3K8, Canada; 

905-883-3919; larry.cook@globaladvantage.ca; 

www.globaladvantage.ca 

Global Certification Laboratories, Ltd. .............. 

4 Matthews Drive, East Haddam, CT 06423 USA; 860- 

873-1451; Fax: 860-873-1947; 

janice@globaltestlabs.com; www.globaltestlabs.com 

Global EMC Ltd. ......................................................... 

Prospect Close, Lowmoor Road Ind., Est Kirkby-in-Ashfield, 

Nottinghamshire NG17 7LF, United Kingdom; +44 

(0)1623 755539; Fax: +44 (0)1623 755719; 

information@globalemc.co.uk; www.globalemc.co.uk 

Global Testing............................................................. 

4183 Riverview Drive, Riverside, CA 92509 USA; 951- 

781-4540; Fax: 951-781-4544; www.global-testing.com/ 

W. L. Gore & Associates, Inc. ....................94, 95 

380 Starr Road, Landenberg, PA 19350-9221 USA; 

electronics.usa@wlgore.com; www.gore.com 

Gowanda Electronics............................................... 

One Magnetics Parkway, Gowanda, NY 14070 USA; 

716-532-2234; Fax: 716-532-2702; 

sales@gowanda.com; www.gowanda.com 

Green Mountain Electromagnetics, Inc. ........... 

219 Blake Roy Road, Middlebury, VT 05753 USA; 802- 

388-3390; Fax: 802-388-6279; gme@gmelectro.com; 

www.gmelectro.com 

GTN Kommunikations- und Sicherungssysteme 

GmbH & Co. KG................................................. 

Lindener Bergsfeld 9, D - 31188 Holle / OT Grasdorf; +49 

(0)5062/8991-0; Fax: +49 (0)5062/8991-99; 

b.siebke@gtn-germany.de; http://www.gtn-germany.de 

H 

Haefely EMC ..........................................................63 

1650 Route 22, Brewster , NY 10509 USA; 845-279- 

8091; emcsales@hubbell-haefely.com; 

www.haefelyemc.com; www.hipotronics.com 

Harris Corp. - EMI/TEMPEST Lab ....................... 

P.O. Box 37, Melbourne, FL 32902 USA; 321-727-6209; 

Fax: 321-727-4335; jboorde@harris.com; 

www.govcomm.harris.com 

Harwin.......................................Inside Front Cover 

7A Raymond Ave., Unit 11, Salem, NH 03079; 603-893- 

5376; Fax: 603-893-5396; misboston@harwin.com; 

www.harwin.com 

IN New Albany.................................................................812-542-2540 

INTERNATIONAL 

GBR Portsmouth, Hants........................................ +44 (0)23-9231-4454 

DEU Munich...............................................................49 (0) 89-379-19400 

SGP Harwin Asia Pte........................................................65-6-779-4909 

Heilind Electronics ................................................... 

58 Jonspin Road, Wilmington, MA 01887 USA; 800- 

555-8027; Fax: 440-473-9330; connect2@heilind.com; 

www.heilind.com 

Henry Ott Consultants ......................................126 

48 Baker Road Livingston, NJ 07039 USA; 973-992-1793; 

Fax: 973-533-1442; h.ott@verizon.net; 

www.hottconsultants.com; Henry W. Ott, Pres. 

Hermon Laboratories................................................ 

Hatachana Street, P.O. Box 23, Binyamina 30500, Israel; 

+972-4-6268450; sales-tca@hermonlabs.com; 

www.hermonlabs.com 

HFC Shielding Prod. Co. Ltd. .................................. 

515 Valley St., Maplewood, NJ USA; 973-928-7769; 

emigasket@hotmail.com; www.emigasket.com 

High & Low Corp. ...................................................... 

4F-2, No. 129, Lane 235 ,Pao-Chiao Road, Hsin Tien City, 

Taipei Hsien 231, Taiwan; +886 2 89191800; Fax: +886 2 

89191900; daniel@hal.com.tw; www.hal.com.tw 

Hi-Tech Controls ........................................................ 

14853 E. Hinsdale Ave., Suite D, Centennial, CO 80112- 

4240 USA; 303-680-5159; info@hitechcontrols.com; 

www.hitechcontrols.com 

Hi-Voltage & EMI Corp. ........................................... 

93 Stone Lane, Levittown, NY 11756 USA; 516-644- 

5486; Fax: 516-735-3585; rfhivoltage2@aol.com; 

www.hivoltage.li 

Holland Shielding Systems BV.............................. 

Jacobus lipsweg 124, 3316BP Dordrecht, the Netherlands; 

+31 (0)78 - 613 13 66; Fax: +31 (0)78 - 614 95 85; 

info@hollandshielding.com; www.hollandshielding.com 

Holaday Industries, Inc., ETS-Lindgren.............. 

1301 Arrow Point Drive, Cedar Park, TX; 512-531-6400; 

Fax: 512-531-6500; www.ets-lindgren.com 

Hoolihan EMC Consulting................................126 

32515 Nottingham Court, P.O. Box 367 Lindstrom MN 

55045 USA; 651-213-0966; Fax: 651-213-0977; Daniel D. 

Hoolihan, danhoolihanemc@aol.com; 

www.emcxpert.com 

HV Technologies, Inc. ............................................5 

8526 Virginia Meadows Drive, Manassas, VA 20109 

USA; 703-365-2330; Fax: 703-365-2331; 

emcsales@hvtechnologies.com; 

www.hvtechnologies.com; Tom Revesz, EMC Sales 

Manager 

I 

I. Thomas GmbH.......................................................... 

An der B73 - 200a,D-21684 Stade, Germany; +49 4141 

82920; Fax: +49 04141 84461; 

Vertrieb@Schirmkabinen.de; www.schirmkabinen.com 

Identification Products Corp.................................. 

104 Silliman Ave., Bridgeport, CT; 203-334-5969; 

info@idproducts.com; www.idproducts.com 

IMS/AMCO Engineered Products........................ 

1 Innovation Drive, DesPlaines, IL; 847-391-8203; Fax: 

847-391-8354; sales@imsmfg.com; www.imsep.com 

iNARTE, Inc. ................................................................ 

840 Queen St., New Bern, NC 28560 USA; 252-672- 

0111; 800-89-NARTE; Fax: 252-672-0111; 

Lawrence@inarte.us 

Ingenium Testing, LLC.............................................. 

3761 South Central Ave., Rockford, IL 61102 USA; 815- 

315-9250; Fax: 815-489-9561; 

michael.caruso@ingeniumtesting.com 

Instrument Plastics Ltd. .......................................... 

Unit 35, Kings Grove Industrial Est., Maidenhead, Berkshire 

SL6 4DP, United Kingdom; +44 01628 770018; Fax: 

+44 01628 773295; rad@instrumentplastics.co.uk; 

www.instrumentplastics.co.uk 



Instruments For Industry (IFI)........17, 38, 39, 51 

903 South Second St., Ronkonkoma, NY 11779 USA; 

631-467-8400; Fax: 631-467-8558; www.ifi.com; Mark 

Swanson, President; Mike Yantz, Sr. VP Sales; Catherine 

Schlie, Sales/Marketing; Leon Benatar, VP Engineering; 

Abe Jaffe, Director of Operations 

AL Huntsville, SMA..................................................256-881-6035 

AZ AZTEC Enterprises, Inc..................................... 800-304-3565 

CA Danville, Advanced Technical Sales (ATS)..... 925-735-2147 

CO Denver, AZTEC Enterprises, Inc...................... 800-304-3565 

CT dB Instruments Co..............................................508-238-1303 

DC Washington, Technology Partners...................301-854-0049 

DE Contech Marketing............................................. 800-219-9417 

FL Longwood, SMA..................................................407-682.7317 

GA Byron, SMA.........................................................478-953-1088 

ID AZTEC Enterprises, Inc..................................... 800-304-3565 

IL Test Midwest.......................................................314-246-0360 

IA Test Midwest...................................................... 309-343-0203 

IN Micro Sales..........................................................614-563-9800 

KS Test Midwest.......................................................816-866-0360 

KY Micro Sales..........................................................614-563-9800 

MA dB Insruments Co................................................508-238-1303 

MD Technology Partners...........................................301-854-0049 

ME dB Instruments Co..............................................508-238-1303 

MI Micro Sales..........................................................734-770-6269 

MN Test Midwest.......................................................612-460-0360 

MO Test Midwest.......................................................314-246-0360 

MS SMA......................................................................256-881-6035 

MT AZTEC Enterprises, Inc..................................... 800-304-3565 

ND Test Midwest.......................................................612-460-0360 

NE Test Midwest.......................................................816-866-0360 

NH dB Instruments Co..............................................508-238-1303 

NJ South Plainfield, Contech Marketing...............908-755-5700 

NM AZTEC Enterprises, Inc..................................... 800-304-3565 

NV AZTEC Enterprises, Inc..................................... 800-304-3565 

NY Metro, Long Island, Contech Marketing.........908-755-5700 

NY Upstate, DFS Associates....................................315-487-2116 

OH Dublin, Micro Sales............................................614-563-9800 

PA Eastern PA, Contech Marketing....................... 800-219-9417 

Western PA, Micro Sales.................................. 330-722-7980 

RI dB Instruments Co..............................................508-238-1303 

SD Test Midwest.......................................................612-460-0360 

TX El Paso, Aztec Enterprises, Inc........................ 800-304-3565 

Arlington, CF Scientific Systems...................... 817-467-0970 

UT Park City, AZTEC Enterprises, Inc................... 800-304-3565 

VA Technology Partners...........................................301-854-0049 

VT dB Instruments Co..............................................508-238-1303 

WI Test Midwest.......................................................262-521-3056 

WV Micro Sales.......................................................... 330-722-7980 

WY AZTEC Enterprises, Inc..................................... 800-304-3565 

INTERNATIONAL 

AUS Mt. Riverview, Test & Measurement Australia Pty Ltd......... 

............................................................................. +61247399523 

AUT EMCO Elektronik...............................................+49898955650 

BEL Air-parts B.V........................................................+31172422455 

BRA LUNUS...............................................................+551239418001 

CAN Vancouver, Jerome and Frances Co. Ltd..........604 986-1286 

Ontario, ConformityPlus, Inc.............................613-226-2365 

CHE Planegg, EMCO Elektronik..............................+49898955650 

CHE Planegg, Pischzan Technologies..............+49(0)6109771948 

CHN Shenzhen, Everjet Science & Technology Co 

........................................................................+8675526864487 

DEU Planegg-Martinsried, EMCO Elektronik........+49898955650 

DEU Maintal, Pischzan Technologies.........+49 (0) 61 09 77 19 48 

DNK Hovik, Saven Hitech............................................+4767120512 

ESP Madrid, Adler Instrumentos.........................+34-91-3584046 

FIN Alphen aan den Rijn, Air-Parts B.V..................+31172422455 

FRA EMC Partner France.................................+33(0)5 55 74 31 68 

GBR Hertfordshire, Dowding & Mills..................+44-462-421234 

GRC Athens, M.J.PRINIOTAKIS SA..........+302107227719 or +30 

IND Mesa MW Corporation....................................+480 890-1612 

IND Secunderabad (Hyderabad), Kaytronics.....+914027847924 

ISR Petah Tikva, RCM Ltd....................................+972-3-9229006 

ITA Rome, LP Instruments................................... +390640800491 

ITA Trezzano, LP Instruments...............................39-02-48401713 

JPN Tokyo, Techno Science Japan Corp. (TSJ).....+81357993160 

KOR Kyonggi, InfoTech Co.....................................+ 82 32 612 8252 

MYS Singapore Technologies Electronics Ltd..........+6564131727 

NLD DA Lelystad, EEMC Coimex.........................+31 0320295395 

NOR Hovik, Saven Hitech............................................+4767120512 

POL Unitronex Corporation...................................+4822 631 2643 

RUS Moscow, Radiocomp....................................+7(095)361-0904 

SGP Singapore Technologies Electronics Ltd (STEE)....................... 

............................................................................... +65 64133119 

SWE Stockholm, Ingenjörsfirman Gunnar Petterson AB 

.............................................................................. +46-8-930280 

THA Singapore Technologies Electronics LTF..........+6564131727 

TWN Honova Resources Ltd.................................+ 88 6282286089 

Insul-Fab, Div of Concote Corp. ............................ 

600 Freeport Parkway, Suite 150, Coppell, TX 75019 

USA; 214-956-0055; Fax: 214-956-0848; 

andyw@insulfab.net; www.insulfab.net 

Integrated Engineering Software........................ 

220-1821 Wellington Ave., Winnipeg, Manitoba, R3H 

0G4 Canada; 204-632-5636; Fax: 204-633-7780; 

info@integratedsoft.com; www.integratedsoft.com 

Integrated Microwave Corp. ................................. 

11353 Sorrento Valley Road, San Diego, CA 92121 USA; 

858-259-2600; Fax: 858-755-8679; dclark@imcsd.com; 

www.imcsd.com 

Intermark (USA) Inc. ...........................................86 

1310 Tully Road #117, San Jose, CA 95122 USA; 408-971- 

2055; Fax: 408-971-6033; sales@intermark-usa.com; 

www.intermark-usa.com; Masa Hatakeyama, VP 

CA San Diego, Rina Tsujimoto................................. 858-202-1585 

INTERNATIONAL 

DEU Frankfurt, Ichikawa........................................49-6106 8524 20 

HKG Tsen Wann, Sano............................................... 852-2612-1161 

JPN Nagoya, Yoshida.............................................. 81-52-261-2740 

SGP Singapore, Mori.......................................................65-56-6511 

TWN Taipei, Iguchi...................................................886-2-26988833 

International Certification Services, Inc. ......... 

1100 Falcon Ave., Glencoe, MN 55336 USA; 320-864- 

4444; 1-888-286-6888; Fax: 320-864-6611; 

duane@icsi-us.com; www.icsi-us.com 

International Compliance Laboratories............. 

1057 Tullar Court, Neenah, WI 54956 USA; 920-720- 

5555; Fax: 920-720-5556; rzimmerman@icl-us.com; 

www.icl-us.com 

Intertek Testing Services........................................ 

70 Codman Hill Road, Boxborough, MA 01719 USA; 978 

263 2662; 1-800-WORLDLAB; Fax: 978 264 9403; 

hope.mascott@intertek.com; www.intertek.com 

INTERTest Systems, Inc.......................................... 

303 Route 94, Colorado Springs, CO; 719-522-9667; Fax: 

908-496-8004; info@intertestinc.com; 

www.intertest.com 

Ion Physics Corp. ....................................................... 

373 Main St., P.O. Box 165, Fremont, NH 03044 USA; 

603-895-5100; 800-223-0466; Fax: 603-895-5101; 

sales@ionphysics.com; www.ionphysics.com; Leslie 

Faunce, Marketing Manager; Helmut Milde, President 

IQS, a Div. of The Compliance Management 

Group.............................................................................. 

257 Simarano Drive, Marlboro, MA 01752 USA; 508- 

460-1400; Fax: 508-460-7979; rdunne@cmgcorp.net; 

www.iqscorp.com 

ITC Engineering Services, Inc. ............................. 

9959 Calaveras Road, Sunol. CA 94586 USA; 925-862- 

2944; Fax: 925-862-9013; sales@itcemc.com; 

www.itcemc.com 

ITEM Publications .......... 126, 127, 143, 150, 175 

1000 Germantown Pike, Suite F-2, Plymouth Meeting, PA 

19462 USA; 484-688-0300; Fax: 484-688-0303; info@ 

interferencetechnology.com; 

www.interferencetechnology.com; Bob Poust, Business 

Development Manager 

INTERNATIONAL 

CHN Beijing, Leadzil................................................ 86-10-65250537 

JPN Tokyo, TUV SUD Ohtama, ltd........................81-44-980-2092 

ITL Israel....................................................................... 

Bat-Sheva St. 1, POB 87, Lod, Israel; 972 8 9153100; Fax: 

972-8-9153101; standard@itl.co.il; www.itl.co.il 

ITT Interconnect Solutions .................................... 

666 East Dyer Road, Santa Ana, CA 92705 USA; 714- 

628-8277; Fax: 714-628-8470; 

christine.stieglitz@btbmarketing.com; 

www.ittcannon.com 

ITW/Pressure Sensitive Adhesinves & 

Components................................................................. 

90 James Way, Southapmton, PA 18966; 215-322-1600; 

Fax: 215-322-1620; info@mcspecialties.com; 

www.mcspecialties.com 

J 

Ja-Bar Silicone Corp. .............................................. 

252 Brighton Ave., P.O. Box 1249, Andover, NJ 07821 

USA; 973-786-5000; Fax: 973-786-5546; Maria Cruz, 

Customer Service Manager, mcruz@ja-bar.com; 

www.ja-bar.com 

Jacobs Technology Inc. .......................................... 

3300 General Motors Road, Milford, MI 48380 USA; 

248-676-1123; www.jacobstechnology.com 

Jastech EMC Consulting, LLC................................ 

P.O. Box 3332, Farmington Hills, MI; 248-876-4810; 

info@jastech-emc.com; www.Jastech-EMC.com 

JEMIC Shielding Technologies............................. 

1160 S. Cameron St., Harrisburg, PA 17104 USA; 717-232- 

1030; dietrich@jemic.com; www.jemic.com 

JiangSu WEMC Technology Co., Ltd. ................. 

No. 8, JianYe Road, TianMu Industrial Park, LiYang, 

JiangSu 213300, China; +86 519 8746 7888; Fax: +86 519 

8746 5666; weiyl@wemctech.com; 

www.wemctech.com 

JINAN Filtemc Electronic Equipment Co.,Ltd. 

# 9 Lanxiang Road, Jinan ID 250032, China; +86 531 

85738859; Fax: + 86 531 85717366; lwl@filtemc.com; 

www.filtemc.com 

Johanson Dielectrics, Inc. ..................................... 

15191 Bledsoe St., Sylmay, CA 91342 USA; 818-364- 

9800; scole@johansondielectrics.com; 

www.johansondielectrics.com 

JRE Test, LLC. ............................................................. 

1350 Pittsford-Mendon Road, Mendon, NY 14506 USA; 

585-298-9736; 888-430-3332; Fax: 585-919-6586; 

brian@jretest.com; www.jretest.com 

JS TOYO Corporation (Shenzhen) Ltd................. 

2-25G, China Phoenix Building Futian CBD, Shenzhen,, 

518026 China; www.jstoyo.cn 



K 

Kemtron Limited......................................................... 

19-21 Finch Drive, Braintree, Essex CM7 2SF, United 

Kingdom; +44 1376 348115; Fax: +44 1376 345885; 

David Wall, Managing Director, dbw@kemtron.co.uk; 

www.kemtron.co.uk 

Keystone Compliance .............................................. 

2861 W. State St., New Castle, PA 16101 USA; 724-657- 

9940; Fax: 724-657-9920; tony@keystonecompliance. 

com; www.keystonecompliance.com 

K-Form, Inc. ................................................................. 

9A Acacia Lane, Sterling, VA 20166 USA; 703-450-4401; 

Fax: 703-894-4914; kform@kform.com; 

http://manufacturing.kform.com 

Kikusui America Inc. ................................................ 

1633 Bayshore Hwy., Suite 331, Burlingame, CA 94010 

USA; 650-259-5900; Fax: 650-259-5904; 

itoko@kikusuiamerica.us; www.kikusuiamerica.us 

Kimmel Gerke Associates, Ltd.......................126 

2538 West Monterey Ave., Mesa, AZ 85202 USA; 

888-EMI-GURU; Daryl Gerke, dgerke@emiguru.com; 

www.emiguru.com 

MN 

St. Paul.......................................................................888-EMI-GURU 

Bill Kimmel, bkimmel@emiguru.com 

Kycon.............................................................................. 

11810 Little Orchard St., San Jose, CA 95125 USA; 408- 

494-0330; jill_scarnecchia@kycon.com; 

www.kycon.com 

L 

L. Gordon Packaging................................................. 

22 W. Padonia Road, Suite 304A, Timonium, MD 21093 

USA; 410-308-2202; Fax: 410-308-2207; 

lgordonpkg@verizon.net; www.lgordonpackaging.com 

L.S. Research............................................................... 

W66 N220 Commerce Court, Cedarburg, WI 53012 USA; 

262-375-4400; Fax: 262-375-4248; www.lsr.com 

L-3 Communications Cincinnati Electronics.... 

.....................................................................................49 

7500 Innovation Way, Mason, OH 45040-9699 USA; 

513-573-6809; Fax: 513-573-6499; Steven Davis, Business 

Development Manager, 

Steven.Davis@L-3Com.com; www.L-3Com.com/ce 

Laboratory Testing Inc. ........................................... 

2331 Topaz Drive, Hatfield, PA 19440 USA; 800-219- 

9095; Fax: 800-219-9096; sales@labtesting.com; 

www.labtesting.com 

Laird Technologies ................................................... 

World Headquarters: 3481 Rider Trail, South St. Louis, 

MO 63045 USA; 1-800-843-4556; Fax 314-344-9333; 

matt.judkins@lairdtech.com;www.lairdtech.com 

Lamart Corp. ................................................................ 

16 Richmond St., Clifton, NJ 07011 USA; 973-772-6262; 

Steve Reidenbach, Product Manager - Industrial Tapes, 

sreidenbach@lamartcorp.com; www.lamartcorp.com 

Langer EMV-Technik GmbH..............................52 

Noethnitzer Hang 31, Bannewitz, 01728, DE, 0351- 

430093-23; michak@langer-emv.de; 

www.langer-emv.de 

Laplace Instruments Ltd. ........................................ 

3B, Middlebrook Way, Holt Road, Cromer, Norfolk, NR27 

9JR, UK; +44 (0) 12 63 51 51 60; Fax: +44 (0) 12 63 51 25 

32; tech@laplace.co.uk; www.laplaceinstruments.com 

Lapp USA...................................................................... 

29 Hanover Road, Florham Park, NJ 07932 USA; 973- 

660-9700; 800-774-3539; Fax: 973-660-9330; 

mbroe@lappusa.com; www.lappusa.com 

LCR Electronics, Inc. .........................................121 

9 S. Forest Ave., Norristown, PA 19401 USA; 610-278- 

0840; Fax: 610-278-0935; Eric A. Kessler, Director of 

Commercial Sales, ekessler@lcr-inc.com; 

www.lcr-inc.com 

Leader Tech, Inc. .................................................. 71 

12420 Race Track Road, Tampa, FL 33626 USA; 813-855- 

6921; 866-832-4364; Fax: 813-855-3291; Tim Black, 

Director - Sales & Marketing, 

tblack@leadertechinc.com; www.leadertechinc.com 

LEDE-SIECIT................................................................. 

48 & 116 St., La Plata, Buenos Aires 1900, Argentina; 

+54 11 221 4250877; lede@ing.unlp.edu.ar 

Less EMF Inc................................................................ 

809 Madison Ave., Albany, NY 12208; 518-432-1550; 

Fax: 309-422 - 4355; lessemf@lessemf.com; 

www.lessemf.com 

L F Research EMC...................................................... 

12790 Route 76, Poplar Grove, IL 61065; 

info@lfresearch.com; www.lfresearch.com; 815-566- 

5655; FAX: 815-547-3467 

LGS Technologies ..................................................... 

2950 W. Wintergreen, P.O Box 763039, Lancaster, TX 

75134 USA; 972-224-9201; 1-800-441-5470; Fax: 972- 

228-0652; crobles@lgsco.com; 

www.lgstechnologies.com 

Liberty Labs, Inc. .................................................. 13 

1346 Yellowwood Road, P.O. Box 230, Kimballton, IA 

51543 USA; 712-773-2199; Fax: 712-773-2299; Tamie 

Fahn, Administrative Assistant, tfahn@libertylabs.com; 

www.libertylabs.com 

international 

JPN Yokohoma, Mitsunobu Samoto............................ 81-45-500-1280 

Lightning Eliminators & Consultants, Inc.......... 

6687 Arapahoe Road, Boulder, CO 80303; 303-447-2828; 

Fax: 303-447-8122; www.lecglobal.com 

Lightning Technologies, Inc. ............................ 61 

10 Downing Industrial Parkway, Pittsfield, MA 01201- 

3890 USA; 413-499-2135; Fax: 413-499-2503; Mary 

Cancilla, cancilla@lightningtech.com; 

www.lightningtech.com 

Little Mountain Test Facility.................................. 

12000 W.12th St., Ogden, UT 84404 USA; 801-315-2320 

Littlefuse Inc................................................................ 

8755 W. Higgins Road, Suite 500, Chicago, IL; 773-628- 

1000; Fax: 847 759 0272; www.littlefuse.com 

LTI Metrology.............................................................. 

2331 Topaz Drive, Hatfield, PA 19440; 800-784-2882; 

Fax: 800.219.9096; sales@labtesting.com; 

www.labtesting.com 

Lubrizol Conductive Polymers 

9911 Brecksville Road, Brecksville, OH 44141 USA; 

888-234-2436; Fax: 216-447-6232; kew@lubrizol.com; 

www.statrite.com 

Lutze Inc. ...................................................................... 

13330 South Ridge Drive, Charlotte, NC 28273 USA; 

704-504-0222; 1-800-447-2371; Fax: 704-504-0223; 

sgregson@lutze.com; www.lutze.com 

M 

Macton Corporation ............................................50 

116 Willenbrock Road, Oxford, CT 06478 USA; 203-267- 

1500x14; Fax: 203-267-1555; Jack Shepherd, Product 

Manager, 203-267-1500 x31, jshepherd@macton.com; 

www.macton.com 

Magnetic Radiation Laboratories........................ 

690 Hilltop Drive, Itasca, IL 60143 USA; 630-285-0800; 

888-251-5942; Fax: 630-285-0807; 

admin@magrad.com; www.magrad.com 

Magnetic Shield Corp. ............................................. 

740 N. Thomas Drive, Bensenville, IL 60106-1643 USA; 

630-766-7800; Fax: 630-766-2813; shields@magneticshield.com; 

www.magnetic-shield.com 

MAJR Products Corp. ............................................. 

17540 State Highway 198, Saegertown, PA 16433 

USA; 814-763-3211; 877-625-7776; Fax: 814-763-2952; 

terry@majr.com; www.majr.com 

Marktek Inc. ............................................................... 

13621 Riverway Drive, Suite H, Chesterfield, MO 63017 

USA; 314-878-9190; 866-364-6285; Fax: 314-878-9558; 

Pres. arhenn@marktek-inc.com; www.marktek-inc.com 

Master Bond Inc. ....................................................... 

154 Hobart St., Hackensack, NJ 07601 USA; 201-343- 

8983; Fax: 201-343-2132; rruchama@masterbond.com; 

www.masterbond.com 

maturo GmbH............................................................... 

Bahnhofstr. 26,92536 Pfreimd, Germany; +49 9606 

9239130; Fax: +49 (0) 9606 923913-29; 

info@maturo-gmbh.de; www.maturo-gmbh.de 

MCL, Inc., A MITEQ Company................................ 

501 S. Woodcreek Drive, Bolingbrook, IL 60440 USA; 

630-759-9500; Fax: 630-759-5018; sales@mcl.com; 

www.mcl.com 

Mech-Tronics.............................................................. 

1635 N. 25th Ave., Melrose Park, IL 60160 USA; 708- 

344-9823 ext.638; 1-800-989-9823; Fax: 708-344-0067; 

bob.feiler@mech-tronics.com; www.mech-tronics.com 

MegaPhase LLC.......................................................... 

2080 Hamilton Road East, Stroudsburg, PA 18360; 570- 

424-8400; Fax: 570-424-6031; www.megaphase.com 

Mekoprint A/S Chemigraphics............................. 

Mercurvej 1, DK-9530 Støvring, Denmark; +45 9936 

5618; Fax: + 45 9936 5603; sk@mekoprint.dk; 

www.mekoprint.dk 

Mercury United Electronics Inc............................ 

9299 9th St., Rancho Cucamonga, CA 91730; 909-466- 

0427; Fax: 909-466-0762; 

sales-us@mercury-crystal.com; 

www.MercuryUnited.com 

Mesago Messe Frankfurt GmbH........................... 

Rotebuehlstrasse 83-85, Stuttgart, D-70178, Germany; 

www.mesago-online.de/en; 49 711 61946 26 

MET Laboratories, Inc. .......................................25 

914 W. Patapsco Ave., Baltimore, MD 21230 USA; 

410-354-3300;800-638-6057;Fax: 410-354-3313; 

info@metlabs.com; www.metlabs.com 



Metal Textiles Corp. ................................................. 

970 New Durham Road, Edison, NJ 08818 USA; 732-287- 

0800; Fax: 732-287-8546; John Soltis, 

jsoltis@metexcorp.com; www.metexcorp.com 

Metatech Corporation.............................................. 

358 South Fairview Avenue Suite E, Goleta, CA; 805- 

683-5681; Fax: 805-683-3023; info@metatechcorp.com; 

www.metatechcorp.com 

MH&W International Corp. ................................... 

14 Leighton Place, Mahwah, NJ 07430 USA; 201-891- 

8800; 866-MHW-CORE; Fax: 201-891-0625; 

garyv@mhw-intl.com; www.mhw-intl.com 

Micrometals, Inc........................................................ 

5615 E. La Palma Ave., Anaheim, CA 92807; 714-970- 

9400; Fax: 714-970-0400; sales@micrometals.com; 

www.micrometals.com 

Michigan Scientific Corp. ...................................... 

321 East Huron St., Milford, MI 48381 USA; 248-685- 

3939 ext. 111; Fax: 248-684-5406; 

pjmorand@michscimfd.com; www.michsci.com 

Micronor, Inc............................................................... 

750 Mitchell Road, Newbury Park, CA 91320; 805-499- 

0114; Fax: 805-499-6585; sales@micronor.com; 

www.micronor.com 

MILMEGA Ltd. ............................................................ 

Ryde Business Park, Park Road, Ryde Isle of Wight PO33 

2BE, United Kingdom; +44 (0)1983 618004; Fax: +44 

(0)1983 811521; joeley@milmega.co.uk; 

www.milmega.com 

MIRA Ltd. ..................................................................... 

Watling St., Nuneaton, Warwickshire CV10 0TU, United 

Kingdom; +44 (0) 2476 355 5000; Fax: +44 (0)2476 355 

8000; matthew.farmer@mira.co.uk; www.mira.co.uk 

Mitsubishi Digital Electronics America Inc. ... 

9351 Jeronimo Road, Irvine, CA 92618-1904 USA; 949- 

465-6206 

MKS Instruments....................................................... 

2 Tech Drive, Suite 201, Andover, MA 01810 USA; 978- 

645-5500; mks@mksinst.com; www.mksinst.com 

Modpak, Inc. ............................................................... 

97 Mudgett Road, Kenduskeag, ME 04450 USA; 207- 

884-8285; Fax: 207-884-8712; 

modpak@roadrunner.com; www.modpak.com 

Montena EMC ............................................................. 

Route de Montena 75, Rossens 1728, Switzerland; +41 

26 411 93 33; Fax: +41 26 411 93 30; 

francois.volery@montena.com; www.montena.com 

Montrose Compliance Service, Inc. ............126 

2353 Mission Glen Drive, Santa Clara, CA 95051-1214 

USA; 408-247-5715; mark@montrosecompliance.com; 

www.montrosecompliance.com 

MOOSER Consulting GmbH.................................... 

Amtmannstrabe 5, Egling/Thanning, 82544 Germany; 

49-8176 92250; 

http://mooser-consulting.de/en_index.php?lang=english 

Moss Bay EDA............................................................. 

23889 NE 112th Circle #2, Redmond ,WA 98053 USA; 

206-779-5345; Fax: 484-730-5345; 

gene@mossbayeda.com; www.mossbayeda.com 

MPE Ltd......................................................................... 

Hammond Road, Knowsley Industrial Park, Liverpool 

Merseyside L33 7UL, United Kingdom; +44(0)151 632 

9100; Fax: +44(0)151 632 9112; sales@mpe.co.uk; 

www.mpe.co.uk 

MTI - Microsorb Technologies, Inc..................... 

32 Mechanic Ave., Unit 211, Woonsocket, RI 02895-0089 

USA; 401-767-2269; 401-767-2255; 

engineer@microsorbtech.com; www.microsorbtech.com 

Mueller Corp. .............................................................. 

530 Spring St., East Bridgewater, MA 02333 USA; 508- 

583-2800; Fax: 508-378-4744; glenn@muellercorp.com; 

www.muellercorp.com 

Murata Electronics North America .................... 

2200 Lake Park Drive, Smyrna, GA 30080-7604 USA; 

770-436-1300; 800-241-6574; Fax: 770-805-3192; 

nrosenfeld@murata.com; www.murata.com 

MµShield Company, Inc. ....................................85 

9 Ricker Ave., Londonderry, NH 03053 USA; P.O. Box 

5045, Manchester, NH 03108-5045; 603-666-4433 ext. 

21; 888-669-3539; Fax: 603-666-4013; (800)666-4013; 

lukeg@mushield.com; www.mushield.com 

N 

Narda Safety Test Solutions, s.r.l......................... 

Via Leonardo da Vinci, 21/23 – 20090, Segrate, Italy; 

39-022699871; Fax: +39 02 26998700; 

support@narda-sts.it; www.narda-sts.it 

National Magnetics Group, Inc............................. 

1210 Win Drive, Bethlehem, PA; 610-761-7600; Fax: 610- 

867-0200; sales@magneticsgroup.com; 

www.magneticsgroup.com 

National Technical Systems ...............................1 

Headquarters: 24007 Ventura Blvd., Suite 200, Calabasas, 

CA 91302 USA; 800-270-2516; Fax: 818-591-0899; 

info@ntscorp.com; www.ntscorp.com; Nia Carignan, 

Marketing Supervisor 

AR Camden, NTS Camden.......................................870-574-0031 

AZ 

CA 

Tempe, NTS Tempe............................................480-966-5517 

Culver City, NTS Culver City...............................310-641-7700 

Fremont, Elliott Labs...........................................408-245-7800 

Fullerton, NTS Fullerton......................................714-879-6110 

Santa Clarita, NTS Santa Clarita.................... 661-259-8184 

Santa Rosa, NTS Santa Rosa/Phase Seven..707-284-5875 

Sunnyvale, Elliott Labs.......................................408-245-7800 

KS Wichita, NTS-USTL.............................................316-832-1600 

MA Acton, NTS Acton...............................................978-263-2933 

MA Boxborough, NTS Boxborough......................... 978-266-1001 

MI Detroit, NTS Detroit...........................................313-835-0044 

NJ Tinton Falls, NTS New Jersey..........................732-936-0800 

TX Plano, NTS Plano................................................972-509-2566 

VA Rustburg, NTS Rustburg/DTI............................414-846-0244 

INTERNATIONAL 

CAN NTS Calgary........................................................ 403-568-6605 

NAVAIR Advanced Warfare Technologies.. 47 

NAWCAD E3 DIVISION - Code 4.4.5, 48202 Standley 

Road, Hangar 144, Suite 3B Unit 5,Patuxent River, MD 

20670-1910; 301-342-1663; Fax 301-342-6982; Mark. 

Mallory@navy.mil; Kurt.Sebacher@navy.mil; 

www.nawcad.navy.mil 

NAWC AIRCRAFT DIVISION - E3 Branch 

Code 5.4.4.5 ................................................................. 

48202 Standley Road, Hangar 144, Suite 3B, Unit 5, 

Patuxent River, MD 20670-1910 USA; 301-342-1663; Fax: 

301-342-6982; raymond.hammett@navy.mil; 

www.navair.navy.mil/nawcad/ 

NCEE Labs..................................................................... 

4740 Discovery Drive, Lincoln, NE 68521-5376 USA; 

402-472-5880; 888-567-6860; Fax: 402-472-5881; 

dkramer@nceelabs.com; www.nceelabs.com 

NEDC Fabricating Solutions................................... 

42 Newark St., Haverhill, MA 01832; (978)374-0789; 

www.nedc.com 

Nemko USA.................................................................. 

802 North Kealy Ave., Lewisville, TX 75057 USA; 972- 

436-9600; bruce.ketterling@nemko.com; 

www.nemko.com 

NewPath Research L.L.C........................................ 

2880 S. Main St., Salt Lake City, UT 84115 USA; 801-573- 

9853; mahagmann@newpathresearch.com; 

www.newpathresearch.com 

NEXIO............................................................................. 

46 Avenue du General de Croutte, Toulouse 31100, 

France; +33 (0)5 61 44 02 47; Fax: +33 (0)5 61 44 05 67; 

sales@nexio.fr; www.nexio.frr 

Nextek........................................................................... 

439 Littleton Road, Westford, MA 01886 USA; 978-486- 

0582; Fax: 978-486-0583; 

araymond@nexteklightning.com; 

www.nexteklightning.com 

Noise Laboratory Co., Ltd. ................................. 12 

1-4-4, Chiyoda, Chuo-ku, Sagamihara City, Kanagawa 

Pref 252-0237, Japan; +81-42-712-2051; Fax: +81-42-712- 

2050; Yuji Kimizuka, Senior Manager, 

sales@noiseken.com; www.noiseken.com 

NY 

New York, Shinyei Corp. of America...............917-484-7893 

INTERNATIONAL 

AUS DHS Elmea Tools GmbH.................................41-1-813-5380-0 

BRA Sao Paulo, T&M Instruments.......................55-11-5092-5229 

CHN Shenzhen, Shenzhen HaoGu Technology Co., Ltd....86 0755 

8398 8565 

Shenzhen, Rico Tools Trading Limited.....86-755- 83600838 

Shenzhen,Nihon Denkei Co., Ltd. ............86-755-8209-6179 

Shanghai, Rico Kohki (Shanghai) Co., Ltd. .86-21-63537223 

Shanghai, Shanghai Sanki Electronics Industries Co., Ltd. ... 

.........................................................................86-21-6257-4333 

Shanghai,Nihon Denkei Co., Ltd. ............... 86-21-5820-9710 

Dalian ,Nihon Denkei Co., Ltd. .................86 -411-8762-2136 

Tianjin, Nihon Denkei Co., Ltd. ...................86-22-8386-5887 

Beijing, Nihon Denkei Co., Ltd. ....................86-10-5131-1181 

Dongguan, Nihon Denkei Co., Ltd. ..........86-769-2202-6986 

DEU Rodemark, DHS Elmea Tools GmbH.........49-6074-9199080 

IDN Jakarta, Nihon Denkei Co. Ltd. ................... 62-21 8087-1621 

IND Chennnai, MEL Systems and Services Ltd............................... 

......................................................................... 91-44-2496-1903 

Bangalore, Complus Systems Pvt. Ltd......91-80-4168-3883 

Bangalore, Nihon Denkei India Private Limited ...................... 

.........................................................................91-80-4093-5381 

ISR 

Ramat Gan, IES Electronics Agencies (1986) Ltd. 

.............................................................................972-3-7530751 

ITA Druento, TESEO SpA........................................39-11-994 1911 

KOR Seoul, Noise Technology Co. Ltd. ..................82-31-781-7816 

MYS Kuala Lumpur,Nihon Denkei (Malaysia) Sdn Bhd.................... 

...........................................................................60-3-2283-5702 

Selangor Daurl Ehsan, AMPTRONIC (M) SDN.BHD.............. 

........................................................................... 60-3-5632-8411 

PHL Makati City, Nihon Denkei Co., Ltd..................63-2-8452638 

SGP NihonDenkei Co. Ltd. .........................................65-6355-0851 

THA Bangkok, Nihon Denkei Co. Ltd. .................... 66-2-675-5688 

Bangkok, Industrial Electrical Co., Ltd. ..........66-2-642-6700 

TWN Taipei, Precision International Corp...........886-2-8512-4888 

VNM Hanoi, Nihon Denkei(Vietnam) Co., Ltd......... 84-4-951-6505 

Nolato Silikonteknik................................................. 

Bergmansv 4, Hallsberg 702 16, Sweden; +46 582 

88900; magnus.johansson@nolato.se; 

www.nolato.se/silikonteknik 



Northern Technologies Corp. ................................ 

95 Konrad Crescent, Markham, Ontario L3R 8T8, Canada; 

905-475-9320; 800-456-1875; Fax: 905-475-5719; 

chrismarshall@northerntech.com; 

www.northerntech.com 

Northwest EMC, Inc. ................................................ 

41 Tesla, Irvine, CA 92618 USA; 888-364-2378; 

www.nwemc.com 

NP Technologies, Inc. .............................................. 

2393 Teller Road #108, Newbury Park, CA 91320 USA; 

805 376-9299; Fax: 805 376-9288; sales@nptrf.com; 

www.nptrf.com 

Nu Laboratories, Inc................................................. 

312 Old Allerton Road, Annandale, NJ; 908-713-9300; 

Fax: 908-713-9001; webmaster@nulabs.com; 

www.nulabs.com 

O 

Oak-Mitsui Technologies........................................ 

80 1st St., Hoosick Falls, NY 12090 USA; 518-686-8088; 

Fax: 518-686-8080; john.andresakis@oakmitsui.com; 

www.oakmitsui.com 

Okaya Electric America, Inc. ................................ 

52 Marks Road, Suite 1, Valparaiso, IN 46383 USA; 

800-852-0122; Fax: 219-477-4856; ross@okaya.com; 

www.okaya.com 

OPHIR RF....................................................................... 

5300 Beethoven St., Los Angeles, CA 90066 USA; 

310-306-5556; Fax: 310-577-9887; pvirga@ophirrf.com; 

www.ophirrf.com 

Orbel Corp. ................................................................... 

2 Danforth Drive, Easton, PA 18045 USA; 610-829-5000; 

Fax: 610-829-5050; lgiralico@orbel.com; 

www.orbel.com 

ORBIT Advanced Electromagnetics, Inc. 

(AEMI)............................................................................ 

P. O. Box 711719, Santee, CA 92072-1719 USA; 619-449- 

9492; Fax: 619-449-1553; Isaac@mc-tech.com; 

www.aemi-inc.com 

Orion Industries Inc................................................... 

One Orion Park Drive, Ayer, MA; 978-772-6000; Fax: 

978-772-0021; www.orionindustries.com 

Oxley Developments Company Ltd. .................... 

Priory Park, Cumbria, Ulverston LA12 9QG, United 

Kingdom; +44 0 1229 840519; Fax: +44 0 1229 870451; 

m.blows@oxley.co.uk; www.oxleygroup.com 

P 

P & P Technology Ltd................................................ 

Finch Drive, Springwood, Braintree, Essex, CM7 2SF 

United Kingdom; +44 (0) 1376 550525; Fax: +44 (0) 1376 

552389; info@p-p-t.co.uk; www.p-p-t.co.uk 

Pacific Aerospace & Electronics, Inc. ............... 

434 Olds Station Road, Wenatchee, WA 98801 USA; 

509-665-8000; Fax: 509-663-5039; 

rkalkowski@pacaero.com; www.pacaero.com 

Paladin EMC................................................................ 

65 Buckwheat Ave., Portsmouth, RI 02871 USA; 401- 

924-3700; spence@paladinemc.com; 

www.paladinemc.com 

Panashield, Inc. ....................................................67 

185R West Norwalk Road, Norwalk, CT 06850-4312 

USA; 203-866-5888; Fax: 203-866-6162; Peggy Girard, 

VP/GM, girard@panashield.com; www.panashield.com 

Panasonic Electronic Components..................... 

Three Panasonic Way, 7H-2 Secaucus, NJ 07094 USA; 

1-800-344-2112; Fax: 201-348-7393; 

piccomponentsmarketing@us.panasonic.com; 

www.panasonic.com/industrial/electronic-components/ 

Parker EMC Engineering......................................... 

15246 Daphne Ave., Gardena, CA 90249-4122 USA; 310- 

323-4188; Fax: 310-323-4188; 

parkeremc@worldnet.att.net; 

http://parkeremc.mustbehere.com 

Partnership for Defense Innovation...............43 

455 Ramsey St., Fayetteville, NC 28301 USA; 910-307- 

3060; Fax: 910-307-3007; info@ncpdi.org; 

www.ncpdilab.org 

Pasternack Enterprises .......................................... 

P.O. Box 16759, Irvine, CA 92623 USA; 1-866-727-8376; 

Fax: 949-261-7451; shaun@pasternack.com; 

www.pasternack.com 

Peak Electromagnetics Ltd. .................................. 

139 Bank St., Macclesfield,Cheshire SK11 7 AY, United 

Kingdom; +44 01625 2698080; 

ian.pocock@peak-em.co.uk; www.peak-em.co.uk 

Pearson Electronics, Inc. ..................................55 

4009 Transport St., Palo Alto, CA 94303 USA; 650-494- 

6444; Fax: 650-494-6716; Sherri Morfin, 

Sherri@pearsonelectronics.com; 

www.pearsonelectronics.com 

international 

CHE Lengwil-Oberhofer, Telemeter Elect.............. 41-71-6992020 

CHN Corad Technology Ltd., T&M..........................852-2793-0330 

DEU Munchen, Nucletron Vertriebs GmbH........ 49-89-14900220 

FRA Evry Cedex, BFi OPTILAS SA......................33-1-60-79-59-01 

GBR Newbury, Alrad Instruments........................44-1-635-30345 

ISR Kfar Saba, Phoenix Technologies, Ltd...........972-9-7644800 

ITA Milan, Hi-Tec S.R.L...........................................39-2-39266561 

JPN Tokyo, Seki Technotron Corp.............................03-3820-1716 

KOR Seoul, Blue & Green Trading Co...................82-2-2026-4444 

NLD Eindhoven, Ohmtronic BV................................31-40-2573148 

NOR Oslo, Semitronics AS.......................................47-22-80-49-20 

SAU Broadway, Denver Tech. Prods......................27-11-626-2023 

SWE Orebro, Trinergi AB...........................................46-19-18-86-60 

PennEngineering........................................................ 

5190 Old Easton Road, Danboro, PA 18916 USA; 215-766- 

8853; Fax: 215-766-0143; gkelly@penn-eng.com; 

www.pemnet.com 

Percept Technology Labs, Inc. ............................. 

4888 Pearl East Circle, #110, Boulder, CO 80301 USA; 

303-444-7480; www.percept.com 

Philips Applied Technologies - EMC center .... 

5190 Old Easton Road, Danboro, PA 18916 USA; 215-766- 

8853; Fax: 215-766-0143; gkelly@penn-eng.com; 

www.pemnet.com 

Philips Innovation Services-EMC center 

High Tech Campus 26, PO box 80036, Eindhoven, Noord 

Brabant 5656AE The Netherland; +31-40-2746771; Fax: 

+31-40-2742233; emc.testlab@philips.com; 

www.emc.philips.com 

Phoenix Contact......................................................... 

586 Fulling Mill Road, Middletown, PA 17057 USA; 717- 

944-1300; Fax: 717-944-1625; info@phoenixcon.com; 

www.phoenixcontact.com/usa_home 

Photofabrication Engineering Inc. ...................... 

500 Fortune Drive, Milford, MA 01757 USA; 508-478- 

2025; Fax: 508-478-3582; 

clehrer@photofabrication.com; 

www.photofabrication.com 

Pioneer Automotive Technologies, Inc. - 

EMC Lab ....................................................................... 

100 S. Pioneer Blvd., Springboro, OH 45066 USA; 937- 

746-6600 ext. 363; Fax: 937-746-6828; 

mark.condon@pioneer-usa.com; www.pioneeremc.com 

Plastic-Metals Technology Inc............................. 

7051 SW Sandburg Road, Ste. 200, Tigard, OR; 503-684- 

0725; Fax: 503-684-0735; www.p-mtinc.com 

Positronic Industries................................................ 

423 N. Campbell Ave., P.O. Box 8247, Springfield, MO 

65806 USA; 417-866-2322; 800-641-4054; Fax: 417- 

866-4115; lscheffler@connnectpositronic.com; 

www.connectpositronic.com 

Potters Industries, Inc. ............................................ 

P.O. Box 840, Valley Forge, PA 19482 USA; 610-651-4704; 

Fax: 610-408-9724; mark.bricker@pottersbeads.com; 

www.pottersbeads.com 

Power & Controls engineering Ltd. ..................... 

4 Foothills Drive, Ottawa, Ontario K2H 6K3, Canada; 613- 

829-0820; Fax: 613-829-8127; mail@pcel.ca; 

www.pcel.ca 

Power Products International Ltd. ...................... 

Commerce Way, Edenbridge, Kent TN8 6ED, United Kingdom; 

+ 44 (0) 1732 866424; Fax: + 44 (0) 1732 866399; 

gkrobinson@ppi-uk.com; www.ppi-uk.com 

Power-Electronics Consulting.............................. 

4 Tyler Road, Lexington, MA 02420-2404 USA; 781-862- 

8998; nathansokal@gmail.com 

Power Standards Lab (PSL).................................... 

2020 Challenger Drive #100, Alameda, CA; 510-919- 

4369; Fax: -510-522-4455; Sales@PowerStandards. 

com; www.powerstandards.com 

PPM (Pulse Power & Measurement) Ltd. ........ 

65 Shrivenham, Hundred Business Park, Watchfield, 

Swindon SN6 8TY, United Kingdom; +44 1793 784389; 

Fax: +44 1793 784391; sales@ppm.co.uk; 

www.point2point.co.uk 

Praxsym, Inc. .............................................................. 

120 S. Third St., P.O. Box 369, Fisher, IL 61843 USA; 217- 

897-1744; Fax: 217-897-6388; jmeissen@praxsym.com; 

www.praxsym.com 

Precision Photo-Fab, Inc......................................... 

4020 Jeffrey Blvd., Buffalo, NY 14219; 716-821-9393; 

Fax: 716-821-9399; www.precisionphotofab.com 

Product Safety Engineering Inc. .......................... 

12955 Bellamy Brothers Blvd., Dade City, FL 33525 USA; 

352-588-2209; Fax: 352-588-2544; arobbins@pseinc. 

com; www.pseinc.com 

Professional Testing (EMI), Inc. .......................... 

1601 N. A.W. Grimes, Suite B, Round Rock, TX 78665 

USA; 512-244-3371; www.ptitest.com 

Progressive Fillers International.......................... 

2404 East 28th St., P.O. Box 72709, Chattanooga, TN 

37407 USA; 1-423-629-0007; 1-888-988-0007; Fax: 

1-423-629-0444; kevin@pfillers.com; 

www.progressivefillers.com 

Prostat Corp. ............................................................... 

1072 Tower Lane, Bensenville, IL 60106; 630-238-8883; 

Fax: 630-238-9717; www.prostatcorp.com 

Protek Test and Measurement.............................. 

45 Smith St., Englewood, NJ 07631 USA; 201-227-1161; 

Fax: 201-227-1169; sgkim@protektest.com; 

www.protektest.com 



Protocol Data Systems Inc. ................................... 

4741 Olund Road, P.O. Box 28945 Mctavish Road, Abbotsford, 

British Columbia V4X 2A1, Canada; 604-607- 

0012; Fax: 604-607-0019; parms@protocol-emc.com; 

www.protocol-emc.com 

PSC Electronics ......................................................... 

2307 Calle Del Mundo, Santa Clara, CA 94086 USA; 408- 

737-1333; 800-654-1518; Fax: 408-737-0502; 

eddie@pscelex.com; www.pscelex.com 

Pulver Laboratories Inc. ......................................... 

320 North Santa Cruz Ave., Los Gatos, CA 95030-7243 

USA; 408-399-7000; 800-635-3050; Fax: 408-399-7001; 

Lee.Pulver@PulverLabs.com; www.PulverLabs.com 

Q 

QEMC............................................................................. 

Rio de Janeiro, Brazil; (+55.21) 8111 6661; 

www.QEMC.com.br 

QinetiQ........................................................................... 

Cody Technology Park, Ively Road, Farnborough, Hants 

GU14 0LX, United Kingdom; +44 1252 393437; Fax: +44 

1252 397058; emcfocus@qinetiq.com; 

www.QinetiQ.com/emc 

Q-par Angus Ltd. ........................................................ 

Barons Cross Laboratories, Leominster, Herefordshire 

HR6 8RS, United Kingdom; +44 (0)1568 612138; Fax: +44 

( 0)1568 616373; julian.robbins@q-par.com; 

www.q-par.com 

Qualtek Electronics Corp. ...................................... 

7675 Jenther Drive, Mentor, OH 44060 USA; 440-951- 

3300; Fax: 440-951-7252; bgrubb@qualtekusa.com; 

www.qualtekusa.com 

Qualtest Inc. ................................................................ 

5325 Old Winter Garden Road, Orlando, FL 32811 USA; 

407-313-4230; Fax: 407-313-4234; 

chebda@qualtest.com; www.qualtest.com 

Quarterwave Corp. ................................................... 

1300 Valley House Drive, Suite 130, Rohnert Park, CA 

94928 USA; 707-793-9105; Fax: 707-793-9245; 

paul@quarterwave.com; www.quarterwave.com 

Quell Corp. ................................................................... 

5639 B Jefferson, NE Albuquerque, NM 87109 USA; 

505-243-1423; Fax: 505-243-9772; eeseal@aol.com; 

www.eeseal.com 

R 

Radiometrics Midwest Corp. ...........................26 

12 E. Devonwood, Romeoville, IL 60446 USA; 815-293- 

0772; Fax: 815-293-0820; Dennis Rollinger, CEO, 

info@radiomet.com; www.radiomet.com 

Radius Power, Inc. .............................................104 

1751 N. Batavia St., Orange, CA 92865 USA; 714-289- 

0055; Fax: 714-289-2149; George Wells, Sales Manager, 

georgew@radiuspower.com; www.radiuspower.com 

Rainford EMC Systems Ltd. ................................... 

North Florida Road, Haydock St., Helens, Merseyside 

GA WA11 9TN, United Kingdom; +44 1942 296 190; Fax: 

+ 44 1942 275 202; bill.mcfadden@rainfordemc.com; 

www.rainfordemc.com 

Ramsey Electronics ................................................. 

590 Fishers Station Drive, Victor, NY 14564 USA; 585- 

924-4560; Fax: 585-924-4555; 

brian@ramseyelectronics.com; www.ramseytest.com 

Remcom Inc. ............................................................... 

315 S. Allen St., Suite 222, State College, PA 1680 USA; 

814-861-1299; 888-773-6266; slucas@remcom.com; 

www.remcom.com 

Restor Metrology ...................................................... 

921 Venture Ave., Leesburg, FL 34748 USA; 877-220- 

5554; 888-886-0585; eric.egler@restormetrology.com; 

www.restormetrology.com 

Retlif Testing Laboratories................................ 14 

795 Marconi Ave., Ronkonkoma, NY 11779 USA; 631- 

737-1500; Fax: 631-737-1497; sales@retlif.com; 

www.retlif.com; Walter A. Poggi, Pres.; William K. 

Hayes, Exec. V.P.; Scott Wentworth, NH Branch Mgr.; 

Joseph Maiello, PA Branch Mgr. 

CT Danielson, Mantec, Inc./Peter Mann...............860-774-1551 

DC Washington, Retlif...............................................703-533-1614 

NC Charlotte, Retlif...................................................704-909-2840 

NH Goffstown, Retlif................................................603-497-4600 

PA Harleysville, Retlif................................................215-256-4133 

RF Exposure Lab, LLC................................................ 

2867 Progress Pl., Escondido, CA 92029-1531 USA; 760- 

737-3131; Fax: 760-737-9131; www.rfexposurelab.com 

RFI Global Services Ltd............................................ 

Pavilion A, Ashwood Park, Ashwood Way, Basingstoke, 

Hampshire, RG23 8BG United Kingdom; +44 (0)1256 

312000; Fax: +44 (0)1256 312001; www.rfi-global.com 

RF Immunity Ltd. ................................................. 118 

2.Prat St., Yavne 81227, Israel; 972-73-2331300; Fax: 

972-73-2331325; Haim Kalfon, Managing Director, 

haimk@rfimmunity.co.il; www.rfimmunity.com 

RFI Controls Company ............................................. 

340 Village Lane, Los Gatos, CA 95030 USA; 408-399- 

7007; Fax: 408-399-7011; 

jessica.hayes@rficontrols.com; www.rficontrols.com 

RFI Corp. ....................................................................... 

100 Pine Aire Drive, Bay Shore, NY 11706-1107 USA; 

631-234-6400; Fax: 631-234-6465; 

ilashinsky@rficorp.com; www.rficorp.com 

RFTEK............................................................................. 

5103 Duntrune Court, Raleigh, NC 27606 USA; 919-622- 

4088; dguzman@rftek.net; www.rftek.net 

Rhein Tech Laboratories, Inc. ............................... 

360 Herndon Parkway, Suite 1400, Herndon, VA 20170 

USA; 703-689-0368; Fax: 703-689-2056; 

sgrandy@rheintech.com; www.rheintech.com 

RIA CONNECT............................................................. 

200 Tornillo Way, Tinton Falls, NJ 07712 USA; 732-389- 

1300; 888-722-5625; Fax: 732-389-9066; 

donna@riaconnect.com; www.riaconnect.com 

Rittal Corp. ................................................................... 

1 Rittal Place, Urbana, OH 43078 USA; 937-399-0500; 

1-800-477-4000; Fax: 937-390-5599; 

mcorcoran@rittal-corp.com; www.rittal-corp.com 

RMV Technology Group, LLC 

NASA Research Park Bldg. 19, Suite 2030, MS 19-46C, 

Moffett Field, CA 94517 USA; 650-964-4792 650-964- 

1268; bob@esdrmv.com; www.esdrmv.com 

Rogers Labs, Inc. ....................................................... 

4405 West 259th Terrace, Louisburg, KS 66053 USA; 913 

837-3214; Fax: 913 837-3214; rogers@pixius.net; 

www.rogerslabs.com 

Rohde & Schwarz, Inc. ............................................ 

8661A Robert Fulton Drive, Columbia, MD 21046-2265 

USA; 888-837-8772; Fax: 410-910-7801; 

Achim.Gerstner@rsa.rohde-schwarz.com; 

www.rohde-schwarz.com/usa 

Roxburgh EMC............................................................ 

Deltron Emcon House, Hargreaves Way, Sawcliffe 

Industrial Park, Scunthorpe, North Lincolnshire, DN15 

8RF, United Kingdom; +44 1724 273205; Fax: +44 1724 

280353; dkilminster@dem-uk.com; 

www.dem-uk.com/roxburgh 

Roxtec............................................................................ 

10127 E. Admiral Place, Tulsa, OK 74116 USA; 918-254- 

9872; 800-520-4769; Fax: 918-254-2544; 

michael.budde@us.roxtec.com; www.roxtec.com 

RTP Company.............................................................. 

580 E. Front St., Winona, MN 55987 USA; 507-454- 

6900; Fax: 507-454-2041; Kirk Fratzke, Advtg and Promotions, 

rtp@rtpcompany.com; www.rtpcompany.com/ 

Rubbercraft.................................................................. 

15627 South Broadway, Gardena ,CA 90248 USA; 310- 

328-5402; Fax: 310-618-1832; 

mchian@rubbercraft.com; www.rubbercraft.com 

Rubicom Systems, A division of ACS.................. 

284 West Drive, Melbourne, FL 32904 USA; 321-951- 

1710; jgerke@rubicomtestlab.com; 

www.rubicomtestlab.com 

S 

Sabritec......................................................................... 

17550 Gillette Ave., Irvine, CA 92614 USA; 949-250- 

1244; Fax: 949-250-1009; sdurr@sabritec.com; 

www.sabritec.com 

SAE Power.................................................................... 

1500 E Hamilton Ave Ste 118, Campbell, CA 95008; 

www.saepower.com/emirfi-filter-products 

Saelig Company.......................................................... 

1160-D2 Pittsford-Victor Road, Pittsford, NY 14534 USA; 

888-772-3544; Fax: 585-385-1768; 

alan.lowne@saelig.com; www.saelig.com 

Safe Engineering Services & 

Technologies, Ltd. ..................................................... 

3055 Boul. des Oiseaux, Laval, Quebec H7L 6E8, Canada 

-6071; 1-800-668-3737; Fax: 1-800-668-6124; 

Carmela.Sabelli@sestech.com; www.sestech.com 

Safety Test Technology Co., Ltd............................ 

Pu Tian Science Park B415, 28 Xin Jie Kou Wai Da Jie, 

Xicheng District, Beijing, 100088 P.R. China; 86-10- 

51654077; FAX: 86-10-82051730; 

overseas@instrument.com.cn; www.instrument.com.cn 

Saint-Gobain High Performance Seals.............. 

7301 Orangewood Ave., Garden Grove, CA 92841-1411 

USA; 1-800-544-0080; 

donald.m.munro@saint-gobain.com; 

www.omnishield.saint-gobain.com 

SAS Industries, Inc. .................................................. 

939 Wading River Manor Road, Manorville, NY 11949 

USA; 631-727-1441 ext. 302; Fax: 631-727-1387; 

msteckis@sasindustries.com; www.sasindustries.com 

Schaffner EMC, Inc. ..........................................105 

52 Mayfield Ave., Edison, NJ 08837 USA; 800-367-5566; 

Fax: 732-225-4789; Ken Bellero, 

ken.bellero@schaffner.com; www.schaffnerusa.com 

AL Aurora-Tech Marketing......................................800-955-1970 

AZ Schaffner West/Carl Martens.........................928-443-7650 

CA O’Donnell Associates North/San Jose ......... 408-456-2950 

CA Conquest Technical Sales/LA/Orange Country ..................... 

................................................................................ 805-241-5118 

CA Admor Technical Sales/San Diego..................760-522-4140 

CO Meridian Marketing............................................303-790-7171 

CT Norris Associates Inc......................................... 781-749-5088 



FL Sunland Associates............................................407-365-9533 

GA Aurora-Tech Marketing......................................800-955-1970 

IA Connector Technology LLC (CTEC)...................636-561-3543 

ID Meridian Marketing............................................303-790-7171 

ID WESCO Sales Group, Inc...................................425-941-6681 

IL Connector Technology LLC (CTEC)/South IL..636-561-3543 

IL Brainard-Nielsen Marketing Inc./N. IL............847-734-8400 

IN Allied Enterprises, Inc....................................... 440-808-8760 

KS Connector Technology LLC (CTEC)...................636-561-3543 

KY Allied Enterprises, Inc....................................... 440-808-8760 

MA Norris Associates Inc......................................... 781-749-5088 

ME Norris Associates Inc......................................... 781-749-5088 

MI Allied Enterprises, Inc....................................... 440-808-8760 

MN Rockford Controls of Minnesota .....................763-557-2801 

MO Connector Technology LLC (CTEC)...................636-561-3543 

MS Aurora-Tech Marketing......................................800-955-1970 

NC Aurora-Tech Marketing......................................800-955-1970 

ND Rockford Controls of Minnesota .....................763-557-2801 

NE Connector Technology LLC (CTEC)...................636-561-3543 

NH Norris Associates Inc......................................... 781-749-5088 

NY Net Sales Inc.......................................................585-924-1844 

OH Allied Enterprises, Inc....................................... 440-808-8760 

OR WESCO Sales Group, Inc...................................425-941-6681 

PA Allied Enterprises, Inc/W.PA........................... 440-808-8760 

PA Colrud Lowery.....................................................610-566-6686 

RI Norris Associates Inc......................................... 781-749-5088 

SD Rockford Controls of Minnesota .....................763-557-2801 

TN Aurora-Tech Marketing......................................800-955-1970 

TX Kruvand................................................................972-437-3355 

VA. Allied Enterprises, Inc....................................... 440-808-8760 

VT Norris Associates Inc......................................... 781-749-5088 

WA WESCO Sales Group, Inc...................................425-941-6681 

WY Meridian Marketing............................................303-790-7171 

INTERNATIONAL 

BRA Sao Paolo , LC Overdata Representação e Comércio 

Exterior Ltda. ............................................................................... 

....................................................................... +55-11-2842-6842 

CAN West Coast/Carl Martens................................928-443-7650 

Brampton, E-Cubed Components, Inc/Michael Wheeler...... 

................................................................................905-791-0812 

MEX Kruvand de Mexico ................................ 01152-33-3671-4159 

Schlegel Electronic Materials ............................. 

......................................................Inside Back Cover 

806 Linden Ave., Rochester, NY 14602 USA; 905-893- 

3241; Fax: 905-893-5623; lee.masucci@schlegelemi. 

com; www.schlegelemi.com 

Schurter, Inc. .......................................................103 

447 Aviation Blvd., Santa Rosa, CA 95403 USA; 707- 

636-3000; Fax: 707-636-3033; Marjorie Tibbs, Marcom 

Coordinator, mtibbs@schurterinc.com; 

www.schurterinc.com 

SWI Lucerne............................................................+41 41 369 33 82 

Seal Science ..........................................................96 

Seal Science West: 17131 Daimler St., Irvine, CA 92614 

USA; 949-253-3130; Fax: 949-253-3141; westernsales@ 

sealscience.com; Seal Science East: 1160 Win Drive, 

Bethlehem, PA 18017-0759; 610-868-2800; Fax: 610- 

868-2144; easternsales@sealscience.com; 

www.sealscience.com 

Sealcon ......................................................................... 

14853 E. Hinsdale Ave., Suite D, Centennial, CO 80112- 

4240 USA; 303-699-1135; info@sealconusa.com; 

www.sealconusa.com 

Sealing Devices Inc. ................................................ 

4400 Walden Ave., Lancaster, NY 14228 USA; 716-684- 

7600; 800-727-3257; Fax: 716-684-0760; deberhardt@ 

sealingdevices.com; www.sealingdevices.com 

Seibersdorf Laboratories........................................ 

Seibersdorf Labor GmbH, Seibersdorf 2444, Austria; +43 

50550 2500; Fax: +43 50550 2502; 

www.seibersdorf-laboratories.at 

Select Fabricators Inc. .......................................99 

5310 North Str. Bldg. 5, P.O. Box 119, Canandaigua, 

NY 14424-0119 USA; 585-393-0650; 888-599-6113; 

Dan Ramich & Brian Smith; contactus@selectfabricators.com; 

www.select-fabricators.com 

Sensor Products Inc. ................................................ 

300 Madison Ave., Madison, NJ 07940 USA; 973-884- 

1755; 800-755-2201; Fax: 973-884-1699; 

dlandau@sensorprod.com; www.sensorprod.com 

Seven Mountains Scientific, Inc. (ENR)......125 

913 Tressler St., P.O. Box 650, Boalsburg, PA 16827 USA; 

814-466-6559; Fax: 814-466-2777; tom@7ms.com 

SDP Engineering Inc. ............................................... 

17 Spectrum Pointe, P.O. Box #508, Lake Forest, CA 

92630 USA; 949-588-7568; Fax: 949-588-8871; don@ 

sdpengineering.com; www.sdpengineering.com 

SGS.................................................................................. 

201 Route 17, North Rutherford, NJ 07070 USA; 201- 

508-3188; Fax: 201-935-4555; maureen.plowman@sgs. 

com; www.ee.sgs.com 

Shanghai Empek Electromagnetic 

Technology Ltd. .......................................................... 

No.78 Caobao Road, Shanghai, China; +86 21 62477218 

62477258; Fax: +86 21 62475839; vtexpo@online.sh.cn; 

www.emcexpo.com 

Shielding Resources Group, Inc........................... 

9512 E. 55th St., Tulsa, OK 74145; 918-663-1985; Fax: 

918-663-1986; www.shieldingresources.com 

SIEMIC Testing and Certification Services...... 

2206 Ringwood Ave., San Jose, CA 95131 USA; 1-408- 

526-1188; Fax: 1-408-526-1088; leslie.bai@siemic.com; 

www.siemic.com 

Silicon Labs.................................................................. 

400 W. Cesar Chavez, Austin, TX 78701 USA; 512-416- 

8500; Fax: 512-416-9669; susan.nayak@silabs.com; 

www.silabs.com 

Silicone Solutions...................................................... 

1670-C Enterprise Pkwy., Twinsburg, OH 44087; 330- 

405-4595; Fax: 330-405-4596; 

www.siliconesolutions.com 

SILENT Solutions ...................................................... 

10 Northern Blvd., Suite 1, Amherst, NH 03031 USA; 

603-578-1842; LeeHillSilent@gmail.com; 

www.silent-solutions.com 

Simberian Inc. ............................................................ 

2326 E. Denny Way, Seattle, WA 98122 USA; -2029; 

Yuriy Shlepnev, President, shlepnev@simberian.com; 

www.simberian.com 

SimLab Software GmbH.......................................... 

Bad Nauheimer Str. 19, 64289 Darmstadt,Germany; 49 

6151 7303-0; Fax: +49 6151 7303-100; schrack@simlab. 

de; www.cst.com 

SiTime Corp. ............................................................... 

990 Almanor Ave., Sunnyvale, CA 94085 USA; 408-331- 

9138; Fax: 408-328-4439; psevalia@sitime.com; 

www.sitime.com 

Solar Electronics Co. ............................................... 

10866 Chandler Blvd., North Hollywood, CA 91601 USA; 

818 755-1700; 800-952-5302; Fax: 818 755-0078; tom@ 

theparkerpress.com; www.solar-emc.com 

Soliani EMC SRL ........................................................ 

Via Varesina 122, 22100 Como Lombardia, Italy; +39- 

031-5001112; Fax: + 39-031-505467; info@solianiemc. 

com; www.solianiemc.com 

Sonnet Software, Inc. .............................................. 

100 Elwood Davis Road, N. Syracuse, NY 13212 USA; 

315-453-3096; 1-877-7SONNET; Fax: 315-451-1694; calton@sonnetsoftware.com; 

www.sonnetsoftware.com 

Soshin Electronics Europe GmbH ....................... 

Westerbachstrasse 32, c/o NGK Europe GmbH, Kronbergim, 

Taunus D-61476, Germany; 49-6173-993108; Fax: + 

49-6173-993206; tkhayashi@soshin.co.jp; 

www.soshin-ele.com/ 

Southwest Microwave, Inc.................................... 

9055 South McKemy St., Tempe, AZ 85284; 480-783- 

0201; www.southwestmicrowave.com 

Southwest Research Institute............................... 

6220 Culebra Road, P.O. Drawer 28510, San Antonio, TX 

78228; 210-684-5111; www.swri.com 

Spec-Hardened Systems ........................................ 

110 Larkwood Drive, Rochester, NY 14625-4270 USA; 

585-225-2857; Fax: 585-225-2857; shsesc@aol.com; 

members.aol.com/shsec.myhomepage/index.html 

Source1 Solutions...................................................... 

4675 Burr Drive, Liverpool, NY 13088 USA; 315-730- 

5667; Fax: 315-457-0428; source1.sf@gmail.com; 

www.source1compliance.com 

Souriau PA&E.............................................................. 

434 Olds Station Road, Wenatchee, WA 98801 USA; 

509-664-8000; Fax: 509-663-5039; rkalkowski@ 

pacaero.com; www.pacaero.com 

Specialty Silicone Products .................................. 

3 McCrea Hill Road, Ballston Spa, NY 12020 USA; 518- 

885-8826; 800-437-1442; Fax: 518-885-4682; astiles@ 

sspinc.com; www.sspinc.com 

Spectrum Advanced Specialty Products 

...................................................................................107 

8061 Avonia Road, Fairview, PA 16415 USA; 814-474- 

1571; Fax: 814-474-3110; Kerri Fabin, Director of Sales & 

Marketing – EMI, Filt susan@altman-hall.com; 

www.specemc.com 

AL Huntsville, GWA-Alt/Hsv..................................256-882-6751 

AZ Tempe, Westrep................................................. 480-820-9932 

Queen Creek, W. Reg. Sales Office/Jim Devere..................... 

......................................................................................................... 

...............................................................................866-281-0903 

CA Anaheim, Westrep............................................. 714-527-2822 

Los Altos, Recht................................................. 650-964-6321 

CO Centennial, W. Howard Associates.................303-766-5755 

FL Hutchinson Island, FLA Technology Sales......954-802-2385 

Lake Mary, SE Reg Sales/Jason Russolese.. 866-565-6226 

IA 

IN 

Cedar Rapids, MidTech......................................219-395-0028 

Indianapolis, Dytec, Inc.......................................317-578-0474 

Indianapolis,Alliance Mfg. (Automotive)........317-575-4600 

MA Woburn, Kitchen & Kutchin............................... 781-782-0700 

MD Columbia, Mechtronics Sales...........................410-309-9600 

MN S. St. Paul, North Port Engineering..................651-457-8000 

NC 

NJ 

NY 

PA 

TX 

Raleigh, EMA (Electronic Marketing Association).................. 

......................................................................................................... 

...............................................................................919-847-8800 

Fairfield, TAM (Technical Applications & Marketing)............. 

......................................................................................................... 

...............................................................................973-575-4130 

E. Syracuse, Leonard D. Allen............................315-431-1001 

Elizabethtown, NE Reg Sales/Jeff Showers.866-281-0988 

Richardson, Pro-Comp Sls..................................817-912-3750 

El Paso, World Class Marketing.......................915-585-3228 

WA Redmond, Haleo, Inc..........................................425-497-8500 

INTERNATIONAL 

CAN ON, Canadian Source Corp.................................905-415-1951 

DEU Schwabach, European Sales............................ 49-9122-7950 

MEX Guadalajara, Marfil..........................................011-52-33-3670 



Spira Manufacturing Corp. ...............................91 

12721 Saticoy St. South, N. Hollywood, CA 91605 USA; 

818 764-8222; Fax: 818-764-9880; Wendy Kunkel, 

wendy@spira-emi.com; www.spira-emi.com 

AZ Tucson, Synergistic Technology Group............520-760-0291 

CA RC Products.........................................................510-440-0500 

CA San Diego, Altamont Tech. Serv.......................858-733-0618 

DC Carwithen Associates.......................................410-549-3335 

MD Mt. Airy, Carwithen Associates Inc.................410-549-3335 

NM Synergistic Technology Group..........................520-760-0291 

NV North, RC Products.............................................510-440-0500 

NV South, Synergistic Technology Group..............520-760-0291 

VA Carwithen Associates.......................................410-549-3335 

INTERNATIONAL 

AUT Tricom Mikrowellen GMBH.............................49-8161-86066 

CHE Tricom Mikrowellen GMBH.............................49-8161-86066 

CHN USA Contact, IES Technologies Inc.................630-632-5941 

DEU Tricom Mikrowellen GMBH.............................49-8161-86066 

FRA Getelec............................................................33-146-44-68-91 

ISR Silram Ltd..........................................................972-9-767-1332 

JPN Intermark Co., Ltd............................................81-587-34-3761 

Sprinkler Innovations .............................................. 

95 Ledge Road, Suite 4, Seabrook, NH 03874 USA; 800- 

850-6692; Fax: 603-468-1031; 

jbeers@sprinklerinnovations.com 

SRICO, Inc..................................................................... 

2724 Sawbury Blvd., Columbus, OH 43235; 614-799- 

0664; Fax: 614-799-2116;sri@srico.com; www.srico.com 

Stahlin Enclosures..................................................... 

500 Maple St., Belding, MI 48809 USA; 616-794-0700; 

Fax: 330-725-7265; tramirez@stahlin.com; 

www.stahlin.com 

Stephen Halperin & Associates Ltd..................... 

1072 Tower Lane, Bensenville, IL 60106 USA; 630-238- 

8883; Fax: 630-238-9717; info@halperinassoc.com; 

www.halperinassoc.com 

Stockwell Elastomerics, Inc. ................................ 

4749 Tolbut St., Philadelphia, PA 19136 USA; 215-335- 

3005; Fax: 215-335-9433; www.stockwell.com 

Stork Garwood Laboratories Inc. ........................ 

7829 Industry Ave., Pico Rivera, CA 90660 USA; 562- 

949-2727; Fax: 562-949-8757; 

info.garwood@us.stork.com; www.storksmt.com 

Sulzer Metco (Canada) Inc. ................................... 

10108 114 Str., Fort Saskatchewan, Alberta T8L 4R1, 

Canada; 780-992-5280; 1-877-440-7941; Fax: 780-992- 

5275; wendy.tetz@sulzer.com; 

www.conductivefillers.com 

Sunkyoung S.T............................................................. 

Hwaseong-Si Gyeonggi-Do, Korea; 82-31-351-8171; 

www.sunkyoungst.com 

Sunol Sciences Corp. ............................................... 

6780 Sierra Court, Suite R, Dublin, CA 94568 USA; 925- 

833-9936; Fax: 925-833-9059; 

stu@sunolsciemces.com; www.sunolsciences.com 

Supression Devices.................................................. 

Unit 8, York Street Business Centre, Clitheroe, Lancashire 

BB7 4TQ, United Kingdom; 44 (0)1200 444497; 

Fax: + 44 (0)1200 444330; 

sales@suppression-devices.com; 

www.supression-devices.com 

Suzhou 3CTEST Electronic Co.,Ltd. .................... 

2th Anda Park, No.198 Jinshan Road, Suzhou Jiangsu 

215011, China; +86-512-68413700; +86-512-68077661; 

Fax: 0512-68079795; sales@3ctest.cn 

www.3ctest.cn 

Swift Textile Metalizing LLC.............................93 

P.O. Box 66, Bloomfield, CT 06002 USA; 860-243-1122; 

Fax: 860-243-0848; Christen Holmberg, Product Manager, 

cholmberg@swift-textile.com; 

www.swift-textile.com 

Syfer Technology Limited................................. 111 

Old Stoke Road, Arminghall, Norwich NR14 8SQ, United 

Kingdom; +44 1603 723310; Fax: +44 1603 723301; Chris 

Noade, cnoade@syfer.co.uk; www.syfer.com 

Synergistic Technology Group, Inc. .................... 

8987 E. Tanque Verde Road, P.O. Box 292B, Tucson, AZ 

85749 USA; 520-760-0291; Fax: 520-760-3361; 

tvenable@dakotacom.net; www.e-synergistictech.com 

Sypris Test and Measurement .............................. 

6120 Hanging Moss Road, Orlando, FL 32807 USA; 800- 

839-4959; Fax: 407-678-0578; 

Kelly.Radziski@Sypris.com; www.wetest.com 

Syscom Advanced Materials................................. 

1275 Kinnear Road, Columbus, OH 43212 USA; 614-487- 

3626; Fax: 614-487-3631; info@amberstrand.com; 

www.syscomadvancedmaterials.com 

T 

Tapecon, Inc................................................................. 

701 Seneca Street, Suite 255, Buffalo, NY 14210 USA; 

800-333-2407; Fax: 716-854-1320; www.tapecon.com 

Taiyo Yuden (U.S.A.) Inc. ........................................ 

1930 N. Thoreau Drive, Suite 190, Schaumburg, IL 60173 

USA; 847-925-0888; 800-350-6800; Fax: 847-925-0899; 

sales@t-yude.com; www.t-yuden.com 

TDK Corp. ..................................................................... 

1221 Business Center Drive, Mount Prospect, IL 60056 

USA; 847-803-6100; Fax: 847-803-1125; 

sreynoso@tdktca.com; www.tdk.com 

TDK-EPC Corp. .....................................................101 

485B Route 1 South, Suite 200, Iselin, NJ 08830 USA; 

800-888-7729; Fax: 732-603-5978; Joe Pulomena, Director 

of Marketing/ferrites/inductors, 

Joseph.Pulomena@epcos.com; www.epcos.com/emc 

TDK-Lambda Americas............................................ 

High Power Division, 405 Essex Road, Neptune, NJ 

07783 USA; 732-922-9300; Fax: 732-922-9334; 

www.us.tdk-lambda.com/hp 

TDK RF Solutions, Inc. ............................................. 

1101 Cypress Creek Road, Cedar Park, TX 78613 USA; 

512-258-9478; Fax: 512-258-0740; info@tdkrf.com; 

www.tdkrfsolutions.com 

TE Connection Asia .................................................. 

Unit 13, 16 / FL Fotan Industrial Centre, 26-28 Au Pui 

Wan Street, Fotan Shatin N.T., Hong Kong; 852-2690- 

1360; Fax: 407-804-1277; 

business@testequipmentconnection.com; 

http://chinese.testequipmentconnection.com 

Tech-Etch, Inc. ......................................................69 

45 Aldrin Road, Plymouth, MA 02360 USA; 508-747- 

0300; Fax: 508-746-9639; Bruce McAllister, VP Sales& 

Marketing, bmcallister@tech-etch.com; 

www.tech-etch.com 

AL Huntsville, Cornerstone Sales, LLC ...............256-430-8000 

AZ Chandler, Moss Marketing .............................. 602-828-1461 

CA Brea, Motion Components ................................714-255-1080 

Mountain View, Ross Marketing .....................650-691-0119 

CO Lakewood, Moss Marketing ...........................800-980-8812 

DC Ellicott City, Eastern Tech Corp.........................410-715-2100 

FL Oviedo, Cornerstone Sales, LLC ......................321-765-4862 

Palm Harbor, Cornerstone Sales, LLC ............727-789-4802 

GA Duluth, Cornerstone Sales, LLC ......................770-242-8800 

IL Barrington, EMT Engineering Sales..................847-481-7403 

KS Lenexa, Midtec Associates, Inc....................... 913-541-0505 

MA Carver, Connors Co., Inc. .................................. 508-866-5392 

MD Ellicott City, Eastern Tech Corp.........................410-715-2100 

ME Carver, MA Connors Co., Inc. .......................... 508-866-5392 

MI Kettering, OH, Frederic Ohmer & Associates .......................... 

...............................................................................937-434-1454 

MN Burnsville, EMT Engineering Sls. ....................952-888-1020 

MO Florissant, Midtec Associates, Inc. ..................314 839-3600 

NC Raleigh, Cornerstone Sales, LLC .....................919-834-2677 

NH Carver, MA, Connors Co., Inc........................... 508-866-5392 

NJ Holgate, Brandon Associates, Inc. ..................610-738-8500 

NY Canandaigua, Brandon Associates, Inc. ........610-738-8500 

Central Square, Brandon Associates, Inc. .....610-738-8500 

Commack, Brandon Associates, Inc................610-738-8500 

OH Kettering, Frederic Ohmer & Assoc ................937-434-1454 

OR Beaverton, Technical Marketing, Inc. .............503-627-9000 

PA West Chester, Brandon Associates, Inc. ........610-738-8500 

Bellefonte, Brandon Associates, Inc. .............610-738-8500 

SC Raleigh, NC, Cornerstone Sales, LLC ..............919-834-2677 

TN Eastern, Duluth, GA, Cornerstone Sales, LLC ......................... 

...............................................................................770-242-8800 

Western, Huntsville, AL Cornerstone Sales, LLC.................... 

.............................................................................. 256-430-8000 

TX Colleyville, Centramark ..................................... 817-498-5818 

Garland, Centramark ......................................... 972-414-8188 

Austin, Centramark ............................................ 512-795-0966 

Bellaire, Centramark ........................................... 713-771-1500 

UT Salt Lake City, Moss Marketing .......................801-947-0169 

VA Ellicott City, MD, Eastern Tech Corp ................410-715-2100 

WA Kirkland, Technical Marketing, Inc. .................425-739-4600 

Spokane, Technical Marketing, Inc. ................509-924-7609 

WI Mequon, EMT Engineering Sales....................262-236-4001 

WY Lakewood, CO, Moss Marketing .....................800-980-8812 

INTERNATIONAL 

BEL HF Technology ....................................................3175-6283717 

CAN Dollard des Ormeuaux, The ID Group Inc.................................. 

...............................................................................514-575-8044 

CHN Beijing, Mindar China Co. LTD. .....................8610 64680338 

DEU Berlin, Feuerherdt Gmbh ...............................4930710964552 

DNK Gydevang, Bomberg EMC Products ..................454 814 0155 

FRA Les Ulis, Yelloz Components ..........................330164460442 

GBR Rochdale , TBA Electro Conductive Products .......................... 

.............................................................................441706 647718 

ISR Rishon Le-Zion, Maham Fasteners ................972 3 9626516 

ITA Sirces/Italy ............................................................0255231395 

JPN Tokyo, Taiyo Wire Cloth Co. ..............................81334937051 

NOR Oslo, EG Components ........................................472-325-4600 

PRK Eretec ................................................................82-31-436-1100 

SGP Ayer Raja Industrial Estate, Glocom Marketing PTE, LTD...... 

................................................................................65 6873 0933 

TWN Taipei Hsien, TennMax, Inc. ........................... 886226954137 

SAF Linbro Park, Actum Electronics.......................27 11 608 3001 

Teledyne Reynolds..................................................... 

Navigation House, Canal View Road, Newbury, Berkshire, 

RG14 5UR United Kingdom; +44(0)1635262231; 

Fax: +44(0)1635521936; gfagg@teledyne.com; 

www.teledynereynolds.co.uk 

TEMPEST Inc. ............................................................. 

11654 Plaza America Drive, P.O. Box #134, Reston, VA 

20190 USA; 03-836-7378; www.tempest-inc.com 



Tempest Security Systems Inc. ............................ 

P.O. Box 584, Troy ,OH 45373 USA; 937-335-5600; Fax: 

937-335-0018; ianwaterman00@aol.com; 

www.tempestusa.con 

TESEO............................................................................. 

Corso Alexander Fleming, 25/27/29 10040 Druento (TO) 

Italia - C.F. / P.I: 02245230012; +39 011 9941 911; Fax: 

+39 011 9941 900; info@teseo.net; www.teseo.net 

Teseq.........................................................................20 

52 Mayfield Ave., Edison, NJ 08837 USA; 732-225-9533; 

Fax: 732-225-4789; Mary Jane Salvador, Sales Contact, 

MJSalvador@teseq.com; www.teseq.com 

CA Universal Components.......................................949-707-0407 

NY PMR, INC..............................................................631- 244-1420 

NY L-MAR Assdciates.............................................585- 899-3920 

OH Electronic Salesmasters................................... 216- 831-9555 

PA Keystone Sales & Marketing............................610- 745-7237 

TX Biggs and Associates........................................972- 679-5871 

INTERNATIONAL 

CAN National Power and Signal............................... 519- 763-4225 

IND Trinity Technologics........................................91-80-25719382 

POL SEEN Distribution............................................48-22-625-1225 

SYSTEM elementy elektroniczne.................48 56 67 87 000 

TUR Kilia Teknoloji....................................................90 212 3439055 

Test & Measurement Australia Pty Limited...... 

P.O. Box 197, Blaxland, NSW 2774 Australia; 61 2 4739 

9523; 1-800-888-523; Fax: +61 2 4739 9524; 

info@TandM.com.au; www.TandM.com.au 

Test Equipment Connection.................................... 

30 Skyline Drive, Lake Mary, FL 32746 USA; 407-804- 

1299; 800-615-8378; 

business@testequipmentconection.com; 

www.testequipmentconnection.com 

Test Site Services...................................................... 

30 Birch St., Milford, MA 01757 USA; 508-634-3444; 

Fax: 508-634-0388; tsslarry@ieee.org; 

www.testsiteservices.com 

Texas Spectrum Electronics ................................. 

120 Regency, Wylie, TX 75098 USA; 972-296-3699; Fax: 

972-296-7881; TSEinfo@texasspectrum.com; 

www.texasspectrum.com 

The Compliance Management Group ................ 

202 Forest St., Marlborough, MA 01752 USA; 508-281- 

5985; Fax: 508-281-5972; ewilbur@cmgcorp.net; 

www.cmgcorp.net 

THEMIX Plastics, Inc. .............................................. 

621-D East Lake St., Lake Mills, WI 53551 USA; 1-920- 

945-0599; 1-888-234-3304; Fax: 1-920-945-0596; 

steven@THEMIXplastics.com; 

www.THEMIXplastics.com 

Thermo Fisher Scientific......................................... 

200 Research Drive, Wilmington, MA 01887 USA; 978- 

935-0800; Fax: 978-275-0850; 

ron.ahlquist@thermofisher.com; 

www.thermoscientific.com/esd 

THORA Elektronik GmbH......................................... 

Esbacher Weg 13, D-91555 Feuchtwangen, Germany; 

0049-9825-92800; Fax: 0 98 52 6 10 79-50; 

service@thora.com; www.thora.com 

3C Test Ltd. - EMC Testing....................................... 

Silverstone Technology Park, Silverstone Circuit, Towcester, 

Northampton NN12 8GX, United Kingdom; +44 (0) 

1327 857500; Fax: +44 (0) 1327 857747; sales@3ctest. 

co.uk; www.3ctest.co.uk 

3Gmetalworx World.................................................. 

101 Planchet Road, Concord L4K 2C6, Canada; 

905-738-7973; MGomez@3gmetalworx.com; 

www.3gmetalworx.com 

3M Electrical Markets Division............................ 

6801 River Place Blvd., Austin, TX 78726-9000, USA; 

800-245-0329; Alex.Gwin@kolarmail.com; 

www.3M.com/electrical 

Timco Engineering, Inc. .......................................... 

849 NW State Road, P.O. Box 45 370, Newberry, FL 

32669 USA; 352-472-5500; 888-472-2424; Fax: 352-472- 

2030; shoffman@timcoengr.com; www.timcoengr.com 

TMD Technologies Ltd. ........................................... 

Swallowfield Way, Hayes, Middlesex UB3 1DQ, United 

Kingdom; +44-20-8573-5555; Fax: + 44-20-8569-1839; 

heather.skinner@tmd.co.uk; www.tmd.co.uk 

TRaC Global.................................................................. 

100 Frobisher Business Park, Leigh Sinton Road, Worcestershire 

WR14 1BX, United Kingdom; +44 (0) 1684 

571700; Bally.Wadalia@tracglobal.com; 

www.trac-ktl.com/emc-testing.html 

Transient Specialists, Inc........................................ 

7704 S. Grant St., Burr Ridge, IL 60527 USA;866-EMI- 

RENT; 630-887-0329; www.transientspecialists.com 

Transtector Systems Inc. ........................................ 

10701 N. Airport Road, Hayden, ID 83835 USA; 208-762- 

6113; Fax: 208 762 6133; ljohnson@transtector.com; 

www.transtector.com 

Tranzeo EMC Labs Inc. ............................................ 

19473 Fraser Way, Pitt Meadows, British Columbia 

V3Y 2V4, Canada; 604-460-4453; Fax: 604-460-6005; 

djohanson@tranzeo-emc.com; www.tranzeo-emc.com 

TREK, Inc.. .................................................................... 

11601 Maple Ridge Road, Medina, NY 14103 USA; 585- 

798-3140; 800-FOR-TREK; Fax: 585-798-3106; 

sales@trekinc.com; www.trekinc.com 

Trialon Corp. ................................................................ 

1465 Walli Strasse Drive, Burton, MI 48509 USA; 810- 

341-7931; 1-800-847-8111; pkrug@trialon.com; 

www.trialon.com/test_engineering.html 

Tri-Mag, Inc. ......................................................... 117 

1601 Clancy Court, Visalia, CA 93291 USA; 559-651- 

2222; Fax: 559-651-0188; Jia-Ming Li, 

jmli@tri-mag.com; www.tri-mag.com 

TUV Rheinland of North America, Inc. ............... 

12 Commerce Road, Newtown, CT 06470 USA; 203-426- 

0888; 888-743-4652; Fax: 203-426-4009; 

vpalmerskok@us.tuv.com; www.tuv.com 

TÜV SÜD America Inc.............................................. 

1775 Old Highway 8 NW, Suite #104, New Brighton, MN 

55112; 651-631-2487 or go to www.TUVamerica.com; 

Fax 651-638-0285; info@tuvam.com; 

www.TUVamerica.com 

TÜV SÜD Product Service Ltd. ............................. 

Octagon House, Concorde Way, Segensworth North, 

Fareham, Hampshire PO15 5RL, United Kingdom; +44 (0) 

1489 558100; Fax: +44 (0) 1489 558101; 

info@tuvps.co.uk; www.tuvps.co.uk 

TÜV SÜD Senton GmbH............................................ 

Äußere Frühlingstraße 45, 94315 Straubing, Germany; 

+09421-5522-22; Fax: +09421-5522-99; 

stefan.kammerl@tuev.sued.de; 

www.tuev-sued.de/senton 

TWP Inc. ....................................................................... 

2831 Tenth St., Berkeley, CA 94710 USA; 510-548-4434; 

800-227-1570; Fax: 510-548-3073; g@twpinc.com; 

www.twpinc.com 

Tyco Electronics......................................................... 

620 S. Butterfield Road, Mundelein, IL 60060 USA; 847- 

573-6508; bob.fawley@tycoelectronics. 

U 

Ultratech Group of Labs .......................................... 

3000 Bristol Circle, Oakville, Ontario L6H 6G4, Canada; 

905-829-1570; vic@ultratech-labs.com; 

www.ultratech-labs.com 

Underwriter’s Laboratories Inc. .......................... 

333 Pfingsten Road, Northbrook, IL 60062-2096 USA; 

847-272-8800; Fax: 847-272-8129; 

www.ul.com/hitech/emc 

United Seal and Rubber Co., Inc............................ 

7025-C Amwiler Ind. Drive, Atlanta, GA; 770-864-0532; 

Fax: 770-729-8992; sales@unitedseal.com; 

www.unitedseal.com 

Universal Air Filter ................................................... 

1624 Sauget Industrial Parkway, P.O. Box 5006, Sauget, 

IL 62206 USA; 618-271-7300; 800-541-3478; Fax: 618- 

271-8808; mikemiano@uaf.com; www.uaf.com 

V 

V-Comm, LLC................................................................ 

2540 US Highway 130, Suite 101, Cranbury, NJ 08512; 

609-655-1200; Fax: 609-409-1927; 

www.vcomm-eng.com 

V Technical Textiles, Inc. ....................................... 

4502 Route31, Palmyra ,NY 14522 USA; 315-597-1674; 

Fax: 315-597-6687;whoge@rochester.rr.com; 

www.shieldextrading.net 

Vacuum Schmelze GmbH & CO. KG..................... 

Grüner Weg 37, D-63450 Hanau, Germany; +49 6181 

380; Fax: +49 6181 38-2645; info@vacuumschmelze. 

com; www.vacuumschmelze.com 

Vanguard Products Corp. ....................................... 

87 Newtown Road, Danbury, CT 06810 USA; 203-744- 

7265; Fax: 203-798-2351; mhansen@vanguardproducts. 

com; www.vanguardproducts.com 

Venture Tape Corp. ................................................... 

30 Commerce Road, P.O. Box 384, Rockland, MA 02370 

USA; 781-331-5900; 800-343-1076; Fax: 781-871-0065; 

mnorton@venturetape.com; www.venturetape.com 

Vermillion, Inc. ........................................................... 

4754 South Palisade, Wichita, KS 67217 USA; 316-524- 

3100; fhunt@vermillioninc.com; www.vermillioninc.com 

Videon Central, Inc. .................................................. 

2171 Sandy Drive, State College, PA 16803 USA; 814- 

235-1111; kent.vonada@videon-central.com; 

www.videon-central.com 

View Thru Technologies, Inc. ............................... 

1765 Walnut Lane , Quakertown ,PA 18951 USA; 215- 

703-0950; Fax: 215-703-0952; jeffreid@viewthru.net; 

www.viewthru.net 

Vishay Intertechnology, Inc. .................................. 

63 Lancaster Ave. (HQ), Malvern, PA 19355 USA; 610- 

644-1300; joan.lordan@vishay.com; www.vishay.com 

Visron Design, Inc. .................................................... 

150 Lucius Gordon Drive, Suite 111, West Henrietta, NY 

14586 USA; 585-292-5780; Fax: 585-292-5787; 

www.visron.com 

VitaTech Engineering, LLC ..................................... 

115 Juliad Court, Suite 105, Fredericksburg, VA 22406 

USA; 540-286-1984; Fax: 540-286-1865; 

lvitale@vitatech.net; www.vitatech.net 

Voltech Instruments, Inc......................................... 

Didcot, NY; 585-292-5780; www.voltech.com 



VPT, Inc. ........................................................................ 

11314 4th Ave. West, Suite 206, Everett ,WA 98204 

USA; 425-353-3010; Fax: 425-353-4030; 

michelle@mm-communications.com; www.vpt-inc.com 

VTI Vacuum Technologies Inc. ............................. 

1215 Industrial Ave., Reedsburg, WI 53959 USA; 608- 

524-9822; Fax: 608-524-9722 ; www.vactecinc.com 

W 

Walshire Labs, LLC.................................................... 

8545 126th Ave., N. Largo, FL 33773 USA; 727-530- 

8637; www.walshirelabs.com 

Washington Laboratories, Ltd. ............................. 

7560 Lindbergh Drive, Gaithersburg, MD 20879 USA; 

301-417-0220; Fax: 301-417-9069; mikev@wll.com; 

www.wll.com 

Wavecontrol................................................................ 

Pallars, 65-71 Barcelona, 8018 Spain;+34 933208055; 

Fax: +34 933208056; ernestcid@wavecontrol.com; 

www.wavecontrol.com 

WaveZero, Inc. ........................................................... 

818 Kifer Road, Sunnyvale, CA 94086 USA;408-830- 

5100; Fax: 408-773-8480; www.wavezero.com 

WEMS Electronics.............................................109 

4650 W. Rosecrans Ave., Hawthorne, CA 90250-6898 

USA;310-644-0251 ext. 176; Fax: 310-644-5334; John 

O’Brien, Marketing Manager, jobrien@wems.com; 

www.wems.com 

White Sands Missile Range................................... 

TEDT-WSV-EE WSMR NM 88002-5158 USA; 575-678- 

6107; Fax: 575-678-3999; stephanie.jesson@us.army. 

mil; www.wsmr.army.mil/ 

Wilcoxon Research................................................... 

20511 Seneca Meadows Parkway, Germantown ,MD 

20876 USA; 301-330-8811; 800-WILCOXON; Fax: 301- 

330-8873; www.wilcoxon.com 

Willow Run Test Labs, LLC...................................... 

8501 Beck Road, Bldg 2227, Belleville, MI 48111 USA; 

734-252-9785; joe@wrtest.com; 

http://www.wrtest.com 

World Cal, Inc. ............................................................ 

2012 High St., P.O. Box 410, Elk Horn, IA 51531 USA; 712- 

764-2197; Fax: 712-764-2195; gking@world-cal.com 

Wurth Elecktronik eiSos GmbH & Co. KG.......... 

Max-Eyth-Str. 1, 74638 Waldenburg, Germany;+49 (0) 

7942/945-0; Fax: +49 (0) 79 42 945 – 400; 

eiSos@we-online.de; www.we-online.com 

Wurth Electronics Midcom Inc. ........................... 

121 Airport Drive, Watertown, SD 57201 USA; 605-886- 

4385; Fax: 605-886-4486; 

lindsey.esche@we-online.com; www.we-online.com 

X 

X2Y Attenuators LLC................................................. 

2730-B W. 21st St.,Erie, PA 16506 USA; 814-835-8180; 

Fax: 814-835-9047; www.x2y.com 

Y 

Yazaki Testing Center .............................................. 

6800 N. Haggerty Road, Catnon, MI 48187 USA; 734- 

983-6012; Fax: 734-983-6013; 

scott.lytle@us.yazaki.com; www.yazakiemc.com 

York EMC Services Ltd............................................. 

Market Square, University of York, Heslington, York YO10 

5DD United Kingdom; www.yorkemc.co.uk 

Z 

Zero Ground LLC ...................................................92 

Main Sales Office: 3392 Hillside Court, Woodridge, IL 

60517-1438 USA; 630-719-1900; 866-937-6463; Fax: 

630-968-1200; panko@zero-ground.com; 

www.zero-ground.com; Mark Panko, ZERO GROUND 

LLC, V.P. Sales & Engineering; Linda Sardone, Sales & 

Mktg. Mgr.; Donna Silvers, President, 2nd Source Wire 

& Cable - Authorized Distr.; Karl Christiansen, Sales 

Mgr., JAN Electronics Supplies - Authorized Distr.; Marie 

Logan, V.P. Americor Electronics Ltd. - Authorized Distr. 

CA Brea, 2nd Source.................................................714-572-9977 

CT New London, JAN Electronics Supplies........ 860-442-4386 

IL Elk Grove Village, Americor Electronics Ltd....847-956-6200 

Zero Surge Inc. ........................................................... 

889 State Route 12, Frenchtown, NJ 0 8825 USA; 908- 

996-7700; 800-996-6696; www.ZeroSurge.com 

Zippertubing Co.......................................................... 

13000 South Broadway, P.O. Box 61129, Los Angeles, CA 

90061 USA; 800-321-8178; Fax: 310-767-1714; 

kira@zippertubing.com; www.zippertubing.com 

Zuken.............................................................................. 

238 Littleton Road, Suite 100, Westford , MA 01886 

USA; 978-692-4900; 800-356-8352; 

amy.clements@zuken.com; www.zuken.com 

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A.H. Systems, Inc. 7, 41 

Advanced Test Equipment rentals 21 

Agilent technologies 31 

AR/RF Microwave Instrumentation 3, 29, 57 

AR Tech engineered fabric products 98 

ARC Technologies 9 

Braden Shielding Systems 81 

Captor Corporation 115 

CPI (Communications and Power Industries) 15 

Computer Simulation Technology (CST) / SimLab 59 

Curtis Industries 112 

Dexmet 97 

DNB Engineering, Inc. 23 

Don Heirman Consultants 126 

Dontech 87 

Electriflex company 83 

EM Software & Systems (USA) Inc 79 

EM Test usa 37 

EMC Partner AG 53 

ENR/ Seven Mountains scientific 125 

ETC - Electronics Test Centre - Kanata 24 

EMI Filter Company 116 

ets - lindgren back cover, 35 

Fair-Rite Products Corp. 113 

Fischer Custom Communications, Inc. 11 

fotofab corporation 75 

Genisco Filter Corporation 119 

gore 94, 95 

haefely emc division 63 

haRWIN 

INSIDE FRONT COVER 

Henry ott consultants 126 

hoolihan emc consulting 126 

hv technologies, inc. 5 

IEEE 2011 Long Beach 89 

IEEE 2012 Pittsburgh 123 

ifi instruments for industry 17, 38, 39, 51 

intermark usa 86 

item publications 126, 127, 143, 150, 175 

kimmel gerke associates, ltd. 126 

L-3 Communications Cincinnati Electronic 49 

langer emv-technik gmbh 52 

LCR Electronics 121 

Leader tech 71 

Liberty Labs 13 

lightning technologies inc. 61 

Macton Corporation 50 

MET Laboratories Inc. 25 

Montrose Compliance Services, Inc. 126 

Mushield Company 85 

NAVAIR Advanced Warfare Technologies 47 

Noise Laboratory Co., Ltd. 12 

NTS - National Technical Systems 1 

Panashield 67 

Partnership for Defense Innovation 43 

Pearson Electronics, Inc. 55 

Radiometrics Midwest Corp. 26 

Radius Power 104 

Retlif Testing Laboratories 14 

RF immunity 118 

Schaffner EMC, Inc. 105 

Schlegel 

Inside back cover 

Schurter, Inc. 103 

Seal Science West 96 

Select Fabricators 99 

Spectrum advanced specialty products 107 

Spira Manufacturing Corp. 91 

Swift Textile Metalizing LLC 93 

Syfer Technology 111 

TDK-EPC Corp 101 

Tech-Etch, Inc. 69 

TESEQ 20 

tri-mag, inc. 117 

WEMS ELECTRONICS 109 

ZERO GROUND 92

2011 EMC Directory & Design Guide - Interference Technology

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