Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Henkel</strong><br />
<strong>Semiconductor</strong> <strong>Solutions</strong>
Worldwide Manufacturing<br />
& Organization<br />
Electronics Group of <strong>Henkel</strong><br />
Irvine, California<br />
Rancho Dominguez, California<br />
Dublin, Ireland<br />
Hemel Hempstead, UK<br />
Yantai, China<br />
Hokkaido, Japan<br />
Isogo, Japan<br />
Salisbury, North Carolina<br />
Seoul, Korea<br />
Westerlo,<br />
Belgium<br />
Lianyungang,<br />
China<br />
Ecatepec de Morelos,<br />
Mexico<br />
Scheemda,<br />
Netherlands<br />
Shanghai, China<br />
Ipoh, Malaysia<br />
Sao Paulo, Brazil<br />
Kuala Lumpur, Malaysia<br />
Corporate Profile – <strong>Henkel</strong> Corporation<br />
Across the Board,<br />
Around the Globe.<br />
www.henkel.com/electronics<br />
<strong>Henkel</strong> is the world’s leading and most progressive provider of<br />
qualified, compatible material sets for semiconductor packaging,<br />
printed circuit board (PCB) assembly and advanced soldering<br />
solutions. As the only materials developer and formulator with<br />
vast technical expertise for all materials required for package<br />
production and assembly, <strong>Henkel</strong> is uniquely positioned to<br />
deliver world-class materials products, process expertise and<br />
total solutions across the board to enable tomorrow’s<br />
electronic industry.
Contents<br />
<strong>Semiconductor</strong> Market <strong>Solutions</strong><br />
Discrete Components . . . . . . . . . . . . . . . . . . . . . . . . . . 5<br />
Passive Components . . . . . . . . . . . . . . . . . . . . . . . . . . . 6<br />
Quad Flat Pack (QFP). . . . . . . . . . . . . . . . . . . . . . . . . . . 7<br />
Quad Flat No-Lead (QFN) . . . . . . . . . . . . . . . . . . . . . . . 8<br />
Small Outline Integrated Circuit/<br />
Small Outline Package (SOIC/SOP) . . . . . . . . . . . . . . . 9<br />
Ball Grid Array/Chip Scale Package (BGA/CSP). . . . 10<br />
Smart Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11<br />
Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12<br />
Image Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13<br />
<strong>Semiconductor</strong> Materials<br />
Die Attach Adhesives. . . . . . . . . . . . . . . . . . . . . . . . . . 15<br />
Die Attach Films . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20<br />
Conductive Pastes and Coatings . . . . . . . . . . . . . . . . 22<br />
Underfills . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24<br />
Encapsulants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27<br />
Photonics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30<br />
Electronic Molding Compounds . . . . . . . . . . . . . . . . . 32<br />
Molding Compounds . . . . . . . . . . . . . . . . . . . . . . . . . . 34<br />
Solder Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42<br />
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46<br />
Periodic Table of Elements . . . . . . . . . . . . . . . . . . . . . 48
Material <strong>Solutions</strong> for<br />
Electronic Packaging<br />
and Assembly<br />
<strong>Semiconductor</strong> assembly materials<br />
Die Attach Paste<br />
Adhesives<br />
Die Attach Film<br />
Adhesives<br />
Conductive Pastes<br />
and Coatings<br />
Underfills<br />
Encapsulants<br />
Photonics<br />
Electronic Molding<br />
Compounds<br />
Molding Compounds<br />
Solder Materials<br />
2
Electronic Assembly Materials<br />
Adhesives<br />
Display Materials<br />
Inks and Coatings<br />
Board Level Underfills<br />
Chip on Board<br />
Encapsulants<br />
Circuit Board<br />
Protection Materials<br />
Solder and Flux<br />
Materials<br />
Surface Mount<br />
Adhesives<br />
Thermal Management<br />
Materials<br />
Please see LT-5012<br />
for Electronic Assembly <strong>Solutions</strong> Guide.<br />
3
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
Device miniaturization and the need for improved reliability continue to drive<br />
advances in semiconductor materials technology. The relentless push for smaller<br />
yet more powerful and less costly products requires semiconductor specialists to<br />
constantly push the envelope when it comes to device packaging.<br />
This is precisely why <strong>Henkel</strong>’s commitment to innovation and materials<br />
technology leadership is a critical component for packaging success. The<br />
never-ending demands imposed by today’s advanced products mean there<br />
is no room for error – materials have to perform as expected the first time.<br />
Because of <strong>Henkel</strong>’s inimitable materials development methodology, where<br />
complete packages are built and various materials combinations are tested for<br />
compatibility and in-field performance, we can ensure not only outstanding<br />
materials performance but also optimized package functionality. We take<br />
the guesswork out of the process and deliver tested, reliable and guaranteed<br />
compatible materials for the most demanding applications.<br />
Across the Board,<br />
Around the Globe.<br />
www.henkel.com/electronics<br />
4
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
Discrete components<br />
Discrete components form by far the largest number of<br />
components in any electrical or electronic application.<br />
Despite the expansion of any number of integrated<br />
circuits, there is always a need for supporting discrete<br />
packages, especially where high power is needed. As<br />
with almost all semiconductor devices, environmental<br />
protection is mostly afforded by epoxy-based mold<br />
compounds with typical packages including TO, SOT,<br />
DAK, etc. Depending upon the component, internal<br />
die placement is generally with a solder or silver die<br />
attach material, with non-conductive pastes also being<br />
used in selected areas.<br />
Discrete Components<br />
Die Attach Adhesives<br />
Encapsulants<br />
Molding<br />
Compounds<br />
Conductive<br />
Non-Conductive<br />
HYSOL<br />
FP0087<br />
Green<br />
Non-Green<br />
ABLEBOND<br />
FS849-TI<br />
HYSOL<br />
QMI536HT<br />
HYSOL<br />
GR15F-1P<br />
HYSOL<br />
KL1000-3LX<br />
ABLECOAT<br />
8008HT (WBC)<br />
HYSOL<br />
QMI547<br />
HYSOL<br />
GR360A-F8<br />
HYSOL<br />
KL-5000HT<br />
ABLETHERM<br />
2600AT<br />
HYSOL<br />
GR750<br />
HYSOL<br />
MG15F<br />
HYSOL<br />
QMI529HT<br />
HYSOL<br />
KL-G100<br />
MULTICORE DA100<br />
(SOLDER)<br />
HYSOL<br />
KL-G200<br />
MULTICORE DA101<br />
(SOLDER)<br />
5
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
Passive COMPONENTS<br />
Passive components include capacitors, resistors and<br />
inductors of various designs. These range from microminiature<br />
surface mount Tantalum (Ta) capacitors<br />
up through power resistors and complete resistor<br />
networks. In each area, encapsulants such as liquid<br />
Potting and powder Molding Compounds are used. In<br />
addition, Silver (Ag) and graphite-based materials are<br />
widely used for termination and both internal and<br />
external connections.<br />
Passive<br />
Conductive Pastes<br />
Conductive Coatings<br />
Graphite Coatings<br />
Electric Molding<br />
Compounds<br />
ECCOBOND<br />
C860-1J<br />
ECCOCOAT<br />
C110<br />
AQUADAG<br />
22<br />
HYSOL<br />
GR2220<br />
ECCOBOND<br />
CE3513<br />
ECCOCOAT<br />
C110-5-4<br />
AQUADAG<br />
E/18%<br />
HYSOL<br />
GR2310<br />
ECCOBOND<br />
CE3804 A/B<br />
ECCOCOAT<br />
CP8825<br />
DAG<br />
1050<br />
HYSOL<br />
GR2710<br />
ECCOBOND<br />
CE3920<br />
ELECTRODAG<br />
503<br />
HYSOL<br />
GR2725<br />
ELECTRODAG<br />
PR406<br />
HYSOL<br />
GR2811<br />
HYSOL<br />
GR2820<br />
6
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
QFP<br />
Quad Flat Pack (QFP) devices are leadframe-type<br />
packages in which leads protrude from the Molding<br />
Compound from all four sides. Though most<br />
QFP structures are similar, Die Attach material<br />
requirements for this type of package may vary based<br />
on the leadframe finish or Integrated Chip (IC) size.<br />
QFN device size may also dictate the use of different<br />
Die Attach formulations and Molding Compounds.<br />
QFP<br />
Die Attach Adhesives<br />
Molding<br />
Compounds<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Green<br />
Non-Green<br />
HYSOL<br />
QMI529HT-LV<br />
ABLEBOND<br />
3230<br />
ABLEBOND<br />
2025DSI<br />
HYSOL<br />
GR828D<br />
HYSOL<br />
KL-7000HA<br />
ABLESTIK<br />
C100 (Film)<br />
ABLEBOND<br />
8290<br />
ABLEBOND<br />
8900NC<br />
HYSOL<br />
GR869<br />
HYSOL<br />
QMI547<br />
HYSOL<br />
KL-G730<br />
7
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
QFN<br />
Though they share similar names, the Quad Flat<br />
No-Lead (QFN) package differs from the QFP in its<br />
lead structure. With the QFN, the leads are located<br />
underneath the device as opposed to protruding from<br />
the sides. The QFN package also includes an exposed<br />
thermal pad, which enhances the ability of this<br />
package to remove heat from the IC. As this package<br />
is designed to manage heat dissipation, the Die Attach<br />
materials employed will most likely be thermally<br />
conductive.<br />
QFN<br />
Die Attach Adhesives<br />
Molding<br />
Compounds<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Green<br />
ABLEBOND<br />
3230<br />
ABLEBOND<br />
8200C<br />
ABLEBOND<br />
2025DSI<br />
ABLEBOND<br />
8900NC<br />
HYSOL<br />
KL-G900HC<br />
ABLECOAT<br />
8008HT (WBC)<br />
ABLEBOND<br />
8200TI<br />
HYSOL<br />
QMI536HT<br />
ABLECOAT<br />
8008NC (WBC)<br />
HYSOL<br />
KL-G900HP<br />
ABLESTIK<br />
8008MD (WBC)<br />
ABLEBOND<br />
8290<br />
HYSOL<br />
QMI538NB<br />
ABLECOAT<br />
8006NS (WBC)<br />
HYSOL<br />
QMI519<br />
ABLEBOND<br />
84-1LMISR8<br />
ABLESTIK<br />
ABP-8910T<br />
HYSOL<br />
QMI529HT<br />
ABLEBOND<br />
FS849-TI<br />
HYSOL<br />
QMI547<br />
HYSOL<br />
QMI529HT-LV<br />
ABLESTIK<br />
C100 (Film)<br />
8
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
SOIC / SOP<br />
The Small Outline Integrated Circuit (SOIC) and Small<br />
Outline Package (SOP) are arguably the most common<br />
package types used today. Similar to the QFP and QFN,<br />
the SOIC ands SOP are leadframe-type packages, with<br />
leadframe finish dictating the Die Attach and Molding<br />
Compound requirements.<br />
SOIC / SOP<br />
Die Attach Adhesives<br />
Molding<br />
Compounds<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Green<br />
Non-Green<br />
ABLEBOND<br />
8352L<br />
ABLEBOND<br />
8200C<br />
ABLEBOND<br />
2025DSI<br />
ABLEBOND<br />
8900NC<br />
HYSOL<br />
GR725LV-LS<br />
HYSOL<br />
KL-4500-1NT<br />
ABLEBOND<br />
84-1LMISR4<br />
ABLEBOND<br />
8200TI<br />
HYSOL<br />
QMI538NB<br />
ABLECOAT<br />
8008NC (WBC)<br />
HYSOL<br />
GR828D<br />
ABLECOAT<br />
8008HT (WBC)<br />
ABLEBOND<br />
8290<br />
HYSOL<br />
QMI536HT<br />
ABLECOAT<br />
8006NS (WBC)<br />
HYSOL<br />
KL-G450H<br />
ABLESTIK<br />
8008MD (WBC)<br />
ABLEBOND<br />
FS849-TI<br />
ABLESTIK<br />
ABP-8910T<br />
HYSOL<br />
KL-G730<br />
HYSOL<br />
QMI519<br />
ABLEBOND<br />
84-1LMISR8<br />
HYSOL<br />
QMI547<br />
HYSOL<br />
QMI529HT<br />
ABLESTIK<br />
C100 (Film)<br />
HYSOL<br />
QMI529HT-LV<br />
9
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
BGA / CSP<br />
Ball Grid Arrays (BGAs) and Chip Scale Packages (CSPs)<br />
are laminate-based devices, which means they are<br />
essentially micro printed circuit boards (PCBs) on<br />
which ICs are mounted. Some BGA-type packages may<br />
alternatively use flip-chip ICs for interconnecting<br />
instead of wirebonds. In this case, the flip-chip<br />
mounted device dictates an assembly process change<br />
in which Wafer Bumping Solder Paste or Tacky Flux is<br />
used to attach the die instead of traditional die attach<br />
materials. Additionally, Underfills are used to protect<br />
the solder connections.<br />
BGA / CSP<br />
Die Attach<br />
Paste Adhesives<br />
Die Attach<br />
Film Adhesives<br />
Encapsulants<br />
Molding<br />
Compounds<br />
Tacky<br />
Fluxes<br />
Underfills<br />
Wafer<br />
Bumping<br />
Lid Attach<br />
Adhesives<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
DA1, PBGA,<br />
CSP, SCSP<br />
DAX, PBGA,<br />
SCSP<br />
Dam<br />
Fill<br />
HYSOL<br />
GR9810 series<br />
MULTICORE<br />
TFN600<br />
ABLEFILL<br />
UF8806G<br />
MULTICORE<br />
WS300<br />
ABLEBOND<br />
3003<br />
ABLEBOND<br />
2000B<br />
ABLESTIK<br />
2025D-SF<br />
ABLESTIK<br />
ATB-100<br />
(20, 30µm)<br />
ABLESTIK<br />
ATB-100<br />
(5, 10, 20µm)<br />
HYSOL<br />
FP4451<br />
HYSOL<br />
CB0260<br />
MULTICORE<br />
WS300<br />
ABLEFILL<br />
UF8826<br />
ABLEBOND<br />
3005<br />
ABLEBOND<br />
2100A<br />
ABLEBOND<br />
2300<br />
HYSOL<br />
QMI536HT<br />
HYSOL<br />
QMI538NB<br />
ABLEBOND<br />
2025DSI<br />
ABLESTIK<br />
ATB-100U<br />
(20, 30µm)<br />
ABLESTIK<br />
ATB-100US<br />
(20, 30µm)<br />
ABLESTIK<br />
ATB-100U<br />
(5, 10, 20µm)<br />
ABLESTIK<br />
ATB-100US<br />
(5, 10, 20µm)<br />
HYSOL<br />
FP4451TD<br />
HYSOL<br />
CB0260-1<br />
HYSOL<br />
FP4450<br />
HYSOL<br />
FP4450HF<br />
ABLEFILL<br />
UF8828<br />
ABLEFILL<br />
UF8829<br />
HYSOL<br />
FP4545FC<br />
ABLEBOND<br />
MC723<br />
ABLEBOND<br />
2053S<br />
ABLESTIK C115<br />
(Conductive)<br />
HYSOL<br />
FP4450LV<br />
HYSOL<br />
FP4549<br />
ABLESTIK<br />
ATB-100 Series<br />
(Curable Film)<br />
ABLESTIK C130<br />
(Conductive)<br />
HYSOL<br />
FP4470<br />
ABLESTIK<br />
ATB-100US<br />
(Skip Cure Film)<br />
10
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
SMART CARDS<br />
Smart cards are very popular in Europe and Asia due<br />
to the ability to securely store information on standard<br />
size credit cards. Embedded microprocessors enable<br />
information to be stored directly on these credit<br />
cards. Die Attach materials are used to attach the<br />
microprocessors, and Encapsulants are used to protect<br />
the electronic assembly.<br />
Smart Card<br />
Die Attach Adhesives<br />
Encapsulants<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Dam<br />
Fill<br />
ABLEBOND<br />
2030SC<br />
ABLEBOND<br />
2033SC<br />
HYSOL<br />
FP4451<br />
HYSOL<br />
FP4450HF<br />
ABLEBOND<br />
8384<br />
ABLEBOND<br />
2035SC<br />
HYSOL<br />
3323<br />
HYSOL<br />
3327<br />
ABLESTIK<br />
ATB-100U<br />
HYSOL<br />
3329<br />
ABLESTIK<br />
ATB-100US<br />
(5, 10, 20µm)<br />
HYSOL<br />
UV8800M<br />
11
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
memory<br />
Memory and data storage are the key drivers of change<br />
in the Electronics industry. <strong>Semiconductor</strong> materials<br />
used in DRAM or flash memory devices include:<br />
Molding Compounds, Die Attach Pastes and Die Attach<br />
Films (for stack die applications).<br />
DRAM<br />
Die Attach Adhesives<br />
ABLEFLEX<br />
6200<br />
ABLEFLEX<br />
6202CX<br />
Flash Memory<br />
Die Attach<br />
Paste Adhesives<br />
Die Attach<br />
Film Adhesives<br />
Molding Compound<br />
ABLESTIK<br />
2025D-SF<br />
ABLESTIK<br />
ATB-100<br />
ABLESTIK<br />
ATB-100US<br />
HYSOL<br />
GR9810-1P<br />
HYSOL<br />
GR9851M<br />
12
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
Image sensors<br />
Image sensors are devices that are integrated into digital<br />
cameras, cell phones and other handheld devices where<br />
functionality dictates image capture capability. Image<br />
processors such as digital light processors (DLPs) are<br />
incorporated into projectors, televisions and, now, even<br />
into cell phones.<br />
Like all electronics, the trend in<br />
image sensor technology is the<br />
drive toward miniaturization, and<br />
also combines requirements for<br />
automatic focus and consumer<br />
affordability. From a materials<br />
point of view, image sensor assembly<br />
processes call for Adhesives that offer<br />
low temperature and fast cure, precise<br />
position and bondline control, and,<br />
in some cases, UV and transparency<br />
properties. Through the use of rheology<br />
control and filler technology, unique<br />
Adhesives have been designed to address<br />
the emerging requirements of image<br />
sensor assembly.<br />
Thermal Cure<br />
ABLEBOND<br />
8387B<br />
ABLEBOND<br />
8387BS<br />
ABLELUX<br />
LHA-2<br />
LOCTITE<br />
3128<br />
LOCTITE<br />
3129<br />
LOCTITE<br />
3220<br />
Image Sensor / Processor<br />
Module Assembly<br />
Lens Holder Attach / Lens<br />
Locking Materials<br />
UV Cure<br />
LOCTITE<br />
3751<br />
HYSOL<br />
UV3000<br />
LOCTITE<br />
UV8000<br />
UV / Thermal Cure<br />
ABLELUX<br />
A4502<br />
ABLELUX<br />
LA-1UV<br />
LOCTITE<br />
3131<br />
LOCTITE<br />
3217<br />
Image Sensor / Processor<br />
Package & Module<br />
Die Attach, Underfill &<br />
Glass Attach<br />
Die Attach<br />
Flip-Chip Bonding<br />
Wafer Level Assembly<br />
Glass Lid Attach<br />
ABLEBOND<br />
2035SC<br />
ABLEBOND<br />
GA-2W<br />
hysol<br />
qmi538nb<br />
HYSOL<br />
FP5110C<br />
HYSOL<br />
FP5201<br />
ABLELUX<br />
OGR150THTG<br />
13
<strong>Semiconductor</strong><br />
MaTERIALS<br />
As the only manufacturer with<br />
materials solutions for the entire<br />
semiconductor packaging value chain,<br />
<strong>Henkel</strong>’s proven and trusted semiconductor<br />
products provide superior manufacturing<br />
advantages. We simplify the supply chain by<br />
delivering exceptionally engineered products and a low-risk<br />
partnership proposition. Our forward-looking, innovative philosophy and<br />
global presence further enable your business by delivering next-generation<br />
technologies today and supporting them with knowledgeable, experienced<br />
worldwide staff.<br />
The full line of <strong>Henkel</strong> packaging materials includes Die Attach Paste<br />
Adhesives, Dicing Die Attach Films and Flow-Over-Wire (FOW) Films, Wafer<br />
Backside Coating (WBC) Die Attach Materials, Package Level Underfills,<br />
Encapsulants, Molding Compounds, Non-Conductive Pastes (NCPs) and Tacky<br />
Fluxes.<br />
Across the Board,<br />
Around the Globe.<br />
www.henkel.com/electronics<br />
14
<strong>Semiconductor</strong><br />
MaTERIALs<br />
DIE ATTACH PASTE ADHESIVES<br />
Die Attach Paste Adhesives<br />
Laminate Packages<br />
BGA, CSP, DRAM, Smart Card<br />
Leaded Packages<br />
SOIC, SOP, QFN, QFP, Discretes<br />
Die Attach Solder Paste<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Dispensable<br />
Printable<br />
ABLEBOND<br />
2000B<br />
ABLEBOND<br />
2025DSI<br />
ABLEBOND<br />
84-1LMISR4<br />
ABLEBOND<br />
2025DSI<br />
MULTICORE<br />
DA100<br />
MULTICORE<br />
DA101<br />
ABLEBOND<br />
2030SC<br />
ABLEBOND<br />
2033SC<br />
ABLEBOND<br />
84-1LMISR8<br />
ABLECOAT<br />
8006NS (WBC)<br />
ABLEBOND<br />
2100A<br />
ABLEBOND<br />
2035SC<br />
ABLEBOND<br />
3230<br />
ABLECOAT<br />
8008NC (WBC)<br />
ABLEBOND<br />
2300<br />
ABLESTIK<br />
2025D-SF<br />
ABLECOAT<br />
8008HT (WBC)<br />
ABLEBOND<br />
8900NC<br />
ABLEBOND<br />
8384<br />
ABLEBOND<br />
2053S<br />
ABLESTIK<br />
8008MD (WBC)<br />
ABLESTIK<br />
ABP-8910T<br />
ABLEBOND<br />
8387B<br />
ABLEFLEX<br />
6200<br />
ABLEBOND<br />
8200C<br />
HYSOL<br />
QMI536HT<br />
ABLEBOND<br />
8387BS<br />
ABLEFLEX<br />
6202CX<br />
ABLEBOND<br />
8200TI<br />
HYSOL<br />
QMI547<br />
ABLEBOND<br />
GA-2W<br />
ABLEBOND<br />
8290<br />
HYSOL<br />
QMI536HT<br />
ABLEBOND<br />
8352L<br />
HYSOL<br />
QMI538NB<br />
ABLEBOND<br />
FS849-TI<br />
ABLETHERM<br />
2600AT<br />
HYSOL<br />
QMI519<br />
HYSOL<br />
QMI529HT<br />
HYSOL<br />
QMI529HT-LV<br />
(WBC) = Wafer-Backside Coating<br />
15
<strong>Semiconductor</strong><br />
MaTERIALS<br />
DIE ATTACH ADHESIVES<br />
As higher-temperature processes are now the norm,<br />
semiconductor packaging materials must be able<br />
to withstand these stressful conditions while still<br />
maintaining their integrity and performance. To<br />
this end, <strong>Henkel</strong> has developed a full suite of Die<br />
Attach products that address the needs of varying<br />
die size and stack requirements, as well as Pb-free<br />
capability. Through the use of <strong>Henkel</strong>’s patented<br />
Bismaleimide (BMI) chemistry, superior Pb-free<br />
processing is achieved. Because the chemistry is<br />
ultrahydrophobic, <strong>Henkel</strong>’s Die Attach Adhesives<br />
deliver superior adhesive strength, elongation<br />
at break, and cohesive energy at high reflow<br />
temperatures. These characteristics enable <strong>Henkel</strong>’s<br />
Die Attach products to maintain adhesive strength<br />
and structural integrity during moisture soak and<br />
alleviate stresses induced by deformations associated<br />
with higher-temperature Pb-free reflow processing.<br />
<strong>Henkel</strong>’s advancements in materials technology<br />
have enabled the development of some<br />
revolutionary new Die Attach products with<br />
unprecedented performance characteristics.<br />
Ablestik Die Attach Paste Adhesives have been<br />
formulated to address multiple process conditions<br />
and application-specific requirements. From our<br />
traditional Ablestik Die Attach Pastes to Self-<br />
Filleting materials and controlled flow technique,<br />
as well as award-winning Wafer-Backside Coating<br />
(WBC) technologies and Multicore Die Attach Solder<br />
Paste for semiconductor power devices, <strong>Henkel</strong>’s<br />
Die Attach Paste solutions are unmatched.<br />
16
<strong>Semiconductor</strong><br />
MaTERIALS<br />
DIE ATTACH ADHESIVES<br />
LAMINATE PACKAGES: PBGA, CSP, DRAM, SMART CARD<br />
LAMINATE PACKAGES: ELECTRICALLY CONDUCTIVE<br />
PRODUCT DESCRIPTION WARPAGE, m MRT<br />
ELECTRICAL<br />
CONDUCTIVITY<br />
Thermal<br />
Conductivity,<br />
W/mK<br />
DISPENSABILITY<br />
CURE SCHEDULE<br />
ABLEBOND<br />
2000B<br />
Electrically conductive Die Attach Adhesive able to withstand<br />
high reflow temperatures.<br />
36 microns,<br />
PBGA, 500 x 500<br />
x 15 mils<br />
L3/L2-260 0.05 1.0 Good<br />
30 min. ramp to 175°C +<br />
15 min. @ 175°C<br />
ABLEBOND<br />
2030SC<br />
Die Attach Adhesive formulated for use in high throughput die<br />
attach applications.<br />
N/A<br />
No JEDEC<br />
requirement<br />
2 x 10 -4 2.3 Good 90 sec. @ 110°C<br />
ABLEBOND<br />
2100A<br />
ABLEBOND<br />
2300<br />
ABLEBOND<br />
8384<br />
ABLEBOND<br />
8387B<br />
ABLEBOND<br />
8387BS<br />
Die Attach Adhesive designed for Pb-free array packaging.<br />
Ultra-low moisture absorption, low stress adhesive.<br />
Die Attach Adhesive designed for smart card applications.<br />
For use in high throughput die attach applications.<br />
Single component Adhesive for high throughput bonding<br />
applications. It contains spacers 45um maximum for<br />
improved bondline control.<br />
17 microns,<br />
PBGA, 500 x 500<br />
x 15 mils<br />
37 microns,<br />
PBGA, 500 x 500<br />
x 15 mils<br />
45 microns,<br />
PBGA, 500 x 500<br />
x 15 mils<br />
35 microns,<br />
PBGA, 500 x 500<br />
x 15 mils<br />
L3 - 260 0.05 1.2 Good<br />
L3/<br />
L2 - 260<br />
5 x 10 -4 0.8 Good<br />
30 min. @ 175°C + 15 min.<br />
@ 175°C<br />
30 min. ramp to 175°C +<br />
15 min. @ 175°C<br />
N/A 0.03 1.1 Excellent 3 min. @ 130°C<br />
N/A N/A N/A Good 2 min. @ 150°C<br />
N/A N/A N/A N/A Good 2 min. @ 150°C<br />
LAMINATE PACKAGES: NON-ELECTRICALLY CONDUCTIVE<br />
PRODUCT DESCRIPTION WARPAGE, m MRT<br />
ELECTRICAL<br />
CONDUCTIVITY<br />
THERMAL<br />
CONDUCTIVITY,<br />
W/mK<br />
DISPENSABILITY<br />
CURE SCHEDULE<br />
ABLEBOND<br />
2025DSI<br />
Non-conductive, low bleed Adhesive. Good L2 - 260 N/A 0.4 Good<br />
30 min. ramp to 175°C<br />
+ 15 min. @ 175°C<br />
ABLEBOND<br />
2033SC<br />
Die Attach Adhesive for high throughput smart card<br />
bonding applications.<br />
N/A N/A N/A 0.35 Good 90 sec. @ 110°C<br />
ABLEBOND<br />
2035SC<br />
Die Attach Adhesive for use in high throughput die<br />
attach applications.<br />
34 microns,<br />
PBGA, 500 x 500<br />
x 15 mils<br />
N/A N/A 0.35 Good 90 sec. @ 110°C<br />
ABLESTIK<br />
2025D-SF<br />
NC Die Attach for use in controlled flow applications,<br />
e.g., FOW.<br />
4 x 300 x 300 mil<br />
Si die on PBGA -<br />
14 MICRONS<br />
L2 - 260 N/A 0.4 Average<br />
30 min. ramp to 175°C<br />
+ 15 min. @ 175°C<br />
ABLEBOND<br />
2053S<br />
Low stress Adhesive for die-to-substrate applications. N/A L2 - 260 N/A N/A Good<br />
30 min. ramp to 175°C<br />
+ 15 min. @ 175°C<br />
ABLEBOND<br />
GA-2W<br />
Single component Adhesive is designed for CCD/CMOS die<br />
attach bonding applications. Unique properties include ultralow<br />
modulus for low stress and chip warpage.<br />
N/A N/A N/A N/A Excellent<br />
30 min. ramp<br />
+ 15 min. @ 175ºC<br />
ABLEFLEX<br />
6200<br />
B-Stageable, Printable Paste with low moisture uptake<br />
and bleed.<br />
N/A L2 - 260 N/A N/A N/A<br />
B-stage + 60 min.<br />
@ 175°C<br />
ABLEFLEX<br />
6202CX<br />
B-Stageable Adhesive for use in laminate-based packages<br />
and stencil printing.<br />
N/A L3 - 260 N/A N/A N/A<br />
30 min. ramp from 30°C to<br />
90°C, hold 60 min.<br />
HYSOL<br />
QMI536HT<br />
HYSOL<br />
QMI538NB<br />
Ideal for mixed stacked die applications. Non-die<br />
damaging filler.<br />
N/A L3 - 260 1 x 10 13 0.9 Excellent<br />
Non-conductive Paste for leadframe applications. N/A L2 - 260 1 x 10 13 0.4 Excellent<br />
≥ 8 sec. @ 150°C<br />
(SkipCure) 15 min.<br />
@ 150°C (Oven)<br />
≥ 10 sec. @ 200°C<br />
(SkipCure) 30 min.<br />
@ 175°C (Oven)<br />
17
<strong>Semiconductor</strong><br />
MaTERIALS<br />
DIE ATTACH ADHESIVES<br />
LEADED PACKAGES: SOP, SOIC, QFN, QFP, DISCRETES<br />
LEADED PACKAGES: ELECTRICALLY CONDUCTIVE<br />
PRODUCT<br />
DESCRIPTION<br />
FINISH (Ag,<br />
Cu, Au)<br />
MRT<br />
ELECTRICAL<br />
CONDUCTIVITY<br />
THERMAL<br />
CONDUCTIVITY,<br />
W/mK<br />
DISPENSABILITY<br />
CURE SCHEDULE<br />
ABLEBOND<br />
84-1LMISR4<br />
Industry standard Die Attach Adhesive. Ag, Cu, Au L3 - 260 1 x 10 -4 2.5 Excellent 60 min. @ 175°C<br />
ABLEBOND<br />
84-1LMISR8<br />
Electrically Conductive Adhesive designed for power applications<br />
that use Cu leadframes.<br />
Cu L1 - 260 4.8 x 10 -5 6.85 Excellent 1 hour @ 175°C<br />
ABLEBOND<br />
3230<br />
Low stress epoxy Die Attach Adhesive suitable for various<br />
package sizes.<br />
Cu L3 - 260 5 x 10 -2 0.3 Good<br />
≥ 8 sec. @ 150°C<br />
(SkipCure ) 15 min. @<br />
150°C (Oven)<br />
ABLECOAT<br />
8008HT (WBC)<br />
High electrical and thermal conductivity die attach adhesive.<br />
Excellent temperature resistance.<br />
Ag, Cu, Au L1 - 260 6 x 10 -5 11 Stencil Print<br />
B-stage + 20 sec. @<br />
280°C<br />
ABLESTIK<br />
8008MD (WBC)<br />
ABLEBOND<br />
8200C<br />
Adhesive designed for medium Die Attach applications Ag, Au L1 - 260 5 x 10 -4 6 Stencil Print<br />
Low bleed Adhesive for pre-plated and Silver (Ag) leadframe. Ag, Cu, Au L1 - 260 2 x 10 -4 1.2 Good<br />
B-stage + 60 min. @<br />
175°C<br />
30 min. ramp to 175°C<br />
+ 15 min. @ 175°C<br />
ABLEBOND<br />
8200TI<br />
8200C with higher thermal conductivity and optimized adhesion on<br />
Nickel-Palladium-Gold (NiPdAu) leadframe.<br />
Ag, Cu, Au L1 - 260 5 x 10 -5 3.5 Good<br />
30 min. ramp to 175°C<br />
+ 15 min. @ 175°C<br />
ABLEBOND<br />
8290<br />
Low stress Die Attach Adhesive suitable for die size
<strong>Semiconductor</strong><br />
MaTERIALS<br />
DIE ATTACH ADHESIVES<br />
LEADED PACKAGES: SOP, SOIC, QFN, QFP, DISCRETES<br />
LEADED PACKAGES: NON-ELECTRICALLY CONDUCTIVE<br />
PRODUCT<br />
ABLEBOND<br />
2025DSI<br />
DESCRIPTION<br />
FINISH (Ag,<br />
Cu, Au)<br />
MRT<br />
ELECTRICAL<br />
CONDUCTIVITY<br />
THERMAL<br />
CONDUCTIVITY,<br />
W/mK<br />
DISPENSABILITY<br />
Non-conductive, low bleed Adhesive. Ag, Cu, Au L2 - 260 N/A 0.4 Good<br />
CURE SCHEDULE<br />
30 min. ramp to 175°C<br />
+ 15 min. @ 175°C<br />
ABLECOAT<br />
8006NS (WBC)<br />
Non-conductive, oven cure Adhesive utilizing WBC technology. Ag, Cu, Au L1 - 260 N/A 0.4<br />
Screen or Stencil<br />
Print<br />
B-stage + 120 min. @ 160°C<br />
ABLECOAT<br />
8008NC (WBC)<br />
Non-conductive, snap cure Adhesive utilizing WBC technology. Ag, Cu, Au L1 - 260 N/A 0.5 Stencil Print B-stage + 60 sec. @ 230°C<br />
ABLEBOND<br />
8900NC<br />
Non-conductive, epoxy Die Attach Adhesive is designed for in-line snap<br />
cure processing or fast cure operations in conventional box ovens. This<br />
high strength Adhesive is moderately stress-absorbing, and intended for<br />
small-to-medium size packages.<br />
Ag, Cu, PdCu N/A 2.3 x 10 13 0.3 Excellent<br />
30 min. ramp to 175°C<br />
+ 15 min. @ 175°C<br />
ABLESTIK<br />
ABP-8910T<br />
Self-filleting Adhesive for same die stacking applications that require<br />
100% coverage.<br />
N/A L3 - 260 1 x 10 13 0.3 Excellent<br />
30 min. ramp to 150°C<br />
+ 30 min. @ 150°C<br />
HYSOL<br />
QMI536HT<br />
HYSOL<br />
QMI547<br />
For component or die attach where very high electrical and thermal<br />
conductivity is required. Suitable for high heat dissipation devices and<br />
solder replacement applications.<br />
Ag, Au L1 - 260 4 x 10 -5 7 Fair<br />
Fluoropolymer-filled, Non-conductive Adhesive. Au, Ag, Cu L3 - 260 1 x 10 13 0.3 Excellent<br />
≥ 60 sec. @ 185°C<br />
(SkipCure) 30 min. @ 185°C<br />
(Oven)<br />
≥8 sec. @ 150°C (SkipCure)<br />
15 min. @ 150°C (Oven)<br />
DIE ATTACH SOLDER PASTE: DISPENSABLE<br />
PRODUCT DESCRIPTION APPLICATION VISCOSITY, cPs ALLOY REFLOW CLEANABILITY<br />
IPC/J-STD-004<br />
CLASSIFICATION<br />
MULTICORE<br />
DA100<br />
Flux designed for Solder Die Attach Paste applications.<br />
Effective thermal control for Cu leadframe power<br />
semiconductor devices, such as rectifiers, power transistors,<br />
and for automotive and consumer packages.<br />
Dispensing 250,000 High Pb Forming Fast Excellent ROL0<br />
DIE ATTACH SOLDER PASTE: PRINTABLE<br />
PRODUCT DESCRIPTION APPLICATION VISCOSITY, cPs ALLOY REFLOW CLEANABILITY<br />
IPC/J-STD-004<br />
CLASSIFICATION<br />
MULTICORE<br />
DA101<br />
Flux designed for Solder Die Attach Paste applications.<br />
Effective thermal control for Cu leadframe power<br />
semiconductor devices, such as rectifiers, power transistors,<br />
and for automotive and consumer packages.<br />
Printing 250,000 High Pb Forming Fast Excellent ROL0<br />
19
<strong>Semiconductor</strong><br />
Market MaTERIALS <strong>Solutions</strong><br />
Discrete DIE ATTACH Market films<br />
As die become thinner and stacked die applications<br />
continue to grow, even more advanced technology in<br />
the form of Die Attach Film is required. <strong>Henkel</strong>’s Nonconductive<br />
Die Attach Films combine the properties<br />
and functions of Die Attach Film and dicing tape<br />
into a single product and eliminate the need for any<br />
dispensing or curing equipment or processes, as curing<br />
takes place during the molding process.<br />
The control, uniformity and wafer stability film<br />
processes offered for emerging thinned wafer<br />
applications are unmatched, and <strong>Henkel</strong>’s Ablestik<br />
products are leading the way. In fact, our development<br />
efforts have recently enabled a breakthrough<br />
formulation for Conductive Die Attach Film. The<br />
Ablestik C100 series of Conductive Films allow<br />
leadframe package manufacturers to enjoy the<br />
same advantages that film-based products offer in<br />
comparison to traditional paste processes. Proven on<br />
die sizes ranging from less than 0.5mm x 0.5mm up to<br />
6mm x 6mm for a variety of package types including<br />
both QFNs and QFPs, Ablestik C100 Die Attach Films<br />
will deliver the processing support and stability<br />
required for today’s thinner die.<br />
Die Attach Film Adhesives<br />
Die Attach Film Adhesives<br />
Non-Conductive DDF<br />
Conductive Film<br />
ABLESTIK<br />
C100<br />
DA1<br />
DAX<br />
ABLESTIK<br />
C115<br />
ABLESTIK<br />
C130<br />
ABLESTIK<br />
ATB-100 (20, 30µm)<br />
ABLESTIK<br />
ATB-100<br />
ABLESTIK ATB-100U<br />
(20, 30µm)<br />
ABLESTIK<br />
ATB-100U<br />
Curable DDF<br />
Skip Cure DDF<br />
ABLESTIK ATB-<br />
100US (20, 25, 30µm)<br />
ABLESTIK<br />
ATB-100US<br />
ABLESTIK<br />
ATB-100A<br />
20
<strong>Semiconductor</strong><br />
Market MaTERIALS <strong>Solutions</strong><br />
Discrete DIE ATTACH Market films<br />
Non-conductive DDF: DA1<br />
PRODUCT<br />
DESCRIPTION<br />
FILM<br />
THICKNESS, µm<br />
UV Dicing<br />
Tape<br />
MRT<br />
CTE °C (Below<br />
Tg/Above Tg)<br />
Cure Type<br />
CURE SCHEDULE<br />
ABLESTIK<br />
ATB-100<br />
Single layer format. 30, 40 No L3 - 260 46/139 Cure<br />
30 min. @ 100°C<br />
+ 30 min. @ 120°C<br />
ABLESTIK<br />
ATB-100U<br />
ABLESTIK<br />
ATB-100US<br />
Single layer format, fast cure and high flowability for DA on rough<br />
surface application.<br />
Non-conductive 2-in-1 Dicing Tape Die Attach Film with good bondline<br />
thickness control. Will not bleed and does not require cure prior<br />
wirebonding. Excellent thin die pickup.<br />
20, 30 No L2 - 260 63/238 Cure 30 min. @ 120°C<br />
20, 25, 30 No L2-260 81/N/A SkipCure N/A<br />
Non-conductive DDF: DAX<br />
PRODUCT<br />
DESCRIPTION<br />
FILM<br />
THICKNESS, µm<br />
UV Dicing<br />
Tape<br />
MRT<br />
CTE °C (Below<br />
Tg/Above Tg)<br />
Cure Type<br />
CURE SCHEDULE<br />
ABLESTIK<br />
ATB-100<br />
Single layer format. 20 No L2 - 260 46/139 Cure<br />
30 min. @ 100°C<br />
+ 30 min. @ 120°C<br />
ABLESTIK<br />
ATB-100A<br />
Excellent pick-up performance with PSA D/T and controlled flow<br />
for die stacking.<br />
5, 10, 20 No L2 - 260 62/224 Cure<br />
30 min. @ 100°C<br />
+ 30 min. @ 120°C<br />
ABLESTIK<br />
ATB-100U<br />
Single layer format with fast cure. 5, 10, 20 No L2 - 260 63/238 Cure 30 min. @ 120°C<br />
ABLESTIK<br />
ATB-100US<br />
Non-conductive 2-in-1 Dicing Tape Die Attach Film with good bondline<br />
thickness control. Will not bleed and does not require cure prior<br />
wirebonding. Excellent thin die pickup.<br />
5, 10, 15, 20 No L2-260 81/N/A SkipCure N/A<br />
Conductive Films<br />
PRODUCT<br />
DESCRIPTION<br />
FILM<br />
THICKNESS, µm<br />
UV Dicing<br />
Tape<br />
MRT<br />
CTE °C (Below<br />
Tg/Above Tg)<br />
Cure Type<br />
CURE SCHEDULE<br />
ABLESTIK<br />
C115<br />
Die Attach Adhesive Film is suitable for tight geometry (
<strong>Semiconductor</strong><br />
MaTERIALS<br />
Conductive Pastes<br />
and Coatings<br />
<strong>Henkel</strong> offers a wide range of electrically Conductive<br />
Paste Adhesives, Silver (Ag)-filled Coatings and<br />
graphite-filled Coatings for passive component<br />
assembly. These Adhesives and Coatings provide the<br />
performance and reliability needed to withstand<br />
the high thermal and physical stresses experienced<br />
during both assembly and operation. We offer two-part<br />
Conductive Paste Adhesives that provide long shelf life<br />
at room temperature, as well as one-part Conductive<br />
Paste Adhesives that provide the convenience of a premixed<br />
reactive system. Our Adhesives are commonly<br />
used to form the bond between the leadframe and<br />
the capacitor itself. We also offer high performance<br />
Silver (Ag)-filled coatings and graphite-filled coatings.<br />
These coatings are typically used to form a contact<br />
layer, usually applied by dipping. We have the most<br />
extensive product range of any supplier to satisfy the<br />
widest range of application requirements.<br />
Conductive Pastes & Coatings<br />
for Passive Components<br />
Conductive Pastes<br />
Silver (Ag) Coatings<br />
Graphite Coatings<br />
ECCOBOND<br />
C860-1J<br />
ECCOBOND<br />
CE3513<br />
ECCOBOND<br />
CE3804 A/B<br />
ECCOBOND<br />
CE3920<br />
ECCOCOAT<br />
C110<br />
ECCOCOAT<br />
C110-5-4<br />
ECCOCOAT<br />
CP8825<br />
AQUADAG<br />
22<br />
AQUADAG<br />
E/18%<br />
DAG<br />
1050<br />
ELECTRODAG<br />
503<br />
ELECTRODAG<br />
PR406<br />
22
<strong>Semiconductor</strong><br />
MaTERIALS<br />
Conductive Pastes<br />
and Coatings<br />
conductive pastes<br />
PRODUCT DESCRIPTION CURE TYPE CURE SCHEDULES<br />
ECCOBOND<br />
C860-1J<br />
ECCOBOND<br />
CE3513<br />
ECCOBOND<br />
CE3804 A/B<br />
ECCOBOND<br />
CE3920<br />
One component, Ag-filled Epoxy Adhesive.<br />
Heat Cure<br />
15 - 60 min.<br />
@ 180°C - 240°C<br />
VISCOSITY<br />
(cPs)<br />
VOLUME RESISTIVITY<br />
(OHM.CM)<br />
SHELF LIFE<br />
POT LIFE<br />
56,000 1.4 x 10 -4 6 months @ 0°C 3 weeks<br />
One component, Ag-filled Epoxy Adhesive. Heat Cure 20 min. @ 150°C 35,000 - 45,000 2 x 10 -4 6 months @<br />
-18°C - 40°C<br />
Electrically Conductive Epoxy Adhesive for microelectronics.<br />
Electrically Conductive Adhesive for thin film PV assembly<br />
with superior contact resistance stability. Viscosity optimized<br />
for dispensing.<br />
Heat Cure<br />
30 min. @ R.T.<br />
+ 30 min. @ 170°C<br />
+ 30 - 60 min. @ 150°C<br />
7,000 6.4 x 10 -4 R.T. Part B 6 months in<br />
Part A- 5 months @<br />
refrigerator<br />
>2 weeks @<br />
18°C - 25°C<br />
Heat Cure 3 min. @ 150°C 26,000 8.0 x 10 -4 Part A- 5 months @ R.T. 3 days<br />
N/A<br />
Silver (Ag) Coatings<br />
PRODUCT DESCRIPTION CURE TYPE CURE SCHEDULES<br />
ECCOCOAT<br />
C110<br />
ECCOCOAT<br />
C110-5-4<br />
ECCOCOAT<br />
CP8825<br />
One component, non-bleeding, solvent-based, flexible,<br />
Ag-filled Epoxy Coating.<br />
VISCOSITY<br />
(cPs)<br />
VOLUME RESISTIVITY<br />
(OHM.CM)<br />
SHELF LIFE<br />
POT LIFE<br />
Heat Cure 60 min. @ 150°C 27,000 - 33,000 4 x 10 -4 12 months @ 0°C - 8°C 2 months<br />
Lower viscosity version of C110. Heat Cure 60 min. @ 150°C 1,600 - 1,900 9 x 10 -5 12 months @ 0°C - 8°C 2 months<br />
Electrically conducting, acrylic, Ag Coating. Heat Cure N/A N/A 5 x 10 -4 6 months N/A<br />
graphite coatings<br />
PRODUCT DESCRIPTION APPLICATION CURE SCHEDULES<br />
AQUADAG<br />
22<br />
AQUADAG<br />
E/18%<br />
Colloidal graphite in water.<br />
Outstanding film-forming properties on a wide variety of materials.<br />
Electrically Conductive Coatings for<br />
electrical and electronic uses<br />
Impregnation or coating of gaskets<br />
for antiherent properties<br />
SHEET RESISTANCE -<br />
OHM/SQUARE/25µ<br />
SHELF LIFE<br />
4 min. @ 200°C 500 Ohm/square 12 months<br />
5 min. @ 150°C 30 Ohm/square 24 months<br />
DAG<br />
1050<br />
ELECTRODAG<br />
503<br />
Aqueous dispersion of high purity micro-graphite for applications<br />
in the manufacturing of capacitors and batteries.<br />
Specially designed for use as a counter electrode Ag paint for<br />
solid Ta capacitors in high temperature applications.<br />
Capacitors and batteries N/A N/A 12 months<br />
Solid Ta capacitors Air dry for four hours 0.05 24 months<br />
ELECTRODAG<br />
PR406<br />
Carbon polymer, thick film ink. Excellent solder resistance,<br />
cohesion, solvent resistance.<br />
Cu contact protection, conductive<br />
pads and jumpers, printed resistors<br />
30 min. @ 150°C
<strong>Semiconductor</strong><br />
MaTERIALS<br />
UNDERFILLs<br />
The shrinking footprint of modern handheld<br />
and mobile products in tandem with the higher<br />
temperature processing demands for advanced<br />
devices has necessitated development of new underfill<br />
technologies that deliver improved shock resistance<br />
and enhanced device reliability.<br />
<strong>Henkel</strong>’s package-level Underfill systems have<br />
been engineered to deliver robust performance<br />
characteristics while meeting stringent JEDEC testing<br />
requirements and ensuring Pb-free compatibility.<br />
With an unyielding focus on quality and performance,<br />
all Hysol Underfills are developed for demanding<br />
end-use requirements including low warpage/low<br />
stress, fine pitch, high reliability and high adhesion.<br />
With a wide variety of formulations from which to<br />
choose, Hysol Underfills have emerged as the premier<br />
industry standard for flip-chip (FC) applications, and<br />
are used in devices such as FC CSPs and FC BGAs for<br />
ASICs, chipsets, graphic chips, microprocessors and<br />
digital signal processors. Formulated with superior<br />
characteristics like fast flow and excellent adhesion,<br />
<strong>Henkel</strong>’s Underfills exhibit no cracking after thermal<br />
shock or thermal cycling.<br />
With Underfills for low Potassium/Copper (K/Cu) die,<br />
materials with tremendously long working lives,<br />
SnapCure processing alternatives, fluxing no-flow<br />
Underfills and high thermal Underfills, our portfolio<br />
of leading edge products continues to get broader and<br />
deeper. The next generation of amine-based Underfill<br />
systems have been introduced and the advantages<br />
are many: <strong>Henkel</strong>’s amine Underfill systems deliver<br />
excellent adhesion to Silicon Nitrogen (SiN) and<br />
polyimide and, when tested against competitive<br />
Underfills, provided superior performance. These nextgeneration<br />
Underfill systems are designed to deliver<br />
lower stress with a unique combination of thermal<br />
mechanical characteristics to prevent delamination,<br />
bump fatigue and Under Bump Metallization (UBM)<br />
failure.<br />
Underfills<br />
Capillaries<br />
No Flow for Small Die Applications<br />
High Lead Packages<br />
DSP, Processor,<br />
ASICs<br />
Pb-Free<br />
Packages<br />
Over-Molded<br />
Flip-Chip<br />
Flip-Chip<br />
on Flex<br />
HYSOL<br />
FP4545FC<br />
ABLEFILL<br />
UF8806G<br />
ABLEFILL<br />
UF8828<br />
HYSOL<br />
FP4583<br />
HYSOL<br />
DC0114<br />
Eutectics<br />
HYSOL<br />
FP4549<br />
HYSOL<br />
FP4583<br />
ABLEFILL<br />
UF8826<br />
ABLEFILL<br />
UF8829<br />
HYSOL<br />
FP4585<br />
HYSOL<br />
FP4585<br />
HYSOL<br />
FP0114<br />
HYSOL<br />
FP4526<br />
HYSOL<br />
FF2200<br />
HYSOL<br />
FP4585<br />
HYSOL<br />
FP4530<br />
HYSOL<br />
FP4531<br />
No-Lead (Pb)<br />
Packages<br />
Fast Cure, Non-JEDEC<br />
Die Edge Coating (DEC)<br />
FCOB/FCOF<br />
Package Level, Longer Cure<br />
New Generation Amine<br />
HYSOL<br />
FP4549<br />
HYSOL<br />
FP4549HT<br />
HYSOL<br />
FF2300<br />
24
<strong>Semiconductor</strong><br />
MATERIALS<br />
UNDERFILLs<br />
CAPILLARY<br />
PRODUCT DESCRIPTION FLOW SPEED VISCOSITY, cPs Tg, °C<br />
CTEa1,<br />
ppm/°C<br />
MODULUS,<br />
GPa<br />
% Filler<br />
RECOMMENDED<br />
CURE<br />
HYSOL<br />
FP4545FC<br />
HYSOL<br />
FP4549<br />
HYSOL<br />
FP4583<br />
ABLEFILL<br />
UF8806G<br />
ABLEFILL<br />
UF8826<br />
ABLEFILL<br />
UF8828<br />
ABLEFILL<br />
UF8829<br />
HYSOL<br />
FP4585<br />
HYSOL<br />
DC0114<br />
HYSOL<br />
FP0114<br />
HYSOL<br />
FP4526<br />
HYSOL<br />
FP4530<br />
HYSOL<br />
FP4531<br />
HYSOL<br />
FP4549HT<br />
Flux Compatible, high purity, Flip-Chip Underfill for high Pb<br />
applications.<br />
Fast-flowing, low stress Underfill for fine-pitch<br />
flip-chip applications.<br />
Fast 9,000 115 30 7.1 55 60 min. @ 165°C<br />
Very Fast 2,300 140 45 5.5 50 30 min. @ 165°C<br />
High purity, FC Underfill, high Pb applications. Fast 14,000 79 40 6.9 57 120 min. @ 165°C<br />
Moisture resistant. For die sizes
<strong>Semiconductor</strong><br />
Materials<br />
UNDERFILLs<br />
All Hysol Non-Conductive Paste (NCP) Encapsulants<br />
are designed to deliver exceptionally high<br />
reliability for flip-chip in package applications.<br />
The materials provide superior moisture and<br />
thermal cycling resistance for thermal compression<br />
bonding processes and meet stringent JEDEC level<br />
testing standards, while allowing for outstanding<br />
performance even in high temperature Pb-free<br />
environments.<br />
The inherent benefits of thermal compression<br />
bonding using <strong>Henkel</strong>’s unique NCP technology<br />
are many. NCP enables an alternative to traditional<br />
Controlled Collapse Chip Connection (C4) soldering<br />
by bonding bumps to the substrate through an<br />
innovative Pb-free compatible thermal compression<br />
process, thus simplifying flip-chip assembly by<br />
eliminating the need for flux application, reflow<br />
and cleaning in most cases.<br />
And now, through a new <strong>Henkel</strong>-patented process<br />
called Accelerated Cooling (AC), the effectiveness<br />
of Hysol NCPs are further enhanced. Unlike<br />
conventional thermal compression processes where<br />
the NCP material is applied onto the substrate and<br />
subsequent heating and compressing of the device<br />
occur, <strong>Henkel</strong>’s AC process heats the device while<br />
it is secured by the flip-chip bonder head and then<br />
is rapidly cooled during compression onto the<br />
NCP-coated substrate. This rapid cooling process<br />
enables assembly completion prior to any excess<br />
heat exposure and, consequently, reduces package<br />
warpage, voids caused by moisture, and assembly<br />
cycle time.<br />
NCP for Thermal Compression Bonding<br />
Laminate Packages<br />
CSP, SCSP, SIP<br />
Flip-Chip on Flex Circuits<br />
(FCOF)<br />
RFID, Misc, Assembly<br />
HYSOL<br />
FP5000<br />
HYSOL<br />
FP5001<br />
HYSOL<br />
FP5201<br />
HYSOL<br />
FP5110C<br />
HYSOL<br />
FP5110C<br />
HYSOL<br />
FP5300<br />
HYSOL<br />
FP5500<br />
LAMINATE PACKAGES: CSP, SCSP,SIP<br />
PRODUCT DESCRIPTION SUBSTRATE<br />
VISCOSITY,<br />
cPs<br />
Tg, °C<br />
CTEa1,<br />
ppm/°C<br />
MODULUS,<br />
DMA<br />
CURE<br />
SCHEDULE<br />
STORAGE<br />
TEMP<br />
SHELF LIFE<br />
HYSOL<br />
FP5000<br />
Excellent MSL and PCT resistance. Compatible with both constant<br />
and pulse heat tool. Recommended for Au/Au assembly joint.<br />
Laminate 80,000 15,000 150 20 - 50 ppm 8.2 GPa<br />
4 sec. @<br />
240°C<br />
-15°C<br />
12 months<br />
HYSOL<br />
FP5001<br />
Excellent thermal cycling resistance. Compatible with both<br />
constant and pulse heat tool. Recommended for Au/Au<br />
assembly joint.<br />
Laminate 25,000 75,000 150 15 - 45 ppm 7.9 GPa<br />
4 sec. @<br />
240°C<br />
-15°C<br />
12 months<br />
HYSOL<br />
FP5201<br />
Designed for laminate assembly using Cu pillar interconnect. Laminate 21,000 87 31 ppm 5.8 GPa<br />
4 sec. @<br />
240°C<br />
-15°C<br />
6 months<br />
HYSOL<br />
5110C<br />
Heat cure material designed for FCOF applications using both<br />
plated and stud bump.<br />
Flexible Printed Circuits 28,000 111 54 ppm 4.0 GPa<br />
4 sec. @<br />
250°C<br />
-15°C<br />
6 months<br />
HYSOL<br />
FP5300<br />
Excellent adhesion strength to 2- and 3-layer flexible printed<br />
circuits as well as laminates. Low temperature cure ACP.<br />
Flexible Printed Circuits and<br />
Laminates<br />
61,000 126 47 ppm 5.9 GPa<br />
8 sec. @<br />
180°C<br />
-15°C<br />
6 months<br />
HYSOL<br />
FP5500<br />
Heat cure material designed for ACP process by thermal<br />
compression.<br />
RFID, Flip-Chip on Laminate,<br />
Flex on Laminate<br />
40,000 121 51 ppm 4.6 GPa<br />
4 sec. @<br />
200°C<br />
-15°C<br />
6 months<br />
26
<strong>Semiconductor</strong><br />
MaTERIALS<br />
encapsulants<br />
Ease of use is a hallmark of all of <strong>Henkel</strong>’s Hysol<br />
brand encapsulation materials, ensuring in-process<br />
simplicity and outstanding long-term performance.<br />
Delivering the ultimate in chip protection, Hysol’s<br />
high purity liquid epoxy encapsulants work<br />
together as dam-and-fill materials for bare chip<br />
encapsulation, providing Gold (Au) wire, Aluminum<br />
(Al), Silicon (Si) die and low-Potassium (K) die<br />
protection from the effects of mechanical damage<br />
and corrosion. For manufacturing environments<br />
that require single material solutions, we have also<br />
formulated a variety of single material glob tops.<br />
Hysol high-purity Encapsulants are available as<br />
self-leveling materials that deliver unmatched<br />
performance for a variety of products including<br />
transistors, System-in-Package (SiP), microprocessors<br />
and ASICs. When there is not a strict limit on overall<br />
package height, cycle time and costs can be reduced<br />
through the use of Hysol single material glob tops.<br />
Like all <strong>Henkel</strong> materials, Hysol liquid Encapsulants<br />
are formulated and tested in-process, and in the<br />
context of full package assembly. They meet the<br />
most stringent JEDEC-level testing requirements<br />
and are developed to deliver outstanding<br />
performance within high temperature, Pb-free<br />
environments. Ever-conscious of environmental<br />
regulations and end-use requirements, Hysol green<br />
Encapsulant materials have been engineered to<br />
meet the needs of demanding applications.<br />
<strong>Semiconductor</strong> Encapsulants<br />
Package Level<br />
Discretes, Fill Materials<br />
Lid Attach<br />
Dam Materials<br />
Fill Materials<br />
MAP Low Stress<br />
Non-Conductive<br />
Conductive<br />
HYSOL<br />
3323<br />
HYSOL<br />
3327<br />
HYSOL<br />
FP4450HF<br />
HYSOL CB064 /<br />
HYSOL FP4653<br />
HYSOL FP0087<br />
Button Diode<br />
ABLEBOND<br />
3003<br />
ABLEBOND<br />
3188<br />
HYSOL<br />
FP4451<br />
HYSOL<br />
3329<br />
HYSOL<br />
FP4450LV<br />
HYSOL<br />
FP4651<br />
ABLEBOND<br />
3005<br />
HYSOL<br />
FP4451TD<br />
HYSOL<br />
CB0260<br />
HYSOL<br />
FP4460<br />
HYSOL<br />
FP4652<br />
ABLEBOND<br />
MC723<br />
HYSOL<br />
FP6401<br />
HYSOL<br />
CB0260-1<br />
HYSOL<br />
UV8800M<br />
HYSOL<br />
FP4654<br />
Non-Green Product<br />
HYSOL CB064 /<br />
HYSOL FP4653<br />
HYSOL<br />
FP4470<br />
Green Product<br />
*All products above are High Reliability Anhydride<br />
HYSOL<br />
FP4450<br />
HYSOL<br />
FP4654<br />
27
<strong>Semiconductor</strong><br />
MaTERIALS<br />
ENCAPSULANTS<br />
PACKAGE LEVEL: Lid Attach-Conductive<br />
PRODUCT DESCRIPTION VISCOSITY, CpS Tg, °C<br />
THERMAL<br />
CONDUCTIVITY,W/MK<br />
MODULUS, GPA<br />
RECOMMENDED CURE<br />
ABLEBOND<br />
3188<br />
Low modulus, Ag-filled, high thermal lid attach material. 15,000 -41 5.4 3<br />
90 min. @ 100°C<br />
+ 60 min. @ 150°C<br />
PACKAGE LEVEL: lid attach-Non-Conductive<br />
PRODUCT<br />
DESCRIPTION<br />
VISCOSITY,<br />
CpS<br />
Tg, °C<br />
THERMAL<br />
CONDUCTIVITY,W/MK<br />
MODULUS, GPA<br />
RECOMMENDED CURE<br />
ABLEBOND<br />
3003<br />
Low modulus, high adhesion, ultra-low moisture lid attach material. 35,000 N/A 1.0 4<br />
90 min. @ 100°C<br />
+ 60 min. @ 150°C<br />
ABLEBOND<br />
3005<br />
Low modulus, high adhesion, ultra-low moisture, long work life, lid attach material. 37,000 -15 0.5 0.4<br />
Ramp 30 min. to 150°C<br />
+ 30 min. hold @ 150°C<br />
ABLEBOND<br />
MC723<br />
Fast cure, high adhesion, ultra-low moisture, long work life, lid attach material. 57,000 N/A 8 3.3<br />
Ramp 30 min. to 150°C<br />
+ 30 min. hold @ 150°C<br />
PACKAGE LEVEL: DAM MATERIALS<br />
PRODUCT DESCRIPTION FLOW SPEED<br />
HYSOL<br />
3323<br />
Developed for encapsulation of wire bonded dies, used for Smart Card IC<br />
modules. It is designed for use only with Hysol UV fill encapsulants, such as<br />
Hysol 3327 and 3329.<br />
VISCOSITY,<br />
cPs<br />
Tg, °C<br />
CTEa1,<br />
ppm/°C<br />
% FILLER RECOMMENDED CURE<br />
N/A 27,500 140 45 43 30 sec. @ 365 nm (UVA)<br />
HYSOL<br />
FP4451<br />
Industry standard damming material for BGAs. N/A 860,000 155 22 72<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
HYSOL<br />
FP4451TD<br />
Tall dam version of FP4451 for applications requiring a taller, narrower dam.<br />
Ionically cleaner also.<br />
N/A 300,000 150 21 73<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
HYSOL<br />
FP6401<br />
Zero stress dam for ceramic or large array packages. N/A 300,000 15 77 9 30 min. @ 125°C<br />
28
<strong>Semiconductor</strong><br />
Materials<br />
ENCAPSULANTS<br />
PACKAGE LEVEL: FILL MATERIALS<br />
PRODUCT DESCRIPTION FLOW SPEED<br />
VISCOSITY,<br />
cPs<br />
Tg, °C<br />
CTEa1,<br />
ppm/°C<br />
% FILLER RECOMMENDED CURE<br />
HYSOL<br />
3327<br />
HYSOL<br />
3329<br />
Developed for encapsulation of wire bonded dies, used for Smart Card IC<br />
modules. It is designed for use only with Hysol UV dam encapsulants, such as<br />
Hysol 3323.<br />
Developed for encapsulation of wire bonded dies, used for Smart Card IC<br />
modules. It is designed for use only with Hysol UV dam encapsulants, such as<br />
Hysol 3323.<br />
N/A 8,000 110 45 40 30 sec. @ 365 nm (UVA)<br />
N/A 8,000 150 45 40 30 sec. @ 365 nm (UVA)<br />
HYSOL<br />
CB0260<br />
HYSOL<br />
CB0260-1<br />
HYSOL CB064 /<br />
FP4653<br />
HYSOL<br />
FP4450<br />
High adhesion version of FP4450 for 260°C L3 JEDEC performance. High 40,000 145 18 74<br />
High adhesion version of FP4450 for 260°C L2A JEDEC performance. High 40,000 149 18 74<br />
Ultra low CTE, low stress version of FP4450 for large array packages. Low 80,000 150 8 86<br />
Industry standard fill material for dam and fill or cavity down BGAs. Medium 43,900 155 22 73<br />
1 hr. @ 110°C<br />
+ 2 hrs. @ 160°C<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
2 hrs. @ 110°C<br />
+ 2 hrs. @ 160°C<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
HYSOL<br />
FP4450HF<br />
High flow version of FP4450LV using synthetic filler for use in fine wire and low<br />
alpha application.<br />
Very High 32,000 164 21 73<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
HYSOL<br />
FP4450LV<br />
HYSOL<br />
FP4460<br />
HYSOL<br />
FP4470<br />
HYSOL<br />
FP4654<br />
HYSOL<br />
UV8800M<br />
Low viscosity version of FP4450 incorporating cleaner resins. High 35,000 160 22 72<br />
Glob top version of FP4450. Low 300,000 173 20 75<br />
High adhesion version of FP4450 for 260°C L3 JEDEC performance. High 48,000 148 18 75<br />
Low viscosity, high adhesion, version of FP4653 for large array packages. Medium 32,000 146 13 80<br />
UV cure Encapsulant for smart card and other COB applications. Medium 3,500 29 41 54<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
1 hr. @ 125°C<br />
+ 2 hrs. @ 160°C<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
30 sec. @ 315<br />
- 400 nm (UVA)<br />
PACKAGE LEVEL: MAP Low Stress<br />
PRODUCT DESCRIPTION FLOW SPEED<br />
VISCOSITY,<br />
cPs<br />
Tg, °C<br />
CTEa1,<br />
ppm/°C<br />
% FILLER RECOMMENDED CURE<br />
HYSOL<br />
FP4651<br />
Low viscosity version of FP4650 for large array packages. Medium 130,000 150 11 82<br />
1 hr. @ 125°C<br />
+ 90 min. @ 165°C<br />
HYSOL<br />
FP4652<br />
Fast cure, low stress version of FP4450 for large array packages. Medium 180,000 150 14 80<br />
15 min. @ 110°C<br />
+ 30 min. @ 165°C<br />
HYSOL CB064 /<br />
FP4653<br />
Ultra low CTE, low stress version of FP4450 for large array packages. Low 80,000 150 8 86<br />
2 hrs. @ 110°C<br />
+ 2 hrs. @ 160°C<br />
HYSOL<br />
FP4654<br />
Low viscosity, high adhesion, version of FP4653 for large array packages. Medium 32,000 146 13 80<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
DISCRETES, Fill Material<br />
PRODUCT DESCRIPTION FLOW SPEED<br />
VISCOSITY,<br />
cPs<br />
Tg, °C CTEa1, ppm/°C % FILLER RECOMMENDED CURE<br />
HYSOL<br />
FP0087<br />
Low stress fill for potting automated sensor and diodes; high Tg. High 20,000 175 18 76<br />
1 hr. @ 125°C<br />
+ 1 hr. @ 180°C<br />
29
<strong>Semiconductor</strong><br />
MaTERIALS<br />
Photonics<br />
<strong>Henkel</strong> offers a various products to be used in the<br />
assembly of a variety of fiber optic components.<br />
These components may consist of Complementary<br />
Metal-Oxide-<strong>Semiconductor</strong> (CMOS) Vision Pack,<br />
Charge-Coupled Device (CCD), Display, Laser, Light-<br />
Emitting-Diode (LED), Transceivers, Couplers,<br />
Splitters as well as Wave Division Multiplexing.<br />
These adhesives are used for applications such as<br />
Fiber pig tailing, Fiber termination, Fiber splicing,<br />
Fiber array assembly and Fiber bonding. The Fiber<br />
bonding may be into V-grooves, into ferrules or onto<br />
Silicon supports as in coupler assemblies. Other<br />
applications could include active alignment of<br />
transceiver packages, WDM component assembly,<br />
integrated optics, lens mounting, Gradient-index<br />
optics (GRIN) lens attach, optical interconnects and<br />
lid sealing CCD packages.<br />
<strong>Henkel</strong> products are cured by UV or visible light,<br />
heat cure or a combination depending on your<br />
package requirements. These products are developed<br />
to be low out-gassing, low warpage, high shear<br />
strength, low ionics and auto dispensable.<br />
Photonics Materials<br />
Image Sensor<br />
(CMOS/CCD) & Camera Module Assembly<br />
Thermal Cure<br />
UV Cure<br />
UV/Thermal Cure<br />
ABLEBOND<br />
8387B<br />
ABLEBOND<br />
8387BS<br />
ABLELUX<br />
LHA-2<br />
LOCTITE<br />
3751<br />
HYSOL<br />
UV3000<br />
LOCTITE<br />
UV8000<br />
ABLELUX<br />
A4502<br />
ABLELUX<br />
LA-1UV<br />
ABLELUX<br />
OGR150THTG<br />
LOCTITE<br />
3128<br />
LOCTITE<br />
3129<br />
LOCTITE<br />
3220<br />
LOCTITE<br />
3131<br />
LOCTITE<br />
3217<br />
30
<strong>Semiconductor</strong><br />
MaTERIALS<br />
photonics<br />
THERMAL CURE<br />
PRODUCT<br />
DESCRIPTION<br />
VISCOSITY,<br />
cPs<br />
Tg, °C<br />
CTEa1,<br />
ppm/°C<br />
Modulus,<br />
Gpa<br />
RECOMMENDED CURE<br />
ABLEBOND<br />
8387B<br />
ABLEBOND<br />
8387BS<br />
ABLELUX<br />
LHA-2<br />
LOCTITE<br />
3128<br />
LOCTITE<br />
3129<br />
LOCTITE<br />
3220<br />
One-component, low temperature cure for high throughput bonding. 9,500 96 94 1.4 2 min. @ 150°C<br />
One-component, low temperature cure for high throughput bonding, 30µm<br />
glass spacers.<br />
14,250 122 N/A 1.9 60 min. @ 100°C<br />
One-component, low temperature cure for lens holder attach. 16,000 110 45 6.0 60 min. @ 100°C<br />
One-component, low temperature cure with excellent adhesion on wide range<br />
of materials.<br />
One-component, low temperature cure, snap cure with excellent adhesion on wide<br />
range of materials.<br />
One-component, low temperature cure, snap cure with excellent adhesion on wide<br />
range of materials.<br />
15,000 45 40 3.9 20 min. @ 80°C bondline temp.<br />
4,200 35 47 5.4 5-10 min. @ 80°C<br />
3,000 26 61 0.6 5-10 min. @ 80°C<br />
uv cure<br />
PRODUCT<br />
DESCRIPTION<br />
VISCOSITY,<br />
cPs<br />
Tg, °C<br />
CTEa1,<br />
ppm/°C<br />
Modulus,<br />
Gpa<br />
RECOMMENDED CURE<br />
HYSOL<br />
UV3000<br />
LOCTITE<br />
3751<br />
LOCTITE<br />
UV8000<br />
High strength, chemical resistant, low outgassing polymer system. 5,300 150 75 N/A 200 mW/cm² for 20 sec.<br />
Designed for tacking, bonding, encapsulating, coating and sealing applications. 8,000 N/A N/A 0.6 30 mW/cm² for 120 sec. per side<br />
UV-curable cationic epoxy Adhesive. It is designed for use in sealing glass lid of<br />
packages of area image sensors such as CCD and CMOS.<br />
27,000 136 N/A 5.0<br />
100 mW/cm² for 30 sec.<br />
+ 30 min. @ 100°C<br />
thermal / uv cure<br />
PRODUCT<br />
DESCRIPTION<br />
VISCOSITY,<br />
cPs<br />
Tg, °C<br />
CTEa1,<br />
ppm/°C<br />
Modulus,<br />
Gpa<br />
RECOMMENDED CURE<br />
ABLELUX<br />
A4502<br />
ABLELUX<br />
LA-1UV<br />
ABLELUX<br />
OGR150THTG<br />
LOCTITE<br />
3131<br />
LOCTITE<br />
3217<br />
One-component, photo or heat-cure Adhesive for high throughput assembly process. 20,000 110 52 2.1<br />
One-component, photocurable Adhesive designed for bonding camera<br />
module assemblies.<br />
7,000 86 62 1.2<br />
One-component, photo or heat cure Adhesive for high throughput assembly process. 1,000 145 61 1.3<br />
One-component UV and heat dual cure Adhesive for assembly of temperature sensitive<br />
electronic components.<br />
One-component UV and heat dual cure Adhesive for assembly of temperature sensitive<br />
electronic components.<br />
14,000 87 51 2.46<br />
10,000 82 53 N/A<br />
500 mW/cm² for 10 sec.<br />
+ 15 min. @ 100°C<br />
500 mW/cm² for 10 sec.<br />
+ 60 min. @ 150°C<br />
800 mW/cm² for 5 sec.<br />
+ 1 hour @ 110°C<br />
100 mW/cm² for 2 sec.<br />
+ 30 min. @ 80°C<br />
100 mW/cm² for 5 sec.<br />
+ 30 min. @ 80°C<br />
31
<strong>Semiconductor</strong><br />
MaTERIALS<br />
electronic molding<br />
compounds<br />
Hysol Electronic Molding Compounds protect<br />
passive components, such as ceramic and Tantalum<br />
(Ta) capacitors and resistors, and are designed<br />
for both automolds and conventional molds. Our<br />
unique Gold (Au) compounds are ideal for high<br />
contrast laser marking and are available in fast<br />
cure versions for high productivity. Cutting-edge<br />
low stress compounds, capable of thin wall designs<br />
for today’s relentless demands to miniaturize every<br />
component, are also available.<br />
Next-generation molding powders have been<br />
designed to meet the Electronics industry’s need<br />
for plastics that are environmentally responsible<br />
and resistant to cracking after 260°C IR reflow.<br />
New blends of proprietary flame retardants are<br />
used to replace the traditional Antimony (Sb) oxide/<br />
halogenated resin flame-out systems. The materials<br />
pass UL standards and meet the EU’s environmental<br />
requirements (i.e., no Halogens, no heavy metals).<br />
Combining these flame retardants with new resin<br />
technology and filler blends has produced a series of<br />
ultra low stress materials that resist cracking after<br />
exposure to 260°C IR reflow conditions.<br />
Electronic Molding Compounds<br />
Tantalum (Ta) Capacitors<br />
Resistor Networks<br />
Other<br />
HYSOL<br />
GR2220 Black<br />
HYSOL<br />
GR2310 Gold<br />
HYSOL<br />
GR2320 Black<br />
HYSOL<br />
GR2710<br />
HYSOL<br />
GR2720 Black<br />
HYSOL<br />
GR2725<br />
HYSOL<br />
GR2310 Gold<br />
HYSOL<br />
GR2320 Black<br />
HYSOL<br />
MG33F<br />
HYSOL<br />
GR2220 Black<br />
HYSOL<br />
GR2310 Gold<br />
HYSOL<br />
GR2320 Black<br />
HYSOL<br />
GR2620 Black<br />
HYSOL<br />
GR2811 Gold<br />
HYSOL<br />
GR2820 Black<br />
HYSOL<br />
GR2811 Gold<br />
HYSOL<br />
MG33F Black<br />
32
<strong>Semiconductor</strong><br />
MaTERIALS<br />
ELECTRONIC MOLDING<br />
COMPOUNDS<br />
TANTALUM (TA) CAPACITORS<br />
Product<br />
HYSOL<br />
GR2220<br />
HYSOL<br />
GR2310<br />
Description<br />
Conventional<br />
Mold<br />
Spiral<br />
Flow<br />
in, @ 177°C<br />
Tg, °C<br />
CTE a1,<br />
ppm/°C<br />
CTE a2,<br />
ppm/°C<br />
Cure Time<br />
@ 177°C<br />
Flexural<br />
Strength,<br />
psi<br />
Flexural<br />
Modulus,<br />
psi<br />
Black/conventional molding of MnO caps. Conventional 40 162 19 60 30 - 45 sec. 18,500 2.4 x 10 6 N<br />
Au/non-halogenated molding powder, Ta and ceramic capacitors,<br />
leaded or surface-mounted sensors.<br />
Laser<br />
Markable<br />
Conventional/Auto 27 166 22 75 30 - 45 sec. 20,500 2.1 x 10 6 Y<br />
HYSOL<br />
GR2320<br />
HYSOL<br />
GR2710<br />
HYSOL<br />
GR2720<br />
Hysol<br />
GR2725<br />
Black/non-halogenated molding powder, Ta and ceramic<br />
capacitors, leaded or surface-mounted sensors.<br />
Au/low stress/non-flame retarded molding powder, Ta and<br />
ceramic capacitors, leaded or surface-mounted sensors.<br />
Black/low stress/non-flame retarded molding powder, Ta and<br />
ceramic capacitors, leaded or surface-mounted sensors.<br />
Black low stress epoxy mold compound. Especially designed for<br />
low ESR on conductive polymer Ta and AO capacitors.<br />
Conventional/Auto 27 172 22 82 N/A 20,300 N/A Y<br />
Conventional/Auto 35 161 13 45 45 - 60 sec. 19,000 2.6 x 10 6 Y<br />
Conventional/Auto 35 165 18 63 N/A 18,000 N/A Y<br />
Conventional/Auto 55 170 17 60 30 - 45 sec. 20,000 2.2 x 10 6 Y<br />
HYSOL<br />
GR2811<br />
Au/thin wall-crack-resistant, low stress, fast cycle time. Conventional/Auto 34 162 13 45 30 - 45 sec. 20,000 2.9 x 10 6 Y<br />
HYSOL<br />
MG33F<br />
Black, environmentally responsible, "green," Molding Compound<br />
designed especially for the encapsulation of Ta capacitors. Low<br />
moisture absorption, excellent moldability with fast cycle times,<br />
especially auto-mold applications.<br />
Conventional/Auto 28 175 19 61 30 - 45 sec. 20,000 2.2 x 10 6 Y<br />
RESISTOR NETWORKS<br />
Product<br />
Description<br />
Conventional<br />
Mold<br />
Spiral Flow<br />
in, @ 177°C<br />
Tg, °C<br />
CTE a1 ,<br />
ppm/°C<br />
CTE a2 ,<br />
ppm/°C<br />
Cure Time<br />
@ 177°C<br />
Flexural<br />
Strength,<br />
psi<br />
Flexural<br />
Modulus,<br />
psi<br />
Laser<br />
Markable<br />
HYSOL<br />
GR2310<br />
HYSOL<br />
GR2320<br />
HYSOL<br />
MG33F<br />
OTHER<br />
Au/non-halogenated molding powder, Ta and ceramic capacitors,<br />
leaded or surface-mounted sensors.<br />
Black/non-halogenated molding powder, Ta and ceramic<br />
capacitors, leaded or surface-mounted sensors.<br />
Black, environmentally responsible, "green," Molding Compound<br />
designed especially for the encapsulation of Ta capacitors. Low<br />
moisture absorption, excellent moldability with fast cycle times,<br />
especially auto-mold applications.<br />
Conventional/Auto 27 166 22 75 30 - 45 sec. 20,500 2.1 x 10 6 Y<br />
Conventional/Auto 27 172 22 82 N/A 20,300 N/A Y<br />
Conventional/Auto 28 175 19 61 30 - 45 sec. 20,000 2.2 x 10 6 Y<br />
Product<br />
Description<br />
Conventional<br />
Mold<br />
Spiral Flow<br />
in, @ 177°C<br />
Tg, °C<br />
CTE a1,<br />
ppm/°C<br />
CTE a2,<br />
ppm/°C<br />
Cure Time<br />
@ 177°C<br />
Flexural<br />
Strength,<br />
psi<br />
Flexural<br />
Modulus,<br />
psi<br />
Laser<br />
Markable<br />
HYSOL<br />
GR2220<br />
Black/conventional molding of MnO caps. Conventional 40 162 19 60 30 - 45 sec. 18,500 2.4 x 10 6 N<br />
HYSOL<br />
GR2310<br />
HYSOL<br />
GR2320<br />
Au/non-halogenated molding powder, Ta and ceramic<br />
capacitors, leaded or surface-mounted sensors.<br />
Black/non-halogenated molding powder, Ta and ceramic<br />
capacitors, leaded or surface-mounted sensors.<br />
Conventional/Auto 27 166 22 75 30 - 45 sec. 20,500 2.1 x 10 6 Y<br />
Conventional/Auto 27 172 22 82 N/A 20,300 N/A Y<br />
HYSOL<br />
GR2620<br />
HYSOL<br />
GR2811<br />
HYSOL<br />
GR2820<br />
General-purpose, good moldability, and high Tg. Conventional 35 145 32 87 N/A 20,000 N/A N<br />
Au/thin wall-crack-resistant, low stress, fast cycle time. Conventional/Auto 34 162 13 45 30 - 45 sec. 20,000 2.9 x 10 6 Y<br />
Au/thin wall-crack-resistant, low stress, fast cycle time. Conventional/Auto 25 153 12 50 N/A 17,000 N/A Y<br />
33
<strong>Semiconductor</strong><br />
MaTERIALS<br />
molding<br />
compounds<br />
From through-hole discrete components to the<br />
most advanced surface mount devices, <strong>Henkel</strong>’s<br />
Hysol brand Molding Compounds deliver the<br />
outstanding performance and ease of use you’d<br />
expect from a world leader in materials technology.<br />
Combining low stress and low moisture absorption<br />
with high physical strength, all of <strong>Henkel</strong>’s<br />
Molding Compounds ensure an optimized process<br />
at high yields even in the most demanding<br />
Pb-free environments. Formulated for the varying<br />
requirements of today’s discrete components,<br />
Hysol products’ high performance Molding<br />
Compounds offer the ultimate in manufacturing<br />
value for general discretes. With fast cycle times,<br />
a robust process window and the ability to run<br />
in excess of 700 cycles prior to mold cleaning,<br />
these materials deliver exceptional results. For<br />
more demanding high voltage applications,<br />
Hysol materials have been formulated to provide<br />
low dielectric properties at high temperatures.<br />
<strong>Henkel</strong> has also developed Molding Compounds<br />
for thermally conductive discretes that provide<br />
excellent thermal characteristics, offering up to 2.1<br />
W/mK with the ability to go as high as 3 W/mK. The<br />
low moisture absorption and low stress properties<br />
of Hysol Molding Compounds for surface-mounted<br />
leadframe devices all pass stringent JEDEC Level 1,<br />
260°C testing. All Hysol Molding Compounds are<br />
green materials, which are halide-free and Pb-free<br />
compatible and meet RoHS requirements, while<br />
delivering superior performance even in high<br />
temperature reflow conditions.<br />
With materials solutions for QFPs, SoPs, SOICs,<br />
QFNs, SOTs and DPAKs, the Hysol line of Molding<br />
Compounds are formulated for package-specific<br />
demands and deliver exceptional adhesion for<br />
a variety of leadframe finishes. For packaging<br />
specialists building surface-mounted laminate<br />
packages such as BGAs and CSPs, <strong>Henkel</strong> has<br />
developed a wide range of state-of-the-art Molding<br />
Compound materials utilizing our unique flexible<br />
hardener technology. Maintaining package flatness<br />
throughout package assembly and subsequent PCB<br />
assembly processes is essential for ensuring high<br />
reliability. <strong>Henkel</strong>’s flexible hardener technology<br />
enables package-specific Molding Compound<br />
formulations that counter-correct any warpage that<br />
may occur during second level reflow processes,<br />
thus ensuring high performance and longterm<br />
reliability. In addition, we have developed<br />
innovative Molding Compound materials for<br />
use with today’s multifunctional memory card<br />
(MMC) and Package-on-Package (PoP) applications.<br />
Hysol MMC and PoP Molding Compounds deliver<br />
the robust performance characteristics and<br />
exceptionally low warpage required for these<br />
devices.<br />
34
<strong>Semiconductor</strong><br />
MaTERIALS<br />
Molding<br />
CompoundS<br />
<strong>Semiconductor</strong> Molding Compounds<br />
Through-Hole Discrete<br />
Surface Mount / Lead Frame<br />
Surface Mount / Laminate<br />
Through-Hole Discretes<br />
General Discretes<br />
TO, Axial, Bridge, Single In-Line<br />
Package (SIP)<br />
High Thermal Conductivity<br />
Application<br />
TO, Full Pack, HSOP<br />
High Voltage Application<br />
TO, Axial, Bridge, DIP,<br />
HYSOL<br />
KL1000-3LX<br />
HYSOL<br />
GR360A-F8<br />
HYSOL<br />
KL-5000HT<br />
HYSOL<br />
GR750<br />
HYSOL<br />
MG15F<br />
HYSOL<br />
KL-2500-1K<br />
HYSOL<br />
KL-G100<br />
HYSOL<br />
KL-G500HT<br />
HYSOL<br />
GR750HT-25<br />
HYSOL<br />
GR15F-1P<br />
HYSOL<br />
KL-4500-1<br />
HYSOL<br />
KL-G150<br />
HYSOL<br />
GR750-SC<br />
HYSOL<br />
KL-G200<br />
Surface Mount / Lead Frames<br />
QFP, T/LQFP,<br />
TSSOP<br />
SOIC<br />
QFN<br />
DPAK/D2PAK<br />
SOT/SMX<br />
High Power Packages<br />
Power SOIC,<br />
Power SSOP<br />
HYSOL<br />
GR869<br />
HYSOL<br />
GR828D<br />
HYSOL<br />
KL-G900HC<br />
HYSOL<br />
GR838LC<br />
HYSOL<br />
GR640HV-L1<br />
HYSOL<br />
GR725LV-LS<br />
HYSOL<br />
KL-7000HA<br />
HYSOL<br />
GR869<br />
HYSOL<br />
KL-G900HP<br />
HYSOL<br />
GR828DD<br />
HYSOL<br />
KL-6500S<br />
HYSOL<br />
KL-G730<br />
HYSOL<br />
KL-4500-1NT<br />
HYSOL<br />
KL-G200S<br />
HYSOL<br />
KL-G450H<br />
HYSOL<br />
KL-G450S<br />
HYSOL<br />
KL-G730<br />
HYSOL<br />
KL-G800H<br />
Surface Mount / Laminates<br />
SIP<br />
PBGA, CSP<br />
PoP, SCSP<br />
MMC<br />
HYSOL<br />
GR9810 Series<br />
HYSOL<br />
GR9810 Series<br />
HYSOL<br />
GR9810-1P<br />
HYSOL<br />
GR9810-1P<br />
Green Product<br />
Non-Green Product<br />
HYSOL<br />
GR9851M<br />
35
<strong>Semiconductor</strong><br />
MaTERIALS<br />
Molding<br />
CompoundS<br />
Through-Hole Discretes<br />
GENERAL DISCRETES, TO, AXIAL, BRIDGE, SIP (SINGLE IN-LINE PACKAGE)<br />
PRODUCT<br />
DESCRIPTION<br />
THERMAL<br />
CONDUCTIVITY<br />
MSL<br />
GREEN<br />
SPIRAL<br />
FLOW, cm<br />
HOT PLATE<br />
GEL TIME,<br />
Sec.<br />
FILLER<br />
TYPE<br />
CTEa1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR360A-F8<br />
Good electrical stability at high temperature. 0.8 W/mK N/A Y 70 28 Fused 13 163<br />
HYSOL<br />
KL1000-3LX<br />
Provides the lowest cost of ownership with superior moldability and<br />
reliability. Extremely suitable for bridge, axial and TO packages.<br />
1.3 W/mK L4/220°C N 75 23 Crystalline 24 165<br />
HYSOL<br />
KL-2500-1K<br />
Low stress Molding Compound and is suitable for TO and DIP packages<br />
and provides superior moldability and reliability.<br />
0.9 W/mK L3/260°C N 100 22 Fused 19 145<br />
HYSOL<br />
KL-4500-1<br />
Low stress, low viscosity. 0.75 W/mK L1/260°C N 91 25 Fused 16 160<br />
HYSOL<br />
KL-G100<br />
HYSOL<br />
KL-G150<br />
Green Molding Compound with 1/4 inch flammability rating suitable for<br />
bridge, axial and TO packages. Offers superior moldability with lowest<br />
cost of ownership.<br />
Green Molding Compound with 1/4 inch flammability rating suitable for<br />
bridge and TO packages. Offers superior moldability.<br />
0.9 W/m.K L3/260°C Y 80 23 Crystalline 22 165<br />
0.9 W/m.K L3/260°C Y 80 20 Crystalline 18 165<br />
HYSOL<br />
KL-G200<br />
Green Molding Compound with 1/4 inch flammability rating suitable for<br />
bridge, axial and TO packages. Offers superior moldability with lowest<br />
cost of ownership.<br />
0.9 W/mK L3/260°C Y 80 23<br />
Crystalline<br />
Fused<br />
22 165<br />
Through-Hole Discretes /<br />
High Thermal Conductivity<br />
to, full pack, hsop<br />
PRODUCT<br />
DESCRIPTION<br />
THERMAL<br />
CONDUCTIVITY<br />
GREEN<br />
SPIRAL<br />
FLOW, cm<br />
HOT PLATE<br />
GEL TIME,<br />
Sec.<br />
FILLER TYPE<br />
CTEa1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR750<br />
Has alumina fillers and delivers a high thermal conductive solution for<br />
TO-220F/3PF’s thermal requirements. Low moisture absorption and low thermal<br />
expansion are suitable for stress sensitive devices.<br />
2.1 W/mK Y 65 30<br />
Alumina/<br />
Crystalline<br />
23 160<br />
HYSOL<br />
GR750HT-25<br />
A high thermal conductivity Molding Compound using fully alumina fillers<br />
designed to improve thermal management for semiconductor devices. It exhibits<br />
high adhesion to Cu and Cu alloys. This material is specifically recommended<br />
for isolated power transistors, which require high heat dissipation.<br />
2.1 W/mK Y 65 30<br />
Alumina/<br />
Crystalline<br />
23 160<br />
HYSOL<br />
GR750-SC<br />
A high thermal conductivity Molding Compound using fully rounded<br />
spherical crystalline fillers designed to improve thermal management for<br />
semiconductor devices. It exhibits high adhesion to Cu and Cu alloys. This<br />
material is specifically recommended for isolated power transistors.<br />
2.1 W/mK Y 45 26 Crystalline 20 155<br />
HYSOL<br />
KL-5000HT<br />
Has alumina fillers and delivers a high thermal conductive solution for<br />
TO-220F/3PF’s thermal requirements. Low moisture absorption and low<br />
thermal expansion are suitable for stress-sensitive devices.<br />
2.1 W/mK N 60 32<br />
Alumina/<br />
Crystalline<br />
22 155<br />
HYSOL<br />
KL-G500HT<br />
High thermal conductivity, for TO-220F/3PF packages. 1.92 W/mK Y 60 40 Fused/Crystal 20 175<br />
36
<strong>Semiconductor</strong><br />
MaTERIALS<br />
Discretes / High Voltage Applications<br />
TO, AXIAL, BRIDGE, DIP<br />
Molding<br />
CompoundS<br />
PRODUCT<br />
DESCRIPTION<br />
VOLTAGE<br />
RATING<br />
IONIC<br />
CONDUCTIVITY,<br />
ROOM TEMP.<br />
IONIC<br />
CONDUCTIVITY,<br />
150°C<br />
MSL<br />
GREEN<br />
SPIRAL<br />
FLOW, cm<br />
CTEa1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR15F-1P<br />
Green, anhydride-cured Molding Compound contains spherical<br />
filler and is designed for high voltage applications. This product<br />
has excellent moldability performance with high yield rates.<br />
>900 V discrete,<br />
>400 V IC<br />
3.6 5.2 L1/235°C N 65 23 160<br />
HYSOL<br />
MG15F<br />
Anhydride-cured Molding Compound designed specifically for use<br />
in high voltage power applications requiring good electrical stability<br />
at high temperature. This material is specifically recommended for<br />
power discrete, high voltage rectifier and other applications where up<br />
until now only silicone Molding Compounds have been satisfactory.<br />
>900 V discrete,<br />
>400 V IC<br />
3.6 5.2 L1/235°C N 65 23 160<br />
37
<strong>Semiconductor</strong><br />
MATERIALS<br />
Molding<br />
CompoundS<br />
SURFACE MOUNT / LEADFRAMEs<br />
QFP, T/LQFP, TSSOP<br />
PRODUCT DESCRIPTION SURFACE FINISH PACKAGE SIZE MSL GREEN % FILLER<br />
SPIRAL<br />
FLOW, cm<br />
CTEa1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR869<br />
HYSOL<br />
KL-7000HA<br />
HYSOL<br />
KL-G730<br />
Green, ultra low stress and high adhesion Molding<br />
Compound designed for QFP packages with Pb-free<br />
finishing. HYSOL GR869 provides wide molding process<br />
window and robust reliability performance.<br />
High adhesion and high strength Molding<br />
Compound suitable for SOT, SSOP and QFP<br />
packages. Provides ultra low stress, low moisture<br />
absorption, high purity and high reliability. Its low<br />
viscosity properties enable low wire sweep.<br />
High adhesion, ultra low stress and green Molding<br />
Compound suitable for SOIC, TSOP, D/D2PAK, QFP, L/TQFP.<br />
Its low viscosity properties enable low wire sweep molding<br />
with a large operating window. It has no flame retardants but<br />
offers a 1/8 inch flammability rating.<br />
Ag, Cu, Ni all T/LQFP L3/260°C Y 86.5 102 9 124<br />
all QFP<br />
< 14 x 14 mm T/<br />
LQFP<br />
L3/260°C N 84 110 9 130<br />
PPF, Ag all SOIC L1/260°C Y 87 129 7 130<br />
38
<strong>Semiconductor</strong><br />
MATERIALS<br />
Molding<br />
CompoundS<br />
SOIC<br />
SURFACE MOUNT / LEADFRAMES<br />
PRODUCT<br />
DESCRIPTION<br />
SURFACE<br />
FINISH<br />
PACKAGE SIZE MSL GREEN % FILLER<br />
SPIRAL<br />
FLOW, cm<br />
CTEa1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR828D<br />
HYSOL<br />
GR869<br />
Green, ultra-low stress and high adhesion Molding Compound<br />
designed for SOIC, TSOP and QFP packages with Pb-free finishing.<br />
Targets package finishings that require Ag adhesion molding with a<br />
large operating window.<br />
Green, ultra low stress and high adhesion Molding Compound<br />
designed for QFP packages with Pb-free finishing. Provides wide<br />
molding process window and robust reliability performance.<br />
PPF, Ag all T/LQFP L3/260°C Y 88 100 9 135<br />
Ag, Cu, Ni all T/LQFP L3/260°C Y 86.5 102 9 124<br />
HYSOL<br />
KL-4500-1NT<br />
Low stress and high reliability Molding Compound suitable for SOIC<br />
packages. Its low viscosity properties enable low wire sweep molding<br />
with a large operating window.<br />
PPF, Ag<br />
< 16L Narrow<br />
body SOIC<br />
L1/260°C N 78 90 14 150<br />
HYSOL<br />
KL-G450H<br />
HYSOL<br />
KL-G730<br />
Low stress, green Molding Compound, suitable for SOP, SSOP, SOJ<br />
packages, low-cost ownership.<br />
High adhesion, ultra-low stress and green Molding Compound<br />
suitable for SOIC, TSOP, D/D2PAK, QFP, L/TQFP. Its low viscosity<br />
properties enable low wire sweep molding with a large operating<br />
window. It has no flame retardants but offers a 1/8 inch<br />
flammability rating.<br />
Ag, Cu, Ni SOP, SSOP, SOJ L3/260°C Y 81 96 16 135<br />
PPF, Ag all T/LQFP L3/260°C Y 87 129 7 130<br />
QFN<br />
PRODUCT<br />
DESCRIPTION<br />
surface<br />
finish<br />
MSL<br />
GREEN<br />
FILLER<br />
CONTENT %<br />
SPIRAL<br />
FLOW, cm<br />
CTE a1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
KL-G900HC<br />
Suitable for Ag/Cu QFN packages with its low wire sweep and<br />
excellent warpage performance. Offers high reliability performance<br />
and moldability on thin panels, and map molding could not be easier.<br />
Ag<br />
L2/260°C<br />
(7 x 7 mm)<br />
Y 88 85 7 105<br />
HYSOL<br />
KL-G900HP<br />
Suitable for PPF QFN packages with its low wire sweep and<br />
excellent warpage performance. Offers high reliability performance<br />
and moldability on thin panels, and map molding could not be easier.<br />
Its unique low stress property at high temperature enables passing<br />
L1/260°C on PPF packages.<br />
PPF<br />
L1/260°C<br />
(7 x 7 mm)<br />
Y 88.5 82 9 100<br />
DPAK/D2PAK<br />
PRODUCT<br />
DESCRIPTION<br />
surface<br />
finish<br />
MSL<br />
GREEN<br />
FILLER<br />
CONTENT %<br />
SPIRAL<br />
FLOW, cm<br />
CTE a1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR828DD<br />
Green, semiconductor grade, low stress and high adhesion<br />
Molding Compound. It’s especially designed for DPAK/D2PAK<br />
packages with Ni and Cu/Ag plating lead frames.<br />
Ag, Ni, Cu L1/260°C Y 88 90 9 135<br />
HYSOL<br />
GR838LC<br />
Low stress, excellent gate leakage performance. Ag, Cu L1/260°C Y 83 90 8.8 125<br />
39
<strong>Semiconductor</strong><br />
MATERIALS<br />
Molding<br />
CompoundS<br />
SURFACE MOUNT / LEADFRAMEs<br />
SOT/SMX<br />
PRODUCT<br />
DESCRIPTION<br />
surface<br />
finish<br />
MSL<br />
GREEN<br />
MAX FILLER<br />
SIZE, µm<br />
SPIRAL<br />
FLOW, cm<br />
CTE a1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR640HV-L1<br />
Low stress Molding Compound suitable for SOT, SOD packages,<br />
GR640HV-L1 provides good workability and high reliability.<br />
Ag, Cu L1/260°C Y 75 69 15 160<br />
HYSOL<br />
KL-6500S<br />
Low stress molding compound suitable for SOT, SOD and SOIC<br />
packages, HYSOL KL6500S provides good workability and high reliability.<br />
Ag, Cu L1/260°C N 75 110 14 150<br />
HYSOL<br />
KL-G200S<br />
Green, super moldability for SMX packages. Ag, Cu L1/260°C Y 125 20 20 175<br />
HYSOL<br />
KL-G450S<br />
High adhesion, low stress green EMC. Ag, Cu L1/260°C Y 75 100 11 112<br />
HYSOL<br />
KL-G800H<br />
High adhesion, ultra-low stress, low viscosity. Ag, Cu L2/260°C Y 75 115 7.5 125<br />
HIGH POWER PACKAGES, POWER SOIC, POWER SSOP<br />
PRODUCT<br />
DESCRIPTION<br />
surface<br />
finish<br />
MSL<br />
GREEN<br />
FILLER<br />
CONTENT %<br />
SPIRAL<br />
FLOW, cm<br />
CTE a1,<br />
ppm/°C<br />
Tg, C<br />
HYSOL<br />
GR725LV-LS<br />
Green Molding Compound. Designed for power SO and surface mount<br />
discrete packages.<br />
Ag, Cu, Ni L1/260°C Y 84 130 11 150<br />
40
<strong>Semiconductor</strong><br />
MATERIALS<br />
Molding<br />
CompoundS<br />
SiP<br />
SURFACE MOUNT / Laminates<br />
PRODUCT<br />
DESCRIPTION<br />
package<br />
size<br />
Warpage, m MSL GREEN<br />
FILLER<br />
CONTENT %<br />
SPIRAL<br />
FLOW, cm<br />
CTE a1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR9810 series<br />
Advanced epoxy Molding Compounds designed for use<br />
as an overmold on a wide variety of BGA and CSP. The<br />
series’ flexible hardener technology enables ultra-low<br />
warpage. HYSOL GR9820-1 is a “green” (non Sb, Br, P)<br />
Molding Compound and is capable of achieving JEDEC<br />
Level 3, at 260ºC reflow temperature.<br />
PBGA 37.5 x 37.5<br />
mm<br />
CSP Panel 50 x<br />
60 mm<br />
<strong>Semiconductor</strong><br />
MaTERIALS<br />
Solder MATERIALS<br />
PoP Tacky Fluxes<br />
As Package-on-Package (PoP) devices have<br />
gained favor in recent years, it has become<br />
increasingly evident that the requirements of<br />
the technology are certainly unique. This is<br />
true for many materials used to manufacture<br />
and assemble PoPs, but particularly for the<br />
tacky fluxes needed for both ball attach and for<br />
device stacking. That’s why <strong>Henkel</strong>, the leader<br />
in solder innovation, has formulated a series of<br />
Tacky Flux systems to address the demands of<br />
PoP production.<br />
PoP Epoxy Flux<br />
Combining both flux functionality and underfill<br />
protection into a single formulation, Hysol<br />
FF6000 takes PoP manufacturing flexibility<br />
to a whole new level. Traditional underfill<br />
application methodologies simply don’t work<br />
for top package assembly, but Hysol FF6000<br />
has solved this problem by incorporating a flux<br />
component that provides the action necessary<br />
for solder joint formation and an epoxy that<br />
encapsulates each solder sphere, delivering<br />
added support and protection. This streamlined<br />
approach effectively eliminates the need for<br />
dispensing equipment and the time required<br />
for underfill application and cure. But that’s<br />
not all: Hysol FF6000 has also been proven to<br />
provide improved protection – as compared to<br />
traditional flux materials – for solder sphere<br />
attach during package production as well.<br />
PoP Solder Paste<br />
When either the top or bottom package of<br />
a PoP is warped, co-planarity of the stacked<br />
packages becomes a challenge. One method<br />
used to overcome co-planarity challenges is<br />
solder paste dipping, where the top package<br />
is dipped into solder paste. Not only does the<br />
extra metallization reduce the possibility of<br />
non- co-planar induced solder joints, but it<br />
improves the joint reliability by increasing the<br />
component stand-off. The metal loading and<br />
particle size distribution of <strong>Henkel</strong>’s Multicore<br />
LF730 Solder Paste have been optimized for<br />
package stacking.<br />
Die Attach Solder Paste<br />
Multicore DA100 and Multicore DA101<br />
have been designed to provide the thermal<br />
management necessary for today’s smaller<br />
outline, higher-functioning semiconductor<br />
power devices, while also delivering the<br />
processability and versatility associated with<br />
solder paste materials. These products offer<br />
robust options for application-specific thermal<br />
requirements and overcome many of the<br />
issues historically associated with alternative<br />
products such as silver (Ag)-based Die Attach<br />
Adhesives and solder wire, neither of which is<br />
ideal for modern semiconductor power device<br />
production. The robust nature of the flux<br />
formulas provides customers the flexibility to<br />
alter alloys based on process requirements.<br />
42
<strong>Semiconductor</strong><br />
MaTERIALS<br />
SOLDER Materials<br />
PoP TAcky Fluxes<br />
Product Description Application Viscosity Color<br />
Tack,<br />
g/mm 2<br />
Acid<br />
Value<br />
Solids<br />
Content, %<br />
MULTICORE<br />
TFN600<br />
No-clean Tacky Flux for sphere attach.<br />
Printing (screen and stencil); pin transfer<br />
and dispensing<br />
480,000 Brown 130 70 49<br />
MULTICORE<br />
TFN700B<br />
MULTICORE<br />
TFN800HF-<br />
Blue<br />
MULTICORE<br />
WS300<br />
Newtonian No-clean Tacky Flux for PoP. Dipping, jetting 47,000 Blue 175 108 80<br />
A non-Newtonian, no-clean, halogen-free, Tacky Flux<br />
intended for use in application such PoP and Flip-Chip.<br />
Standard viscosity; water-wash Tacky Flux.<br />
Dipping, jetting 33,000 Blue 160 N/A 75<br />
Printing (screen and stencil); pin transfer<br />
and dispensing<br />
550,000 Brown 132 30 80<br />
PoP epoxy Fluxes<br />
Product Description Viscosity pot life cure schedules tg (°c) CTE (ppm/°C)<br />
HYSOL<br />
FF6000<br />
A Tacky Flux with the additional features and benefits of an epoxy. It is formulated to provide both<br />
fluxing action during reflow and a cured adhesive bond after reflow in a Pb-free process – with no<br />
additional processing.<br />
4,600 24 hrs.<br />
Pb-free solder<br />
reflow profile @<br />
260°C<br />
30 88<br />
solder paste<br />
Product Description alloy<br />
% metal<br />
loading<br />
Tack,<br />
g/mm 2<br />
print speed,<br />
mm/s<br />
ipc/j-std-004<br />
classification<br />
MULTICORE<br />
LF730<br />
A halide-free, no-clean, low voiding, Pb-Free solder paste, which has excellent humidity resistance<br />
and a broad process window both for printing and reflow.<br />
96SC, 97SC 88.5 2.4 70 - 130 ROL0<br />
die attach solder paste<br />
Product Description APPLICATION<br />
VISCOSITY,<br />
cPs<br />
ALLOY REFLOW CLEANABILITY<br />
IPC/J-STD-004<br />
CLASSIFICATION<br />
MULTICORE<br />
DA100<br />
MULTICORE<br />
DA101<br />
Flux designed for Solder Die Attach Paste applications. Effective thermal control<br />
for Cu leadframe power semiconductor devices, such as rectifiers, power<br />
transistors, and for automotive and consumer packages.<br />
Flux designed for Solder Die Attach Paste applications. Effective thermal control<br />
for Cu leadframe power semiconductor devices, such as rectifiers, power<br />
transistors, and for automotive and consumer packages.<br />
Dispensing 250,000 High Pb Forming Fast Excellent ROL0<br />
Printing 250,000 High Pb Forming Fast Excellent ROL0<br />
43
SemiConductor<br />
solutions<br />
<strong>Semiconductor</strong><br />
Underfills<br />
Tacky Fluxes<br />
44
Molding Compounds<br />
Die Attach Paste<br />
Die Attach Film<br />
Wafer-Backside Coating<br />
Self Filleting Paste<br />
Solder Paste<br />
45
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
index<br />
ABLEBCOAT 8008HT .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15<br />
ABLEBOND 84-1LMISR4.. . . . . . . . . . . . . . . . . . . . . . . . 9, 15, 18<br />
ABLEBOND 84-1LMISR8.. . . . . . . . . . . . . . . . . . . . . . 8, 9, 15, 18<br />
ABLEBOND 2000B.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 15, 17<br />
ABLEBOND 2025DSI .. . . . . . . . . . . . . . . . . 7, 8, 9, 10, 15, 17, 19<br />
ABLEBOND 2030SC.. . . . . . . . . . . . . . . . . . . . . . . . . . . 11, 15, 17<br />
ABLEBOND 2033SC.. . . . . . . . . . . . . . . . . . . . . . . . . . . 11, 15, 17<br />
ABLEBOND 2035SC.. . . . . . . . . . . . . . . . . . . . . . . . 11, 13, 15, 17<br />
ABLEBOND 2053S.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 15, 17<br />
ABLEBOND 2100A.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 15, 17<br />
ABLEBOND 2300 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 15, 17<br />
ABLEBOND 3003 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 27, 28<br />
ABLEBOND 3005 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 27, 28<br />
ABLEBOND 3188 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27, 28<br />
ABLEBOND 3230 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7, 8, 15, 18<br />
ABLEBOND 8200C.. . . . . . . . . . . . . . . . . . . . . . . . . . . 8, 9, 15, 18<br />
ABLEBOND 8200TI.. . . . . . . . . . . . . . . . . . . . . . . . . . . 8, 9, 15, 18<br />
ABLEBOND 8290 .. . . . . . . . . . . . . . . . . . . . . . . . . . 7, 8, 9, 15, 18<br />
ABLEBOND 8352L .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9, 15, 18<br />
ABLEBOND 8384 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11, 15, 17<br />
ABLEBOND 8387B.. . . . . . . . . . . . . . . . . . . . . . 13, 15, 17, 30, 31<br />
ABLEBOND 8387BS.. . . . . . . . . . . . . . . . . . . . . 13, 15, 17, 30, 31<br />
ABLEBOND 8900NC.. . . . . . . . . . . . . . . . . . . . . . . . 7, 8, 9, 15, 19<br />
ABLEBOND FS849-TI.. . . . . . . . . . . . . . . . . . . . . . . 5, 8, 9, 15, 18<br />
ABLEBOND GA-2W .. . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 15, 17<br />
ABLEBOND MC723 .. . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 27, 28<br />
ABLECOAT 8006NS .. . . . . . . . . . . . . . . . . . . . . . . . . . 8, 9, 15, 19<br />
ABLECOAT 8008HT .. . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 8, 9, 18<br />
ABLECOAT 8008NC.. . . . . . . . . . . . . . . . . . . . . . . . . . 8, 9, 15, 19<br />
ABLEFILL UF8806G .. . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 24, 25<br />
ABLEFILL UF8826. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 24, 25<br />
ABLEFILL UF8828. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 24, 25<br />
ABLEFILL UF8829. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 24, 25<br />
ABLEFLEX 6200 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12, 15, 17<br />
ABLEFLEX 6202CX.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12, 15, 17<br />
ABLELUX A4502.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
ABLELUX LA-1UV.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
ABLELUX LHA-2.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
ABLELUX OGR150THTG .. . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
ABLESTIK 2025D-SF .. . . . . . . . . . . . . . . . . . . . . . . 10, 12, 15, 17<br />
ABLESTIK 8008MD.. . . . . . . . . . . . . . . . . . . . . . . . . . . 8, 9, 15, 18<br />
ABLESTIK ABP-8910T .. . . . . . . . . . . . . . . . . . . . . . . . 8, 9, 15, 19<br />
ABLESTIK ATB-100. . . . . . . . . . . . . . . . . . . . . . . . . 10, 12, 20, 21<br />
ABLESTIK ATB-100A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20, 21<br />
ABLESTIK ATB-100 Series.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10<br />
ABLESTIK ATB-100U .. . . . . . . . . . . . . . . . . . . . . . . 10, 11, 20, 21<br />
ABLESTIK ATB-100US.. . . . . . . . . . . . . . . . . . . 10, 11, 12, 20, 21<br />
ABLESTIK C100 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7, 8, 9, 20<br />
ABLESTIK C115 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 20, 21<br />
ABLESTIK C130 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 20, 21<br />
ABLETHERM 2600AT .. . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 15, 18<br />
AQUADAG 22.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
AQUADAG E/18%.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
DAG 1050.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
ECCOBOND C860-1J.. . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
ECCOBOND CE3513 .. . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
ECCOBOND CE3804 A/B.. . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
ECCOBOND CE3920 .. . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
ECCOCOAT C110.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
ECCOCOAT C110-5-4. . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
ECCOCOAT CP8825.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
ELECTRODAG 503.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
ELECTRODAG PR406. . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 22, 23<br />
HYSOL 3323.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11, 27, 28<br />
HYSOL 3327.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11, 27, 29<br />
HYSOL 3329.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11, 27, 29<br />
HYSOL 5110C.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26<br />
HYSOL CB064 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27, 29<br />
HYSOL CB0260 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 27, 29<br />
HYSOL CB0260-1.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 27, 29<br />
HYSOL DC0114 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25<br />
HYSOL FF2200.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25<br />
HYSOL FF2300.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25<br />
HYSOL FF6000.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43<br />
HYSOL FP0087.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 27, 29<br />
HYSOL FP0114.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25<br />
HYSOL FP4450.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 27, 29<br />
HYSOL FP4450HF .. . . . . . . . . . . . . . . . . . . . . . . . . 10, 11, 27, 29<br />
HYSOL FP4450LV.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 27, 29<br />
HYSOL FP4451.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 11, 27<br />
HYSOL FP4451TD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 27, 28<br />
HYSOL FP4460.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27, 29<br />
HYSOL FP4470.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 27, 29<br />
HYSOL FP4526.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25<br />
HYSOL FP4530.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25<br />
HYSOL FP4531.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25<br />
HYSOL FP4545FC .. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 24, 25<br />
HYSOL FP4549.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 24, 25<br />
HYSOL FP4549HT .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25<br />
HYSOL FP4583.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25<br />
HYSOL FP4585.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24, 25<br />
HYSOL FP4651.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27, 29<br />
HYSOL FP4652.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27, 29<br />
HYSOL FP4653.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27, 29<br />
HYSOL FP4654.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27, 29<br />
HYSOL FP5000.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26<br />
HYSOL FP5001.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26<br />
HYSOL FP5110C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 26<br />
HYSOL FP5201.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 26<br />
HYSOL FP5300.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26<br />
46
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
INDEX<br />
HYSOL FP5500.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26<br />
HYSOL FP6401.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27, 28<br />
HYSOL GR15F-1P. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 35, 37<br />
HYSOL GR360A-F8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 35, 36<br />
HYSOL GR640HV-L1 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 40<br />
HYSOL GR725LV-LS.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9, 35, 40<br />
HYSOL GR750 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 35, 36<br />
HYSOL GR750HT-25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 36<br />
HYSOL GR750-SC .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 36<br />
HYSOL GR828D.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7, 9, 35, 39<br />
HYSOL GR828DD.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 39<br />
HYSOL GR838LC.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 39<br />
HYSOL GR869 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7, 35, 38, 39<br />
HYSOL GR2220 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 32, 33<br />
HYSOL GR2310 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 32, 33<br />
HYSOL GR2320 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32, 33<br />
HYSOL GR2620 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32, 33<br />
HYSOL GR2710 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 32, 33<br />
HYSOL GR2720 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32, 33<br />
HYSOL GR2725 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 32, 33<br />
HYSOL GR2811 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 32, 33<br />
HYSOL GR2820 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 32, 33<br />
HYSOL GR9810-1P. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12, 35, 41<br />
HYSOL GR9810 Series.. . . . . . . . . . . . . . . . . . . . . . . . . 10, 35, 41<br />
HYSOL GR9851M.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12, 35, 41<br />
HYSOL KL1000-3LX.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 35, 36<br />
HYSOL KL-2500-1K.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 36<br />
HYSOL KL-4500-1 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 36<br />
HYSOL KL-4500-1NT.. . . . . . . . . . . . . . . . . . . . . . . . . . . 9, 35, 39<br />
HYSOL KL-5000HT.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 35, 36<br />
HYSOL KL-6500S.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 40<br />
HYSOL KL-7000HA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7, 35, 38<br />
HYSOL KL-G100.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 35, 36<br />
HYSOL KL-G150.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 36<br />
HYSOL KL-G200.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 35, 36<br />
HYSOL KL-G200S. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 40<br />
HYSOL KL-G450H .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9, 35, 39<br />
HYSOL KL-G450S. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 40<br />
HYSOL KL-G500HT .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 36<br />
HYSOL KL-G730.. . . . . . . . . . . . . . . . . . . . . . . . . . 7, 9, 35, 38, 39<br />
HYSOL KL-G800H .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35, 40<br />
HYSOL KL-G900HC.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8, 35, 39<br />
HYSOL KL-G900HP .. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8, 35, 39<br />
HYSOL MG15F.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 35, 37<br />
HYSOL MG33F.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32, 33<br />
HYSOL QMI519. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8, 9, 15, 18<br />
HYSOL QMI529HT .. . . . . . . . . . . . . . . . . . . . . . . . . 5, 8, 9, 15, 18<br />
HYSOL QMI529HT-LV.. . . . . . . . . . . . . . . . . . . . . . . 7, 8, 9, 15, 18<br />
HYSOL QMI536HT .. . . . . . . . . . . . . . . . . . . 5, 8, 9, 10, 15, 17, 19<br />
HYSOL QMI538NB.. . . . . . . . . . . . . . . . . . . . . 8, 9, 10, 13, 15, 17<br />
HYSOL QMI547. . . . . . . . . . . . . . . . . . . . . . . . . . 5, 7, 8, 9, 15, 19<br />
HYSOL UV3000. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
HYSOL UV8800M.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11, 27, 29<br />
LOCTITE 3128.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
LOCTITE 3129.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
LOCTITE 3131.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
LOCTITE 3217.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
LOCTITE 3220.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
LOCTITE 3751.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
LOCTITE UV8000 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 30, 31<br />
MULTICORE DA100 .. . . . . . . . . . . . . . . . . . . . . . . . . 5, 15, 19, 43<br />
MULTICORE DA101 .. . . . . . . . . . . . . . . . . . . . . . . . . 5, 15, 19, 43<br />
MULTICORE LF730.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43<br />
MULTICORE TFN600 .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 43<br />
MULTICORE TFN700B.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43<br />
MULTICORE TFN800HF-Blue.. . . . . . . . . . . . . . . . . . . . . . . . . . 43<br />
MULTICORE WS300.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 43<br />
47
Periodic<br />
Table of elements<br />
NOTES:<br />
48
<strong>Henkel</strong> –<br />
Your partner worldwide<br />
AMERICAS<br />
HEADQUARTERS:<br />
UNITED STATES<br />
<strong>Henkel</strong> Corporation<br />
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Tel: 1-949-789-2500<br />
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<strong>Henkel</strong><br />
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ASIA - PACIFIC<br />
HEADQUARTERS: ASIA<br />
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AUSTRALIA<br />
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Tel: +86 21 2891 8000<br />
<strong>Henkel</strong> China<br />
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<strong>Henkel</strong> Hong Kong<br />
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<strong>Henkel</strong> Corporation<br />
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Across the Board,<br />
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www.henkel.com/electronics<br />
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KM31.2,<br />
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<strong>Henkel</strong> Japan<br />
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KOREA<br />
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Tel: +82 2 3279 1730<br />
<strong>Henkel</strong> Korea<br />
6th Floor, Dae Ryung Techno<br />
Town II<br />
569-21 Gasan-dong,<br />
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MALAYSIA<br />
Lot 973, Jalan Kampung<br />
Baru Hicom,<br />
Persiaran Tengku Ampuan,<br />
Lion Industrial Park, Sek 26,<br />
Shah Alam, 40400 Selangor,<br />
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Tel: +60 3 5192 6200<br />
<strong>Henkel</strong> Malaysia<br />
(M) Sdn Bhd., 88K-2<br />
Jalan Tun Dr Awang, Sri Bukit<br />
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11900 Bayan Lepas,<br />
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Tel: +60 4-6435244<br />
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(M) Sdn Bhd., Lot 8 & 10<br />
Jalan Tukul 16/5,<br />
40000 Shah Alam,<br />
Selangor, Malaysia<br />
Tel: +60 3-55191105<br />
PHILIPPINES<br />
21/F, Asia Star Building,<br />
2402-2404 Asean Drive,<br />
Filinvest Corporate City,<br />
Alabang, Muntinlupa City 1781,<br />
Philippines<br />
Tel: +632 859 3100<br />
<strong>Henkel</strong> Philippines<br />
2 Perfector Drive,<br />
Sta Maria Industrial Estate<br />
Bagumbayan, Taguig,<br />
Metro Manila<br />
1600 Philippines<br />
Tel: +632 837-5898<br />
SINGAPORE<br />
401, Commonwealth Drive<br />
#03-01/02,<br />
Haw Par Techno Centre,<br />
Singapore 149598<br />
Tel: +65 6266 0100<br />
<strong>Henkel</strong> Singapore<br />
Block 11, Kallang Place #07-10<br />
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Singapore 339155<br />
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TAIWAN<br />
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Taiwan<br />
Tel: +886 2 2227 1988<br />
<strong>Henkel</strong> Taiwan<br />
B-5F, No. 356 Sec 2<br />
Ching Nien Road<br />
Feng Shan City,<br />
Kaoshiung, Taiwan<br />
Tel: +886 7-776-2313<br />
THAILAND<br />
Centralworld, 35th Floor,<br />
999/9 Rama 1 Road,<br />
Patumwan, Bangkok, 10330<br />
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Tel: +66 2 209 8000<br />
<strong>Henkel</strong> Thailand<br />
40/14 Moo<br />
12 Bangna Trad Road<br />
Bangkaew, Bangplee,<br />
Samutprakarn 10540<br />
Thailand<br />
Tel: +662 3120530-45<br />
EUROPE<br />
AUSTRIA<br />
See <strong>Henkel</strong> Germany<br />
BELGIUM<br />
<strong>Henkel</strong> Belgium N.V.<br />
Havenlaan 16<br />
B-1080 Brussel, Belgium<br />
Tel: +32-(0)2-42125 55<br />
BULGARIA<br />
<strong>Henkel</strong> Bulgaria E.O.O.D.<br />
Business Park Sofia<br />
Block 2, 4th floor<br />
BG-1715 Sofia, Bulgaria<br />
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CZECH REPUBLIC<br />
<strong>Henkel</strong> CR, spol. s r.o.<br />
U Pruhonu 10<br />
CZ-170 04 Praha 7<br />
Czech Republic<br />
Tel: +420 2 20101401<br />
CROATIA<br />
<strong>Henkel</strong> Croatia d.o.o.<br />
Budmanijeva 1<br />
HR-10000 Zagreb, Croatia<br />
Tel. +85 1 6008-161<br />
DENMARK<br />
<strong>Henkel</strong> Norden AB,<br />
Copenhagen<br />
Horskaetten 3<br />
DK-2630 Taastrup, Denmark<br />
Tel: +45 43 30 13 01<br />
FINLAND<br />
<strong>Henkel</strong> Norden Oy<br />
Ayritie 12 a<br />
01510 Vantaa, Finland<br />
Tel: +358 020 122 311<br />
FRANCE<br />
<strong>Henkel</strong> Loctite ® France<br />
10, Avenue Eugene Gazeau<br />
BP 40090<br />
F-60304 Senlis-Cedex, France<br />
Tel: +33 0344 216600<br />
GERMANY<br />
<strong>Henkel</strong> AG & Co. KGaA<br />
Gutenbergstrasse 3<br />
85748 Garching, Germany<br />
Tel: +49-89-92-68-0<br />
HUNGARY<br />
<strong>Henkel</strong> Magyarorszag Kft.<br />
H-1113 Budapest<br />
David Ferenc u. 6, Hungary<br />
Tel: +36 30 9192884<br />
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<strong>Henkel</strong> Loctite ® Adesivi S.r.l.<br />
Via Talete 56<br />
20047 Brugherio (MI), Italy<br />
Tel: +39 039 21251<br />
NETHERLANDS<br />
<strong>Henkel</strong> Nederland B.V.<br />
<strong>Henkel</strong> Technologies<br />
Postbus 2100<br />
3430 CM Nieuwegein, Netherlands<br />
Tel: +31 030 607 38 50<br />
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0604 Oslo, Norway<br />
Tel: +47 23 37 15 20<br />
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Domaniewska 41<br />
PL-02-672 Warszawa, Poland<br />
Tel: +48 22 5656200<br />
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See <strong>Henkel</strong> Hungary<br />
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RUSHENK<br />
Bakhrushina Ul., 32, Building 1<br />
RU-113054 Moscow, Russia<br />
Tel: +7 095 7452318<br />
SLOVAKIA<br />
<strong>Henkel</strong> Slovensko s.r.o.<br />
Zahradnicka 91<br />
P.O. Box 66<br />
SK-821 08 BRATISLAVA, Slovakia<br />
Tel: +421 2 50246402, 111<br />
SPAIN<br />
<strong>Henkel</strong> Iberica, S.A.<br />
Pol. Ind. Alparrache<br />
Camino de Villaviciosa, 18 y 20<br />
28600 Navalcarnero,<br />
Madrid, Spain<br />
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SWEDEN<br />
<strong>Henkel</strong> Norden AB<br />
P.O. Box 120 80,<br />
SE-102 22 Stockholm,<br />
Sweden<br />
Tel: +46 863443800<br />
SWITZERLAND<br />
See <strong>Henkel</strong> Germany<br />
TURKEY<br />
Türk <strong>Henkel</strong> Kimya Sanayi ve<br />
Ticaret A.S.<br />
Kayisdagi CadKaraman Ciftligi<br />
YoluKar Plaza D Blok<br />
34752 Icerenköy - Istanbul,<br />
Turkey<br />
Tel: 0090 216 579 4000<br />
Fax: 0090 216 579 4092<br />
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Silver Centre<br />
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UA-03067 Kiev, Ukraine<br />
Tel: +38 044 20145 77<br />
Ireland and UK<br />
<strong>Henkel</strong> Loctite ®<br />
Adhesives Limited<br />
Technologies House<br />
Wood Lane End,<br />
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United Kingdom<br />
Tel: +44 (0)1442 278000<br />
<strong>Henkel</strong> United Kingdom<br />
Station Road, Linton<br />
Cambridge CB1 6NW<br />
United Kingdom<br />
Tel: +44 1-223-893-771<br />
Except as otherwise noted, all marks used in LT-5013 are trademarks and/or registered trademarks of <strong>Henkel</strong> and/or its affiliates in the U.S. and<br />
elsewhere. ® = registered in the U.S. Patent and Trademark Office. © <strong>Henkel</strong> Corporation, 2010. All rights reserved. 6286/LT-5013 (6/10)
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