TM 11-6625-2837-14&P-7 TECHNICAL MANUAL OPERATOR'S ...

TECHNICAL MANUAL 

OPERATOR’S, ORGANIZATIONAL, 

DIRECT SUPPORT,AND GENERAL SUPPORT 

MAINTENANCE MANUAL 

INCLUDING REPAIR PARTS AND 

SPECIAL TOOLS LIST 

(INCLUDING DEPOT MAINTENANCE REPAIR 

PARTS AND SPECIAL TOOLS) 

FOR 

RF SECTION HP-86602B 

(NSN 6625-01-031-8853) 

HEADQUARTERS, DEPARTMENT OF THE ARMY 

OCTOBER 1981 

TM 11-6625-2837-14&P-7

SAFETY 

WARNING 

Although this instrument has been designed in 

accordance with international safety standards, this 

manual contains information, cautions, and warnings 

which must be followed to retain the instrument in safe 

condition. Be sure to read and follow the safety 

information in Sections 11, III, V, an VIII. 

BEFORE CONNECTING THIS SYSTEM TO LINE 

(MAINS) VOLTAGE, the safety and installation 

instructions found in Sections II and III of the mainframe 

manual should be followed. 

HIGH VOLTAGE 

Adjustments and troubleshooting are often performed 

with power supplied to the instrument while protective 

covers are removed. Energy available at many points 

may constitute a shock hazard 

The multi-pin plug connector which provides inter 

connection from mainframe to RF Section, will be 

exposed with the RF Section removed from the righthand 

mainframe cavity. With the Line (Mains Voltage off 

and power cord disconnected, power supply voltages 

may still remain and may constitute a shock hazard. 

WARNING 

COMPATIBILITY 

TM 11-6625-2837-14&P-7 

Damage to the synthesized signal generator system may 

result if an option 002 RF Section is used with 

unmodified Model 8660A or 8660B main-frames with 

serial prefixes 1349A and below. 

PERFORMANCE TESTING 

To avoid the possibility of damage to the instrument or 

test equipment, read completely through each test before 

starting it. Then make any preliminary control settings 

necessary before continuing with the procedure. 

PLUG-IN REMOVAL 

Before removing the RF Section plug-in from the 

mainframe, remove the line (Mains) voltage by 

disconnecting the power cable from the power outlet. 

SEMI-RIGID COAX 

Slight but repeated bending of the semi-rigid coaxial 

cable will damage them very quickly. Bend the cables as 

little as possible. If necessary, loosen the assembly to 

release the cable. 

Voltages are present in this instrument, when energized, which can 

cause death on contact. 

The multi-pin plug connector which provides interconnection from 

mainframe to RF Section, will be exposed with the RF Section removed 

from the righthand mainframe cavity. With the line voltage off and power 

cord disconnected, power supply voltage may still remain and may 

constitute a shock hazard. 

A


This manual contains copyrighted material reproduced by permission of the Hewlett-Packard Company. All rights 

reserved. 

TM 11-6625-2825-14&p-7 

TECHNICAL MANUAL ) HEADQUARTERS 

) DEPARTMENT OF THE ARMY 

No. 11-6625-2825-14&p-7 ) Washington, D.C., 18 October 1981 

OPERATOR’S, ORGANIZATIONAL, DIRECT SUPPORT 

AND GENERAL SUPPORT MAINTENANCE MANUAL 

INCLUDING REPAIR PARTS AND SPECIAL TOOLS LISTS 

FOR 

RF SECTION PLUG-IN, HEWLETT-PACKARD MODEL 86602B 

(NSN 6625-01-031-8853) 

CURRENT AS OF 30 JANUARY 1981 

REPORTING ERRORS AND RECOMMENDING IMPROVEMENTS 

You can help improve this manual. If you find any mistakes or if you know of a way to improve the procedures, 

please let us know. Mail your letter or DA Form 2028 (Recommended Changes to Publications and Blank Forms), direct 

to: Commander, US Army Communications and Electronics Materiel Readiness Command, ATTN: DRSEL-ME-MQ, Fort 

Monmouth, New Jersey 07703. In either case, a reply will be furnished direct to you. 

This manual is an authentication of the manufacturer’s commercial literature which, through usage, has been found to 

cover the data required to operate and maintain this equipment. The manual was not prepared in accordance with military 

specifications; therefore, the format has not been structured to consider categories of maintenance. Section IX contains 

improvements made after the printing of the manufacturer’s manual. 

CONTENTS 

SECTION 0 INTRODUCTION PAGE 

0-1. Scope 0-1 

0-2. Indexes of Publications 0-1 

0-3. Maintenance Forms, Records and Reports 0-1 

0-4. Reporting Equipment Improvement Recommendations (EIR) 0-1 

0-5. Administrative Storage 0-2 

0-6. Destruction of Army Electronics Materiel 0-2 

i

Section Page 

I GENERAL INFORMATION ......................... 1-1 

1-1. Introduction....................................... 1-1 

1-7. Specifications .................................. 1-1 

1-9. Instruments Covered by Manual....... 1-1 

1-12. Manual Change Supplements.......... 1-1 

1-15. Description........................................ 1-5 

1-20. Options ............................................ 1-5 

1-24. Compatibility..................................... 1-5 

1-27. Equipment Required but not 

Supplied........................................ 1-5 

1-28. System Mainframe ........................... 1-5 

1-31. Frequency Extension Module........... 1-6 

1-33. Auxiliary Section............................... 1-6 

1-35. Modulation Section Plug-ins............. 1-6 

1-37. Equipment Available......................... 1-6 

1-40. Safety Considerations...................... 1-6 

1-43. Recommended Test Equipment....... 1-6 

II INSTALLATION........................................... 2-1 

2-1. Introduction....................................... 2-1 

2-3. Initial Inspection ............................... 2-1 

2-5. Preparation For Use......................... 2-1 

2-6. Power Requirements........................ 2-1 

2-8. Interconnections............................... 2-1 

2-10. Modifications..................................... 2-1 

2-13. Operating Environment..................... 2-1 

2-15. Installation Instructions..................... 2-1 

2-17. Storage and Shipment...................... 2-2 

2-18. Environment..................................... 2-2 

2-20. Packaging......................................... 2-2 

III OPERATION........................................... 3-1 

3-1. Introduction ...................................... 3-1 

3-3. Panel Features................................. 3-1 

3-5. Operator’s Check.............................. 3-1 

3-8. Operating Instructions ..................... 3-1 

IV PERFORMANCE TESTS ....................... 4-1 

4-1. Introduction....................................... 4-1 

4-3. Equipment Required......................... 4-1 

4-5. Test Record...................................... 4-1 

4-7. Performance Tests........................... 4-1 

4-9. Frequency Range............................. 4-2 

4-10. Frequency Accuracy and Stability.... 4-3 

4-11. Frequency Switching Time............... 4-3 

4-12. Output Level Switching Time............. 4-5 

4-13A . Output Accuracy.......................... 4-7 

4-13B . Output Accuracy- Alternate 

Procedure...................................... 4-12 

4-14. Output Flatness................................ 4-15 

4-15. Harmonic Signals............................. 4-16 

CONTENTS 

ii 


Section Page 

4-16. Pulse Modulation Risetime............... 4-17 

4-17. Pulse Modulation On/Off Ratio......... 4-19 

4-18. Amplitude Modulation Depth and 

3 dB Bandwidth............................. 4-19 

4-19. Frequency Modulation Rate and 

Deviation....................................... 4-23 

4-20. Output Impedance and VSWR......... 4-23 

4-21. Signal-to-Phase Noise Ratio............ 4-25 

4-22. Signal-to-AM Noise Ratio................. 4-27 

4-23. Residual FM..................................... 4-29 

4-24. Amplitude Modulation Distortion...... 4-31 

4-25. Incidental Phase Modulation ........... 4-33 

4-26. Frequency Modulation Distortion...... 4-35 

4-27. Incidental AM................................... 4-38 

4-28. Spurious Signals, Narrowband......... 4-40 

4-29. Spurious Signals, Wideband........... . 4-41 

4-30. Phase Modulation Peak Deviation... 4-43 

4-31A. Phase Modulation Distortion........... 4-43 

4-31B. Phase Modulation Distortion - 

Alternate Procedure...................... 4-45 

V ADJUSTMENTS.......................................... 5-1 

5-1. Introduction...................................... 5-1 

5-4. Equipment Required........................ 5-1 


5-12. Factory Selected Components......... 5-1 

5-14. Related Adjustments........................ 5-1 

5-18. Adjustment Locations....................... 5-2 

5-20. Adjustments........................... .......... 5-2 

5-22. Post Adjustment Tests ............... ..... 5-2 

5-24. RF Output Level Adjustment............ 5-3 

5-25. 1 dB Step Attenuator Adjustment..... 5-4 

5-26. Amplitude Modulation Input Circuit 

Adjustment.................................... 5-5 

5-27. Phase Modulator Driver Frequency 

Response Adjustments................. 5-7 

5-28A. Phase Modulation Level and 

Distortion Adjustments.................. 5-8 

5-28B. Phase Modulation Level and Distortion 

Adjustments - Alternate Procedure5-11 

VI REPLACEABLE PARTS.......................... 6-1 

6-1. Introduction...................................... 6-1 

6-3. Exchange Assemblies...................... 6-1 

6-5. Abbreviations............................. ...... 6-1 

6-7. Replaceable Parts List..................... 6-1

Section Page 

VII MANUAL CHANGES ............................... 7-1 

7-1. Introduction ...................................... 7-1 

7-3. Manual Changes.............................. 7-1 

7-6. Manual Change Instructions............. 7-2 

VIII SERVICE................................................... 8-1 

8-1. Introduction....................................... 8-1 


8-12. Principles of Operation..................... 8-1 

8-16. Troubleshooting................................ 8-1 

Figure Page 

1-1. HP Model 86602B RF Section (Opt. 002 

Shown) 

1-2. 40 dB Test Amplifier................................ 1-0 

1-3. 15 kHz Low Pass Filter .......................... 1-11 

1-4. Low Pass Filters...................................... 1-11 

2-1. RF Section Partially Inserted into 

Mainframe ........................................ 2-2 

3-1. Front Panel Controls, Connectors, and 

Indicators.......................................... 3-2 

3-2. Rear Panel Connectors and Indicators... 3-3 

3-3. Operator’s Check.................................... 3-4 

4-1. Frequency Range Test Setup................. 4-2 

4-2. Frequency Switching Time Test Setup... 4-4 

4-3. Output Level Switching Time Test Setup 4-6 

4-4A. Output Accuracy Test Setup.................. 4-8 

4-4B. Output Accuracy Test Setup (Alternate 

Procedure......................................... 4-13 

4-5. Pulse Modulation Risetime Test Setup . . 4-18 

4-6. Amplitude Modulation, Depth and 3 dB 

Bandwidth Test Setup...................... 4-20 

4-7. Output Impedance Test Setup................ 4-24 

4-8. Signal-to-Phase Noise Ratio Test Setup. 4-26 

4-9. Signal-to-AM Noise Ratio Test Setup..... 4-28 

4-10. Residual FM Test Setup ......................... 4-29 

4-11. Amplitude Modulation Distortion Test 

Setup................................................ 4-30 

4-12. Incidental Phase Modulation Test Setup 4-32 

4-13. Frequency Modulation Distortion Test 

Setup................................................ 4-35 

4-14. Incidental AM Test Setup ....................... 4-38 

4-15. Narrowband Spurious Signal Test Setup. 4-39 

4-16. Wideband Spurious Signal Test Setup... 4-41 

CONTENTS (Cont’d) 

ILLUSTRATIONS 

iii 


Section Page 

8-17. System Troubleshooting.................. 8-2 

8-19. RF Section Troubleshooting............. 8-2 

8-21. Troubleshooting Aids....................... 8-2 

8-28. Recommended Test Equipment ...... 8-2 

8-30. Repair............................................... 8-2 

8-31. General Disassembly Procedures.... 8-2 

8-34. Non-Repairable Assemblies............. 8-2 

8-36. Module Exchange Program.............. 8-3 

8-38. Repair Procedures........................... 8-3 

8-42. Post Repair Adjustments ................. 8-3 

IX ERRATA 

Figure Page 

4-17A. Phase Modulation Distortion Test Setup 4-44 

4-17B.Phase Modulation Distortion Test Setup 

(Alternate Procedure)....................... 4-46 

5-1. RF Output Level Adjustment Test Setup 5-3 

5-2. 1 dB Step Attenuator Adjustment Test 

Setup................................................ 5-4 

5-3. Amplitude Modulation Input Circuit 

Adjustment Test Setup..................... 5-5 

5-4. Phase Modulator Driver Frequency 

Response Adjustment Test Setup ... 5-7 

5-5A. Phase Modulation Level and Distortion 

Adjustment Test Setup..................... 5-9 

5-5B. Phase Modulation Level and Distortion 

Adjustment Test Setup (Alternate 

Procedure)....................................... 5-12 

7-1. Phase Modulator Driver Frequency Response 

Adjustment Test Setup (Change B). 7-2 

7-2. A16 Phase Modulator Driver Assembly 

Component and Test Point Locations 

(Change B)....................................... 7-6 

7-3. Phase Modulation Section Schematic 

Diagram (Option 002) (Change B).. . 7-8 

7-4. A17 Phase Modulator Assembly 

Component Locations (Change C) .. 7-9 

7-5. P/O Phase Modulation Section Schematic 

Diagram (Change C)........................ 7-11 

7-6. P/O Attenuator Section Schematic 

Diagram (Change D)........................ 7-11 

7-7. P/O All Logic Assembly Schematic 

Diagram (Change E)........................ 7-12 

8-1. LO Signal Circuits Repair....................... 8-4

Figure Page 

8-2. Rear Panel Disassembly......................... 8-8 

8-3. Schematic Diagram Notes...................... 8-9 

8-4. System Test Point Locations.................. 8-17 

8-5. Mainframe Interconnect Jack.................. 8-17 

8-6. System Troubleshooting Block 

Diagram............................................ 8-17 

8-7. RF Section Simplified Block Diagram..... 8-19 

8-8. Main Troubleshooting Block Diagram .... 8-19 

8-9. Logic Troubleshooting Block Diagram . .. 8-21 

8-10. A7 Mixer Assembly’s Subassembly and 

Component Location........................ 8-22 

8-11. Mixer Section Schematic Diagram.......... 8-23 

8-12. A16 Phase Modulator Driver Assembly 

Component and Test Point Locations 8-25 

8-13. A17 Phase Modulator Assembly 

Component Locations . .................... 8-25 

8-14. Phase Modulation Section Schematic 

Diagram (Option 002)....................... 8-25 

8-15. A4 Detector Amplifier Assembly 

Component and Test Point Locations 8-27 

Table Page 

1-1. Models 86602B/11661 Specifications..... 1-2 

1-2. Recommended Test Equipment............. 1-7 

3-1. Operating Instructions ............................ 3-6 

4-1. dB to Power Ratio Conversion................ 4-37 

4-2. Narrowband Spurious Signal Checks..... 4-40 

4-3. Wideband Spurious Signal Checks ........ 4-41 

4-4. Performance Test Record ...................... 4-47 

5-1. Factory Selected Components................ 5-2 

ILLUSTRATIONS (Cont’d) 

TABLES 

APPENDICES 


Figure Page 

8-16. .Amplifier/Detector Section 

Schematic Diagram.......................... 8-27 

8-17. A3 ALC Amplifier Assembly Component 

and Test Point Locations.................. 8-28 

8-18. A10 Reference Assembly 

Component Locations ..................... 8-29 

8-19. A2 ALC Mother Board Assembly 

Component Locations...................... 8-29 

8-20. ALC Section 


8-21. A9 Attenuator Driver Assembly 

Component Locations ..................... 8-31 

8-22. Attenuator Section 


8-23. All Logic Assembly 

Component Locations...................... 8-33 

8-24. All Logic Assembly 


8-25. Assemblies, Chassis Parts, and Adjustable 

Component Locations ............... ...... 8-35 

Table Page 

6-1. Reference Designations & Abbreviations6-3 

6-2. Replaceable Parts.................................. 6-5 

6-3. Code Lists of Manufacturers................... 6-15 

6-4. Parts to NSN Cross Refererence........... 6-16 

7-1. Manual Changes by Serial Prefix........... 7-1 

7-2. Summary of Changes by Component.... 7-1 

7-3. Replaceable Parts (P/O Change B)........ 7-7 

8-1. Front Panel Housing Repair................... 8-7 

8-2. Adjustable Components Locations .. 8-34 

Page 

APPENDIX A. References............................................................................................. A-1 

APPENDIX B. Maintenance Allocation 

Section I. Introduction............................................................................................. B-1 

II. Maintenance Allocation.......................................................................... B-5 

III. Tool and Test Equipment Requirements ............................................ B-6 

NOTE 

Users of this manual are advised to consult SECTION IX, ERRATA. SECTION IX 

contains errors and changes in text and illustrations. The user should correct the errors 

and perform the changes indicated, as needed. 

iv

0-1. Scope 

SECTION 0 

INTRODUCTION 


This manual describes RF Section Hewlett-Packard Model 86602B, hereinafter referred to as the RF Section, and 

provides instructions for its operation and maintenance. 

This manual applies directly to instruments with serial numbers prefixed 1638A. It is also applicable to instruments with 

other serial number prefixes for which manual changes are given in SECTION VII. 

SECTION VI includes Table 6-4, a cross reference between the Hewlett-Packard part numbers and the equivalent 

NATO/NATIONAL Stock Numbers (NSN). 

Appendix A provides a reference of pertinent Department of the Army publications. 

Appendix B contains the Maintenance Allocation Chart (MAC) which defines the levels and scope of maintenance 

functions for the equipment in the Army system and a list of the tools and test equipment required. 

0-2. Indexes of Publications 

a. DA Pam 310-4. Refer to the latest issue of the DA Pam 310-4 to determine whether there are new editions, 

changes or additional publications pertaining to the equipment. 

b. DA Pam 310-7. Refer to DA Pam 310-7 to determine whether there are Modification Work Orders (MWOs) 

pertaining to the equipment. 

0-3. Maintenance Forms, Records and Reports 

a. Reports of Maintenance and Unsatisfactory Equipment. Department of the Army forms and procedures 

used for equipment maintenance will be those prescribed by TM 38-750, the Army Maintenance Management System. 

b. Report of Item and Packaging Discrepancies. Fill out and forward SF 364 (Report of Discrepancy (ROD) as 

prescribed in AR 735-11-2/DLAR 4140.55/NAVSUPINST 4440.127E/AFR 400.54/MCO 4430.E. 

c. Discrepancy in Shipment Report (DISREP) (SF 361). Fill out and forward Discrepancy in Shipment Report 

(DISREP) (SF 361) as prescribed in AR 55-38/NAVSUPINST 4610.33B/AFR 75-18/MCO P4610.19C and DLAR 4500.15. 

0-4. Reporting Equipment Improvement Recommendations (EIR) 

If your HP 86602B RF Section needs improvement, let us know. Send us an EIR. You, the user, are the only one 

who can tell us what you don’t like about your equipment. Let us know why you don’t like the design. Tell us why a 

procedure is hard to perform. Put it on an SF 368 (Quality Deficiency Report). Mail it to: Commander, US Army 

Communications - Electronics Command, ATTN: DRSEL-ME-MQ, Fort Monmouth, New Jersey 07703. We’ll send you a 

reply. 

0-1

0-5. Administrative Storage. 

Store in accordance with Paragraphs 2-17 through 2-22. 

0-6. Destruction of Army Electronics Materiel 


Destruction of Army electronics materiel to prevent enemy use shall be in accordance with TM 750-244-2. 

0-2

Section 1 TM 11-6625-2837-14&P-7 

Figure 1-1. HP Model 86602B RF Section (Option 002 Shown) 

1-0


1-1. INTRODUCTION 

1-2. This manual contains all information required to 

install, operate, test, adjust and service the Hewlett- 

Packard Model 86602B RF Section plug-in, hereinafter 

referred to as the RF Section. For information 

concerning related equipment, such as the Hewlett- 

Packard Model 8660-series mainframes or the Model 

11661 Frequency Extension Module, refer to the 

appropriate manual or manuals. 

1-3. This manual is divided into eight sections which 

provide information as follows: 

a. SECTION I, GENERAL INFORMATION, 

contains the instrument description and specifications as 

well as the accessory and recommended test equipment 

list. 

b. SECTION II, INSTALLATION, contains 

information relative to receiving inspection, preparation 

for use, mounting, packing, and shipping. 

c. SECTION III, OPERATION, contains 

operating instructions for the instrument. 

d. SECTION IV, PERFORMANCE TESTS, 

contains information required to verify that instrument 

performance is in accordance with published 

specifications. 

e. SECTION V, ADJUSTMENTS, contains 

information required to properly adjust and align the 

instrument after repair. 

f. SECTION VI, REPLACEABLE PARTS, 

contains information required to order all replacement 

parts and assemblies. 

g. SECTION VII, MANUAL CHANGES, provides 

information to document all serial number prefixes listed 

on the title page. 

h. SECTION VIII, SERVICE, contains 

descriptions of the circuits, schematic diagrams, parts 

location diagrams, and troubleshooting procedures to aid 

the user in maintaining the instrument. 

SECTION I 

GENERAL INFORMATION 

1-1 

1-4. Figure 1-1 shows the Option 002 RF Section. 

1-5. DELETED 

1-6. On the title page of this manual, below the manual 

part number, is a “Microfiche” part number. This number 

may be used to order 4 x 6-inch microfilm transparencies 

of the manual. Each microfiche contains up to 60 photoduplicates 

of the manual pages. The microfiche 

package also includes the latest Manual Changes 

supplement as well as all pertinent Service Notes. 

1-7. SPECIFICATIONS 

1-8. Instrument specifications are listed in Table 1-1. 

These specifications are the performance standards, or 

limits against which the instrument may be tested. 

1-9. INSTRUMENTS COVERED BY MANUAL 1-10. 

This instrument has a two-part serial number. The first 

four digits and the letter comprise the serial number 

prefix. The last five digits form the sequential suffix that 

is unique to each instrument. The contents of this 

manual apply directly to instruments having the same 

serial number prefix(es) as listed under SERIAL 

NUMBERS on the title page. 

1-11. For information concerning a serial number prefix 

not listed on the title page or in the Manual Changes 

supplement, contact your nearest Hewlett-Packard 

office. 

1-12. MANUAL CHANGE SUPPLEMENTS 

1-13. An instrument manufactured after the printing of 

this manual may have a serial prefix that is not listed on 

the title page. This unlisted serial


FREQUENCY CHARACTERISTICS 

Range: 1.0 to 1299.999999 MHz selectable in 1 Hz 

steps. Frequencies from 200 kHz to 1 MHz may also be 

selected with some degradation in specifications. 

Accuracy and Stability 1 : CW frequency accuracy and 

long term stability are determined by the aging rate of the 

time base (internal or external) and its sensitivity to 

changes in temperature and line voltage. Internal 

reference oscillator accuracy = + aging rate ± 3 x 10 -10 

/°C + 3 x 10 -10 /1% change in line voltage 

Switching Time: 6 ms to be within 50 Hz of any new 

frequency selected; 100 ms to be within 5 Hz of any new 

frequency delected. 

Typical 86602B/11661 Frequency Switching 

Characteristics 

Harmonic Signals: 

All harmonically related signals are at least 30 dB below 

the desired output signal for output levels 45 MHz from carrier at 

frequencies >700 MHz 

50 dB down from carrier on the +10 dBm range. 

All Power Line Related spurious signals are 70 dB down 

from carrier. 

Signal-to-Phase Noise Ratio (CW, AM, and OM only): 

Greater than 45 dB in a 30 kHz band centered 

on the carrier and excluding a 1 Hz band 

centered on the carrier. 

Typical SSB Phase Noise Curve: 

Typical 86602B Phase Noise 

Signal-to-AM Noise Ratio: Greater than 65 dB down in 

a 30 kHz bandwidth centered on the carrier and 

excluding a 1 Hz band centered on the carrier


OUTPUT CHARACTERISTICS 

Level: Continuously adjustable from +10 to -146 dBm 

(0.7 Vrms to 0.01 /Vrms) into a 50Q resistive 

load. Output attenuator calibrated in 10 dB steps 

from 1.OV full scale (+10 dBm range) to 0.03 

pVrms full scale (-140 dBm range). Vernier 

provides continuous adjustment between 

attenuator ranges. Output level indicated on 

output level meter calibrated in volts and dBm 

into 50 ohms. 

Accuracy: (Local and remote modes) 

+ 1.5 dB to -76 dBm; + 2.0 dB to -146 dBm at 

meter readings between +3 and -6 dB. 

Flatness: Output level variation with frequency is less 

than ±1.0 dB from 1-1300 MHz at meter 

readings between +3 and --6 dB. 

Level Switching Time: In the remote mode any level 

change can be accomplished in less than 50 ms. 

Any change to another level on the same 

attenuator range can be accomplished in less 

than 5 ms. 

Impedance: 50Q. 

VSWR:


FREQUENCY MODULATION 

Rate: DC to 200 kHz with the 86632B and 86635A. 

20 Hz to 100 kHz with the 86633B. 

Maximum Deviation (peak): 

200 kHz with the 86632B and 86635A 

100 kHz with the 86633B 

Incidental AM: AM sidebands are greater than 60 dB 

down from the carrier with 75 kHz peak deviation 

at a 1 kHz rate. 

FM Total Harmonic Distortion (at rates up to 20 kHz); 


prefix indicates that the instrument is different from those 

documented in this manual. The manual for this 

instrument is supplied with a yellow Manual Changes 

supplement that contains “change information” that 

documents the differences. 

1-14. In addition to change information, the supplement 

may contain information for correcting errors in the 

manual. To keep this manual as current and accurate as 

possible, Hewlett-Packard recommends that you 

periodically request the latest Manual Changes 

supplement. The supplement for this manual is keyed to 

this manual’s print date and part number, both of which 

appear on the title page. Complimentary copies of the 

supplement are available from Hewlett-Packard. 

1-15. DESCRIPTION 

1-16. The HP Model 86602B RF Section is one of 

several RF Sections available for use in an 8660-series 

Synthesized Signal Generator System. This RF Section 

plug-in is used with an option 100 8660-series 

mainframe (Frequency Extension Module installed). The 

RF Section provides precisely tuned RF output 

frequencies over the 1 to 1300 MHz range with 1 Hz 

frequency resolution (8660-series option 004 instruments 

have resolutions of 100 Hz.) Frequencies from 200 kHz 

to 1 MHz can also be generated with some degradation 

in the amplitude leveling and other related specifications. 

1-17. The output power can be set to any level between 

+10 and --146 dBm by means of the front panel 

VERNIER and calibrated OUTPUT RANGE controls. A 

front panel-mounted meter and the OUTPUT RANGE 

switch indicate the output power and voltage levels 

delivered by the RF Section to any external load having a 

characteristic impedance of 50 ohms. Output power 

levels are maintained within + 1 dB of selected values 

through internal leveling of the output signal over the full 

frequency range of the instrument. 

1-18. Amplitude, frequency, phase, or pulse modulation 

of the RF OUTPUT signal can be accomplished within 

the RF Section by using the appropriate Auxiliary or 

Modulation Section plug-in. 

1-19. External programming permits remote selection of 

the output signal frequency in 1 Hz steps (100 Hz for 

option 004 mainframes) and the output power in 1 dB 

steps over the full operating 

1-5 

range of the instrument. External programming is 

accomplished via the mainframe computer-compatible 

interface and digital control unit circuits. 

1-20. OPTIONS 

1-21. This RF Section has two options available. They 

affect the instrument’s RF output level, and phase 

modulation capabilities. 

1-22. Option 001. The RF output attenuator is 

removed. This limits the RF output level range from +10 

to -6 dBm. 

1-23. Option 002. Circuits are added to provide the 

phase modulation capability. A compatible modulation 

section is required. 

1-24. COMPATIBILITY 

1-25. Except for Option 002 instruments, the Model 

86602B is compatible with all 8660-series option 100 

mainframes, all AM-FM Modulation Sections and the 

Auxiliary Section. This RF Section is partially compatible 

with the FM/OM Modulation Section. 

Damage to the signal generator system 

may result if an option 002 RF Section 

is used with Model 8660A or 8660B 

main-frames with serial prefixes 1349A 

and below. 

1-26. Option 002 instruments are compatible with all 

instruments which are part of the Model 8660-series 

Synthesized Signal Generator System except early 

model 8660A and 8660B Mainframes. Refer to the 

paragraph entitled Modifications in Section II of this 

manual for further information. 

1-27. EQUIPMENT REQUIRED BUT NOT 

SUPPLIED 

1-28. System Mainframe 

1-29. The mainframe uses phase-locked loops to 

accurately generate clock, reference, and tuning signals 

required for operation of the Synthesized Signal 

Generator System. Front panel-mounted mainframe 

controls are used to digitally tune two phase-locked loops 

in the Frequency Extension Module which, in turn, 

produce two high-frequency output signals that are 

applied to the RF Section. The RF Section mixes the 

two signals


and presents their frequency difference at the front panel 

OUTPUT jack. The output frequency is either the value 

selected by the mainframe front panel controls or 

external programming. 

1-30. The mainframe power supply provides all dc 

operating voltages required by the RF Section, 

Frequency Extension Module, and Modulation Section 

plug-ins. Remote programming of the plug-ins is 

accomplished via the mainframe interface and digital 

control unit circuits. 

1-31. Frequency Extension Module 

1-32. The Frequency Extension Module plug-in extends 

the output frequency range of the main-frame to meet 

the input requirements of the RF Section. The 

Frequency Extension Module plug-in contains two highfrequency 

phase-locked loops which receive digital 

tuning signals, variable synthesized signals, and fixed 

synthesized signals from the mainframe. The phaselocked 

loops use the main-frame signals, in conjunction 

with the output frequency from a 4.43 GHz oscillator that 

is common to both loops, to produce two high-frequency 

output signals that are supplied to the RF Section. One 

output signal is generated by a phase-locked loop using 

a Voltage Controlled Oscillator (VCO) that is tuneable in 

1 Hz steps (100 Hz steps for option 004 mainframe) over 

the 3.95 to 4.05 GHz range. The other output signal is 

generated by a phase-locked loop using a Yittrium-Iron- 

Garnet (YIG) oscillator that is tunable in 100 MHz steps 

over the 3.95 to 2.75 GHz range. The two outputs from 

the Frequency Extension Module plug-in are applied to 

the RF Section for mixing, amplification of the converted 

signal, and final output power level control. 

1-33. Auxiliary Section 

1-34. The Auxiliary Section plug-in provides a means of 

applying externally generated amplitude or pulse 

modulation drive signals to modulate the RF Section’s 

output carrier. 

1-6 

1-35. Modulation Section Plug-ins 

1-36. The Model 86630-series Modulation Section plugins 

can accept external modulation drive signals or 

generate internal drive signals to amplitude, frequency, 

phase or pulse modulate the RF Sections output signal. 

1-37. EQUIPMENT AVAILABLE 

1-38. Extender cables, coaxial adapters, and an 

adjustment tool are available for use in performance 

testing, adjusting, and maintaining the RF Section. Each 

piece may be ordered separately or as part of the 

11672A Service Kit. 

1-39. Extender cards for use in servicing the RF Section 

and a type N to BNC adapter for use on the front panel 

RF OUTPUT connector are contained in the HP Rack 

Mount Kit, Part Number 08660-60070, that is supplied 

with the mainframe. 

1-40. SAFETY CONSIDERATIONS 

1-41. This instrument has been designed in accord-ance 

with international safety standards and has been 

supplied in safe condition. 

1-42. Although this instrument has been designed in 



which must be followed to retain the instrument in safe 

condition. Be sure to read and follow the safety 

information in Sections II, III, V, and VIII. 

1-43. RECOMMENDED TEST EQUIPMENT 1-44. 

Table 1-2 lists the test equipment and accessories 

recommended for use in testing, adjusting, and servicing 

the RF Section. If any of the recommended test 

equipment is unavailable, instruments with equivalent 

specifications may be used. See Appendix B, Section III.


See Appendix B, Section III 

Table 1-2. Recommended Test Equipment (1 of 4) 

Item Critical Specifications Suggested Model Use* 

Adapter (Male Type N Frequency range 100 MHz to 1.3 GHz HP 1250-0847 P 

to GR874 ) 

Adapter, SMA-to-BNC 2 required OSM 21190 P 

Adapter, SMA-to-OSM OSM 219 P 

Right Angle 

Adapter, Type N-to- OSM 21040 P 

SMA 

Amplifier, 20 dB -20 dB gain at 30 MHz HP 8447A P 

Input SWR




Counter, Computing 50 kHz to 50 MHz with a 1 ms gate time and HP 5360A with HP 5365A P 

external trigger; 1 Hz resolution plug-in 

Counter, Frequency Range: 0.2-1300 MHz HP 5340A P 

Resolution: 1 Hz 

10 MHz external reference output 

7.2 Vrms output into 170 ohms 

Coupler, Directional Frequency range 100 MHz to 1.3 GHz HP 778D Option 12 P 

Detector, Crystal 1 to 1200 MHz HP 8471A P 

Detector, Crystal 10 MHz to 1.3 GHz HP 423A P, A 

FM Discriminator Input frequency 100 kHz to 10 MHz HP 5210A P, A 

Linear Analog Output 1V full scale 

Filter Kit Accessory for HP 5210A HP 10513A P, A 

Filter, Low Pass, Special (see Figure 1-3) P 

15 kHz 

Filter, Low Pass, Cutoff frequency: 4 MHz CIR-Q-TEL P 

4 MHz FLT/21B-4-3/50-3A/3B 

Filter, Low Pass, Cutoff frequency: 2200 MHz HP 360C P 

2200 MHz 

Filters, Low Pass, 100 kHz at 50 and 600 ohms Specials (See Figure 1-4) A 

100 kHz 

Filters, Low Pass, 1 MHz - 50 and 600 ohms Specials (See Figure 1-4) P, A 

1 MHz 

Filters, Low Pass, 5 and 10 MHz - 50 ohms Specials (See Figure 1-4) P 

5 and 10 MHz 

Filter, Band Pass Pass band 1-2 GHz HP 8430A P 

Generator, Distortion less than 0.3% HP 203A P 

Function Range: 0.5 Hz to 20 kHz 

Output level: 0.1 to 2.0 Vrms into 600 ohms 

Generator, Pulse Output -10 Vpk with 0.5V into 170 ohms 

*Use: P = Performance Tests, A = Adjustments, T = Troubleshooting 

1-8




Mixer, Double 1 MHz to 110 MHz HP 10514A A 

Balanced 

Mixer, Double 300 to 1300 MHz Watkins-Johnson M1J P 

Balanced 

Oscillator, Test 1 kHz to 10 MHz HP 651B P, A 

1.0 to 2.0 Vrms into 600 

or 50 ohms 

Oscilloscope Vertical: HP 180C with HP 1801A P, A, T 

Bandwidth 50 MHz with sensitivity of and HP 1821A plug-ins 

5mV/ division minimum 

Horizontal: 

Sweep time 10 ns to 1 s 

Delayed sweep 

External triggering to 100 MHz 

Oscilloscope, Input impedance HP 10004 P, A, T 

10:1 divider probes 10 megohm shunted by 10 pF 

Power MeterISensor Range: -10 to +10 dBm from 10 MHz to 1.3 HP 435A/8481A P, A, T 

GHz 

Power Supply, DC 0-10 volts HP 721A P 

Programmer, Marked Capable of programming BCD or HP-IB data HP 3260A Option 001 P, A 

Card 

Probe, Logic TTL Compatible HP 10525T T 

Resistor, 1000 ohm +2% HP 0757-0280 P, A 

Resistor, 10K ohm +2% HP 0757-0442 P 

Resistor, 100K ohm f2% HP 0698-7284 P 

Service Kit Interconnect cables, adaptors, and coaxial HP 11672A (See A, T 

cables compatible to 8660-series plus and Operating Note or 

jacks mainframe manual for 

parts list) 

Stub, Adjustable Frequency range 100 MHz to 1.3 GHz General Radio 874-D50L P 

Tee, Coaxial 2 required HP 1250-0781 (BNC) P, A 

Termination, 50 50 ohm HP 11048C P 

ohm Feed Thru 

*Use: P = Performance, A = Adjustments, T = Troubleshooting 

1-9




Termination, 50 ohm 50 ohm, (2 required) HP 11593A P 

Test Set, Phase Input Frequency Range 250 to 950 MHz HP 8660C-K10 (only) P, A 

Modulation Distortion 


40 dB TEST AMPLIFIER 

Amplifier Specifications 

Gain 44 dB at 25°C 

Bandwidth 100 kHz (3 dB down) 

Noise Bandwidth 157 kHz 

Input Impedance 75K Ohms 

Output Impedance 12K Ohms 

Current Drain 260 Microamperes 

Output (Maximum) 1 Volt 

Dynamic Range 66 dB 

Figure 1-2. 40 dB Test Amlifier 

Figure 1-3. 15 kHz Low Pass Filter 

1-11


100 kHz - 50 ohms 100 kHz - 600 ohms 

C1, C4 0.015 μF Mylar 0160-0194 C1, C4 1300 pF 0160-2221 

C2 0.027 μF Mylar 0170-0066 C2 3000 pF 0160-2229 

C3 0.022 μF Mylar 0160-0162 C3 1100 pF 0160-2219 

L1, L2 100 μH 9140-0210 L1, L2 1200 μH 9100-1655 

1 MHz -50 ohms 1 MHz - 600 ohms 

C1, C4 1500 pF 0160-2222 C1, C4 130 pF 0140-0195 

C2 3300 pF 0160-2230 C2 300 pF 0160-2207 

C3 1600 pF 0160-2223 C3 120, μH 0140-0194 

L1, L2 10H ±10% 9140-0114 L1, L2 120 μ 9100-1637 

5 MHz - 50 ohms 10 MHz - 50 ohms 

C1, C2, C4 300 pF 0160-2207 C1, C4 150 pF 0140-0196 

C3 680 pF 0160-3537 C2 330 pF 0160-2208 

L1, L2 2 μH 9100-3345 C3 160 pH 0160-2206 

L1, L2 1 μH±10% 9140-0096 

NOTE 

Unless otherwise noted, tolerance of components is + 5% 

and capacitors are mica. Part numbers are Hewlett-Packard 

Figure 1-4. Low Pass Filters 

1-12



2-2. This section provides information relative to initial 

inspection, preparation for use, and storage and 

shipment of the Model 86602B RF Section plug-in. Initial 

Inspection provides instructions to be followed when an 

instrument is received in a damaged condition. 

Preparation For Use gives all necessary interconnection 

and installation instructions. Storage and Shipment 

provides instructions and environmental limitations 

pertaining to instrument storage. Also provided are 

packing and packaging instructions which should be 

followed in preparing the instrument for shipment. 

2-3. INITIAL INSPECTION 

2-4. Inspect the shipping container for damage. If the 

shipping container or cushioning material is damaged, it 

should be kept until the contents of the shipment have 

been checked for completeness and the instrument has 

been checked mechanically and electrically. The 

contents of the shipment should be as shown in Figure 

1-1, and procedures for checking electrical performance 

are given in Section IV. If the contents are incomplete, if 

there is mechanical damage or defect, or if the instrument 

does not pass the electrical performance test, 

notify the nearest Hewlett-Packard office. If the shipping 

container is damaged, or the cushioning material shows 

signs of stress, notify the carrier as well as the Hewlett- 

Packard office. Keep the shipping materials for carrier’s 

inspection. The HP office will arrange for repair or 

replacement without waiting for claim settlement. 

2-5. PREPARATION FOR USE 

2-6. Power Requirements 

2-7. All power required for operation of the RF Section 

is furnished by the mainframe. This RF Section requires 

approximately 40 volt-amperes. 

2-8. Interconnections 

2-9. Prior to installing the RF Section plug-in into the 

mainframe, verify that the Frequency Extension Module 

plug-in and interconnecting cable assemblies have been 

installed in accordance with the instructions contained in 

the Frequency Extension Module manual. 

SECTION II 

INSTALLATION 

2-1 

2-10. Modifications 

2-11. A power supply modification to older versions of 

Model 8660A and 8660B mainframes are required if they 

are to be used with the option 002 RF Section. 

Damage to the synthesized signal generator 

system may result if an option 002 RF 

Section is used with an older 8660A or 8660B 

mainframe. 

2-12. Due to the increased power consumption of the 

option 002 instrument, mainframes with serial prefixes 

1349A and below must be modified by installing a Field 

Update Kit. For mainframe configurations other than 

option 003 (60 Hz line operation), order kit number 

08660-60273. For option 003 mainframes (50 - 400 Hz 

line operation) order kit number 08660-60274. 

NOTE 

Verify that a new higher current fuse, HP Part 

Number 2110-0365, 4A Slow Blow, is used in 

mainframes with the power supply modification. 

2-13. Operating Environment 

2-14. The RF Section is designed to operate within the 

following environmental conditions: 

Temperature ........................................ 0° to +55°C 

Humidity ..................................... less than 95% relative 

Altitude ....................................... less than 15,000 feet 

2-15. Installation Instructions 

WARNING 

The multi-pin plug connector which provides 

interconnection from mainframe to RF 

Section, will be exposed with the RF Section 

removed from the right-hand mainframe 

cavity. With the Line (Mains) Voltage off and 

power cord disconnected, power supply 

voltages may still remain which, if contacted, 

may constitute a shock hazard.


2-16. Insert the plug-in approximately half-way into the 

right cavity of the mainframe. Rotate the latch (lower 

right corner) to the left until it protrudes perpendicular to 

the front panel. Refer to Figure 2-1, which shows the 

plug-in partially inserted into the mainframe and the latch 

rotated to a position that is perpendicular to the plug-in 

front panel. Push the plug-in all the way into the 

mainframe cavity and then rotate the latch to the right 

until it snaps into position. 

2-17. STORAGE AND SHIPMENT 

2-18. Environment 

2-19. The storage and shipping environment of the RF 

Section should not exceed the following limits: 

Temperature................................ 40° to +75°C 

Humidity....................................... less than 95% relative 

Altitude......................................... less than 25,000 feet 

2-20. Packaging 

2-21. Original Type Packaging. Containers and 

materials identical to those used in factory packaging are 

available through Hewlett-Packard offices. If the 

instrument is being returned to Hewlett-Packard for 

servicing, attach a tag indicating the type of service 

required, return address, model number, and full serial 

Figure 2-1. RF Section Partially Inserted into Mainframe 

Figure 2-1. RF Section Partially Inserted into Mainframe 

2-2 

number. Also mark the container FRAGILE to assure 

careful handling. In any correspondence, refer to the 

instrument by model number and full serial number. 

2-22. Other Packaging. The following general 

instructions should be used for re-packaging with 

commercially available materials: 

a. Wrap the instrument in heavy paper or 

plastic. (If shipping to a Hewlett-Packard office or 

service center, attach a tag indicating the type of service 

required, return address, model number, and full serial 

number.) 

b. Use a strong shipping container. A doublewall 

carton made of 350-pound test material is adequate. 

c. Use enough shock-absorbing material (3 to 4inch 

layer) around all the sides of the instrument to 

provide firm cushion and prevent movement inside the 

container. Protect the control panel with cardboard. 

d. Seal the shipping container securely. 

e. Mark the shipping container FRAGILE to 

assure careful handling.



3-2. This section contains information which will enable 

the operator to learn to operate and quickly check for 

proper operation of the RF Section plug-in as part of the 

Synthesized Signal Generator System. 

3-3. PANEL FEATURES 

3-4. The front and rear panel controls, connectors, and 

indicators of the RF Section and its options are 

described by Figure 3-1 and 3-2. 

3-5. OPERATOR’S CHECKS 

3-6. The RF Section, as part of the Synthesized Signal 

Generator System, accepts inputs from the rest of the 

system but controls only the RF output level. Even 

though the controlled circuits for most other functions are 

within the RF Section, the actual checks are found in the 

manual of the instrument which controls that function. 

SECTION III 

OPERATION 

3-1 

3-7. The Operator’s Checks in this manual are intended 

to verify proper operation of the circuits which control and 

are controlled by the RF output level controls. This 

includes the meter, the VERNIER control, the OUTPUT 

RANGE switch, and the Output Range Attenuator when 

operating in the local mode. When the system is being 

remotely controlled, the 1 dB and 10 dB remote step 

attentator switches are checked in place of the VERNIER 

control and OUTPUT RANGE switch. Refer to Figure 3- 

3. 

3-8. OPERATING INSTRUCTIONS 

3-9. In this system, the mainframe and plug-ins contain 

the controls for frequency, modulation, and RF level 

selection. The mainframe controls frequency, the 

Modulation Section plug-in controls modulation type and 

level, and the RF Section plug-in controls RF output 

level. The Operating Instructions for the RF Section 

plug-in are included in Table 3-1.


1 Meter. Indicates the RF Output level in Vrms and 

dBm (50w) with the scale reference indicated by the 

OUTPUT RANGE switch. 

2 Mechanical Meter Zero Control. Sets the Panel 

Meter indicator to zero when the mainframe LINE Switch 

is set to STBY. 

3 OUTPUT RANGE Switch. Sets the output level 

range of all except option 001 instruments from 

NOTE 

The front panel of the option 002 instrument is shown. 

The standard instrument does not have the term PHASE 

MODULATION after 1-1300 MHz. The option 001 

instrument has an OUTPUT RANGE switch which shows 

only the +10 and 0 dBm ranges. 

Figure 3-1. Front Panel Controls, Connectors, and Indicators 

3-2 

+10 to -140 dBm (502) in 10 dB steps. For option 001 

instruments, +10 and 0 dBm ranges only. 

4 OUTPUT Jack. Type-N female coaxial connector. 

RF Output level +10 to -146 dBm (0.7 Vrms to 0.01 

/IVrms) into a 50Q load. Frequency range is 1 to 

1299.999 999 MHz in 1 Hz steps. 

5 VERNIER Control. RF Output continuously var-iable 

within the useable range (+3 to --6 dB) as indicated by 

the meter.


1 Coaxial Plug. Connects the 3.95 to 2.75 GHz RF 

Input signal to the RF Section from the Frequency 

Extension Module. 

2 Interconnect Plug. Provides interconnection of 

power supply voltages; RF and control signals between 

the RF Section plug-in and the Main-frame, Frequency 

Extension Module, and Modulation Section plug-in. 

Figure 3-2. Rear Panel Connectors and Indicators 

3-3 

3 Coaxial Plug. Connects the 3.95 to 4.05 GHz LO 

Input signal to the RF Section plug-in from the Frequency 

Extension Module. 

4 Serial Number Plate. Metal plate with stamped 

serial number. Four-digit and letter for prefix. Suffix is 

unique to an instrument.


1. Set the System controls as follows: 

WARNING 

BEFORE CONNECTING THIS SYSTEM TO LINE (MAINS) VOLTAGE, 

the safety and installation instructions found in Sections II and III of the 

mainframe manual should be followed. 

Damage to the signal generator system may occur if option 002 RF 

Sections are used with unmodified 8660A and 8660B main frames with 

serial prefixes 1349A and below. See the paragraph entitled 

Modifications in Section II. 

NOTE 

Refer to Section HI for RF Section Installation instructions. 

Mainframe 

LINE Switch .................................................................................... ON 

REFERENCESELECTOR .............................................................. EXT 

CENTER FREQUENCY ................................................................. 500 MHz 

Modulation Section plug-in 

MODE Switch ................................................................................. OFF 

RF Section plug-in 

OUTPUT RANGE Switch ............................................................... 0 dBm 

VERNIER Control ........................................................................... +3 dB meter reading 

Figure 3-3. Operator’s Checks (1 of 2) 

3-4


OPERATOR’S CHECKS 

2. Connect the RF Section OUTPUT to the power sensor input. Verify that the amplitude of the 500 MHz signal 

is approximately +3 dBm. 

3. Set the OUTPUT RANGE Switch to +10 dBm and adjust the VERNIER control for a -3 dB meter reading. 

Verify that the output level is approximately +7 dBm. 

4. Connect the RF Section OUTPUT to the frequency counter input through the 3 dB attenuator. Verify that the 

signal is accurate within +1 Hz. 

5. To check the remote control capabilities of the RF Section, connect a control unit to the mainframe. Repeat 

steps 1 through 4 while the system is remotely programmed from an external source. Application Note 164-1 

"Programming the 8660A/B Synthesized Signal Generator" provides the information needed for remote BCD 

operation of this system. Application Note 164-2 "Calculator Control of the 8660A/B/C Synthesized Signal 

Generator" provides the information needed for calculator control of the system using the HP-IB (option 005). 

Section III of the mainframe manual contains the same information in abridged form. 

Figure 3-3. Operator’s Checks (2 of 2) 

3-5


TURN ON 

Table 3-1. Operating Instructions (1 of 2) 

OPERATING INSTRUCTIONS 

BEFORE CONNECTING THIS SYSTEM TO THE LINE (MAINS) 

VOLTAGE, the safety and installation instructions found in Sections 

II and III of the mainframe manual should be followed. 

Damage to the signal generator system may occur if option 002 RF 

Sections are used with unmodified 8660A and 8660B mainframes 

with serial prefixes 1349A and below. See the paragraph entitled 

Modifications in Section II. 

NOTE 

Refer to Section II for RF Section Installation Instructions. 

1. Set the mainframe’s LINE Switch to ON and the rear panel REFERENCE SELECTOR Switch to INT. Wait for the 

mainframe "oven" indication to go out. 

FREQUENCY SELECTION 

2. Refer to Section III of the mainframe operating and service manual for information on system frequency selection. 

RF OUTPUT LEVEL 

3. dBm. Set the OUTPUT RANGE switch to within +3 and --6 dB of the desired output level. Adjust the VERNIER 

control for a meter reading which when added to the OUTPUT RANGE switch indication equals the desired output 

level. 

4. VOLTS. To set the RF output level in rms volts, the OUTPUT RANGE switch selected the full scale meter reading 

and the VERNIER control is adjusted for the correct voltage reading on the meter. The voltage level for meter 

scale 1.0 should not be set below 0.32 of full scale. The voltage level should not be set below 1 when using the 

meter scale of 3. 

NOTE 

In order to achieve the output level accuracy specified, the level 

selected must be S


Table 3-1. Operating Instructions (2 of 2) 

MODULATION SELECTION 

6. Refer to Section III of the Modulation Section plug-in operating and service manual for information relating to 

selection of modulation type and level. 

REMOTE OPERATION 

7. Application Note 164-1 "Programming the 8660A/B Synthesized Signal Generator" provides most of the 

information needed for remote BCD operation of this system. AN 164-2 "Calculator Control of the 8660A/B/C 

Synthesized Signal Generator" provides information for remote HP-IB operation of this system. In abridged form, 

Section III of the mainframe manuals contain the same information. 

3-7



4-2. The procedures in this section test the 

instrument’s electrical performance using the 

specifications of Table 1-1 as the performance standard 

All tests can be performed without access to l interior of 

the instrument. A simpler operation test is included in 

Section III under Operator’s Checks. 

4-3. EQUIPMENT REQUIRED 

4-4. Equipment required for the performance tests is 

listed in the Recommended Test Equipment table in 

Section I. Any equipment that satisfies critical 

specifications given in the table may substituted for the 

recommended model(s). 

4-5. TEST RECORD 

4-6. Results of the performance tests may tabulated 

on the Test Record at the end of the procedures. The 

Test Record lists all of the test specifications and their 

acceptable limits. Test results recorded at incoming 

SECTION IV 

PERFORMANCE TESTS 

4-1 

inspection can be used for comparison in periodic 

maintenance and trouble-shooting, and after repairs or 

adjustments. 

4-7. PERFORMANCE TESTS 

4-8. For each test, the specifications are written 

exactly as they appear in the specification table in 

Section I. Next, a description of the test and any special 

instructions or problem areas are included. Most tests 

that require test equipment have a setup drawing; each 

has a list of required equipment. The initial steps of each 

procedure give control settings required for that 

particular list. 

To avoid the possibility of damage to the 

instrument or test equipment, read 

completely through each test before starting 

it. Then make any preliminary control 

settings before continuing with the 

procedure.


4-9. FREQUENCY RANGE 


SPECIFICATION: 

1 to 1299.999999 MHz selectable in 1 Hz steps. Frequencies from 200 to kHz to 1 MHz may also be selected with some 

degradation in specifications. 

DESCRIPTION: 

The Synthesized Signal Generator System RF OUTPUT is monitored by a frequency counter which supplies a common 

time base reference signal. The frequencies are checked at the extremes. Any specified frequency may be checked. 

EQUIPMENT: 

Figure 4-1. Frequency Range Test Setup 

Frequency Counter... .................................HP 5340A 

10 dB Fixed Attenuator ..............................HP 8491A Opt 003 

NOTE 

In the following procedure, allow for accuracy of counter used. -Model 

recommended is specified at +1 count. 

1. Connect frequency counter 10 MHz output reference signal to mainframe EXT REF input as shown in Figure 4-1 

and set mainframe rear panel REF switch to EXT. 

2. Set the RF Section OUTPUT RANGE switch to 0 dBm; set the VERNIER control full CW. 

3. Set mainframe center frequency to 1.000 000 MHz and check RF section output frequency with counter. Record 

the frequency. 

0.999999_______________________1.000001 MHz 

4. Set mainframe center frequency to 1299.999 999 MHz (Option 004 mainframe set to 1299.,space 9999 MHz) and 

check RF Section output frequency with counter. Record the frequency. 

4-2 

1299.999 998________________1300.000 000 MHz


4-10. FREQUENCY ACCURACY AND STABILITY 



CW frequency accuracy and long term stability are determined by the aging rate of the time base (internal or external) and 

its sensitivity to changes in temperature and line voltage. Internal reference oscillator accuracy = + aging rate +3 x 10-10/° 

C + 3 x 10-10/1% change in line voltage. (Aging rate for the time base in the standard mainframe is 3 x 10- 8/day; for 

option 001 mainframes, 3 x 10-9/day.) 

_______________________________________ 

4-11. FREQUENCY SWITCHING TIME 

NOTE 

If there is any reason to doubt the mainframe crystal oscillator 

accuracy or stability, refer to the performance test in Section IV of 

the mainframe manual. 


6 ms to be within 50 Hz of any new frequency selected; 100 ms to be within 0.5 Hz of any new frequency selected. 

DESCRIPTION: 

A change in the Synthesized Signal Generator System's frequency is remotely programmed; after a preset time interval 

the frequency is measured. A trigger pulse from the programming device is first coupled to the oscilloscope. The pulse is 

delayed a preset interval by the oscilloscope and then coupled to the computing counter at which time the frequency is 

measured. 

NOTE 

The frequencies in this test were selected for worst-case 

conditions (longest switching time). 

4-3


4-11. FREQUENCY SWITCHING TIME (Cont’d) 

EQUIPMENT: 


Figure 4-2. Frequency Switching Time Test Setup 

DC Power Supply.......................................HP 721A 

Computing Counter....................................HP 5360A/5365A 

Marked Card Programmer .........................HP 3260A Opt 001 

Oscilloscope...............................................HP 180C/1801A/1821A 

Coaxial Tee................................................HP 1250-0781 

PROCEDURE: 

1. Connect the dc power supply +5 volt output through a 1000 ohm resistor to pin 17 of the mating connector for J3. 

Pin 17 (flag) of the Marked Card Programmer output connector is also connected to the oscilloscope ext trigger 

input. 

2. Connect the marked card programmer to mainframe rear panel connector J3. 

3. Connect oscilloscope delayed sweep output through a BNC TEE to oscilloscope channel A vertical input and to 

computing counter rear panel external time measurement input. 

4. Set counter controls as follows: rear panel switch to trigger; "B" channel to X1 sensitivity; module switch pressed; 

digits displayed for necessary resolution; measurement time to 1; counter gate time to 1 ms. 

5 Program the System for 29.999 999 MHz. Set the mainframe rear panel reference switch to external. 

6. Set oscilloscope controls as follows: trigger to ac slow; ext, negative slope, trigger level at about 9:00 o’clock; 

sweep mode auto; delay trigger auto; main sweep 1 ms; delay sweep 0.1 ps; main sweep mode. 

7. Set oscilloscope trace to start at left vertical graticule line. Use oscilloscope delay control to delay spike 5.5 

divisions from CRT left graticule line. 

8. Switch oscilloscope sweep mode from auto to normal. 

4-4


4-11. FREQUENCY SWITCHING TIME (Cont’d) 


9 Program the system for 30.000 000 MHz. Frequency displayed on computing counter should be 30 MHz + 50 Hz. 

Record the frequency. 

29.999950__________________30.000050 MHz 

10. Program the system for 29.999 999 MHz. Frequency displayed on counter should be within + 50 Hz of 29.999 999 

MHz. 

29.999949__________________30.000049 MHz 

11. Set Oscilloscope normal sweep for 10 ms and delay sweep to 1 us. 

12. Set Oscilloscope sweep mode to auto and delay control for delay spike 9.5 divisions from the CRT left graticule 

line. 

13. Set Oscilloscope main trigger to normal and computing counter gate time to 10 ms. 

14. Program the System for 30.000 000 MHz. Frequency displayed on computing counter should be within + 5 Hz or 

programmed frequency. 

29.999995__________________30.000005 MHz 

15. Program the System for 29.999 999 MHz. Frequency Displayed on computing counter should be within + 5 Hz of 

programmed frequency. 

29.999994___________________30.000004 MHz 

NOTE 

To reduce the effect of random errors, steps 5 through 10 and 13 through 

15 may be repeated several times (5 minimum). Record the average 

frequency. 

______________________________________________ 

4-12. OUTPUT LEVEL SWITCHING TIME 


In remote mode, any level change can be accomplished in less than 50 ms. Any change to another level on the same 

attenuator range can be accomplished in 5 ms. 

DESCRIPTION: 

The Synthesized Signal Generator System RF OUTPUT level (attenuation) is remotely programmed while the RF 

OUTPUT is detected and monitored by an oscilloscope. Because the oscilloscope is triggered by the programming 

device, the time needed to effect the level change may be measured directly on the oscilloscope CRT. 

4-5


4-12 OUTPUT LEVEL SWITCHING TIME (Cont’d) 

EQUIPMENT: 


Figure 4-3. Output Level Switching Time Test Setup 

Marked Card Programmer ...................................... HP 3260A Opt 001 

Oscilloscope............................................................ HP 180C/1801A/1821A 

Crystal Detector . .................................................... HP 8471A 

Power Supply.......................................................... HP 721A 

PROCEDURE: 

1. Connect equipment as illustrated in Figure 4-3. Note that + 5 volt output from DC Power Supply is connected 

through a 1000 ohm resistor to pin 17 of mating connector to J3 and to Oscilloscope external trigger input. 

2. Connect RF Section OUTPUT through crystal detector to oscilloscope Channel A input. 

3. Set Oscilloscope controls as follows: Main Time/Div, 5 ms; Vertical input, dc coupled, 0.2 V/Div; Normal Sweep; 

Ext Trigger, negative slope, AC slow Trigger level about 9:00 o’clock. 

4. Program the System’s center frequency for 500 MHz and 10 dB attenuation of the RF output signal. Reprogram 

for 19 dB attenuation. Switching time should be less than 5 ms. Record switching time. 

10 to 19 dB_______________________5 ms 

5. Program RF Section attenuation for 10 dB, then for 30 dB. Switching time should be less than 50 ms. 

4-6 

10 to 30 dB_______________________50 ms


4-12. OUTPUT LEVEL SWITCHING TIME (Cont’d) 


6. Repeat steps 4 and 5 with center frequency set to 1 MHz. 

_______________________________________________ 

4-13A. OUTPUT ACCURACY 

SPECIFICATION: (for local and remote modes) 

+1.5 dB to -76 dBm; +2.0 dB to -146 dBm at meter readings between +3 and -6 dB. 

10 to 19 dB__________________________5 ms 

DESCRIPTION: 

The RF level accuracy for the +10 and 0 dBm ranges is measured with a power meter. For the lower ranges, an IF 

substitution measurement technique is used. 

RF level (attenuation) measurements using IF substitution is accomplished by 1) converting the RF output to a low 

frequency IF signal, 2) offsetting the decrease in RF level (increase in attenuation) by an equal decrease in IF attenuation. 

This maintains a fairly constant output level at the IF load. The intermediate frequency is selected on the basis of 

availability of a precision attenuator. Therefore, any variation in output level from an established reference is primarily due 

to the RF attenuator. 

4-7


4-13A. OUTPUT ACCURACY (Cont’d) 

EQUIPMENT: 


Figure 4-4A. Output Accuracy Test Setup 

Power Meter/Sensor ............................................... HP 435A/8481A 

Synthesized Signal Generator ............................... HP 8660C/86602B/86631B 

40 dB Attenuator..................................................... HP 8491A Option 040 

Mixer. ...................................................................... Watkins-Johnson M1J 

4 MHz Low Pass Filter............................................ CIRC-Q-TEL FLT/21B- 

4-3/50-3A/3B 

Coaxial Tee............................................................. 1250-0781 (BNC) 

50 Ohm Termination... ............................................ HP 11593A 

40 dB Amplifier........................................................ (See Figure 1-2) 

Double Shielded Cables (5 required)...................... HP 08708-6033 

Capacitor, 100 #F ................................................... .HP 0180-2207 

Resistor, 100 k. ....................................................... HP 0698-7284 

Type N-to SMA Adaptor.......................................... OSM 21040 

SMA-to-OSM Right Angle Adapter ......................... OSM 219 

SMA-to-BNC Adapter (2) ........................................ OSM 21190 

10 dB Step Attenuator............................................. HP 355D Option H38 

Wave Analyzer........................................................ HP 3581A 

4-8



PROCEDURE: 


1. Set the System Under Test Controls for a center frequency of 1000.000000 MHz and an output level of +10 dBm. 

2. Set the power meter controls for the +15 dBm range. 

3. Connect the power sensor to the RF Section OUTPUT jack of the System Under Test. 

4. Set the RF Section controls as shown in the table below and verify that the RF output level is within the specified 

tolerance. 

Synthesized Signal Generator System 

OUTPUT RANGE 

Switch 

(dBm) 

Panel Meter 

Reading 

(dB) 

Power Reading 

Reading 

(dBm) 

+10 0 +8.5________+11.5 

+10 -3 +5.5________+ 8.5 

+10 -6 +2.5________+ 5.5 

0 -6 -7.5_________- 4.5 

0 -3 -4.5_________- 1.5 

0 0 -1.5_________+ 1.5 

0 +3 +1.5_________+ 4.5 

NOTE 

Be careful not to vary the RF Section ‘s VERNIER control setting 

throughout the rest of this procedure. 

5. Connect the 40 dB attenuator directly to the OUTPUT jack of the RF Section in place of the power sensor. 

6. Connect the “R” port of the mixer directly to the 40 dB attenuator using the Type N-to SMA adapter and the SMAto-OSM 

right angle adapter. 

7. Connect the 4 MHz Low Pass Filter to the “I” port of the mixer with a SMA-to-BNC adapter. 

8. Connect the cable from the Reference System output to the “L” port of the mixer with a SMA-to-BNC adapter. 

NOTE 

Be sure all connections are tight to prevent RF leakage. 

9. Set the reference system controls for a center frequency of 1000.011000 and an output level of +7 dBm. Set the 

rear panel reference selector to external. 

10. Set the 10 dB Step Attenuator to 50 dB. 

4-9




11. Set the wave analyzer controls as follows: frequency 11 kHz, resolution bandwidth 3 Hz, sweep mode off, dBv/LIN 

- dBm 600:1 switch to dBv/LIN, amplitude reference level -40 dB, AFC switch unlock and scale 10 dB. 

12. Connect the other equipment which follows the 4 MHz Low Pass Filter as shown in Figure 4-4A. 

13. Tune the wave analyzer frequency control for the maximum meter reading. Adjust the input sensitivity and vernier 

controls for a midscale meter reading. Press the AFC control for frequency lock. 

14. Wait 30 seconds for the DVM reading to stabilize. Record the DVM reading. This is the reference level equivalent 

to the last power meter reading ( +3 dBm). 

15. Use the following formula to calculate the obsolute RF output level from the System Under Test: 

dBm = dBm1 -A dB +2(V-Vreff 

dBm is the RF output level 

dBm1 is the actual RF level measured at the +3 dBm (O dBm OUTPUT RANGE setting) in Step 4. 

A dB is the difference in 10 dB step attenuator setting. 

V is the DVM reading for each individual OUTPUT RANGE. 

Vref is the reference DVM reading. 

NOTE 

The wave analyzer recorder output sensitivity is 2dB/volt. 

16. Set the RF Section OUTPUT RANGE switch to -10 dBm; set the 10 dB step attenuator to the 40 dB. Wait 30 

seconds for the reading to stabilize. Record the DVM reading in the table following step 17. Calculate and record 

the RF level in the table. 

EXAMPLE: 

dBm = dBm1 --(ΔdB) +2 (V1 -Vref) 

dBm1 = 2.8 dBm 

ΔdB = 10 dB 

V1= 2.388 Vdc 

Vref = 2.433 Vdc (from step 14) 

dBm = 2.8 - (10) +2(2.388-2.433) 

= 2.8 -10 +2(-0.045) 

= -7.29 dBm 

4-10




17. Continue as in step 16,space to measure, record and calculate the DVM reading and RF level for each OUTPUT 

RANGE setting as shown in the following table. 

Absolute RF Output 

Output Range 10dB Step DVM Level (dBm) 

Switch Attenuator Reading 

(dB) (Vdc) Min. Actual Max. 

0 50 _________ + 1.5 __________ + 4.5 

- 10 40 _________ - 8.5 __________ - 5.5 

-20 30 _________ -18.5 __________ -15.5 

-40 10 _________ -38.5 __________ -35.5 

-50 0 _________ -48.5 __________ -45.5 

18. Set the 10 dB step attenuator to 50 dB. 

19. Remove the 40 dB attenuator and connect the mixer directly to the OUTPUT jack of the system under test. 

20. Increase the wave analyzer’s input sensitivity by 10 dB. If necessary,space adjust the input sensitivity vernier for a 

midscale meter reading. 

21. Transfer the last calculated RF output level on the preceding table to the first line on the following table. Wait 30 

seconds and record the new DVM reading (Vref). 

22. Use the formula and the new Vref level to calculate the RF level for each range shown in the following table. 


Output Range 10 dB Step DVM Level (dBm) 

Switch (dBm) Attenuator Reading 


-50 50 ________ -48.5 ________ -45.5 

-60 40 ________ -58.5 ________ -55.5 

-70 30 ________ -68.5 ________ -65.5 

-80 20 ________ -79.0 ________ -75.0 

-90 10 ________ -89.0 ________ -85.0 

-100 0 ________ -99.0 ________ -95.0 

23. Set the wave analyzer’s AFC switch to unlock (OFF). Adjust the frequency control for the peak reading equal to 

the last recorded DVM reading on the previous table. 

24 Set the 10 dB step attenuator to 30 dB. 





25. Set the wave analyzer amplitude reference level to -60 dB. Increase the input sensitivity 10 dB. 

26 Transfer the last RF output level reading on the preceding table to the first line of the following table. After 30 

seconds record the new DVM reference on the first line of the following table. 

27. Measure, calculate,space and record the DVM reading and RF level for each OUTPUT RANGE Setting as shown 

in the following table. Due to the high noise levels evident on this test, there is appreciable deviation in the wave 

analyzer and DVM readings. Record the average reading. 


Output Range 10dB Step DVM Level (dBm) 

Switch (dBm) Attenuator Reading 


-100 30 _______ -99.0 _________ -95.0 

-110 20 _______ -109.0 _________ -105.0 

-120 10 _______ -119.0 _________ -115.0 

-130 0 _______ -129.0 _________ 125.0 

NOTE 

Output level accuracy may be checked at any frequency between 300 

and 2000 MHz using this procedure. This procedure may also be used at 

the frequency extremes if a well shielded mixer specified for the desired 

frequency range is used in place of the Watkins Johnson M1J. 

4-13B. OUTPUT ACCURACY - ALTERNATE PROCEDURE 


+1.5 dB to -76 dBm; +2.0 dB to -146 dBm at meter readings between +3 and -6 dB. 

DESCRIPTION: 

The RF Level Accuracy for the +10 and 0 dBm ranges is measured with a power meter. A reference level is established 

and accuracy is checked from 0 dBm to -80 dBm by comparing the RF Section attenuation against a calibrated 10 dB step 

attenuator. 

NOTE 

This procedure checks all sections of the RF Section Attenuator 

separately. Also, the 10 dB, 20 dB, and 40 dB sections are checked in all 

possible combinations. The sum of the -70 dBm inaccuracy at -80 dBm 

shall not exceed +1.0 dB. 

4-12



4-13B. OUTPUT ACCURACY - ALTERNATE PROCEDURE (Cont’d) 

EQUIPMENT: 

Figure 4-4B. Output Accuracy Test Setup (Alternate Procedure) 

Spectrum Analyzer.................................................. HP 8555A/8552B/140T 

Power Meter/Sensor. .............................................. HP 435A/8481A 


20 dB Amplifier........................................................ HP 8447A 

PROCEDURE: 

1. Set the system controls for a frequency of 30 MHz and an output level of +10 dBm. 

2. Connect the power sensor to the RF Section’s OUTPUT jack. 

3. Set the RF Output Level as shown in the table below and verify that the level is within the specified tolerance. 

Synthesized Signal Generator System 

Output Range 

Switch 

(dBm) 

Panel Meter 

Reading 

(dB) 

Power Meter 

Reading 

(dBm) 

+10 0 +8.5_______+11.5 

+10 -3 +5.5_______+ 8.5 

+10 -6 +2.5_______+ 5.5 

0 -6 -7.5________-4.5 

0 -3 -4.5________-1.5 

0 0 -1.5________+1.5 

0 +3 +1.5________+4.5 

4-13




NOTE 

Do not change the RF Section VERNIER Control Setting until this 

procedure is completed. 

4. Set the spectrum analyzer controls as follows: center frequency 30 MHz, frequency span per division 5 kHz, 

resolution bandwidth 3 kHz, input attenutation 10 dB, vertical sensitivity per division 2 dB and sweep time per 

division 5 ms. 

5. Set the 10 dB Step attenuator switch to the 80 dB range. 

6. Connect the equipment as shown in Figure 4-4B. 

7. Adjust the reference level range and vernier to extablish a reference level on the analyzer display. 

8. On the first line of the following table, record the power meter reading shown on the preceding table for the 

OUTPUT RANGE Setting of 0 dBm and the panel meter reading of +3 dB. This is the absolute RF level which 

corresponds to the display reference. 

9. Set the OUTPUT RANGE switch and the 10 dB step attenuator range switch settings as shown on each line of the 

following table. Record the display variation from the established reference. 

10. Calculate the RF level using the following formula: 

dBm = dBm1 - ΔAdB10 + ΔdB 

dBm is the RF output level 

dBm1 is the RF level measured at +3 dBm (0 dBm OUTPUT RANGE setting) in step 3. 

Δ dB10 is the change in 10 dB Step Attenuator level 

Δ dB is the variation from the established display reference for each OUTPUT RANGE setting. 

For example, results of the first step are: 

dBm1 =+2.8 

ΔA dB10 = 10 

ΔA dB= -0.2 

dBm = +2.8 dBm -10 dB +(-0.2) dB 

= -7.4 dBm 

4-14




10 dB Step RF Output Level 

Output Range Attenuator (dBm) 

Switch (dBm) (dB) Min. Measured Max. 

0 80 + 1.5 ________ + 4.5 

-10 70 -8.5 ________ - 5.5 

-20 60 -18.5 ________ -15.5 

-30 50 -28.5 ________ -25.5 

-40 40 -38.5 ________ -35.5 

-50 30 -48.5 ________ -45.5 

-60 20 -58.5 ________ -55.5 

-70 10 -68.5 ________ -65.5 

-80 0 -79.0 ________ -75.0 

11. Subtract the two levels obtained for OUTPUT RANGES of -70 and -80 dBm. The level change should be 10 + 1 

dB. 

4-14. OUTPUT FLATNESS 

9 dB_________________________________11 dB 


Output level variation with frequency is less than +1.0 dB from 1-1300 MHz at front panel meter readings between +3 and - 

6 dB. 

DESCRIPTION: 

After an output level reference is established, power level measurements are made at various frequencies across the 

range of the Synthesized Signal Generator System. The Output levels must fall within the limits specified. 

EQUIPMENT: 

PROCEDURE: 

1. Zero the Power Meter. 

Power Meter/Sensor ............................................... HP 435A/8481A 

2. Set the system center frequency to 1000 MHz. 

3. Set the Power Meter range switch to 0 dBm; set the RF Section OUTPUT RANGE Switch and VERNIER Control 

for an output level of -1.0 dBm as read on the power meter. 

4-15


4-14. OUTPUT FLATNESS (Cont’d) 


4. Measure and record the power level indicated by the Power Meter at the following center frequencies: 1 MHz, 10 

MHz, 100 MHz, 200,space 400,space 600,space 800,space and 1299 MHz. 

4-15. HARMONIC SIGNALS 

1 MHz -2.0_______________0.0 dBm 

10 MHz -2.0_______________0.0 dBm 

100 MHz -2.0_______________0.0 dBm 

200 MHz -2.0_______________0.0 dBm 

400 MHz -2.0_______________0.0 dBm 

600 MHz -2.0_______________0.0 dBm 

800 MHz -2.0_______________0.0 dBm 

1299 MHz -2.0_______________0.0 dBm 


All harmonically related signals are at least 30 dB below the desired output signal for output levels < +3 dBm. (25 dB down 

for output levels above +3 dBm.) 

DESCRIPTION: 

A spectrum analyzer is used to measure the relative levels of the second and third carrier harmonics with respect to the 

carrier fundamental at various center frequencies. 

EQUIPMENT: 


PROCEDURE: 

1. Set the system center frequency to 1299 MHz; set the RF Section OUTPUT RANGE switch and VERNIER control 

for an output level of +10 dBm. 

2. Connect the power meter/sensor to the system RF OUTPUT jack. 

3. Readjust the VERNIER control for a power meter reading of +10 dBm. 

4. Set the spectrum analyzer input attenuation to 30 dB. Connect the RF Section OUTPUT jack to the spectrum 

analyzer RF input. 

5. Set the other spectrum analyzer controls for convenient viewing of the carrier. Adjust the controls as necessary to 

view the second and third harmonics. Record the harmonic levels relative to the fundamental signal. 

Second Third 

1299 MHz >,space 25 dB down ______ ______ 

4-16


4-15. HARMONIC SIGNALS (Cont’d) 


6. Repeat steps 1 through 5 at the other frequencies listed. Record the levels. 

Second Third 

1000 MHz>-25 dB down ______ ______ 

500 MHz>25 dB down ______ ______ 

100 MHz>25 dB down ______ ______ 

10 MHz >25 dB down ______ ______ 

7. Set the system center frequency to 100 MHz; set the RF Section OUTPUT RANGE switch to 0 dBm and the 

VERNIER control for a front panel meter reading of +3 dB. Record the harmonic levels. 

4-16 PULSE MODULATION RISETIME 


50 nanoseconds. 

Second Third 

100 MHz >-30 dB down ______ ______ 

DESCRIPTION: 

The external pulse generator output is coupled to the RF Section plug-in through the Model 86631B Auxiliary Section. The 

pulse modulated signal is detected and the rise time measured with an oscilloscope. 

4-17


4-16. PULSE MODULATION RISETIME (Cont’d) 

EQUIPMENT: 


Figure 4-5. Pulse Modulation Risetime Test Setup 

Pulse Generator...................................................... HP 8013A 


Crystal Detector ...................................................... HP 423A 

Termination, 50Ω Feedthru..................................... HP 11048C 

Band Pass Filter...................................................... HP 8430A PROCEDURE: 

1. Set System center frequency to 1200 MHz. 

2. Set the RF Section OUTPUT RANGE switch and VERNIER control for an output of +10 dBm. 

3. Set the Auxiliary Section external modulation switch to pulse; set pulse level control full cw. 

4. Adjust pulse generator output for -10 Vpk (into 50Q) with risetime


4-17. PULSE MODULATION ON/OFF RATIO 


At least 40 dB 


DESCRIPTION: 

An HP Model 86631B Auxiliary Section is inserted in the left cavity of the mainframe. Inputs of -9.5Vdc (pulse-on) and 0 

Vdc (pulse-off) are input to the Auxiliary Section while the RF output of the system is monitored by a spectrum analyzer. 

The ratio of the pulse-off and pulse-on RF levels is the on/off ratio. 

EQUIPMENT: 

PROCEDURE: 


Power Supply.......................................................... HP 6215A 

1. Set System center frequency to 500 MHz, RF Section OUTPUT RANGE Switch and VERNIER control for an 

output level of +10 dBm, and Auxiliary Section external modulation switch to pulse. 

2. Set spectrum analyzer input attenuation to 30 dB; connect the RF Section OUTPUT to the analyzer RF input. 

3. Connect -9.5 Vdc from the power supply to the Auxiliary Section input. 

4. Adjust the analyzer controls for a CRT display of the carrier. Establish the reference by positioning the carrier 

peak on the top horizontal graticule line. 

5. Set the power supply output to 0.0 Vdc. Set the Pulse Level control fully clockwise. The signal displayed on 

Spectrum Analyzer should be >40 dB down with respect to the reference. Record the displayed level. 

4-18. AMPLITUDE MODULATION DEPTH AND 3 dB BANDWIDTH 


Depth: 0-90% for RF output level meter readings from +3 to -6 dB and only at +3 dBm and below. 3 dB 

Bandwidth: At center frequencies 10 MHz 

100 kHz from 0 - 30% AM 

60 kHz from 0 - 70% AM 

50 kHz from 0 --90% AM 

NOTE 

To check AM accuracy, refer to section IV of the appropriate modulation 

section Operating and Service manual. 

4-19 

40 dB down__________



4-18. AMPLITUDE MODULATION DEPTH AND 3 dB BANDWIDTH (Cont’d) 

DESCRIPTION: 

The system Rf output is amplitude modulated. The signal is demodulated by a peak detector in a spectrum analyzer (the 

frequency span width is set to zero). The ac and dc components are measured with a voltmeter at the detector (vertical) 

output. First, the dc component is set to -283 mVdc plus a detector offset correction. Then, the ac component is 

measured. The AM level (%) is ½ (one half) the rms output. 

Because of the required measurement accuracy, the accuracy of the spectrum analyzer’s detector offset must be known to 

+2 mVdc. The offset voltage is calculated by measuring the change in the detector output for a change in the RF input 

and assuming a linear detector over the range of the levels used. 

EQUIPMENT: 

Figure 4-6. Amplitude Modulation Depth and 3 dB Bandwidth Test Setup 

Test Oscillator ......................................................... HP 651B 

AC Voltmeter........................................................... HP 403B 

10 dB Step Attenuator............................................. HP 3550 Option H38 


Digital Voltmeter ..................................................... HP 34740A/34702A 

Coaxial Tee (2 required) ......................................... HP 1250-0781 



Resistor 1K ............................................................ HP 0757-0280 

4-20




PROCEDURE: 

1. Connect the equipment as shown in Figure 4-6 (step 1). 

2. Set the synthesized signal generator controls as follows: center frequency 30 MHz, OUTPUT RANGE 10 dBm, 

VERNIER control for a panel meter reading of 0 dB, and AM off. 

3. Let the spectrum analyzer warm up for 1 hour to minimize drift of the spectrum analyzer detector output. Set 10 

dB step attenuator to 10 dB attenuation. 

4. Set the spectrum analyzer center frequency to 30 MHz, frequency span per division 5 MHz, resolution bandwidth 

300 kHz; input attenuation to 20 dB, and vertical sensitivity per division 10 dB. Adjust the center frequency control 

to center the display. Set the frequency span to zero and tune to peak the trace. 

NOTE 

Throughout this test, continually check that the signal is peaked for 

maximum deflection. Tune the center frequency control for maximum 

signal deflection. 

5. Set the vertical scale to linear and adjust the reference level vernier for a digital voltmeter reading of 200 mVdc. 

6. Set the 10 dB step attenuator to 0 dB and record the digital voltmeter reading. 

7. Set the 10 dB Step Attenuator to 20 dB and record the digital voltmeter reading. 

8. Calculate the offset voltage using the following formula: 

mVdc + 200a 

Voff = 

1-a 

Where Voff is the offset voltage in millivolts 

mVdc is the DVM reading in millivolts a is 3.16 

(step 5) or 0.316 (step 6). 

For example: 

mVdc = -687 in step 5 

-687 + 200 (3.16 ) 

therefore Voff= = +25.5 mVdc 

1 -(3.16) 

_______________mVdc 

_______________mVdc 

9. Find the value of Voff for step 6. The difference between the two should be < 4 m Vdc. Use the average value of 

Voff. 

10. Set the 10 dB step Attenuator to 10 dB. 

4-21




11. Set the system center frequency to 500 MHz, the modulation mode to AM, the modulation source to external, and 

a modulation level of 30% (0.3 Vrms input to an Auxiliary Section; 1.5 Vrms to a Modulation Section) at a 1 kHz 

rate. 

12. Set the spectrum analyzer center frequency control to 500 MHz, frequency span to zero, and peak the trace. Set 

the reference level vernier for a digital voltmeter reading of -283 mVdc + Voff. See Steps 8 and 9. 

13. Set the DVM controls to measure the peak detector’s ac component. The modulation level (%) is 1/2 (one-half) 

the DVM reading (Vrms). Record the reading for 30% AM. 

50 mVrms_______________________70 mVrms 

14. Set the modulation section (test oscillator) controls for 70% AM. Record the DVM reading. 

130 mVrms_____________________150 mVrms 

15. Set the modulation section (test oscillator) controls for 90% AM. Record the DVM reading 

170 mVrms_____________________190 mVrms 

16. Connect the crystal detector to the RF Section OUTPUT jack. 

17. Set the modulation section and test oscillator controls for an AM level of 30% (0.3 Vrms input to an auxiliary 

section; 1.5 Vrms to a modulation section) at a 5 kHz rate. 

18. Set the oscilloscope controls for a 5 division peak-to-peak display of the demodulated signal. 

19. Increase the test oscillator frequency to 100 kHz. The signal amplitude should be >3.5 divisions peak-to-peak. 

20. Install the 1500 Pf capacitor as shown in Figure 4-6. 

3.5 div. p-p_________________ 

21. Repeat steps 17 through 19 with center frequency set to 9 MHz. Increase the test oscillator frequency from 5 to 

10 kHz. Record the signal amplitude. 

4-22 

3.5 div. p-p_________________



4-19. FREQUENCY MODULATION RATE AND DEVIATION 


Rate: DC to 200 kHz with the 86632B or 86635A. 

20 Hz to 100 kHz with the 86633B. 

Maximum Deviation (Peak): 

200 kHz with the 86632B and 86635A. 

100 kHz with the 86633B. 

4-20. OUTPUT IMPEDANCE AND VSWR 


NOTE 

To check the frequency modulation rate and deviation, refer to the 

performance test in Section IV of the applicable modulation section 

manual. 

Impedance: 50Ω 

VSWR:


4-20. OUTPUT IMPEDANCE AND VSWR (Cont’d) 

EQUIPMENT: 

PROCEDURE: 


Figure 4-7. Output Impedance Test Setup 

Directional Coupler ................................................. HP 778D Opt 12 

Adapter (Male Type N to GR 874) .......................... HP 1250-0847 

Adjustable Stub....................................................... General Radio 874-D50L 

Spectrum Analyzer ................................................. HP 8555/8552B/140T 

5052 Termination.................................................... HP 11593A 

1. Set the Synthesized Signal Generator system center frequency to 500 MHz, the OUTPUT RANGE switch to +10 

dBm, and the VERNIER control for a panel meter reading of 0 dB. 

2. Set up the equipment as shown in Figure 4-7. 

3. Set the spectrum analyzer controls for a convenient display of the signal. Set the vertical sensitivity to 2 dB per 

division. 

4. Adjust the stub for a minimum indication on the spectrum analyzer display. Adjust the reference level range and 

vernier controls for a convenient reference level. 

5. Adjust the stub for a maximum indication on the display. The signal level increase should be


4-20. OUTPUT IMPEDANCE AND VSWR (Cont’d) 


9. Repeat steps 3 and 4. The signal level increase should be


4-21 SIGNAL-TO-PHASE NOISE RATIO (Cont’d) 

EQUIPMENT: 


Figure 4-8. Signal-to-Phase Nose Ratio Test Setup 

Synthesized Signal Generator System ................... HP 8660C/86602B/86631B 


Coaxial Tee............................................................. HP 1250-0781 (BNC) 

Double Balanced Mixer........................................... Watkins-Johnson M1J 


40 dB Amplifier........................................................ (See Figure 1-2) 

15 kHz Low Pass Filter ........................................... (See Figure 1-3) 

502 Termination ...................................................... HP 11593A 

PROCEDURE: 

1. Set the controls of the system under test as follows: center frequency 500.001000 MHz and the output level to -47 

dBm (OUTPUT RANGE switch set to -50 dBm). 

2. Set the controls of the reference system as follows: center frequency 500.000000 MHz and the output level to +7 

dBm. 

3. Connect the equipment as shown in Figure 4-8. 

4. Record the relative ac voltmeter reading. 

4-26 

_______________dB


4-21. SIGNAL-TO-PHASE NOISE RATIO (Cont’d) 


5. Set the system under test OUTPUT RANGE switch to -10 dBm (-7 dBm output level). 

6. Adjust the oscilloscope display of the 1 kHz signal for an amplitude of eight divisions. Set the oscilloscope vertical 

input to ground and adjust the vertical position control so the trace lies over the center horizontal line of the 

graticule. Set the vertical input to dc coupled. 

7. Set the system under test center frequency to 500.000001 MHz and note that oscilloscope baseline trace 

alternately rises and falls over eight-division display. (510.0001 MHz; Option 004). 

8. Reset the center frequency to 500.000000 MHz at a time that causes the oscilloscope baseline trace to stop within 

+ 1/10 division of the center horizontal line of the graticule. 

9. Read the noise level on the ac voltmeter. Signal-to-phase noise ratio equals the sum of the attenuator change 

and the reference system noise contribution minus the change in voltmeter reading (in dB). Signal-to-phase noise 

ratio = 40 dB +3 dB - (+A dB). For example, the voltmeter reading is 8 dB below the reference (-8 dB). Therefore, 

the signal-to-phase noise ratio = 40 + 3 - (-8) = 51 dB down. 

10. Record the ratio. 

4-22. SIGNAL-TO-AM NOISE RATIO 

45 dB down__________ 


Greater than 65 dB in a 30 kHz bandwidth centered on the carrier excluding a 1 Hz band centered on the carrier. 

DESCRIPTION: 

A comparison of ac voltage measurements proportional to carrier amplitude and AM noise yields the signal-to-AM noise 

ratio. First, a carrier reference level is determined by measuring the detected ac voltage for 30% AM (the detected signal 

is 10.5 dB below the carrier level). Then the AM noise level is measured and the signal-to-AM noise ratio is determined. 

4-27


4-22. SIGNAL-TO-AM NOISE RATIO (Cont’d) 

EQUIPMENT: 

PROCEDURE: 


Figure 4-9. Signal-to-AM Noise Test Setup 


40 dB Amplifier........................................................ Special (See figure 1-2) 


15 kHz Low Pass Filter ........................................... Special (See figure 1-3) 

Test Oscillator... ...................................................... HP 651B 

502 Termination ..................................................... HP 11593A 

Coaxial Tee............................................................. HP 1250-0781 



2. Set the system center frequency to 500 MHz and the RF output level to +3 dBm (O dBm OUTPUT RANGE). 


4. Set the system’s modulation section controls for the AM mode and an external modulation source. The 

modulation level control and/or the test oscillator controls are set for a modulation level of 30% (0.3 Vrms to an 

auxiliary section; 1.5 Vrms to a modulation section) at a 1 kHz rate. 

NOTE 

The ac voltmeter can be used to monitor the modulation or auxiliary 

section input voltage while it is being set. 

5. Record the ac voltmeter reading of the 40 dB amplifier output in dB. 

4-28 

______________dB


4-22. SIGNAL-TO-AM NOISE RATIO (Cont’d) 

6. Set the system’s modulation mode to off. 


8. Record the ac voltmeter reading.dB 


9. The signal-to-AM noise ratio is equal to the sum of the change in attenuation level and the level of the 30% AM 

level relative to the carrier minus the change in ac voltmeter reading in dB. Therefore, signal-to-AM noise ratio = 

50 dB + 10.5 dB - (+A dB). For example,space the ac voltmeter reading is 12 dB down (below) the reference 

level and the signal-to-AM noise ratio = 50 + 10.5 - (-12) or 72.5 dB down. 

10. Record the ratio. 

4-23. RESIDUAL FM 


In the FM XO.1 MODE,


4-23. RESIDUAL FM (Cont’d) 

EQUIPMENT: 

PROCEDURE: 


Synthesized Signal Generator System ................... HP 8660C/86602B/86631B 

Coaxial Tee............................................................. HP 1250-0781 (BNC) 

FM Discriminator..................................................... HP 5210A 

50 Ohm Termination ............................................... HP 11593A 

40 dB Amplifier (34 dB into 502 )............................ HP 465A 


Capacitor, 5 μF ....................................................... HP 0180-2211 

Mixer ...................................................................... Watkins-Johnson M1J 

3 kHz Low Pass Filter ............................................. CIR-Q-TEL FLT/21B-3K-5/50-3A/3B 


1. Set the system under test center frequency to 1200.0 MHz, the output level to +10 dBm, the modulation mode to 

FM XO.1 modulation source to internal 1 kHz, and set the modulation level control for a meter reading of 2.4 kHzpeak. 

2. Set the spectrum analyzer controls for a center frequency of 1200 MHz, frequency span per division 2 kHz, 

resolution bandwidth 0.3 kHz, input attenuation 40 dB, vertical sensitivity per division 10 dB, and sweep time per 

division to 50 ms. Adjust the controls as necessary for a convenient display of the FM signal. 

3. Connect the System Under Test OUTPUT jack to the spectrum analyzer’s RF input jack as shown in Figure 4-10. 

4. Adjust the signal generator’s modulation level control to null the carrier (2.4048 kHz-pk). 

5. Set the Reference System center frequency to 1200.1 MHz, the RF output level to +10 dBm, and modulation off. 

6. Disconnect the spectrum analyzer from the System Under Test and connect the other equipment as shown in 

Figure 4-10. 

7. Set the FM discriminator controls to the 100 kHz range and the sensitivity to 0.01 Vrms (full scale). Install a 10 

kHz Butterworth Low Pass Filter in the discriminator output. (Refer to the FM discriminator’s operating and service 

manual). 

8. Adjust the FM discriminator’s sensitivity control for an ac voltmeter reading of 0.850 Vrms. (This ensures the 

sensitivity of the measurement is 2.00/vO/Hz-rms per millivolt-rms. The V2 factor accounts for the residual FM 

contributed by the reference system.) 

9. Set the System Under Test modulation source switch for external ac (leveled); set the modulation level control full 

clockwise. 

10. Press the CF CAL switch (Models 86632A and 86635A only) several times. 

11. Verify and record that the residual FM is less than 10 Hz-rms (less than 7.10 mVrms). 

4-30 

__________< 7.10 mVrms


4-24. AMPLITUDE MODULATION DISTORTION 



AM distortion at 30% AM is < 1%, at 70% AM is < 3%, and at 90% AM is < 5%. 

NOTES 

1. The AM distortion specification applies only at 400 and 1000 Hz rates, with 

a front panel meter indication of 0 to +3 dB, and at OUTPUT RANGE switch 

settings of < 0 dBm. At a meter indication of -6 dB, the distortion 

approximately doubles. The modulating signal distortion must be < 0.3% 

for the system performance to meet the specifications. 

2. If the signal generator system does not meet the AM distortion 

specification, refer to the Systems Troubleshooting information in Section 

VIII (Service Sheet 1) in this manual. 

DESCRIPTION: 

To measure AM distortion, a distortion analyzer is connected to the video output of a spectrum analyzer. In the zero 

frequency-span mode, the video output of the spectrum analyzer is the detected RF signal. The signal generator system 

controls are set for a specific AM level and the distortion level is measured. 

EQUIPMENT: 

Figure 4-11. Amplitude Modulation Distortion Test Setup. 

Distortion Analyzer.................................... .HP 333A 

Spectrum Analyzer.................................... HP 8555A/8552B/140T 

Function Generator................................... HP 203A 

AC Voltmeter............................................. HP 403B 

4-31


4-24. AMPLITUDE MODULATION DISTORTION (Cont’d) 

PROCEDURE: 


1. Set the signal generator system controls for a center frequency of 1000 MHz, the output level to -20 dBm 

(OUTPUT RANGE -20 dBm), and the modulation mode to off. 

2. Set the spectrum analyzer center frequency to 1000 MHz, frequency span per division 1 MHz, resolution 

bandwidth 300 kHz, input attenuation 20 dB, vertical sensitivity per division 10 dB and video filter to 10 kHz. 

3. Connect the equipment as shown in Figure 4-11. 

4. Set the spectrum analyzer’s tuning stabilizer to on. Adjust the center frequency fine tune to center the signal on 

the display. Set the reference switch and vernier to center the trace vertically. 

5. Set the frequency span per division to zero, and the vertical scale to linear. Peak the trace by adjusting the fine 

tune center frequency control. Center the trace vertically with the vertical sensitivity and vernier controls. 

6. Set the signal generator system’s modulation mode to AM, the source to external, and set the modulation level to 

30%. If a modulation section plug-in is installed in the Signal Generator mainframe, set the test oscillator controls 

to 1.5 Vrms at 1000 Hz. If an auxiliary section plug-in is installed, set the test oscillator controls to 0.3 Vrms at 

1000 Hz. 

7. Measure the total harmonic distortion. With the trace peaked on the display, the distortion should be less than 1%. 

8. Set the System modulation level to 70% AM. If the Auxiliary Section plug-in is being used, set the test oscillator to 

an output of 0.7 Vrms. 

9. Measure the total harmonic distortion. With the trace peaked on the display, the distortion should be less than 3%. 

10. Set the system modulation level to 90% AM.3% 

10. Set the system modulation level to 90% AM. If the Auxiliary Section plug-in is being used, set the test oscillator to 

an output of 0.9 Vrms. 

11. Measure the total harmonic distortion. With the trace peaked on the display, the distortion should be less than 5%. 

4-32 

1% 

3% 

5%


4-25. INCIDENTAL PHASE MODULATION 


At 30% AM < 0.2 radians 


DESCRIPTION: 

The phase difference between the signal generators is monitored with a vector voltmeter. Amplitude modulation is applied 

to the system under test. The peak-to-peak phase variation incidental to the amplitude modulation is read on the vector 

voltmeter. 

EQUIPMENT: 

Figure 4-12. Incidental Phase Modulation Test Setup 

Synthesized Signal Generator ................. HP 8660C/86602B/86631B 

Function Generator .................................. HP 203A 

Vector Voltmeter (with 10:1 voltage 

divider probe) ....................................... HP 8405A 

AC Voltmeter............................................. HP 403B 

Mixer ......................................................... Watkins-Johnson M1J 

4-33


4-25. INCIDENTAL PHASE MODULATION (Cont’d) 

PROCEDURE: 


1. Set the system under test rear panel reference selector to external, center frequency 500 MHz, output level -10 

dBm (OUTPUT RANGE -10 dBm) and AM mode to off. 

2. Set the reference system center frequency to 510 MHz and the output level to +7 dBm (OUTPUT RANGE +10 

dBm). 


4. Adjust the vector voltmeter’s frequency range control to 10 MHz, phase range switch to +180, and the phase 

meter offset switch for a near or on scale phase reading (Phase reading will drift somewhat due to phase drift in 

the synthesized signal generator outputs). 

5. Set the system under test modulation mode to AM, the source to external, and the modulation level to 30%. Set 

the input level to 0.3 Vrms at 1 kHz if an auxiliary section is inserted into the mainframe of the system under test. 

If a modulation section is used, the input level should be 1.5 Vrms at 1 kHz. Use the external dc source if an 

86632B or 86633B Modulation Section is used. 

6. Set the function generator controls for a modulation rate of 0.5 Hz. (The low rate is necessary for the vector 

voltmeter’s metering circuitry. The modulation level is still 30%.) 

7. The phase reading will vary at a 0.5 Hz rate. If necessary, readjust the vector voltmeter’s phase meter offset 

switch for an on scale reading. 

8. Note the peak-to-peak phase variation caused by the 0.5 Hz AM. Visually disregard the random phase variations 

caused by phase drift in the synthesized signal generator outputs. Divide the reading by 2 to obtain the peak 

phase deviation. The phase deviation should be less than 11.50 - peak (0.2 radians-peak) 

4-34 

11.5°-pk


4-26. FREQUENCY MODULATION DISTORTION 



Total harmonic distortion for modulation rates up to 20 kHz, < 1% up to 200 kHz peak deviation. Distortion from an 

external source must be < 0.3% to meet these specifications. 

DESCRIPTION: 

NOTES 

1. In the FM mode, typical Residual FM in a 0.3 to 3 kHz audio bandwidth is 



4-26. FREQUENCY MODULATION DISTORTION (Cont’d) 

EQUIPMENT: 

Figure 4-13. Frequency Modulation Distortion Test Setup 

FM Discriminator....................................... HP 5210A 

Wave Analyzer.......................................... HP 3581A 

Function Generator................................... HP 203A 

NOTE 

This performance test is normally performed with either an HP model 

86632B or 86635A Modulation Section inserted into the signal generator 

mainframe. Control settings in parenthesis apply only to the Model 

86633B. 

1. Set the signal generator system center frequency to 8.5 MHz and set the OUTPUT RANGE switch to +10 dBm. 

Adjust the VERNIER control for a -3 dB meter reading. 

2. Connect equipment as illustrated in Figure 4-13. 

3. Set Modulation Section MODE to FM X10 (FM X1) and source switch to EXTERNAL AC. Adjust Modulation 

Section modulation level control for 200 kHz (100 kHz) peak deviation and press FM CF CAL switch. 

NOTE 

The 86633B does not have an FM CF CAL switch. 

4. Set the function generator output for 10 kHz at 1.5 Vrms. 

5. Install a 100 kHz low pass filter in the FM Discriminator. (Refer to the FM Discriminator Operating and Service 

Manual for details ). 

4-36




6. Adjust the FM Discriminator for 1 volt rms input sensitivity. Set the controls for the 10 MHz range. 

7. Set the wave analyzer scale switch to 90 dB, reference level to normal, resolution bandwidth 30 Hz, sweep mode 

off, and AFC on. 

8. Peak the meter reading near 10 kHz with the frequency control. Verify that the AFC locks and the amplitude is ~- 

37 dBV (14.4 mVrms). Use the input sensitivity switch and vernier control and the amplitude reference level 

control to establish a reference level at 0 dB. 

9. Set the frequency to ~ 20 kHz (second harmonic) and peak the meter reading. Record the meter reading. 

10. Set the frequency to ~ 30 kHz (third harmonic) and peak the meter reading. Record the meter reading. 

11. Use Table 4-1 to obtain power ratios for the levels recorded in steps 8 and 9. Then use Table 4-1 to find the dB 

level corresponding to the sum of the ratios. The resultant level should be -> 40 dB down from the fundamental 

frequency level. Record the level. 

4-37 

dB 

dB 

40 dB down




4-27. INCIDENTAL AM 


Table 4-1. dB To Power Ratio Conversion 

AM sidebands > 60 dB down from carrier with FM peak deviation of 75 kHz at a 1 kHz rate. 

DESCRIPTION: 

A reference is established on the wave analyzer by detecting an AM signal of known modulation level and rate from the 

Synthesized Signal Generator System. The output is frequency modulated at a specified rate and level. The incidental 

AM level is detected during frequency modulation and compared to the carrier amplitude. 

4-38


4-27. INCIDENTAL AM (Cont’d) 

EQUIPMENT: 

PROCEDURE: 


Figure 4-14. Incidental AM Test Setup 

Wave Analyzer ......................................... HP 3581A 

Crystal Detector ........................................ HP 8471A 

15 kHz Low Pass Filter ............................. (See Figure 1-3) 

Resistor 10K .............................................. HP 0757-0442 

Capacitor 1500 p....................................... HP 0160-2222 

1. Set the signal generator system controls for a center frequency of 100 MHz, a +3 dBm output level, the amplitude 

modulation mode, an internal source at 1 kHz rate, and a modulation level of 50%. 

2. Connect the equipment together as shown in Figure 4-14. 

3. Set the wave analyzer controls for the 90 dB scale, AFC on, and resolution bandwidth 30 Hz. Tune the wave 

analyzer for a peak meter indication near 1 kHz. Set a reference level of 0 dB using the input sensitivity switch 

and the amplitude reference switch. This reference level (AM sidebands) is 12 dB down from carrier signal (50% 

AM). 

4. Set the system modulation section controls for FM mode, and a modulation level of 75 kHz peak deviation. 

5. The meter reading should be > 48 dB down (> 60 dB down from carrier). 

4-39 

60 dB down


4-28. SPURIOUS SIGNALS, NARROWBAND 



All narrowband spurious signals in the CW, AM, and OM modes are: 

80 dB down from carrier at frequencies < 700 MHz 

80 dB down from carrier within 45 MHz of the carrier at frequencies >- 700 MHz 


ALL power line related spurious signals are 70 dB down from the carrier. 

DESCRIPTION: 

The outputs of two Synthesized Signal Generator Systems which use the same time base reference are mixed and the 

difference frequency is amplified and coupled to the wave analyzer. A reference level is established, various selected 

frequencies are then set on the two generator systems, and the spurious signal levels are measured. 

EQUIPMENT: 

PROCEDURE: 

1. Connect the equipment as illustrated in Figure 4-15. 

Figure 4-15. Narrowband Spurious Signal Test Setup. 


Double Balanced Mixer............................. Watkins Johnson M1J 

Wave Analyzer ......................................... HP 3581A 

40 dB Amplifier.......................................... See Figure 1-2 

2. Connect rear panel REFERENCE OUTPUT from reference system to rear panel REFERENCE INPUT of system 

under test. Set REFERENCE SELECTOR of system under test to EXT. 

3. On reference system. set the mainframe center frequency to 500.001 MHz, the OUTPUT RANGE switch to +10 

dBm, and adjust VERNIER control to a -3 dB meter reading. 

4-40


4-28. SPURIOUS SIGNALS, NARROWBAND (Cont’d) 


4. On system under test, set mainframe center frequency to 500 MHz, the RF Section OUTPUT RANGE switch to - 

80 dBm, and adjust VERNIER control to 0 dB indication on meter scale. 

5. Set the wave analyzer scale switch to 90 dB, amplitude reference to -60, dBV mode, resolution band-width 3 Hz, 

display smoothing to max, and AFC on. 

6. Set wave analyzer frequency control to 1 kHz and adjust the input sensitivity for a 0 dB indication on meter scale. 

7. On system under test, set the OUTPUT RANGE switch to -10 dBm and adjust VERNIER to 0 dB indication on 

meter scale. 

8. On reference system and system under test, set mainframe center frequency values to those listed in Table 4-2 

and verify that levels of corresponding spurious signals are in accordance with specification. The corrected 

reading of spurious level relative to carrier is 70 dB - (+ difference level), therefore a reading of -13 dB relative to 

the reference level (step 6) gives the spurious signal level. 70 dB -(-13 dB) = 83 dB down. 

4-29. SPURIOUS SIGNALS, WIDEBAND 


NOTE 

It may be necessary to slightly readjust the Wave Analyzer Frequency 

control to locate the spurious signal. 

Table 4-2. Narrowband Spurious Signals Checks 

System Under Test Reference System Level Measured 

(dBdown) 

100.280000 MHz 100.561000 MHz 80 dB 

200.280000 MHz 200.561000 MHz 80 dB 

409.720000 MHz 409.441000 MHz 80 dB 

509.720000 MHz 509.441000 MHz 80 dB 

1109.720000 MHz 1109.441000 MHz 80 dB 

1209.720000 MHz 1209.441000 MHz 80 dB 

All wideband non-harmonically related spurious signals in the CW, AM, and OM modes are: 

80 dB down from carrier at frequencies < 700 MHz 

80 dB down from carrier > 45 MHz from carrier at frequencies > 700 MHz 


4-41


4-29. SPURIOUS SIGNALS, WIDEBAND (Cont’d) 

DESCRIPTION: 


The RF OUTPUT of the Synthesized Signal Generator System is monitored by a spectrum analyzer after being passed 

through a 2200 MHz low pass filter. Selected signals which fall within the specified range are measured. 

EQUIPMENT: 

PROCEDURE: 

1. Connect equipment as illustrated in Figure 4-16. 

Figure 4-16. Wideband Spurious Signal Test Setup 

Spectrum Analyzer ................................... HP 8555A/8552B/140T 

Low Pass Filter (2200 MHz)...................... HP 360C 

2. With the RF Section OUTPUT RANGE switch set to +10 dBm and VERNIER control adjusted for 0 dB meter 

indication, set mainframe center frequency to those values listed in Table 4-3 and adjust the Spectrum Analyzer to 

measure corresponding spurious signal level relative to the carrier. 

Table 4-3. Wideband Spurious Signals Checks 

Mainframe Frequency Spurious Frequency Level Measured 

1299.9 MHz 150 MHz 50 dB down 

1150 MHz 50 dB down 

1450 MHz 50 dB down 

1000 MHz 950 MHz 50 dB down 






4-42


4-30. PHASE MODULATION PEAK DEVIATION 



0 to 100 degrees peak. May be overdriven to 2 radians (1150) in Modulation Section external dc mode. 

NOTE 

To check Phase Modulation peak deviation, refer to Section IV of the 

appropriate Modulation Section Operating and Service Manual. 

4-31A. PHASE MODULATION DISTORTION 



4-31A. PHASE MODULATION DISTORTION (Cont’d) 

EQUIPMENT: 

PROCEDURE: 


Figure 4-17A. Phase Modulation Distortion Test Setup 

Vector Voltmeter ..................................................... HP 8405A 

Test Oscillator . ........................................................ HP 651B 

Distortion Analyzer ................................................. HP 333A 

50Ω Termination . ................................................... HP 11593A 

Coaxial Tee............................................................. HP 1250-0781 

1. Set the Synthesized Signal Generator System controls for a center frequency of 10.000 000 MHz and an 

output level of +3 dBm (O dBm range). 

2. Set the test oscillator output to 1.5 Vrms at 20 Hz. Set the signal generator system’s modulation mode to off. 

3. Connect the instruments as shown in Figure 4-17A. 

4. Set the vector voltmeter’s phase range switch to +180 °. Set the meter offset switch for a phase meter reading 

of 0 +100. 

5. Set the modulation section controls for the OM mode and a modulation level of 1000 as indicated by the front 

panel meter. 

*In Figure 4-16A, the test oscillator output is 50 ohms when the modulation section is a Model 86634A and 600 ohms 

when used with a Model 86635A. 

4-44


4-31A. PHASE MODULATION DISTORTION (Cont’d) 


6. Measure the total harmonic distortion of the 20 Hz demodulated signal using the distortion analyzer. Distortion 

should be


EQUIPMENT: 

PROCEDURE: 


Figure 4-17B. Phase Modulation Distortion Test Setup (Alternate Procedure) 


Test Oscillator........................................... HP 651B 

Mixer ......................................................... Watkins Johnson M1J 

Phase Modulation Test Set....................... HP 8660C-K10 

Spectrum Analyzer.................................... HP 8553B/8552B/140T 

Low Pass Filters (1 MHz 600Ω; 1, 5, and 

10 MHz --50Ω) .......................................... Specials (See Figure 1-4) 

1. Set the Test Oscillator to 1 MHz, connect a 1 MHz low pass filter (50 ohm for 86634A, 600 ohm for 86635A) to 

appropriate test oscillator output and adjust for 1.7 Vrms output. Connect the rest of the equipment as shown in 

Figure 4-17B. 

2. Set the system under test for 300 MHz center frequency and +3 dBm output (O dBm range). Connect the RF 

output jack directly to the RF input of the phase modulation test set. 

3. Set the system under test controls for OM with a modulation level of 1000 peak deviation. 

*In Figure 4-16B. the test oscillator output impedance and Low Pass Filter impedance is 50 ohms when the modulation 

section is a 

Model 86634A and 600 ohms with a Model 86635A. 

4-46



4-31B. PHASE MODULATION DISTORTION - ALTERNATE PROCEDURE (Cont’d) 

4. View the signal generator output on the spectrum analyzer display. Record the level of the second and third 

harmonics of the demodulated output signal with respect to the fundamental. 

5. Use Table 4-1 to obtain power ratios of the harmonics. Then use Table 4-1 to find the dB level corresponding to 

sum of the two ratios. The resultant level should be < 5% or >- 26 dB down. 

86634A 26 dB down 

86635A 26 dB down 

6. Set the center frequency of the system under test to 299.9 MHz. 

7. Set the test oscillator to 1 MHz (10 MHz), connect the 1 MHz (10 MHz) low pass filter to the appropriate oscillator 

output (50 or 600Ω) and adjust for an output of 1.7 Vrms. 

8. Repeat steps 3-5. Total harmonic distortion should be < 5% or > 26 dB down (< 15% or >- 16.5 dB down). 

86634A 16.5 dB down 

86635A 26 dB down 

9. Set the center frequency of the system under test to 1200 MHz. Connect the mixer and the reference system as 

shown in Figure 4-17B. 

10. Set the reference system center frequency to 900 MHz with an RF output level of +7 dBm. 

11. Increase the RF output level of the system under test (if necessary) until the Phase Modulation Test Set phase 

locks. 

12. Set the test oscillator frequency to 1 MHz (5 MHz). Connect the 1 MHz (5 MHz) low pass filter (50 or 600Ω) to the 

oscillator output. Adjust the test oscillator output level to 1.7 Vrms. Set the system under test modulation level to 

1000 peak deviation. 

13. Repeat steps 3-5. Total harmonic distortion should be < 5% or > 26 dB down (< 7% or >- 23.1 dB down). 

86634A 23.1 dB down 

86635A 26 dB down 

4-47


Table 4-4. Performance Test Record (1 of 6) 

4-9. 

4-11. 

4-12. 

4-48


4-13A. 

4-13B. 


4-49


4-14. 

4-15. 

4-16. 

4-17. 


4-50


4-18. 

4-20. 

4-21. 

4-22. 

4-23. 


4-51


4-24. 

4-25. 

4-26. 

4-27. 

4-28. 

4-29. 


4-52


4-31A. 

4-31B. 


4-53



5-2. This section contains adjustment procedure: 

required to assure peak performance of the Mode 

86602B RF Section. The RF Section should be adjusted 

after any repair or if the unit, in conjunction with the 

Frequency Extension Module, fails to meet the 

specifications listed in Section IV of this manual. Prior to 

making any adjustments, allow the RF Section warmup 

for 30minutes. 

5-3. The order in which some adjustments are made 

to the RF Section is critical. Perform the adjustments 

under the conditions presented in this section. Do not 

attempt to make adjustment randomly to the instrument. 

Prior to making any adjustments to the RF Section, refer 

to the paragraph entitled Related Adjustments. 

5-4. EQUIPMENT REQUIRED 

5-5. Each adjustment procedure in this section 

contains a list of test equipment and accessories: 

required to perform the adjustment. The test equipment 

is also identified by callouts in the test setup diagrams 

included with each procedure. 

5-6. If substitutions must be made for the specified 

test equipment, refer to Table 1-2 for the minimum 

specifications of the test equipment to be used in the 

adjustment procedures. Since the Synthesized Signal 

Generator System is extremely accurate, it is particularly 

important that the test equipment used in the adjustment 

procedure meets the critical specifications listed in the 

table 

5-7. The HP 11672A Service Kit is an accessories 

item available from Hewlett-Packard for use it 

maintaining the RF Section. A detailed listing of the 

items contained in the service kit is provided in the 

11672A Operating Note and in Section I of the 

mainframe manuals. Any item in the kit may be ordered 

separately. 




manual and the system mainframe manual contain 

SECTION V 

ADJUSTMENTS 

5-1 

information, cautions, and warnings which must be 

followed to ensure safe operation and to retain the 

complete system in safe condition. Service adjustments 

should be performed only by qualified service personnel. 

NOTE 

Refer to the mainframe manual for safety 

information relating to ac line (Mains) 

voltage, fuses, protective earth grounding, 

etc. 

5-10. Any adjustment, maintenance, and repair of the 

opened instrument under voltage should be avoided as 

much as possible and, when inevitable, should be carried 

out only by a skilled person who is aware of the hazard 

involved. 

5-11. Capacitors inside the instrument may still be 

charged even if the instrument has been disconnected 

from its source of supply. 

WARNING 

Adjustments described herein are 

performed with power supplied to the 

instrument while protective covers are 

removed. Energy available at many 

points may constitute a shock hazard. 

5-12. FACTORY SELECTED COMPONENTS 

5-13. Factory selected components are identified on 

the schematics and parts list by an asterisk which follows 

the reference designator. The normal value of the 

components are shown. The manual change sheets will 

provide updated information pertaining to the selected 

components. Table 5-1 lists the reference designator, 

the criterion used for selecting a particular value, the 

normal value range, and the service sheet where the 

component part is shown. 

5-14. RELATED ADJUSTMENTS 

5-15. The RF Output Level and 1 dB Step Attenuator 

Adjustments interact. The Amplitude Modulation Input 

Circuit Adjustment is dependent on


and should be performed after the previous mentioned 

adjustments. The Phase Modulation Level and 

Distortion Adjustment is affected by and should he 

performed after the Phase Modulator Driver Frequency 

Response Adjustment. All other adjustments are 

independent. 

5-16. If the RF Output Level Adjustment is performed, 

the 1 dB Step Attenuator Adjustment should follow 

immediately. Repeat these procedures until the RF 

levels are within the stated limits without further 

adjustment. Then perform the Amplitude Modulation 

Input Circuit Adjustment If the Phase Modulator Driver 

Frequency Response Adjustment is performed, the 

Phase Modulator Level and Distortion Adjustment should 

be performed. 

5-17. If the RF Output Level and 1 dB Steel Attenuator 

Adjustments are not performed, the Amplitude 

Modulation Input Circuit Adjustment may be considered 

independent. If the Phase Modulator Driver Frequency 

Response Adjustment is not performed, the Phase 

Modulation Level and Distortion Adjustment may be 

considered independent. 

5-18. ADJUSTMENT LOCATIONS 

5-19. The last foldout in this manual contains table 

which cross-references pictorial and schematic locations 

of the adjustable controls. The figure accompanying the 

table shows the locations of adjustable controls, 

assemblies, and chassis-mounted parts. 

5-20. ADJUSTMENTS 

5-21. Before performing the adjustment procedures (1) 

disconnect the mainframe (Mains) Power 

Cable, (2) remove the RF Section from the main-frame, 

and (3) remove the RF Section covers. At this point, the 

RF Section is either reinserted into the mainframe or 

connected to the mainframe with interconnection cables 

supplied in the Service Kit. If the RF Section is 

reinserted into the mainframe for adjustments, the 

mainframe top and/or right side covers must be 

removed. Refer to the left-hand foldout page 

immediately preceding the last foldout in this manual for 

procedures explaining how to remove the RF Section 

from the main-frame, the RF Section cover removal, and 

how to interconnect the RF Section and mainframe for 

adjustments. 

NOTE 

It may be necessary to remove the upper guide 

rail to gain access to some of the adjustable 

components. 

5-22. POST ADJUSTMENT TESTS 

5-23. After adjustments are performed verify that the 

system performance is within the parameters specified 

for the RF Section and Frequency Extension Module. 

Perform the applicable performance test(s) found in 

Section IV. 

WARNING 

The multi-pin plug connector (on mainframe), 

which provides interconnection to 

the RF Section, will expose power supply 

voltages which may remain on the pins after 

the RF Section is removed and after the 

(Mains) power cable is disconnected from 

the mainframe. Be careful to avoid contact 

with the pins during interconnection with RF 

Section. 

Table 5-1. Factory Selected components 

Reference Selected For Normal Value Service 

Designator Range Sheet 

A4R17 Accurately sets the 10 dB difference in 237Ω 6 

the power output between OUTPUT 

RANGE switch settings of +10 and 0 dBm 

(the VERNIER control is not moved). 

A16R5 Sets the adjustment range of the Gain 10 to 316Ω 5 

Tracking Control A16R4. Refer to the 

Phase Modulator Driver Adjustments 

procedure. 

5-2


5-24. RF OUTPUT LEVEL ADJUSTMENT 

REFERENCE: 

Service Sheet 6. 

DESCRIPTION: 


The Meter and Detector Bias controls are adjusted alternately at specific RF Output levels until the VERNIER’S control of 

the RF Output is linear across the control range. 

EQUIPMENT: 

PROCEDURE: 

Figure 5-1. RF Output Level Adjustment Test Setup 

Power Meter/Sensor ............................................... .HP 435A/8481A 

NOTE 

Prior to performing the procedure, clean the meter face with antistatic glass cleaner.* 

1. Extract the RF Section from the mainframe. Remove the mainframe top cover and the RF Section covers. Insert 

the RF Section into the mainframe. 

2. Zero the external Power Meter. 

3. Interconnect the equipment as illustrated in Figure 5-1. 

4. Set the system’s center frequency to 1000 MHz and the RF Section’s OUTPUT RANGE switch to the 0 dBm 

position. 

5. Adjust the VERNIER control for a +3.0 dBm indication on the external Power Meter. 

6. Adjust MTR potentiometer A4R26 for a +3.0 dB indication on the front panel meter. 

7. Adjust the VERNIER control for a front panel meter indication of --6.0 dB. 

8. Adjust the BIAS potentiometer A4R13 for a -6.0 dBm indication on external Power Meter. 

9. Repeat steps 5 through 8 until the RF Section's front panel meter indicates power levels that are with-in ±0.3 dB of 

the external Power Meter indications with no further adjustment. 

*STATNUL by Weston Instrument Inc., Newark, New Jersey 

5-3


5-25. 1 dB STEP ATTENUATOR ADJUSTMENT 

REFERENCE: 


DESCRIPTION: 


RF Level and RF Linearity controls are adjusted alternately at specific RF Output levels until the programmed 1 dB step 

control of RF Output is linear across the range (10 dB). 

EQUIPMENT: 

Figure 5-2. 1 dB Step Attenuator Adjustment Test Setup 

Marked Card Programmer ..................................... HP 3260A Opt 001 

Power Meter/Sensor .............................................. HP 435A/8481A 

PROCEDURE: 

1. Connect the equipment as illustrated in Figure 5-2. 

2. Zero the external Power Meter. 

3. Use a Marked Card Programmer to program the mainframe for a center frequency of 1000 MHz and the RF 

Section for an output power level of +3 dBm. 

4. Adjust the RF Section’s RF Level Control A10OR7 for a +3.0 dBm indication on the power meter. 

5. Use the Marked Card Programmer to program the RF Section for an output power level of -6 dBm. 

6. Adjust the Linearity control A3R4 for a -6.0 dBm indication on the power meter. 

7. Repeat steps 3 through 6 until the programmed output power levels are within ± 0.3 dB of the required power 

meter indication. 

8. Recheck the power meter readings for the RF Output Level Adjustments. If necessary, perform the adjustments 

again. Then check the power meter readings for this procedure. Alternately perform one procedure and check 

the power meter readings on the other until the RF levels are within tolerance without further adjustment. 

5-4

Section 5 TM 31-6625-2837-14&P-7 

5-25. 1 dB STEP ATTENUATOR ADJUSTMENT (Cont’d) 


9. Perform the Amplitude Modulation Input Circuit Adjustments. 

5-26. AMPLITUDE MODULATION INPUT CIRCUIT ADJUSTMENT 

REFERENCE: 


DESCRIPTION: 

A specific modulation drive level is coupled to the RF Section. The RF output signal is demodulated by a peak detector in 

a spectrum analyzer (when the frequency-span width is set to zero). The ac and dc components are measured with a 

voltmeter at the detector (vertical) output. First, the dc component is set to 283 mVdc plus the detector offset correction. 

Then, the ac component is measured. The AM level (%) is 1/2 (one half) the rms output. 

Because of the required measurement accuracy, the accuracy of the spectrum analyzer’s detector offset must be known to 

±2m Vdc. The offset voltage is calculated by measuring the change in the detector output for a change in the RF input and 

assuming a linear detector over the range of the levels used. 

EQUIPMENT: 

Figure 5-3. Amplitude Modulation Input Circuit Adjustment Test Setup 

Test Oscillator ........................................................ HP 651B 


10 dB Step Attenuator ............................................ HP H38-355D 

Spectrum Analyzer ................................................. HP 8555A/8552B/140T 

Digital Voltmeter...................................................... HP 34740A/34702A 

Coaxial Tee (2 required) ......................................... HP 1250-0781 


Oscilloscope ........................................................... HP 180C/1801A/1821A 

Resistor, 1K . .......................................................... HP 0757-0280 

5-5



5-26. AMPLITUDE MODULATION INPUT CIRCUIT ADJUSTMENT (Cont’d) 

PROCEDURE: 

1. Remove the RF Section from the mainframe. Remove the mainframe top cover and the RF Section covers. 

Insert the RF Section into the mainframe. 


3. Set the synthesized signal generator controls as follows: center frequency 30 MHz, OUTPUT RANGE 0 dBm. 

VERNIER control for a panel meter reading of +3 dB, and AM off. 

4. Let the spectrum analyzer warm up for 1 hour to minimize drift of the spectrum analyzer detector output. Set the 

10 dB step attenuator to 10 dB attenuation. 

5. Set the spectrum analyzer center frequency to 30 MHz, frequency span per division 5 MHz, resolution bandwidth 

300 kHz; input attenuation to 20 dB, and vertical sensitivity per division 10 dB. Adjust the center frequency 

control to center the display. Set the frequency span to zero and tune to peak the trace. 

NOTE 

Throughout this test, continually check that the signal is peaked for maximum deflection. 

Tune the center frequency control for maximum signal deflection. 

6. Set the vertical scale to linear and adjust the reference level vernier for a digital voltmeter reading of -200 mVdc. 

7. Set the 10 dB step attenuator to 0 dB and record the digital voltmeter reading. 

8. Set the 10 dB Step Attenuator to 20 dB and record the digital voltmeter reading. 

9.Calculate the offset voltage using the following formula: 

For example: 

V off = mVdc + 200a 

1- α 

Where Voff is the offset voltage in millivolts mVdc is 

the DVM reading in millivolts. α is 3.16 (step 

7) and 0.316 (step 8). 

mVdc = ⎯-687 in step 7 

Therefore Voff =⎯ 687+200(3.16) =+25.5 mVdc 

1 - (3.16)-+5 m 

10. Find the value of Voff for step 8. The difference between the two should be



5-26. AMPLITUDE MODULATION INPUT CIRCUIT ADJUSTMENT (Cont’d) 

11. Set the 10 dB step attenuator to 10 dB. 

12. Set the system center frequency to 1000 MHz, the modulation mode to AM, the modulation source to external, and 

a modulation level of 50% (0.5 Vrms input to an Auxiliary Section) at a 1 kHz rate. 

13. Set the spectrum analyzer center frequency control to 1000 MHz, and set the reference level vernier for digital 

voltmeter reading of ⎯ 283 mVdc + Voff. See Step 10. 

14. Set the DVM controls to measure the peak detector’s ac component. The modulation level (%) is 1/2 (one-half) 

the DVM reading (Vrms). Adjust the AM CAL Control A10R5 for a reading of 100 mVrms. 

15. Set the RF Section’s VERNIER control for a front panel meter reading of ⎯ -6 dB. 

16. Set the DVM to monitor the dc vertical output. Reset the DVM reading of ⎯283 mVdc + Voff. 

17. Set the DVM to monitor the ac vertical output. Adjust the AM Linearity control A10OR2 for a DVM reading of 100 

mVrms. 

18. Repeat steps 13 through 17 until the DVM reading is 100 ±2 mVrms at RF Section meter readings of +3 and -6 dB 

without further adjustment. 

5-27. PHASE MODULATOR DRIVER FREQUENCY RESPONSE ADJUSTMENTS 

REFERENCE: 


DESCRIPTION: 

The output of a sweep generator is connected to the A16 Phase Modulator Driver Assembly input while a spectrum 

analyzer monitors the system’s phase modulated RF output. The frequency response control is adjusted for maximum 

flatness to ±40 MHz and for minimum peaking at 80 MHz. 

Figure 5-4. Phase Modulator Driver Frequency Response Adjustment Test Setup 

5-7



5-27. PHASE MODULATOR DRIVER FREQUENCY RESPONSE ADJUSTMENTS (Cont’d) 

EQUIPMENT: 

Sweep Generator............................................................ HP 8601A 

Spectrum Analyzer.......................................................... HP 8555A/8552B/140T 

Digital Voltmeter ............................................................. HP 34740A/34702A 

PROCEDURE: 

1. Remove the RF Section from the mainframe. Remove the mainframe top cover and the RF Section covers and 

top guide rail. 

2. Remove cable W12 from the OM Input A16J1 and wrap the connector with insulating tape. Connect 11672-60005 

(from the Service Kit) to A16J1. Route the BNC end of cable into the cavity and out through the top of the 

mainframe. Carefully reinstall the RF Section so as not to damage the cables. 

3. Set the sweep generator controls as follows: sweep range 110 MHz, frequency 100 MHz, output level -10 dBm, 

sweep video, sweep mode free-slow, and sweep vernier full clockwise. 


5. Set the synthesized signal generator controls for a center frequency of 1.05 GHz and an output level of 0 dBm. 

6. Set the spectrum analyzer controls for center frequency of 1.05 GHz, frequency span per division 20 MHz, 

resolution bandwidth 300 kHz, input attenuation 30 dB, vertical sensitivity per division linear, and sweep time per 

division 2 ms. 

7. Center the RF Section’s Gain Tracking Adj control, A16R27. 

8. Set the Second Harmonic Adj control for +7.0 Vdc on A16TP2. 

9. Remove the DVM connection to A16TP2 before continuing. 

10. Set the Third Harmonic and Gain Adj controls (A16R1 and A16R2) to their full counter clockwise position. 

11. Adjust the sweep generator output level so the sidebands are approximately 34 dB below carrier level. 

12. Adjust the Frequency Response Control A16C7 for maximum flatness within 40 MHz of the carrier and for the 

minimum peaking at frequencies from 60 to 80 MHz. 

13. Disconnect sweep generator from the A16 Assembly and set signal generator LINE switch to STBY. 

14. Carefully remove the RF Section. Be careful not to damage the cables. Reconnect W12 to A16J1. 

5-28A. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS 

REFERENCE: 


DESCRIPTION: 

The phase modulated signal from the synthesized signal generator is monitored by a spectrum analyzer and is adjusted to 

the modulation level indicated by the modulation level meter. The phase modulated signal is then mixed down, the 

difference frequency is connected to an FM discriminator, and the detected output is connected to the spectrum analyzer. 

The adjustments are set to minimize harmonic distortion. The modulation level and distortion adjustments are repeated 

until both are within the required accuracy. 

5-8

Section 5 TM 11-6625-2837-14 & P-7 


5-28 A. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS (Cont’d) 

EQUIPMENT: 

Figure 5-5A. Phase Modulation Level and Distortion Adjustment Test Setup 

Spectrum Analyzer...............................HP 8553B/8552B/140T 

Synthesized Signal Generator System ............HP 8660C/86603A/86631B 

Test Oscillator .....................................HP 651B 

FM Discriminator..................................HP 5210A 

Mixer, Doubler Balanced......................HP 10514A 

Low Pass Filters (100 kHz at 5012 or 6001 )....Special (See Figure 1-4) 

PROCEDURE: 

1. Extract the RF Section from mainframe. Remove the mainframe top cover, the RF Section covers, and the top 

guide rail. Insert the RF Section back into the mainframe. 

2. Connect the equipment as shown in Figure 5-5A. Connect the output of the System Under Test directly to the 

spectrum analyzer RF input. Be sure to use the correct impedance test oscillator output and the correct low pass 

filter. 

3. Set the test oscillator output to 100 kHz at 1.5 Vrms. 

4. Set the System Under Test center frequency to 100 MHz with a 0 dBm OUTPUT level. 

*In Figure 5-5A. the test oscillator output and low pass filter impedances are 50s when the modulation section being used 

is a Model 86634A 

and 60012 when used with an 86635A. 

5-9

Section 5 


5-28A. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS (Cont’d) 

TM 11-6625-2837-14 & P-7 

5. Set the spectrum analyzer controls for a center frequency of 100 MHz, resolution bandwidth of 10 kHz, frequency 

span per division of 0.5 MHz, sweep time per division of 10 ms, input attenuation of 30 dB, vertical scale per 

division to 2 dB and adjust the reference level to a readable level. 

6. Set the Modulation Section controls for OM mode, external AC source, and a modulation level of exactly 82° as 

read on the front panel meter. 

7. Adjust A16R2 so the carrier and first sidebands are of equal amplitude. 

8. Step the System Under Test center frequency down 1 Hz to 99.999999 MHz. Adjust A16R27 so the carrier and 

first sidebands are equal. 

9. Set the FM discriminator controls for the 10 MHz range and 0.1V sensitivity, and insert an internal 1 MHz lowpass 

filter. 

10. Set the spectrum analyzer controls for a center frequency of 100 kHz, resolution bandwidth to 3 kHz, frequency 

span per division to 100 kHz, input attenuation to 0 dB, log reference level to a convenient level, vertical 

sensitivity per division to 10 dB, and scan time per division to 20 ms. 

11. Set the Reference System controls for a center frequency of 109 MHz and an output level of +7 dBm. 

12. Set the System Under Test center frequency to 100 MHz; set the modulation level to 100° as read on the front 

panel meter. 

13. Refer to Figure 5-5 and connect the System Under Test OUTPUT to the "RF" input of the mixer. Connect the FM 

Discriminator output to the spectrum analyzer RF input. 

14. Adjust the spectrum analyzer's reference level control so the peak of the fundamental 100 kHz signal is viewed on 

the CRT display at the log reference graticule line. 

15. Adjust A16R36 to null the second harmonic level; adjust A16R1 to null the third harmonic level. 

NOTE 

Observing harmonic distortion of a OM signal after passing it through an FM discriminator 

results in an increase in level of 6 dB per octave. There- fore, the measured second 

harmonic level will be 6 dB higher and the third harmonic level 9.5 dB higher than with a 

phase demodulator. 

16. Step the System Under Test center frequency down 1 Hz. Note the direction and amount of readjustment of 

A16R36 and R1 necessary to null the second and third harmonics. 

17. Set A16R36 and R1 for the best compromise (minimum second and third harmonic levels) at both center 

frequency settings of 99.999999 and 100.000000 MHz. 

18. Set the System Under Test center frequency to 100 MHz; set the modulation level to 82 degrees as indicated on 

the Modulation Section meter. 

19. Reconnect the RF Section output directly to the spectrum analyzer input. 

5-10

Section 5 


5-28A. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS (Cont’d) 

20. Adjust A16R2 for equal carrier and first sideband levels. 


21. Step center frequency down 1 Hz to 99.999999 MHz and adjust A16R27 for equal amplitude carrier and first 

sidebands. 

22. Repeat steps 4 through 22 until all the conditions below are met without further adjustment. 

a. Carrier and first sidebands are equal within 0.5 dB when changing Center Frequency of System Under Test 

between 100 and 99.999999 MHz (Steps 7-8). 

b. Second harmonic levels are equal within 4 dB or >40 dB down from the fundamental as indicated by the 

spectrum analyzer at center frequencies of 100 an,, 99.999999 MHz (Step 17). 

c. Third harmonic levels are equal within 4 dB or >35 dB down from the fundamental as indicated by spectrum 

analyzer at center frequencies of 300 and 299.999999 MHz (Step 17). 

23. Replace the RF Section top guide rail and covers, and the mainframe cover. 

5-28B. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS - ALTERNATE PROCEDURE 

REFERENCE: 


DESCRIPTION: 

The phase modulated signal from the synthesized signal generator is monitored by a spectrum analyzer and is adjusted to 

the modulation level indicated by the modulation level meter. The phase modulated signal is then mixed down, the 

difference frequency is connected to a phase demodulator, and the detected output is connected to the spectrum analyzer. 

The adjustments are set to minimize harmonic distortion. The modulation level and distortion adjustments are repeated 

until both are within the required accuracy. 



5-28B. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS - ALTERNATE 

PROCEDURE (Cont’d) 

EQUIPMENT: 

PROCEDURE: 


Figure 5-5B. Phase Modulation Level and Distortion Adjustment Test Setup (Alternate Procedure) 

Spectrum Analyzer ...........................HP 8553B/8552B/140T 

Test Oscillator...................................HP 651B 

Low Pass Filters (1 MHz at 500 or 6002) .....Special (See Figure 1-4) 

Phase Modulation Test Set...............HP 8660C-K10 

1. Extract the RF Section from mainframe. Remove the mainframe top cover, the RF Section covers, and the top guide 

rail. Insert the RF Section back into the mainframe. 

2. Connect the equipment as shown in Figure 5-5A. Connect the output of the System Under Test directly to the 

spectrum analyzer RF input. Be sure to use the correct impedance test oscillator output and the correct low pass 

filter. 

3. Set the test oscillator output to 100 kHz at 1.5 Vrms. 

4. Set the System Under Test center frequency to 100 MHz with a 0 dBm OUTPUT level. 

5. Set the spectrum analzer controls for a center frequency of 100 MHz, resolution bandwidth of 10 kHz, frequency span 

per division of 0.5 MHz, sweep time per division of 10 ms, input attenuation of 30 dB, vertical scale per division of 2 dB, 

and adjust the reference level to a readable level. 

6. Set the Modulation Section controls for OM mode, external AC source, and a modulation level of exactly 82° as read 

on the front panel meter. 

*In Figure 5-5B, the test oscillator output and low pass filter impedances are 50 ohms when the modulation section being 

used is a Model 

86634A and 600 ohm when used with an 86635A. 

5-12

Section 5 



5-28B. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS - ALTERNATE PROCEDURE (Cont’d) 

7. Adjust A16R2 so the carrier and first sidebands are of equal amplitude. 

8. Step the System Under Test center frequency down 1 Hz to 99.999999 MHz. Adjust A16R27 so the carrier and first 

sidebands are equal. 

9. Set the spectrum analyzer controls for a center frequency of 2 MHz, resolution bandwidth to 30 kHz, frequency span 

per division to 0.5 MHz, input attenuation to 30 dB, log reference level to a convenient level, vertical sensitivity per 

division to 10 dB, and scan time per division to 10 ms. 

10. Set the System Under Test center frequency to 300 MHz with a modulation level of 100° as read on the front panel 

meter. 

11. Connect the phase modulation test set between the signal generator output and the spectrum analyzer input as 


12. Adjust the spectrum analyzer's reference level so the peak of the fundamental 1 MHz signal is viewed on the CRT 

display at the log reference graticule line. 


14. Step the System Under Test center frequency down 1 Hz. Note the direction and amount of readjustment of A16R36 

and R1 necessary to null the second and third harmonics. 

15. Set A16R36 and R1 for the best compromise (minimum second and third harmonic levels) at both center frequency 

settings of 299.999999 and 300 MHz* 

16. Set the System Under Test center frequency to 100 MHz; set the modulation level to 82° as indicated on the 

Modulation Section meter. 

17. Reconnect the RF Section output directly to the spectrum analyzer input. 

18. Adjust A16R2 for equal carrier and first sideband levels. 

19. Step the center frequency down 1 Hz to 99.999999 MHz and adjust A16R27 for equal amplitude carrier and first 

sidebands. 


a. Carrier and first sidebands are equal within 0.5 dB when changing Center Frequency of System under 

Test between 100 and 99.999999 MHz (Steps 7-8). 

b. Second harmonic levels are equal within 4 dB or > 46 down from the fundamental. at center 

frequencies of 300 and 299.999999 MHz (Step 15). 

c. Third harmonic levels are equal within 4 dB or >46 dB down from the fundamental at center frequencies 

of 300 and 299.999999 MHz (Step 15). 

21. Replace the RF Section top guide rail and covers, and the mainframe cover. 

5-13

Section 6 


6-2. This section contains information for ordering parts. 

Table 6-1 lists abbreviations used in the par list and 

throughout the manual. Table 6-2 lists a replaceable 

parts in reference designation order Table 6-3 contains 

the names and addresses that correspond with the 

manufacturers’ code numbers 

6-3. EXCHANGE ASSEMBLIES 

6-4. The A13 Attenuator Assembly may be re placed on 

an exchange basis, thus affording a con siderable cost 

saving. Exchange, factory-repaired and tested 

assemblies are available only on a trade basis; therefore, 

the defective assemblies must be returned for credit. 

For this reason, assemblies required for spare parts 

stock must be ordered by the new assembly part 

number. The A13 assembly exchange part number is 

86601-60109. 

6-5. ABBREVIATIONS 

6-6. Table 6-1 lists abbreviations used in the part list, 

schematics and throughout the manual. I some cases, 

two forms of the abbreviation are used one all in capital 

letters, and one partial or n capitals. This occurs 

because the abbreviations i the parts list are always all 

capitals. However, in the schematics and other parts of 

the manual other abbreviation forms are used with both 

lower case and upper case letters. 

6-7. REPLACEABLE PARTS LIST 

6-8. Table 6-2 is the list of replaceable parts and in 

organized as follows: 

a. Electrical assemblies and their components in 

alpha-numerical order by reference designation. 

b. Chassis-mounted parts in alpha-numerical order 

by reference designation. 

c. Miscellaneous parts. 

The information given for each part consists of the 

following: 

a. The Hewlett-Packard part number. 

SECTION VI 

REPLACEABLE PARTS 

(Next printed page is 6-3) 

6-1 


b. The total quantity (Qty) used in the instrument. 

c. The description of the part. 

d. A typical manufacturer of the part in a five-digit 

code. 

e The manufacturer’s number for the part. 

The total quantity for each part is given only at the first 

appearance of the part number in the list.

Section 6 

Table 6-1. Reference Designations and Abbreviations (1 of 2) 

6-3 

TM 11-6625-2837-14 & P-7

Section 6 

Table 6-1. Reference Designations and Abbreviations (1 of 2) 

6-4 

TM 11-6625-2837-14&P-7

Section 6 

Reference 

Designatio 

n 

HP Part 

Number 

See TABLE 6-4, Parts to National Stock Number Cross Reference 

Table 6-2. Replaceable Parts 

Qty Description Mfr 

Code 


Mfr Part Number 

A1 86602-60002 1 MODULATOR FILTER ASSY 28480 86602-60002 

A1C1 0160-3874 1 CAPACITOR-FXD 1OPf: +-.PF 200WVDC CER 28480 060-3874 

AJ11 0360-1514 TERMINAL-STUD SGL-PIN PRESS-MTG 28480 0360-1514 

A1J2 0360-1514 TERMINAL-STUD SGL-PIN PRESS-MTG 28480 9360-1514 

A1L1 9140-0158 2 COIL-FXD MOLDED RF CHOKE IUH 10 24226 O/101101 

A1L2 9140-0158 COIL-FXD MOLDED RF CHOKE IUH l10 24226 10/101 

A1L3 9100-2247 1 COIL-FXD MOLDED RF CHOKELUH 10 24226 10D100 

A1P1 1251-3172 5 CONNECTOR;1-CONT SKT .03 DIA 00779 2-331677-9 

A1P2 1251-3172 CONNECTOR;1-CONT SKT .03 DIA 00779 2-331677-9 

A1P3 1251-3172 CONNECTOR 1-CONT SKT .03 DIA 00779 2-331677-9 

A1P4 1251-3112 CONNECTOR;1-CONT SKT .03 DIA 00779 2-331677-9 

A1P5 1251--3172 CONNECTOR;1-CONT SKT .03 DIA 00779 2-3316177-9 

A2 86603-60001 1 ALC MOTHER BCARD ASSY 28480 86603-60001 

A2C1 0160-2204 2 CAPACITOP-FXD 100IPF-51 300WVOC MICA 28480 0160-2204 

A2C2 060-3457 1 CAPACITOR-FXC 2000PF +-10T 250WVDC CER 28480 0160-3457 

A2J1 1250-1255 1 CONNECTOR-RF SMB M PC 98291 SL-O51-0000 

A2K1 0490-0916 3 RELAY-REED 1A .56 50V CONT 5V-COIL 28480 0490-0916 

A201 1854-0404 5 TRANSISTOR NPN SI TO-18 P09360MW 28480 1854-0404 

A2R1 069-0084 1 RESISTOR 2.15K 1t .125W F TC-0-100 16299 C4-1/8-TO-2151-F 

A282 0757-1060 1 RESISTOR 196 IT .5w F TC=0-10O 19701 MFTCI/2-TO0196R-F 

A2R3 0757-0441 1 RESISTOR 8.25K It .125w F TC-0-100 24546 C4-1/8-TD-8251-F 

A2R4 0698-3405 1 RESISTOR 422 1 .5W F TC-0+-100 19701 MFTC/2-TO-422R-F 

A205 0757-0438 10 RESISTOR 5.11K T .125w F TC-0--100 24546 C4-1/8-TO -5111-F 

A209 0757-0276 1 RESISTOR 61.9 11 .125w F TC-0-100 24546 C4-1/8-TD-6192-F 

A2Vet 1902-3139 1 DIODE-ZNR 8.25V 5% DO-7 PD0.4w TC-a.0531 04713 S2 10939-158 

A2XA3 1251-1626 3 CONNECTOR-PC EDGE 12-CONT/ROw 2-ROWS 71785 252-12-30-300 

A2XA4 1251-1626 CONNECTOR-PC EDGE l2-CONT/ROW 2-ROWS 71785 252-12-30-300 

A2XA16 1251-1626 CONNECTOR-PC EDGE I2-CONTIROW 2-ROWS 71785 252-12-30-300 

A2 MISCELLANEOUS 

0360-1514 6 TERMINAL-STUD SOL-PIN PRESS-ITG 28480 0360-1514 

A3 8660260040 1 ALC AMNPLIFIER ASSY 28480 86602-60040 

A3C1 3180-tOS8 2 CAPACITOR-FXO 50UFa75-10t 25¥DC AL 56289 300506G025CC2 

A3C2 0180-0058 CAPACITOR-FXD 50UF+75T10t 25VDC AL 56289 300506G025CC2 

A3C3 0140-0193 1 CAPACITOR-FXD 82PF a-51 300WVDC MICA 04522 DM15E820J0300WV1CR 

A3C4 0160-2199 2 CAPACITOR-FXO 30PF t51300WVDC MICA 28480 0160-2199 

AI3CS 0160-2199 1 CAPACITOR-FXO300PF +-51 300WVDC MICA 28480 0160-2199 

A3C6 0160-0302 1 CAPACITOR-FXD.018UF +-10% 200WVDC POLYE 56289 292P18392 

63C7 0160-3468 1 CAPACITOR-FXDZ2UF +1.03 BOWVOC POLYE 56289 292P1249"8 

A3C8 0160-2204 CAPACITOR-FXC 100PF a-51 300WVOC MICA 28480 0160-2204 

A3C9 0160-2238 1 CAPACITOR-FXD1.5PF +.25PF 500WVDC CER 28480 0160-2238 

A3CR1 1901-0047 3 DIODE-SWITCHING 20V 75MA IONS 28480 1901-0047 

A3CR2 1901-0047 DIODE-SWITCHING 20V 75MA IONS 28480 1901-0047 

A3CR3 1901-0047 DIODE-SWITCHING 20V 75MA IONS 28480 1901-0047 

A3CR4 1901-0050 2 DIODE-SWITCHING8OV 2OONA 2NS 00-7 28480 1901-0050 

A3K1 0490-0916 RELAY-REED IA .56 50V CONT 5V-COIL 2R480 0490-0916 

A3L1 91402--0237 4 COIL-FOE MOLDED RF CHOKE 0ZO0UH 51 24226 151203 

A3L2 9140-0237 COIL-FXD MOLDED RF CHOKE 200UH S51 24226 15/203 

A313 9140-0105 1 COIL-FXD MOLDED RF CHOKE 8.2UH 10 24226 151821 

A301 1853-0020 3 TRANSISTOR PNP SI PD-300MW FT-I1SOMHZ 28480 1853-0020 

A302 1854-0404 TRANSISTOR NPN SI TO-18 PD-36OMW 20480 1854-0404 

A303 1855-0020 1 TRANSISTOR J-FET N-CHAN D-MODE0-18 SI 28480 1805-0020 

A304 1853-0034 5 TRANSISTOR PNP SI T-18 P9036ONW 28480 1853-0034 

A305 18S3-0020 TRANSISTOR PNP SI PD-300RW FT-1SOMHZ 28480 1853-0020 

A306 1853-0034 TRANSISTOR PNP SI TO-is PD0360AW 28480 1853-0034 

A307 1854-0404 TRANSISTOR NPN S1 70-8 PD-360MW 28480 1854-0404 

6308 1854-0404 TRANSISTOR NPN SI T0-18 PD0360MW 28490 1R54-0404 

A309 1853-0034 TRANSISTOR PNP SI TO-l8 PD9360MW 28480 1853-0034 

A3010 1854-0221 2 TRANSISTOR-DUAL NPPO-T950MW 28480 1854-0221 

A3Q11 1854-0053 1 TRANSISTOR NPN 2N2218 SI TI-5 P0=800Mw 04713 2N2218 

See Introduction to this section for ordering information 

6-5

Section 6 

Reference 

Designation 

HP Part 

Number 

Qty 


Description Mfr 

Code 



A4R16 0698-0083 RESISTOR 1.96K 1% .125W F TO-04-100 16299 C4-1/8-TO-1961-F 

A4R17* 0689-3442 1 RESISTOR 237 1% .125 F TO-0+-100 16299 C4-1/8-TO-237R-F 

A4R18 0757-0280 *FACTORY SELECTED PART 24546 C4-1/8-TO-1001-F 

A4R19 0698-3447 2 RESISTOR 1K 1% .125W F TO+-100 16299 C4-1/8-TO-422R-F 

A4R20 0698-0082 2 RESISTOR 422 1%.125W F TO +-100 16299 C4-1/8-TO 4640-F 

A4R21 0698-3447 1 RESISTOR 464 1% .125W F TO +-100 16299 C4-1/8-TO-422R-F 

A4R22 0698-3157 1 RESISTOR 422 1% .125W F TO +-100 16299 C4-1/8-TO-1962-F 

A4R23 0698-3455 1 RESISTOR 19.6K 1% .125W F TO +-100 16299 C4-1/8-TO-2613-F 

A4R24 0757-0439 RESISTOR 261K 1% .125W F TO +-100 24546 C4-1/8-TO-6811-F 

A4R25 0698-0082 1 RESISTOR 6.81K 1% .125W F TO+-100 16299 C4-1/8-TO-4640-F 

A4R26 2100-2489 1 RESISTOR 19701 ET50X02 

A451 3101-0973 1 SWITCH-SL DPDT-NS MINTR .5A 125VAC/DC PC 79727 GF126-0018 

A4TP1 0360-1514 TERMINAL-STUD SGL-PIN PRESS-MTG 28480 0360-1514 

A4TP12 0360-1514 TERMINAL-STUD SGL-PIN PRESS MTG 28480 0360-1514 

A4U1 1826-0013 1 IC DP AMP 28480 1826-0013 


4040-0748 EXTRACTOR -PC BD BLK POLYC .062-BD-THNKS 28480 4040-0748 

1480-0073 4 PIN:DRIVE 0.25”LG 00000 OBD 

4040-0751 1 EXTRACTOR-PC BD ORN POLYC 0.62-BD-THNKS 28480 4040-0751 

1480-0073 PIN:DRIVE 0.25”LG 00000 OBD 

A5 5086-7049 1 MODULATOR ASSY 28480 5086-7049 

A5J1 NSR 

A5J2 NSR 

A5J3 NSR 

A5J4 NSR 

A5J5 NSR 

A5J6 NSR 

A6 5086-7048 1 AMPLIFIER DETECTOR ASSEMBLY 28480 5086-7048 

A6J1 NSR 

A6J2 NSR 

A6J3 NSR 

A6J4 NSR 

A6J5 NSR 

A6J6 NSR 

A7 86602-60044 1 MIXER ASSY (EXCEPT OPTION 002) 28480 86602-60044 

A7J1 86601-20022 3 CONNECT, BULKHEAD 28480 86602-20022 

A7J2 86602-20022 CONNECT, BULKHEAD 28480 86602-20022 

A7J3 86602-20022 CONNECT, BULKHEAD 28480 86602-20022 

A7 MISCELLANEOUS 28480 

0360-0124 3 TERMINAL-STUD SGL-PIN PRESS-MTG 28480 0360-0124 

5001-002 1 COVER, FILTER 28480 5001-0002 

86602-00003 1 COVER,MIXER,SMALL 28480 86602-00003 

86602-20026 1 BUSHING 28480 86602-20026 

86602-20029 1 SUPPRESSOR 28480 86602-20029 

86603-00005 1 COVER,MIXER,LARGE 28480 86603-00005 

86603-20024 1 HOUSING, MIXER 28480 86603-20024 

A7A1 86602-20009 1 BALUN MIXER ASSY 28480 86602-20009 

A7A2 86602-60008 1 BALANCE MIXER ASSY 28480 86602-60008 

A7A2CR1 5080-0271 1 DIODE, SILICON, MATCHED QUAD 28480 5080-0271 

A7A3 5086-7066 1 LOW PASS FILTER ASSY, 1.45GHZ 28480 5086-7066 

A7A4 86603-20023 1 TRANSISTOR ASSY 28480 86603-20023 


See introduction to this section for ordering information 

6-6

Reference 

Designation 

HP Part 

Number 

Qty 



Code 



A7 86603-60023 1 MIXER ASSY (OPTION 002 ONLY) 28480 86603-60023 

A7 C1 0160-4082 1 CAPACITOR-FXD 1000PF +-20% 200WVDC CER 28480 0160-4082 

A7 J1 86602-20022 3 CONNECTOR, BULKHEAD 28480 86602-20022 

A7 J2 86602-20022 CONNECTOR, BULKHEAD 28480 86602-20022 

A7 J3 86602-20022 CONNECTOR, BULKHEAD 28480 86602-20022 

A7 L1 9100-1666 1 COIL-FXD MOLDED RF CHOKE 3.6MH 5% 24226 22/364 

A7 MISCELLANEOUS 83330 

0340-0044 1 TERMINAL-STUD DBL-TUR PRESS MTG 28480 92-1500 

0360-0124 1 TERMINAL-STUD SGL-PIN PRESS-MTG 28480 0360-0124 

5001-0002 1 COVER, FILTER 28480 5001-0002 

86602-00003 1 COVER, MIXER, SMALL 28480 86602-00003 

86602-20026 1 BUSHING 28480 86602-20026 

86602-20029 1 SUPPRESSOR 28480 86602-20029 

86603-00005 1 COVER, MIXER, LARGE 28480 86603-00005 

86603-20024 1 HOUSING, MIXER 28480 86603-20024 

A7A1 86603-20009 1 BALUN MIXER ASSY 28480 86603-20009 

A7A2 86603-60008 1 BALANCE MIXER ASSY 28480 86602-60008 

A7A2CR1 5080-0271 1 DIODE SILICON , MATCHED QUAD 28480 5080-0271 

A7A3 5086-7066 1 LOW PASS FILTER ASSY, 1.45 GHZ 28480 5086-7066 


A7A5 86603-60010 1 LOW PASS FILTER ASSY, 50 MHz (OPT 002 ONLY) 28480 86603-60010 

A7A5 C1 0160-4303 2 CAPACITOR-FXD .027UF +-10% 50WVDC CER 26654 38X050S273K 

A7A5 C2 0160-4305 2 CAPACITOR-FXD 47PF +-10% 100WVDC CER 28480 0160-4305 

A7A5 C3 0160-4308 1 CAPACITOR-FXD 33PF +-10% 100WVDC CER 26654 2BN100S330K 

A7A5 C4 0160-4247 CAPACITOR-FXD .047 UF +-10% 100WVDC CER 28480 0160-4247 

A7A5 C5 0160-4303 CAPACITOR-FXD .027 UF +-10% 100WVDC CER 26654 38X050S273K 

A7A5 C6 0160-4305 1 CAPACITOR-FXD 47 PF +- 10% 100WVDC CER 28480 0160-4305 

A7A5 CR1 1901-0639 2 DIODE-PIN 110V 28480 1901-0639 

A7A5 CR2 1901-0639 DIODE-PIN 110V 28480 1901-0639 

A7A5 L1 86603-80001 2 INDUCTOR, TOROID 28480 86603-80001 

A7A5 L2 86603-80001 INDUCTOR, TOROID 28480 86603-80001 

A7A5 R1 0698-7222 2 RESISTOR 261 2% .05W F TO-0-+-100 24546 C3-1/8-TO-261R-G 

A7A5 R2 0698-7222 RESISTOR 261 2% .05W F TO 0-+-100 24546 C3-1/8-TO-261R-G 

A7A5 R3 0698-7229 1 RESISTOR 261 2% .05W F TO-0-+-100 28480 C3-1/8-TO-511R-G 

A8 86603-67003 1 4 GHZ AMPLIFIER ASSY (EXCEPT OPTION 002) 28480 86603-67003 

A8 86603-67001 1 4 GHZ AMPLIFIER ASSY (OPTION 002 ONLY) 28480 8660-67001 

A8J1 NSR 

A8J2 NSR 

A9 86602-60040 1 ATTENUATOR DRIVER ASSY 28480 86602-60040 

(EXCEPT OPTION 001) 

A9CR1 1901-0025 8 DIODE-GEN PRP 100V 200NA DO-7 28480 1901-0025 

A9CR2 1901-0025 DIODE-GEN PRP 100V 200NA DO-7 28480 1901-0025 







A9Q1 1853-0213 4 TRANSISTOR PNP 2N4236 SI TO-5 PD=1W 04713 2N4236 

A9Q2 1854-0361 4 TRANSISTOR PNP 2N4239 SI TO-5 PD =800MW 04713 2N4239 

A9Q3 1853-0020 17 TRANSISTOR PNP SI PD=300MW FT=150MHz 28480 1853-0020 

A9Q4 1854-0071 4 TRANSISTOR PNP SI PD=300MW FT=200MHz 28480 1854-0071 

A9Q5 1854-0404 5 TRANSISTOR PNP SI TD=18 PD 360MW 28480 1854-0404 

A9Q6 1853-0020 TRANSISTOR PNP SI PD=300MW FT=150MHz 28480 1853-0020 

A9Q7 1853-0213 TRANSISTOR PNP 2N4236 SI TO=5 PD=1W 04713 2N4236 

A9Q8 1854-0361 TRANSISTOR PNP 2N4239 SI TO=5 PD=800MW 04713 2N4239 


A9Q10 1854-0071 TRANSISTOR PNP SI PD=300MW FT=200MHz 28480 18540071 

A9Q11 1854-0404 TRANSISTOR PNP SI TD=18 PD 360MW 28480 1854-0404 


A9Q13 1854-0213 TRANSISTOR PNP 2N4236 SI TO=5 PD=1W 04713 2N4236 

A9Q14 1850-361 TRANSISTOR PNP 2N4239 SI TO=5 PD=800MW 24713 2N4239 



6-8

Section 6 

Reference 

Designation 

HP Part 

Number 

Qty 



Code 



A9016 1853-0071 TRANSISTOR NPN SI PO-300NM FT-200MHz 28480 1854-0071 

A9017 1853-0404 TRANSISTOR NPN SI TD-18 PD.360NM 28480 185-0404 

A9Q18 1853-0020 TRANSISTOR PNP SI PD-3001i FT.150MH 28480 1853-0020 

A9019 1853-0213 TRANSISTOR PNP 2N4236 SI TO-5 PD-W 04713 2N4236 

A9020 1853-0036 TRANSISTCR NPN 2N4239 SI T-S5 PD-800M 04713 2N4239 

A9021 1853-0020 TRANSISTOR PNP SI PD-300WM FT-101HHZ 28480 1853-0020 

A9022 1854-0071 TRANSISTOR NPN SI PD-300MW FT-200MHZ 28480 1854-0071 

A9023 1054-0404 TRANSISTOR NPN SI TD-18 PO-360NM 28480 185-0404 

A9024 1853-0020 TRANSISTOR PNP SI PD-300NM FT-150HZ 28480 1853-0020 

A9R1 0757-0280 11 RESISTOR 1K LI .125W F TD-0-100 24546 C4-1/8-TO-1001-F 

A9R2 0757-0159 8 RESISTOR 1K IS .5F TD-0+-100 19701 MF7C1/2-TO-IRO-F 

A9R3 0757-0159 RESISTOR 1K It .5W F TD-0+-IO0 19701 F7TCIZ2-TO-IRO-F 

A9R4 0698-3440 4 RESISTOR 196 It .125H F TD-0-100 16299 C4-1/8-TO-1 96R-F 

A9R5t 0683-0335 6 RESISTOR 3.3 51 .25WFC TD--400/+500 01121 C833G5 

A9R6t 0683-0335 RESISTOR 3.3 5S .25N FC TD--400/+500 01121 CB33GS 

A9R7 0757-0401 8 RESISTOR 100 11.125N F TO-0-100 24546 C4-118-TO-101-F 

A9R8 0757-0401 RESISTOR 100 11 .125i F TO-0+-100 24546 C4-18-T-L101-F 

A9R9 DELETED 

A9R10 DELETED 

A9R11 0757-0280 RESISTOR IK 1I .125M F TO-0+-100 24546 C4-1/8-TO-1001-F 

A9R12 0757-0159 RESISTOR IK 11 .5W F TO-0+-100 19701 NF7C1/2-TO-IRO-F 

A9R13 0757-0159 RESISTOR IK 1 .5W F TO-0+-100 19701 NF7CI/2-TO-IRO-F 

A9R14 0698-3440 RESISTOR 196 13 .125N F TO-0+-100 16299 C4-1/8-TO-196R-F 

A9R15 0683-0335 RESISTOR 3.3 51 .25W FC TO--400/+500 01121 CR3365 

A9R16 0683-0335 RESISTOR 3.3 51 .25S FC TO--400/+500 01121 C833G5 

A9R17 0757-0401 RESISTOR 100 I1 .1251 F TO-0- 100 24546 C4-1/8-TO-101-F 

A9R18 0757-0401 RESISTOR 100 11 .125W F TO-0+-100 24546 C4l/8-TO-101-F 

A9R19 DELETED 

A9R20t DELETED 

A9R21 0757-0280 RESISTOR IK I1 .125W F TO-0+-100 24546 C4-18-TO-1001-F 

A9R22 0757-0159 RESISTOR IK 13 .5w F TO-0+-100 19701 HFTC1/2-TO-IRO-F 

A9R23 0757-0159 RESISTOR 1K 1I .SW F TO-0+-100 19701 HF7C2lZ-TO-lRO-F 

A9R24 0698-3440 RESISTOR 196 11 .125W F TO-0-+-100 16299 C4-1/8-TO-196R-F 

A9R25 0683-0335 RESISTOR 3.3 5S .25W FC TC--4,00/+500 31121 C833G5 

A9R26 0683 0335 PRSISTOP 3.3 51 .25L FC TC--4001+500 01121 CR33G5 

A9R27 0757-0401 RESISTOR 100 11 .125M F TC-O,I00 24546 C4-128-TO-101-F 

A9R28 0757-0401 RESISTOR 100 11 .125W F TC-O+-100 24546 C4-1/8-TO-101-F 

A9R29 DELETED 

A9R30 t DELETED 

A9R31 0757-0280 RESISTOR 1K 11 .125L F TO-0100 24546 C4-18-TO-1001-F 

A9R32 0757-0159 RESISTOR 1K IX .SW F TO-0+-100 19701 MFT7C/2-TO-IPO-F 

A9R33 0757-0159 RESISTOR IK 1t .5S F TC-O+-100 19701 F7C1IZ-TO-IRO-F 

A9R34 0698-3440 RESISTOR 196 11 .125W F TC-O’100 16299 C4-18-TO-196R-F 

A9R35 0811-2815 2 RESISTOR 1.’ 5S .75L PW TC-O, 50 91637 PSI12-T2-RS5-J 

A9R36 0811-2815 RESISTOR 1.5 51 .75M PW TC-O+-50 91637 PS1/2-T2—IR5-J 

A9R37 0757-0401 RESISTOR 100 11 .125L F TC-O+-100 24546 C4-1/8-TO-101-F 

A9R38 0757-0401 RESISTOR 100 I3 .125W F TC.O+ 100 24546 C4-18-TO-101-F 

A9R39t DELETED 

A9R40 t DELETED 

A9VR1 1902-3002 4 DIODE-ZNR 2.37V 53 DO 7 PO-.4W TC--.0742 04713 SI 10939-2 

A9VRZ 1902-3002 DIODE-ZNR 2.37V 51 DO-7 PDO.4W TC--.074S 04713 SZ 10939-2 

A9VR3 1902-3002 DIODE-ZNR 2.371 5S D0-T PCD-.4 TC--.0742 04713 SZ 10939-2 

A9VR4 1902-3002 DIODE-ZNR 2.37V 5S 00-7 PD-.4W TC--.074S 04713 SZ 10939-2 

A9 P MISCELLANEOUS 

1480-0073 7 PIN:ORIVF 0.250' LG 00000 080 

4040-0752 2 EXTRACTOR-PC BD YEL POLYC .062-BD-THNKS 

A10 86602-60006 1 REFERENCE ASSY 28480 86602-60006 

A1C1 NOT ASSIGNED 

A10C2 01800291 2 CAPACITOR FXO IUF+10 35VDC TA 56289 1500105X9035A2 

A10K1 0490-0916 6 RELAY-REED IA .5A 50V CONT 5V-COIL 28480 0490-0916 

A10K2 0490-0916 RELAY-REED IA .5A SOV CONT 5Y-COIL 28480 0490-0916 

A10K3 0490-0916 RELAY-REED IA .5A 50V CONT 5V-COIL 28480 0490-0916 

A10K4 0490 0916 RELAY-REEO IA 5A 50V CONT 5V-COIL 28480 0490-0916 

A10K5 0490-0916 RELAY-REED IA .5A 50V CONT 5V-COIL 28480 0490-C916 

A10K6 0490-0916 RELAY-REED IA .5A 50V CONT 5V-COIL 28480 0490-0916 

A10Q1 1853-0020 TRANSISTOR PNP SI PO-300HM FT-150NHZ 28480 1853-0020 

AIC02 1853-0020 TRANSISTCR PNP SI PO-300NW FT-150NHZ 28480 1853-0020 

Ai003 1853-0020 TRANSISTOR PNP SI PO-3001M FT.150MHZ 28480 1853-0020 

AO14 1853-0020 TRANSISTOR PNP SI PD-300MW FT-150NHZ 28480 1853-0020 

A1005 1853-0020 TRANSISTOR PRP SI PO-300MN FT-150HHZ 28480 1853-0020 


FOR BACKDATING, SEE TABLE 7-1. 

6-9

Section 6 

Reference 

Designation 

HP Part 

Number 



Code 



A10Q6 1853-0020 TRANSISTOR PFNP SPO-30OMW FT.ISOMHZ 28480 1853-0020 

A10Q7 1853-OC20 TRANSISTOR PNP SI PDO300MW FTS150HHn 28480 1853-0020 

A10Q8 1853-0020 TRANSISTOR PNP SI PD-30OMW FTI1SOMHZ 2840 1853-0020 

A10Q9 1853-0020 TRANSISTOR PNP SI PD-30o0N FT-150MHZ 28480 1853-OC2J 

A10Q10 1854-0404 TRANSISTOR NPN SI TO-I8 PD-360MW 28480 1854-004 

A10Q11 1855-0082 1 TRANSISTOR MOSFET P-CHAN O-MODE SI 28480 1855-0082 

A10R1 0757-0279 1 RESISTOR 3.16K 1 .125W F TC-O-100 24546 C4-1/8-T-3161-F 

A10R2 2100-2517 1 RESISTOR-TRMR 50K 10t C SIDE-AOJ I-TURN 30993 ET5X50O3 

A10R3 0757-0280 RESISTOR IK It .125w F TC-O=100 24546 C4-1/8-TO-1001-F 

A10R4 0757-0817 1 RESI STOR 750 1I .5W F TC-O+-100 19701 MFTClZ2-TO-751-F 

A10R5 2100-2633 3 RESISTOR-TRMR IK 10X C SIDE-ADJ I-TURN 30983 ETSOX1O2 

A10R6 0757-0443 1 RESISTOR IIK 1I .125w F TC-O+-1OO 24546 C4-1/8-TO-lOZ-F 

A10R7 2100-2633 RESISTOR-TRMR 1K 10% C SIDE-AD0J 1-TURN 30983 ETSOX102 

A10R8 0757-0416 2 RESISTOR 511 1I .125W F TC-O0100 24546 C4-1/8-TO-511R-F 

A10R9 0757-0280 RESISTOR LI 1X .125w F TC-O+-100 24546 C4-1/8-TO-1001-F 

A10R10 0698-3260 2 RESISTOR 464K IS .125W F TC-O-100 0388 PME55SSS 

A10R11 0698-3260 RESISTOR 464K I1 .125 F TC=-.100 03888 PFME5S 

A10R12 0698-3453 1 RESISTOR 196K 1t .125w F TC-O-100 16299 CI1/8-TO-1963-F 

A10R13 0757-0439 1 RESISTOR 6.81K 11 .125W F TC-O= -100 24546 C4-1/8-TO-6811-F 

A10R14 0683-1065 1 RESISTOR 10ON 5 .25w FC TC--900/+1100 01121 C81065 

A10R15 0757-0280 RESISTOR IK 1I .125w F TC-O+-100 24546 C4-1/8-TO-1001-F 

A10R16 0690-3450 1 RESISTOR 42.2K 11 .IZS F TC-O-100 16299 C4-1/8-TO-4222-F 

A10R10 0757-0280 RESISTOR IK I1 .125w F TC-O+-100 24546 C4-1/8-TO-1001-F 

A10R18 0698-0083 10 RESISTOR 1.96K 1IS .125 F TC-100 16299 C4-1I8-TO-1961-F 

A10R19 0698-0083 RESISTOR 1.96K 11 .125W F TC=-100 16299 C4-118-TI-1961-F 

A10R20 0698-0083 RESISTOR 1.96K 1 .125w F TC-O-100 16299 C4-1/8-TO-1961-F 

A10R21 069-4406 2 RESISTOR 115 1I .125w F TC-0O*100 16299 C4I1/8-TO-L15R-F 

A10R22 0698-4482 1 RESISTOR 17.4K 11 .125 F TC-O+-100 03888 PME55-1/8-T0-1742-F 

A10R23 0698-4406 RESISTOR 115 1I .125w F TC-O+-100 16299 CI-/8-TO-115P- F 

A10R24 0698-0083 RESISTOR 1.96K 11 .125w F TC-Oe100 16299 C4-1/8-TO-1961-F 

A10R25 0698-0083 RESISTOR 1.96K 1I .125w F TC-O+-100 16299 C4-I18-TO-1961-F 

A10R26 0698-3486 2 RESISTOR 232 1% .125w F TO-O+-100 16299 C4-1/8-TO-232R-F 

A10R27 0698-3498 1 RESISTOR 8.66K 1% .125w F TO-O-100 16299 C4-1/8-TO-866R-F 

A10R28 0698-3486 RESISTOR 232 1% .125W F TO-O+-l00 16299 C4-1/8-TO-232R-F 

A10R29 0690-0083 RESISTOR 1.96% 1% .125W F TO-O-100 16299 C4-1/8-TO-1961-F 

A10R30 0698-0083 RESISTOR 1.96K 1% .125w F TO-O 100 16299 C4-1/8-TO-1961-F 

A10R31 0698-3510 2 RESISTOR 453 1% .125w F TO-O+-100 16299 C4-1/8-TO-453R-F 

A10R32 0698-3154 1 RESISTOR 4.22K 1% .125W F TO-O+I00 16299 C4-1/8-TO-4221-F 

A10R33 0698-3510 RESISTOR 453 1% .125w F TO+-0100 16299 C4-1/8-TO-453R-F 

A10R34 0698-0083 RESISTOR 1.96K 1% .125w F TO-0100 16299 C4-1/8-TO-1961-F 

A10R3S 0691-0083 RESISTOR 1.96K 1% .125I F TO-O I100 16299 C4-1/8-TO-1961-F 

A10R36 0698-3495 2 RESISTOR 866 1% .125W F TO-O-100I 16299 C4-1/8-TO-866R-F 

A10R37 0698-4430 1 RESISTOR 1.91K 1% .125w F TO-O100 16299 C4-1/8-TO-1911-F 

A10R38 0698-3495 RESISTOR 866 I% .Z15N F TO-O- 100 16299 C4-1/8-TO-866R-F 

A10R39 0757-0280 RESISTOR 1K 1% .125w F TO*-100 24546 C4-1/8-TO-1001-F 

A10R40 0757-0442 3 RESISTOR 10K 1% .125W F TO-O-100 24546 C4-1/8-TO-1002-F 

A10R41 0757-0442 RESISTOR 10K 1 % .125W F TO-O- 100 24546 C4-1/8-TO-1002-F 

A10U1 1826-0081 1 IC LM 318 OP ANP 27014 LM318H 

A10VR1 1902-0041 DIODE-ZNR 5.11V 53 DO-7 PDI-.4TC--.009 04T13 SZ 10939-98 


4040-0753 2 EXTRACTOR-PC 80 GRN POLYC .062-8D-THKNS 28480 4040-0753 

1480-0073 PIN:DRIVE 0.250- LG 00000 080 

4040-0753 EXTRACTOR-PC 80 GRN POLYC .062-6D-THKNS 28480 4040-0753 

1480-0073 PIN:ORIVE 0.250" LG 0000G 080 

A11 86603-60029 1 LOGIC ASSY 28480 86603-60029 

A11C1 0180-2206 1 CAPACITOR-FXO 60UFILOl 6VOC TA 56289 1500606X900682 

A11L1 9140-0105 1 COIL-FXO MOLOED RF CHCKE 8.2UH 10 24226 15/821 

A11U1 1820-0508 1 IC N8202N RGTR 18324 N8202N 

A11U2 1820-0077 1 IC SN74 74 N FLIP-FLOP 01295 SN74744 

A11U3 1820-0069 1 IC SN74 20 N GATE 01295 SN742ON 

A11U4 1820-0305 2 IC:TTL 4-81T BINARY FULL ADDER 01295 SN7483N 

A11U5 1820-0054 4 IC SNT4 00 N GATE 01295 SN7400N 

A11U6 1820-0054 IC SNT4 00 N GATE 01295 SNT400N 

A11U7 1820-0305 IC:TTL 4-BIT BINARY FULL ADDER 01295 SN7483N 

A11U8 1820-0114 2 IC SN74 04 N INV 01295 SN7404N 

A1LI9 1820-0054 IC SN74 00 N GATE 01295 SN740ON 

A11U10 1820-0054 IC SN74 00 N GATE 01295 SN7400N 


6-10


Section 6 

Reference HP Part Qty 


Description Mfr Mfr Part Number 

Designation Number Code 

4040-0754 1 

A11 MISCELLANEOUS 

EXTRACTOR, PC BD BLU POLYC .062-D-THKNS 28480 4040-0754 

1480-0073 1 PIN: DRIVE 0.250” LG 00000 0BD 

86603-00007 1 INSULATOR 28480 9200-6-B-091 

A12 86602-60038 1 LOGIC MOTHER BOARD ASSY 28480 86602-60038 

A12C1 0160-2055 2 CAPACITOR-FXD .01UF +80-20% 100WVDC CER 28480 0160-2055 

A12C2 0160-2055 CAPACITOR-FXD .01UF +80-20% 100WVDC CER 28480 0160-2055 

A12L1 9140-0144 2 COIL-FXD MOLDED RF CHOKE 4.7UH 10% 24226 10/471 

A12L2 9140-0144 COIL-FXD MOLDED RF CHOKE 4.7UH 10% 24226 10/471 

A12XA9 1251-11626 1 CONNECTOR-PC EDGE 12-CONT/ROW 2-ROWS 71785 252-12-30-300 

A12XA10 1251-2034 1 CONNECTOR-PC EDGE 10-CONT/ROW 2-ROWS 71785 252-10-30-300 

A12XA11 1251-1388 1 CONNECTOR-PC EDGE 15 CONT/ROW 2-ROWS 71785 252-15-30-008 

A13 86603-60043 1 ATTENUATOR ASSY(EXCEPT OPTION 001) 28480 86603-60043 

A13 86601-60109 RESTORED 86603-60043, REQUIRES EXCHANGE 28480 86601-60109 

A13J1 NSR 

A13J2 NSR 

A14 86602-60041 1 WIRING HARNESS, MAIN(EXCEPT OPT’S 001-002 

(INCLUDES P5, P7, P8, P13 & P14 

28480 86602-60041 

WIRING HARNESS, MAIN (OPTION 001 ONLY) 

28480 86602-60042 

A14 86602-60045 WIRING HARNESS,MAIN (OPTION 002 ONLY) 

28480 86602-60045 

(INCLUDES P5, P7, P8, P13 & P14 

A15 86602-60035 1 20 MHz AMPLIFIER ASSY 28480 86602-60035 

A15C1 0160-2437 7 CAPACITOR-FXD 5000PF +80-20% 200WVDC CER 

NSR 

28480 0160-2437 

A15J1 1250-1194 3 CONNECTOR-RF SM-SLD M SGL-HOLE-FR 50-OHM 

NSR 

28480 1250-1194 

A15J2 1250-1194 CONNECTOR-RF SM-SLD M SGL-HOLE-FR 50-OHM 

NSR 

28480 1250-1194 

A16 86603-60041 1 BOARD ASSEMBLY, PHASE MODULATOR DRIVER 

28480 86603-60041 

(OPTION 002) 

A16C1 0180-0228 1 CAPACITOR-FXD 22UF +-10% 15 VDC TA 56289 150D226X9015B2 

A16C2 0160-0575 5 CAPACITOR-FXD .047UF +-20% 50WVDC CER 28480 0160-0575 

A16C3 0160-0127 1 CAPACITOR-FXD 1UF +-20% 25WVDC CER 28480 0160-0127 

A16C4 0160-0575 CAPACITOR-FXD .047UF +-20% 50WVDC CER 28480 0160-0575 


A16C6 0180-0374 1 CAPACITOR-FXD 10UF +-10% 20VDC TA 56289 150D106X9020B2 

A16C7 0121-0494 1 CAPACITOR-V TRMR-CER 2/6.5PF 250V PC-MTG 0086s 7-S TRIKO-13 

A16C8 0160-4084 CAPACITOR-FXD 0.1 UF +-20% 50WVDC CER 28480 0160-0575 


A16CR1 1901-0179 2 DIODE-SWITCHING 15V 50NA 750PS DO-7 28480 1901-0179 

A16CR2 1901-0179 DIODE-SWITCHING 15V 50NA 750PS DO-7 28480 1901-0179 




A16CR6 1901-0539 1 DIODE-SCHOTTKY 28480 1901-0539 




A16E1 0410-0184 1 OVEN:COMPONENT 01295 5ST1-2 

A16J1 1250-1377 2 CONNECTOR-RF SMB FEM PC 2K497 700214 

A16J2 1250-1377 CONNECTOR-RF SMB FEM PC 2K497 700214 

A16L1 9140-0158 1 COIL-FXD MOLDED RF CHOKE 1UH 10% 24226 10/101 

A16Q1 1853-0075 2 TRANSISTOR-DUAL PNP PD=400MW 28480 1853-0075 

A16Q2 1854-0295 1 TRANSISTOR-DUAL NPN PD=400MW 28480 1854-0295 

A16Q3 1853-0075 TRANSISTOR-DUAL PNP PD+400MW 28480 1853-0075 

A16Q4 1855-0327 1 TRANSISTOR J-FET 2N4416 N-CHAN D-MODE 01295 2N4416 

A16Q5 1854-0457 1 TRANSISTOR-DUAL NPN PD+400MW 28480 1854-0457 

A16Q6 1853-0352 1 TRANSISTOR PNP SI TO-92 PD+350MW FT=1GHZ 28480 1853-0352 

A16Q7 1854-0013 1 TRANSISTOR NPN 2N2218A SI TO-5 PD=880MW 04713 2N2218A 

A16Q8 1853-0012 1 TRANSISTOR PNP 2N2904A SI TO-5 PD=600MW 01295 2N2904A 

0340-0850 2 INSULATOR-XSTR NYLON WHITE 28480 0340-0850 

A16Q9 1853-0451 1 TRANSISTOR PNP SI TO-18 PD=360MW 28480 1853- 

A16Q10 1854-0023 1 TRANSISTOR NPN SI TO-18 PD=360MW 28480 1854-0023 

A16R1 2100-3095 2 RESISTOR -TRMR 200 10% C SIDE ADJ-17-TURN 32997 3006P-I-201 

A16R2 2100-3095 RESISTOR-TRMR 200 10% C SIDE ADJ 17-TURN 32997 3006P-I-201 

A16R3 0698-7236 7 RESISTOR 1K 2% .05W F TO=0+-100 24546 C3-1/8-TO-1001-G 

A16R4 0698-7241 1 RESISTOR 1.62K 2% F TO-+-100 16299 C3-1/8-TO-1621-G 

A16R5 0698-7236 RESISTOR 1K 2% .05W F TO-0-+10C 24546 C3-1/8-TO-1001-G 


FOR BACKDATING, SEE TABLE 7-1. 


Section 6 

Reference 

Designation 

HP Part 

Number 



Code 



A16R6 0698-7234 1 RESISTOR 825 2% .05W F TO=0+-100 24546 C3-1/8-TO-825R-G 

A16R7 0698-7236 RESISTOR 1K 2% .05W F TO=0+-100 24546 C3-1/8-TO-1001-G 

A16R8 0698-7226 1 RESISTOR 383 2% .05W F TO =0+-100 24546 C3-1/8-TO-383R-G 



A16R11 0698-7260 4 RESISTOR 10K 2% .05W F TO=0+-100 24546 C3-1/8-TO-1002-G 




A16R15 0698-0083 3 RESISTOR 1.96K 1% .125 F TO=0+-100 24546 C3-1/8-TO-1961-F 

A16R16 0698-7280 2 RESISTOR 31.6 2% .05W F TO=0+-100 24546 C3-1/8-TO-31R6-G 



A16R19 0698-7200 RESISTOR 31.6 2% .05W F TO=0+-100 24546 C3-1/8-TO-31R6-G 

A16R20 0698-7221 RESISTOR 237 2% .05W F TO=0+-100 24546 C3-1/8-TO-237R-G 





A16R25 0698-0083 RESISTOR 1.96K 1% .05W F TO=0+-100 24546 C3-1/8-TO-1961-F 

A16R26 0698-7213 3 RESISTOR 110 2% .05W F TO=0+-100 24546 C3-1/8-TO-110R-G 

A16R27 2100-2633 1 RESISTOR TRMR 1K 10% .C SIDE-ACJ 17-TURN 30983 ET050X102 

A16R28 0698-0083 RESISTOR 1.96K 1% .05W F TO=0+-100 16299 C3-1/8-TO-1961-F 

A16R29 0698-7213 RESISTOR 110 2% .05W F TO=0+-100 24546 C3-1/8-TO-110R-G 



A16R32 0698-7248 2 RESISTOR 3.16K 2%.05W F TO=0+-100 24546 C3-1/8-TO-3161-G 


A16R34 0698-7243 1 RESISTOR 1.96K.05W F TO=0+-100 24546 C3-1/8-TO-1961-G 

A16R35 0757-0418 1 RESISTOR 619 1% .125W F TO=0+-100 24546 C3-1/8-TO-619R-F 

A16R36 2100-3123 1 RESISTOR TRMR 1K 10% .C SIDE-ACJ 17-TURN 24546 3006P-1-501 

A16R37 0757-0421 1 RESISTOR 825 1% .125W F TO=0+-100 24546 C3-1/8-TO-825R-F 

A16R38 0698-7213 RESISTOR 110 2% .05W F TO=0+-100 24546 C3-1/8-TO-110R-G 

A16R39 0698-7233 1 RESISTOR 750K 2% .05W F TO=0+-100 24546 C3-1/8-TO-750R-G 

A16R40 0698-7202 2 RESISTOR 38.3 2% .05W F TO=0+-100 24546 C3-1/8-TO-383R-G 

A16R41 0698-7202 RESISTOR 38.3 2% .05W F TO=0+-100 24546 C3-1/8-TO-383R-G 

A16R42 0757-0280 1 RESISTOR 1K 1% .05W F TO=0+-100 24546 C3-1/8-TO-1001-G 



A16R45 0698-0085 1 RESISTOR 2.61K 1% .05W F TO=0+-100 24546 C3-1/8-TO-2611-F 





A16R50 0698-7248 RESISTOR 3.16K 2% .05W F TO=0+-100 24546 C3-1/8-TO-3161-G 


A16RT1 0839-0004 1 THERMISTOR NEG TO 2K BEAD 83196 32A3 

A16TP1 0360-0124 2 TERMINAL-STUD SGL-PIN PRESS-MTG 28480 0360-0124 

A16TP2 0360-0124 2 TERMIANL-STUD SGL-PIN PRESS-MTG 28480 0360-0124 

A16U1 1858-0032 1 IC CA3146E XSTR ARRAY 02735 CA3146E 

A16VR1 1902-0554 1 DIODE-ZNR 10V 5% DO-15 PD-1W TO-+.06% 28480 1902-0554 

A16VR2 1902-0579 1 DIODE-ZNR 5.11V 5% DO-15 PD-1W TO--.009 28480 1902-0579 


4040-0748 1 EXTRACTOR -PC BD REG POLYC .062-BD-THNKS 28480 4040-0748 

1480-0073 2 PIN DRIVE 0.250M LG 00000 OBD 

4040-0750 1 EXTRACTOR-PC BD REG POLYC .062-BD-THNKS 28480 4040-0750 

1480-0073 1 PIN DRIVE 0.250M LG 00000 OBD 

A17 86603-60042 1 PHASE MODULATOR ASSEMBLY 28480 86603-60042 

A17C1 0160-4304 4 CAPACITOR-FXD 10PF +-10% 100WVDC CER 28480 0160-4304 

A17C2 0160-4304 CAPACITOR-FXD 10PF +-10% 100WVDC CER 28480 0160-4304 



A17CR1 0122-0074 2 DIODE-WC.7PF 10% CO/C25-MIN-4 BVR-40V 96341 MA45644 

A17CR2 0122-0074 DIODE-WC.7PF 10% CO/C25-MIN-4 BVR-40V 96341 MA45644 

A17J1 1250-1194 1 CONNECTOR-RF SM-SLD M SGL-HOLE-FR 50OHM 28480 1250-1194 

A17P1 1250-0563 2 CONNECTOR-RF SMA M 4 HOLE FLG FR 28480 1250-0563 

A17P2 1250-0563 CONNECTOR-RF SMA M 4 HOLE FKLG FR 28480 1250-0563 


86603-00004 1 COVER, PHASE MODULATOR HOUSING 28480 86603-00004 

86603-20011 1 HOUSING. PHASE MODULATOR 28480 86603-20011 


6-12

Section 6 

Reference 

Designation 

HP Part 

Number 

Qty 



Code 



86602-00006 1 Support, Bottom 28480 86602-00006 

86602-00007 1 Panel, Front (OPTION 001 ONLY) 28480 86602-00007 

86602-20019 2 Plate, Front Support 28480 86602-00019 

86603-20028 Plate, Rear Support 28480 86603-20028 

86602-20028 2 Guide, Connector 28480 86602-20028 

86603-00001 1 Support, Right Front 28480 

86603-00002 1 Support, Right Rear 28480 86603-0001 

86603-00003 1 Support, Mixer 28480 86603-00002 

86603-00008 1 Support, Left 28480 86603-00008 

86602-20041 1 Window (EXCEPT OPTION 002) 28480 86602-20041 

86602-20042 1 Window (OPTION 002 ON LY) 28480 86602-20042 

Table 6-3. Code List of Manufacturers 

Mfr Manufacturer Name Address Zip Code 

Code 

00000 U.S.A. COMMON ANY SUPPLIER OF THE U.S.A. 

007119 AMP INC HARRISBURG PA 17105 

0086S STETTNER-TRUSH INC CAZENOVIA NY 13035 

01121 ALLEN-BRAULEY Co MILWAUKEE WI 53212 

01295 TEXAS INSTR INC SENICONO CMPNT DIV DALLAS TX 75231 

02735 RCA CORP SOLID STATE DIV SOMMERVILLE NJ 08876 

03888 PYROFILM CORP WHIPPANY NJ 07981 

04713 NOTOROLA SEHICONDUCTOR PRODUCTS PHOENIX AZ 8(008 

06540 ANATOH ELEK HARDWARE DIV OF MITE NEW ROCHELLE NY 10"L2 

16299 CORNING GL wK ELEC CMPNT DIV RALEIGH NC 27604 

18324 SIGNETICS CORP SUNNYVALE CA 94086 

19701 MEPCO/ELECTRA CORP MINERAL WELLS TX 7606? 

2K497 CABLEWAVE SYSTEMS INC NORTH HAVEN CT 06473 

24226 IGOANDA ELECTRONICS CORP GOMANDA NY 14070 

24546 CORNING GLASS WORKS (BRADFORD) BRADFORO PA 16701 

24931 SPECIALTY CONNECTOR CO INC INDIANAPOLIS IN 46227 

26654 VARADYNE INC SANTA MONICA CA 90403 

27014 NATIONAL SEMICONDUCTOR CORP SANTA CLARA CA 95051 

28480 HEWLETT-PACKARD CO CORPORATE NH PALO ALTO CA 94304 

30983 NEPCO/ELECTRA CORP SAN DIEGO CA 92121 

32171 MOOUTEC INC NORWALK CT 06854 

32997 BOURNS INC TRIMPOT PROD DIV RIVERSIDE CA 92507 

56289 SPRAGUE ELECTRIC CO NORTH ADAMS KA 01247 

71002 BIRNBACK CO INC FREEPORT LI NY 11520 

71785 TRW ELEK COMPONENTS CINCH DIV ELK GROVE VILLAGE IL 60007 

73734 FEDERAL SCRE PROOUCTS CO CHICAGO IL 60618 

78189 ILLINOIS TOOL WORKS INC SHAKEPROOF ELGIN IL 60126 

79727 C-W INDUSTRIES WARMINSTER PA 18974 

81312 WINCHESTER ELEK DIV LITTON INO INC DAKVILLE CT 06779 

90949 AMPHENOL SALES DIV OF BUNKER-RAHO HAZELWOOD NO 63042 

91637 DALE ELECTRONICS INC COLUMBUS NE 68601 

95238 CONTINENTAL CONNECTOR CORP WOODSIDE NY 11377 

96341 MICROWAVE ASSOCIATES INC BURLINGTON IA 01801 

98291 SEALECTRO CORP MAMARONECK NY 10544 

6-15

Table 6-4. 

PART NUMBER - NATIONAL STOCK NUMBER 

CROSS REFERENCE INDEX 


NATIONAL NATIONAL 

PART STOCK PART STOCK 

NUMBER FSCM NUMBER NUMBER FSCM NUMBER 

CB33G5 01121 5905-00-485-2918 0698-0084 28480 5905-00-974-6073 

ET50X502 19701 5905-01-013-2344 0698-0085 28480 5905-00-998-1814 

GF126-0018 79727 5930-00-412-0939 0698-3154 28480 5905-00-891-4215 

SN7400N 01295 5962-00-922-3138 0698-3155 28480 5905-00-976-3418 

SN7404N 01295 5962-00-404-2559 0698-3157 28480 5905-00-433-6904 

SN7420N 01295 5962-00-927-1567 0698-3159 28480 5905-00-407-0053 

SN7432N 01295 5962-00-276-9929 0698-3260 28480 5905-00-998-1809 

SN7474N 01295 5962-00-106-4287 0698-3403 28480 5905-00-469-2957 

SN7483N 01295 5962-00-011-2762 0698-3405 28480 5905-00-405-3723 

0140-0193 28480 5910-00-774-7319 0698-3430 28480 5905-00-420-7136 

0160-0127 28480 5910-00-809-5484 0698-3440 28480 5905-00-828-0377 

0160-2055 28480 5910-00-211-1611 0698-3442 28480 5905-00-489-6773 

0160-2199 28480 5910-00-244-7164 0698-3447 28480 5905-00-828-0404 

0160-2204 28480 5910-00-463-5949 0698-3450 28480 5905-00-826-3262 

0160-2207 28480 5910-00-430-5675 0698-3453 28480 5905-00-078-1548 

0160-2244 28480 5910-00-008-4451 0698-3455 28480 5905-00-407-0060 

0160-2436 28480 5910-00-472-5005 0698-3486 28480 5905-00-998-1919 

0160-2437 28480 5910-00-431-3956 0698-3495 28480 5905-01-042-5033 

0160-3457 28480 5910-00-832-9122 0698-3498 28480 5905-00-478-2244 

0160-3874 28480 5910-01-057-8163 0698-3510 28480 5905-00-407-0107 

0160-3879 28480 5910-00-477-8011 0698-4002 28480 5905-00-009-4322 

0160-4084 28480 5910-01-057-8158 0698-4482 28480 5905-00-407-0116 

0180-0058 28480 5910-00-027-7069 0698-7188 28480 5905-00-138-7304 

0180-0116 28480 5910-00-809-4701 0698-7195 28480 5905-00-161-8921 

0180-0228 28480 5910-00-719-9907 0698-7200 28480 5905-00-161-8936 

0180-0291 28480 5910-00-931-7055 0698-7212 28480 5905-00-138-7305 

0180-0374 28480 5910-00-931-7050 0698-7216 28480 5905-00-138-7307 

0180-1743 28480 5910-00-430-6017 0698-7229 28480 5905-01-009-7560 

0180-2206 28480 5910-00-879-7313 0698-7233 28480 5905-00-160-5437 

0360-0124 28480 5940-00-993-9338 0757-0159 28480 5905-00-830-6677 

0698-0082 28480 5905-00-974-6075 0757-0198 28480 5905-00-830-6188 

0698-0083 28480 5905-00-407-0052 0757-0276 28480 5905-00-479-4628 

6-16

TABLE 6-4 (continued) 

PART NUMBER—NATIONAL STOCK NUMBER 

CROSS-REFERENCE INDEX 





0757-0279 28480 5905-00-221-8310 1251-2034 28480 5935-00-267-2973 

0757-0280 28480 5905-00-853-8190 1251-2262 28480 5935-01-026-0952 

0757-0346 28480 5905-00-998-1906 1251-2293 28480 5999-00-477-1360 

0757-0394 28480 5905-00-412-4036 1251-3087 28480 5999-01-029-9983 

0757-0399 28480 5905-00-929-7774 150D104X9035A2 56289 5910-00-189-3178 

0757-0401 28480 5905-00-981-7529 150D105X9035A2 56289 5910-00-421-8346 

0757-0416 28480 5905-00-998-1795 150D106X9020B2 56289 5910-00-936-1522 

0757-0418 28480 5905-00-412-4037 150D226X9015B2 56289 5910-00-807-7253 

0757-0420 28480 5905-00-493-5404 150D685X9035B2 56289 5910-00-104-0145 

0757-0438 28480 5905-00-929-2529 1820-0054 28480 5962-00-138-5248 

0757-0439 28480 5905-00-990-0303 1820-0077 28480 5962-00-138-5250 

0757-0441 28480 5905-00-858-6799 1820-0174 28480 5962-00-404-2559 

0757-0442 28480 5905-00-998-1792 1820-0305 28480 5962-00-011-2762 

0757-0443 28480 5905-00-891-4252 1826-0013 28480 5962-00-247-9568 

0757-0465 28480 5905-00-904-4412 1826-0081 28480 5962-01-021-5220 

0757-0482 28480 5905-00-857-0060 1853-0018 28480 5961-00-989-2747 

0757-0817 28480 5905-00-909-1778 1853-0020 28480 5961-00-904-2540 

0757-1060 28480 5905-00-405-8094 1853-0034 28480 5961-00-987-4700 

0757-1094 28480 5905-00-917-0580 1853-0050 28480 5961-00-138-7314 

0764-0013 28480 5905-00-931-6977 1853-0075 28480 5961-00-758-5355 

0839-0004 28480 5905-00-539-2095 1853-0213 28480 5961-00-937-1409 

08555-20093 28480 5999-00-008-8444 1853-0352 28480 5961-01-051-4015 

08731-210 28480 5310-00-401-6934 1854-0023 28480 5961-00-998-1923 

0960-0084 28480 5985-00-787-2899 1854-0071 28480 5961-00-137-4608 

10/471 24226 5950-00-961-9600 1854-0221 28480 5961-00-836-1887 

1120-0543 28480 6625-01-057-4031 1854-0247 28480 5961-00-464-4049 

1200-0173 28480 5999-00-008-7037 1854-0295 28480 5961-00-493-0789 

1250-0872 28480 5935-00-147-4284 1854-0345 28480 5961-00-401-0507 

1250-0914 28480 5935-00-434-3040 1854-0361 28480 5961-00-400-5973 

1250-1194 28480 5935-00-446-4102 1854-0404 28480 5961-00-408-9807 

1250-1221 28480 5935-00-594-0720 1854-0457 28480 5961-01-055-4186 

1250-1227 28480 5935-00-009-1329 1855-0020 28480 5961-00-105-8867 

6-17

TABLE 6-4 (continued) 

PART NUMBER --NATIONAL STOCK NUMBER 

CROSS REFERENCE INDEX 

TM 11-6625-2837-14 & P-7’ 




1855-0081 28480 5961-00-350-8299 3006P-1-102 32997 5905-00-107-4881 

1855-0082 28480 5961-00-442-9470 3006P-1-201 32997 5905-00-101-2350 

1855-0327 28480 5961-00-107-2678 3006P-1-501 32997 5905-00-428-5335 

1901-0025 28480 5961-00-978-7468 3100-3050 28480 5930-01-064-1150 

1901-0033 28480 5961-00-821-0710 3101-0973 28480 5930-00-455-0120 

1901-0047 28480 5961-00-929-7778 4040-0748 28480 5999-00-230-8834 

1901-0050 28480 5961-00-914-7496 4040-0749 28480 6625-00-031-4796 

1901-0179 28480 5961-00-853-7934 4040-0750 28480 5999-00-415-1213 

1901-0539 28480 5961-00-577-0558 4040-0751 28480 5999-00-230-8835 

1901-0639 28480 5961-00-787-3394 4040-0752 28480 5999-00-230-8832 

1902-0041 28480 5961-00-858-7372 4040-0753 28480 5999-00-230-8836 

1902-0554 28480 5961-00-918-7501 4040-0754 28480 5999-00-230-8837 

1902-0579 28480 5961-00-452-0438 5040-0306 28480 5970-00-470-7622 

1902-3002 28480 5961-00-252-1307 5080-0271 28480 5961-00-513-2726 

1902-3036 28480 5961-00-350-2205 5086-7049 28480 5840-01-039-2123 

1902-3139 28480 5961-00-494-4848 51-051-0000 98291 5935-00-539-1940 

2-331677-9 00779 5935-01-017-6539 52-328-0019 98291 5935-00-506-7332 

2N2218 04713 5961-00-985-2363 60373-2 00779 5999-00-173-3441 

2N2218A 04713 5961-00-922-2944 86601-60109 28480 5895-01-037-5355 

2N4236 04713 5961-00-937-1409 86602-20022 28480 5935-01-057-3785 

2N4239 04713 5961-00-400-5973 86602-20044 28480 6625-01-063-5591 



2100-2489 28480 5905-00-105-1774 86603-67003 28480 6625-01-028-9762 

2100-2517 28480 5905-00-161-9090 9100-1629 28480 5950-00-430-6864 

2100-2633 28480 5905-00-476-5796 9100-1640 28480 5950-00-765-2814 

2100-3095 28480 5905-01-052-9092 9100-2247 28480 5950-00-405-3735 

2100-3113 28480 5905-00-470-3420 9135-0009 28480 5915-01-039-0268 

2100-3154 28480 5905-00-615-8111 9140-0105 28480 5950-01-009-9864 

251-10-30-400 71785 5935-01-026-0952 9140-0144 28480 5950-00-837-6029 

252-12-30-300 71785 5935-00-448-2236 9140-0158 28480 5950-00-059-5920 

252-15-30-008 71785 5935-00-138-5209 9140-0210 28480 5950-00-431-3215 

30D506G025CC2 56289 5910-00-247-2075 9140-0237 28480 5950-00-431-3216 

6-18

Section 7 


7-2. This section contains manual change instructions 

for backdating this manual for HP M 86602B RF 

Sections that have serial number fixes that are lower 

than 1638A. This section contains modification 

suggestions and proceed that are recommended to 

improve the perform, and reliability of your instrument. 

7-3. MANUAL CHANGES 

7-4. To adapt this manual to your instrument, 

refer to Table 7-1 and make all of the ma 

SECTION VII 

MANUAL CHANGES 

Table 7-1. Manual Changes by Serial Number 

TM 11-6625-2837-14 &P 

changes listed opposite your instrument’s serial prefix. 

The manual changes are listed in serial prefix 

sequence and should be made in the sequence listed. 

For example, Change A should be made after Change B; 

Change B should be made after Change C; etc. Table 7- 

2 is a summary of changes by component. 

7-5. If your instrument’s serial prefix is not listed on 

the title page of this manual or in Table 7-1, it may be 

documented in a MANUAL CHANGES supplement. For 

additional important information about serial number 

coverage, refer to INSTRUMENTS COVERED BY 

MANUAL in Section I. 

Serial Prefix Make Manual Changes 

1433A, 1518A E, D, C, B, A 

1519A E, D, C, B 

1524A E, D, C 

1543A E, D 

1551A E 

Table 7-2. Summary of Changes by Component 

Change A9 A11 A13 A16 A17 

A R5,R6,R15, 

R16,R25,R26 

B Assy Part No. Assy Part No. Assy Part No. 

& Parts List & Parts List 

C C4 

R9,R10,R19, 

D R20,R29, 

R39,R40 

E U7 

7-1

7-6. MANUAL CHANGE INSTRUCTIONS 

CHANGE A 

Section 7 

Table 6-2: 

Change A9R5, R6, R15, R16, R25, and R26 to 0811-2815 RESISTOR 1.5 OHM 5% 0.75W PW 

TC=0+-50. 

Service Sheet 8: 

Change the value of A9R5, R6, R15, R16, R25, and R26 to 1.5 OHM. 

CHANGE B 

Figure 5-4: 

Replace with Figure 7-1. 

Figure 7-1. Phase Modulator Driver Frequency Response Adjustment Test Setup (Change B) 


Paragraph 5-27, EQUIPMENT: 

Delete Digital Voltmeter. 

Change the PROCEDURE as follows: 

3. Set the sweep generator controls as follows: sweep range to 110 MHz, frequency to 80 MHz, output level at 

-10 dBm, sweep video, and sweep mode free-slow. 

6. Set the spectrum analyzer controls for center frequency of 1.05 GHz, frequency span per division 20 MHz, resolution 

bandwidth 300 kHz, input attenuation 30 dB, vertical sensitivity per division 10 dB, and sweep time per division 2 ms. 

7. Adjust the sweep generator output level so the sidebands are approximately 34 dB below the carrier level. 

8. Set the spectrum analyzer vertical sensitivity per division to 2 dB. 

9. Adjust the Frequency Response control (A16C8) for maximum flatness within 40 MHz of the carrier and for the 

minimum peaking at 80 MHz. 

10. Disconnect the sweep generator from the A16 Assembly and set the signal generator LINE switch to STBY. 

11. Carefully remove the RF Section. Be careful not to damage the cables. Reconnect W12 to A16J1. 

Figure 5-5A: 

Change the reference "step 13" to "step 15" in two places. 

7-2


CHANGE B (Cont’d) 

Paragraph 5-28A: 

Change the last sentence of step 2 to "Be sure to use the correct test oscillator output and the correct low 

pass filter." 


Replace steps 8 through 15 with the following: 

8. Step the System Under Test center frequency down 1 Hz to 99.999999 MHz. The carrier and first sidebands should 

be within 0.5 dB. If the difference is less than or equal to 0.4 dB, proceed to step 11. If the difference is greater than 

0.5 dB and if the OM deviation is 82° proceed to step 10. 

9. Adjust A16R4 one-eighth turn cw. If A16R4 is in contact with the ccw stop, increase the value of A16R5. (The normal 

value range is 10 to 316Q.) Set the frequency of the System Under Test to 100 MHz and repeat steps 7 and 8. 

10. Adjust A16R4 one-eighth turn cw. If A16R4 is in contact with the cw stop, decrease the value of A16R5. (The normal 

value range is 10 to 316f.) Set the frequency of the System Under Test to 100 MHz and repeat steps 7 and 8. 

11. Set the FM discriminator controls for the 10 MHz range and the 0.1V sensitivity, and insert an internal 1 MHz low-pass 

filter. 

12 Set the spectrum analyzer controls for a center frequency of 200 kHz, resolution bandwidth to 3 kHz, frequency span 

per division to 50 kHz, input attenuation to 0 dB, log reference level to a convenient level, vertical sensitivity per 


13. Set the Reference System controls for a center frequency of 309 MHz and an output level of +7 dBm. 


meter. 

15. Refer to Figure 5-5A and connect the System Under Test OUTPUT to the "RF" input of the mixer. Connect the 

FM Discriminator output to the spectrum analyzer RF input. 

16. Adjust the spectrum analyzer's reference level control so the peak of the fundamental 100 kHz signal is viewed on 

the CRT display at the log reference graticule line. 


NOTE 

Observing harmonic distortion of a OM signal after passing it through an FM discriminator 

results in an increase in level of 6 dB per octave. Therefore, the second harmonic will be 

6 dB higher and the third harmonic 9.5 dB higher than with a phase demodulator. 



18. Step the System Under Test center frequency down 1 Hz. Note the direction and amount of readjustment of 


7-3


Paragraph 5-28A (cont’d) 


19. Set A16R3 and Ri for the best compromise (minimum second and third harmonic levels) at both center frequency 

settings of 299.999999 and 300 MHz. 


a Carrier and first sidebands are equal within 0.5 dB when changing Center Frequency of System Under 


b. Second harmonic levels are equal within 4 dB or >40 dB down from the fundamental as indicated by 

the spectrum analyzer at center frequencies of 300 and 299.999999 MHz (Step 19). 

c. Third harmonic levels are equal within 4 dB or>35 dB down from the fundamental as indicated by the 

spectrum analyzer frequencies of 300 and 299.999999 MHz (Step 19). 

21. Replace the mainframe cover and wait 10 minutes. Check to see if the conditions outlined in step 21 are still met. 

If not repeat steps 4 through 21. 

Figure 5-5B: 

Change the reference "step 11" to "step 13". 

Figure 5-28B: 

Change the second sentence of step 2 to "Be sure to use the correct test oscillator output and the correct low 

pass filter." 

Paragraph 5-28B: 


8. Step the System Under Test center frequency down 1 Hz to 99.999999 MHz. The carrier and first sidebands should 

be within 0.5 dB. If the difference is less than or equal to 0.5 dB, proceed to Step 11. If the difference is greater than 

0.5 dB and if the OM deviation is 82° proceed to Step 10. 

9. Adjust A16R4 one-eighth turn ccw. If A16R4 is in contact with the ccw stop, increase the value of A16R5. (The normal 

value range is 10 to 316 ohms.) Set the frequency of the System Under Test to 100 MHz and repeat Steps 7 and 8. 

10. Adjust A16R4 one-eighth turn cw. If A16R4 is in contact with the cw stop, decrease the value of A16R5. (The normal 

value range is 10 to 316 ohms.) Set the frequency of the System Under Test to 100 MHz and repeat Steps 7 and 8. 

11. Set the spectrum analyzer controls for a center frequency of 2 MHz, resolution bandwidth to 30 kHz, frequency span 

per division to 0.5 MHz, input attenuation to 0 dB, log reference level to a convenient level, vertical sensitivity per 



meter. 

13. Connect the phase modulation test set between the signal generator output and the spectrum analyzer input as 


14. Adjust the spectrum analyzer's reference level so the peak of the fundamental 1 MHz signal is viewed on the CRT 

display at the log reference graticule line. 

7-4




16. Step the System Under Test center frequency down 1 Hz. Note the direction and amount of read- injustment of 


17. Set A16R3 and R1 for the best compromise (minimum second and third harmonic levels) at both center frequency 

settings of 299.999999 and 300 MHz. 


a. Carrier and first sidebands are equal within 0.5 dB when changing Center Frequency of System Under 


b. Second harmonic levels are equal within 4 dB or >40 dB down from the fundamental at center 


c. Third harmonic levels are equal within 4 dB or >35 dB down from the fundamental at center 


19. Replace the mainframe cover and wait 10 minutes. Check to see if the conditions outlined in Step 18 are still met. If 

not, repeat steps 4 through 19. 

Table 6-2: 

Change A13 to 86601-60039 ATTENUATOR ASSY (except Option 001). 

Replace the A16 Assembly parts list with the one in this change. 

Figure 8-12: 


7-5

Change B (Cont’d) 

TM 11-6625-2837-34-&P-7 

Figure 7-2. A16 Phase Modulator Driver Assembly Component and Test Point Locations (Change B 

7-6


Table 7-3. P/O Table 6-2. Replaceable Parts (P/O Change B) 

Reference 

Designation 

HP Part 

Number 


Code 


A16 86603-60002 1 PHASE MODULATOR DRIVER ASSY 

(OPTION 002 ONLY) 

28480 86603-60002 

A16C1 0160-4247 CAPACITOR-FXD 28480 0160-4247 

A16C2 0160-0127 1 CAPACITOR-FXD 28480 0160-0127 

A16C3 0160-4247 CAPACITOR-FXD 28480 0160-4247 

A16C4 0180-0374 4 CAPACITOR-FXD 56289 150D106X9020B2 



A16C7 0180-0228 2 CAPACITOR-FXD 56289 150D106X9010B2 

A16C8 0121-0447 1 CAPACITOR-FXD 00865 5S-TRIKO-04 

A16C9 0180-0374 CAPACITOR-FXD 56289 150D106X9020B2 

A16C10 0180-0228 CAPACITOR-FXD 56289 150D106X9010B2 

A16CR1 1901-0179 2 DIODE-SWITCHING 15V 50NA 750PS DO-7 28480 1901-0179 

A16CR2 1901-0179 DIODE-SWITCHING 15V 50NA 750PS DO-7 28480 1901-0179 


A16E1 0410-0184 1 OVEN: COMPONENT 01295 5ST1-2 

A16J1 1250-1377 2 CONNECTOR-RF SMB FEM PC 2K497 700214 

A16J2 1250-1377 CONNECTOR-RF SMB FEM PC 2K497 700214 

A16L1 9140-0158 1 COIL-FXD MOLDED RF CHOKE 1UH 10% 24226 10/101 

A16Q1 1855-0327 1 TRANSISTOR J-FET 2N4416 N-CHAN D-MODE 01295 2N4416 

A16Q2 1854-0023 2 TRANSISTOR NPN SI TO-18 PD-360MW 28480 1854-0023 

A16Q3 1853-0050 1 TRANSISTOR PNP SI TO-18 PD-360MW 28480 1853-0050 

A16Q4 1853-0018 2 TRANSISTOR PNP SI TO-72 PD-200MW FT-1GHZ 28480 1853-0018 

A16Q5 1853-0018 TRANSISTOR PNP SI TO-72 PD-200MW FT-1GHZ 28480 1853-0018 

A16Q6 1854-0345 2 TRANSISTOR PNP 2N5179 SI TO-72 PD-200MW 04713 2N5179 

A16Q7 1854-0345 TRANSISTOR NPN 2N5179 SI TO-72 PD-200MW 04713 2N5179 

A16Q8 1853-0034 1 TRANSISTOR NPN SI TO-18 PD-360MW 28480 1853-0034 

A16Q9 1855-0081 1 TRANSISTOR J-FET 2N5245 N-CHAN D-MODE SI 01295 2N5245 

A16Q10 1854-0247 1 TRANSISTOR NPN SI TO-39 PD-1W FT-800MW 28480 1854-0247 

A16Q11 1854-0023 TRANSISTOR NPN SI TO-18 PD-360MW 28480 1854-0023 

A16R1 2100-3123 1 RESISTOR-TRMR 500 10% C SIDE -ADJ 17-TURN 28480 3006P-1-501 

A16R2 2100-3095 1 RESISTOR-TRMR 200 10% C SIDE-ADJ 17-TURN 32997 3006P-1-201 

A16R3 2100-3154 1 RESISTOR-TRMR 1K 10% C SIDE-ADJ 17-TURN 32997 3006P-1-102 

A16R4 2100-2633 RESISTOR-TRMR 1K 10% C SIDE-ADJ 17-TURN 32997 ET50X102 

A16R5 0698-7216 1 RESISTOR 147 2% .05W F TO-0+-100 30983 C3-1/8-TO-1002-G 

A16R6 0698-7260 4 RESISTOR 10K 2% .05W F TO-0+-100 24546 C3-1/8-TO-8251-G 

A16R7 0698-7258 1 RESISTOR 8.25K 2% .05W F TO-0+-100 24546 C3-1/8-TO-1002-G 

A16R8 0698-7260 RESISTOR 10K 2% .05W F TO-0+-100 24546 C3-1/8-TO-3831-G 



A16R11 0698-7243 1 RESISTOR 1.96K 2% .05W F TO-0+-100 24546 C3-1/8-TO-1002-G 





A16R16 0698-7244 RESISTOR 2.15K 2% .05W F TO-0+-100 24546 C3-1/8-TO-196R- 

A16R17 0698-7219 2 RESISTOR 196 2% .05W F TO-0+-100 24546 C3-1/8-TO-196R-G 

A16R18 0698-7219 RESISTOR 196 2% .05W F TO-0+-100 24546 C3-1/8-TO-3161-G 

A16R19 0698-7248 1 RESISTOR 3.16K 2% .05W F TO-0+-100 24546 C3-1/8-TO-619RG 

A16R20 0757-0418 2 RESISTOR 619 1% .05W F TO-0+-100 24546 C3-1/8-TO-619R-G 


A16R22 0698-0083 RESISTOR 1.96K 1% .05W F TO-0+-100 16299 C3-1/8-TO-100R-G 

A16R23 0698-7212 4 RESISTOR 100 2% .05W F TO-0+-100 24546 C3-1/8-TO-511R-F 

A16R24 0757-0416 RESISTOR 511 1% .05W F TO-0+-100 24546 C3-1/8-TO-100R-F 

A16R25 0698-7212 RESISTOR 100 2% .05W F TO-0+-100 24546 C3-1/8-TO-1001-F 

A16R26 0698-7236 RESISTOR 1K 2% .05W F TO-0+-100 24546 C3-1/8-TO-10R-G 

A16R27 0698-7188 2 RESISTOR 10 2% .05W F TO-0+-100 24546 C3-1/8-TO-1001-F 

A16R28 0757-0280 RESISTOR 1K 1% .05W F TO-0+-100 24546 C3-1/8-TO-100R-G 

A16R29 0698-7212 RESISTOR 100 2% .05W F TO-0+-100 24546 C3-1/8-TO-10R-G 

A16R30 0698-7188 RESISTOR 10 2% .05W F TO-0+-100 24546 C3-1/8-TO-19R6-G 

A16R31 0698-7195 3 RESISTOR 19.6 2% .05W F TO-0+-100 24546 C3-1/8-TO-19R6-G 

A16R32 0698-7195 RESISTOR 19.6 2% .05W F TO-0+-100 24546 C3-1/8-TO-100R-G 


A16R34 0757-0280 RESISTOR 1K 1% .05W F TO-0+-100 24546 C3-1/8-TO-390R-F 

A16R35 0698-3633 1 RESISTOR 390 2% .05W F TO-0+-100 24546 FP42-2-TOO-390R-J 


A1637 0698-7195 RESISTOR 19.6 2% .05W F TO-0+-100 24546 C3-1/8-TOO-19R6-G 

A16U1 1858-0032 1 IC CA3146E XSTR ARRAY 02735 CA3146E 

A16U2 1820-0174 IC SN74 04 N INV 


01295 SN7404N 

1200-0173 1 INSUALTOR-XSTR TO-5 .075-THK 28480 1200-0173 

1480-0073 PIN: DRIVE 0.250" LG 00000 OBD 

4040-0748 1 EXTRACTOR-PC BD BLK POLYC .062-BD-THKNS- 28480 4040-0748 

4040-0750 1 EXTRACTOR -PC BD-RED POLYC .062-BD-THKNS 28480 4040-0750 


7-7

Reference 

Designation 

HP Part 

Number 

Table 7-3. P/O Table 6-2 Replaceable Parts 


Code 



A17 86603-60019 1 PHASE MODULATOR ASSY (O\0 PT. 002 28480 86603-60019 

ONLY) 

86603-00004 1 COVER, PHASE MODULATOR HOUSING 28480 86603-00004 

86603-200011 1 HOUSING, PHASE MODULATOR 28480 86603-20011 

A17J1 1250-1194 CONNECTOR-RF SM-SLD M SGL-HOLE- 28480 1250-1194 

FR 50 OHM 

A17P1 1250-0563 2 CONNECTOR-RF SMA M 4 HOLE FLG FR 28480 1250-0563 

A17P2 1250-0563 CONNECTOR-RF SMA M 4 HOLE FLG FR 28480 1250-0563 

A17A1 86603-60003 1 PHASE MODULATOR BOARD ASSY 28480 86603-60003 

A17A1C1 0160-0559 3 CAPACITOR-FXD 10PF+-10% 28480 0160-0559 

100WVDC CER 

A17A1C2 0160-0559 CAPACITOR-FXD 10PF+-10% 28480 0160-0559 

100WVDC CER 

A17A1C3 0160-0559 CAPACITOR-FXD 10PF+-10% 28480 0160-0559 

100WVDC CER 

A17A1CR1 0122-0074 2 DIODE VVC.7PF 10% CO/C25-MIN=4 96341 MA45644 

BVR=40V 

A17A1CR2 0122-0074 DIODE VVC.7PF 10% CO/C25 MIN=4 96341 MA45644 

BVR=40V 

7-8


Figure 7-3. Phase Modulation Section Schematic Diagram (Option 002) (Change B) 

7-9


CHANGE C 

Page 6-12, Table 6-2: 

Change: 

A17C1 to A17A1C1 

A17C2 to A17AlC2 

A17C3 to A17AlC3 

A17CR1 to A17AlCR1 

A17CR2 to A17AlCR2 

Add A17A1, 86603-60003, 1, PHASE MODULATOR BOARD ASSY, 28480, 86603-60003. 

Delete A17C4. 

Figure 8-13: 


A17 ASSEMBLY 

Figure 7-4. A17 Phase Modulator Assembly Component Locations (Change C) 

7-10


CHANGE C (Cont’d) 

Figure 8-14: 

Change the diagram as shown in the partial schematic, Figure 7-5: 

CHANGE D 

Figure 7-5. P/O Phase Modulation Section Schematic Diagram (Change C) 

Table 6-2: 

Add A9R9, R10, R19, R20, R29, R30, R39, R40 0698-4002 RESISTOR 5K 1% 125W. 

Figure 8-21: 

Mark the locations of: 

R29, 30 between Q1 and Q2 




Figure 8-22: 

Change the schematic as shown in Figure 7-6. 

Figure 7-6. P/O Attenuator Section Schematic Diagram (Change D) 



CHANGE E 

Table 6-2: 

Change A11U7 to 1820-0639 IC MC 4001P CONV. 

Service Sheet 9: 

Change the schematic as shown in Figure 7-7. 

Figure 7-7. P/O All Logic Assembly Schematic Diagram (Change E) 

7-12



8-2. This section contains troubleshooting and repair 

information for the RF Section plug-in. Safety of 

technical personnel is considered. Circuit operation and 

troubleshooting on system, plug-in and assembly levels 

is provided. 

8-3. The service sheets normally include principles of 

operation and troubleshooting information, a component 

location diagram, and a schematic, all of which apply to a 

specific portion of circuitry within the instrument. 

8-4. Information related to operation of the RF 

Section plug-in as part of the 8660-series Synthesized 

Signal Generator System is provided in Service Sheet 1. 

8-5. Service Sheets 2 and 3 include an overview of 

RF Section operation, troubleshooting on an assembly or 

stage level, and a troubleshooting block diagram. The 

block diagrams also serve as an index for the remaining 

service sheets. 

8-6. The Schematic Diagram Notes, Figure 8-3, aid 

in interpreting the schematics. 

8-7. The last foldout in the manual includes a table 

which cross-references all pictorial and schematic 

locations of each assembly, chassis mounted 

component, and adjustable component. The figure is a 

pictorial representation of the RF Section and shows 

location of the aforementioned parts. 





which must be followed to ensure safe operation and to 

retain the instrument in safe condition (see Sections II, 

III, and V). Service and adjustments should be 

performed only by qualified service personnel. 

8-10. Any adjustment, maintenance, and repair of the 

opened instrument under voltage should be avoided as 

much as possible and, when inevitable, should be carried 

out only by a skilled person who is aware of the hazard 

involved. 

SECTION VIII 

SERVICE 

8-1 

8-11. Capacitors inside the instrument may still be 

charged even if the instrument has been disconnected 

from its source of supply. 

WARNING 

The service information is often used with power 

supplied and protective covers removed from the 

instrument. Energy available at many points 

may constitute a shock hazard. 

8-12. PRINCIPLES OF OPERATION 

8-13. The Principles of System Operation ex-plains 

how the RF Section operates within the Synthesized 

Signal Generator System, i.e., how other sections affect 

the RF Section and in turn how they are affected by the 

RF Section. Control functions in both local and remote 

modes are also explained. 

8-14. Service Sheet 1 includes a block diagram and an 

explanation of system operation with respect to the RF 

Section. 

8-15. Overall operation of the RF Section is discussed 

in Service Sheet 2 and 3. The remaining service sheets 

are concerned only with sections and/or circuit 

assemblies within the RF Section plug-in. 

8-16. TROUBLESHOOTING 

NOTE 

When a malfunction occurs, refer to Section VIII 

of the HP Model 8660-series mainframe 

Operating and Service Manual to begin 

troubleshooting (System Troubleshooting 

Guide). Then, if that information indicates 

possible problems in the RF Section, refer to the 

Systems Troubleshooting information in Service 

Sheet 1. This information may be used to isolate 

the defect to the RF Section, another plug-in, or 

the main-frame. If the problem is in this plug-in, 

turn to Service Sheet 2 for further 

troubleshooting information.


8-17. System Troubleshooting 

8-18. The System Troubleshooting information in Section 

VIII of the HP 8660-series mainframe manual should be 

used when first attempting to isolate a circuit defect. If 

the defect cannot be isolated to an individual instrument 

in the system the technician is normally directed to the 

System Troubleshooting in the RF Section manual 

(Service Sheet 1). The problem may then be isolated to 

the RF Section, Modulation Section, Frequency 

Extension Module, or the mainframe. 

8-19. RF Section Troubleshooting 

8-20. When the defect has been isolated to the RF 

Section, refer to Service Sheet 2. This information is 

used to isolate the problem to a section or assembly. 

8-21. Troubleshooting Aids 

8-22. Circuit Board Aids. Test points are physically 

located on the circuit boards as metal posts or circuit 

pads and usually have either a reference designator 

(such as TP1) or a label which relates to the function 

(AM, Pulse, ID, etc.). Transistor emitters, diode 

cathodes, the positive lead of electrolytic capacitors, and 

pin 1 of integrated circuits are indicated by a variety of 

symbols such as E, a diode symbol, +, and a tear-drop 

shape respectively. Also, a square circuit pad (as 

opposed to the round pad) may be used in place of any 

of the previously mentioned symbols. 

8-23. Service Sheet Aids. RF levels, ac voltages and 

dc voltages are often shown on schematic diagrams. 

Integrated circuit connection diagram plus diagrams of 

relays and printed circuit connectors help to locate 

specific inputs and outputs Notes are used to explain 

certain circuits or mechanical configurations not easily 

shown on the schematic. 

8-24. The locations of individual component mounted 

on printed circuit boards are found or individual service 

sheets on the pictorial representation of the circuit 

boards. Chassis mounted parts, major assemblies, and 

adjustable component locations are found on the last 

foldout in this manual. 

8-25. Table 8-3, Schematic Diagram Notes, provides 

information relative to symbols and value shown on the 

schematic diagrams. 

8-2 

8-26. Service Kit and Extender Boards. The HP 

11672A Service Kit contains interconnect cables, RF 

cables, various coaxial adaptors, and an adjustment tool, 

all of which are useful in servicing the RF Section plug-in. 

Refer to the HP 11672A Operating Note for a listing and 

pictorial representation of the contents. A list of the 

service kit contents is also found in the Test Equipment 

and accessories list in Section I of the mainframe 

manual. 

8-27. Circuit board extenders are provided with the 

mainframe. These extender boards enable the 

technician to extend plug-in boards clear of the assembly 

to provide easy access to components and test points. 

Refer to the list found under Accessories Supplied in 

Section I of the mainframe manual. 

8-28. RECOMMENDED TEST EQUIPMENT 

8-29. Table 1-2 lists the test equipment and 

accessories recommended for use in servicing the 

instrument. If any of the recommended test equipment is 

unavailable, instruments with equivalent specifications 

may be used. 

See Appendix B, Section III. 

8-30. REPAIR 

8-31. General Disassembly Procedures 

8-32. Procedures for removing the RF Section plug-in 

from the mainframe and the covers from the plug-in are 

found on the left-hand foldout page immediately 

preceding the last foldout in the manual. 

8-33. The machine screws used throughout the plug-in 

have a Pozidriv head. Pozidriv is very similar in 

appearance to the Phillips head, but using a Phillips 

screwdriver may damage the Pozidriv screw head. 

8-34. Non-Repairable Assemblies 

8-35. Repairs should not be attempted on the following 

assemblies if any is found to be defective 

during troubleshooting: 

A5 Modulator Assembly 

A6 1-1300 MHz Amplifier Assembly 

A8 4 GHz Amplifier Assembly 

A13 Attenuator Assembly 

A15 20 MHz Amplifier Assembly 

A18 Circulator Assembly 

A19 3.9 - 4.1 GHz Isolator Assembly 

AT1 Isolator 

AT2 3 dB Attenuator 

FL1 4 GHz Band Pass Filter

Section 8 TM11-6625-2837-14 & P-7 

8-36. Module Exchange Program 

8-37. Only the A13 Attenuator is available as restored 

assembly. It may be ordered as a replacement under the 

Module Exchange Program. Refer to Section VI for 

ordering information. 

8-38. Repair Procedures 

8-39. LO Signal Circuits Repair Procedure. Refer to 

Figure 8-1. This procedure is used in conjunction with 

Service Sheet 2 for isolating circuit defect which are 

evident as a phase modulation problem or an incorrect 

LO signal level (option 002 instruments only). Perform 

the procedure if one of the following components is 

suspected of being defective: W1, W2, W10, W13, W14, 

A7, A8, A17, A1 A19, or AT2. 

8-40. Front Panel Housing Disassembly and Repair 

Procedure. Circuits and parts located in the front 

8-3 

Panel Housing are the meter, output range switch, and 

vernier control. Perform the procedure in Table 8-1 to 

gain access to these circuits for purposes of repair. 

8-41. Rear Panel Disassembly Procedure. To gain 

access to assemblies and parts mounted on or behind 

the rear panel, refer to Figure 8-2. The A12 Logic Mother 

Board, A15 20 MHz Amplifier, and the P6 Interconnect 

Plug are accessible only after removing the panel. 

8-42. Post Repair Adjustments 

8-43. After a defective circuit is repaired, refer to 

Section V and perform the adjustment procedure(s) for 

circuits which may be affected by the change. Consider 

the instructions under paragraphs entitled Related 

Adjustments and Post Adjustment Tests.


NOTE 

In conjunction with this procedure, use the troubleshooting information on Service Sheet 2 to isolate a 

circuit malfunction to one of the following assemblies, circuits, or cables: A 7, A8, A18, A19, AT2, W1, W2, 

W10, or W13 (RF problem); A 1 7 or W14 (phase modulation problem). The procedure applies for option 

002 instruments only. 

a. Set the System Line switch to Standby. 

b. Remove screws 2, 7 and 14 to release the A17 Phase Modulator 3 and A18 Circulator 5 Assemblies. 

c. With a 5/16” open end wrench, loosen the SMA connectors 6 , 8, and 3 . Carefully pull the 

assemblies 3 and 5 away from the aluminum decking until A17 3 slips past AT1 1 . 

Figure 8-1. LO Signal Circuits Repair (1 of 3) 

8-4

Section 8 TM 11-6625-2737-14 & P-7 

d. Phase Modulation Problems. Separate A17 and A18 at connectors 4 and 11 . Set the system LINE switch 

to ON. Measure the output of W14 at connector 

e. Set the system LINE switch to Standby, replace the defective part of assembly. Reassemble the items in the 

reverse order given for disassembly. 

Be sure W14 13 runs under connector 11 and is not crushed 

under A17 7 . 

f. RF Problems. To measure the LO signal at the output of A18 10 , remove the SMA connectors 6 and 8 

,and set the System LINE switch to ON. 

g. If the output from A18 is correct, proceed to step h. Otherwise, determine which of A18, W13, A19, or W1 is 

defective by measuring the outputs of W13, A19, and W1. Refer to Service Sheet 2. 

h. Disconnect the System’s line (Mains) power. Release the A20 Assembly by removing the screws (one each where 

circuit board and aluminum decking meet). Lift the assembly straight up. Connect a ground lead from the chassis to the 

angle bracket which is connected to the ground point on the circuit board. 

i. Remove cable W2 at the A8 Assembly output. (The A8 output jack is closer to the top of the RF Section). 

j. Reconnect the System’s line (Mains) power. Measure the output level from A8 (refer to Service Sheet 2). If the 

output level is correct, determine if cable W2 or the A7 Mixer Assembly is defective. If the level is incorrect, proceed to 

step k. 

k. Remove the three screws which secure the A8 Assembly. Remove the cable connector 9 at the output of A18. 

Carefully pull A8 away from the decking so the end of AT2 (connected to the input of A8) is exposed. 

I. With the wrench, loosen and remove AT2 from A8. Carefully remove W10 and AT2 from between the decking. 

m. Reconnect the cable to the output of A18 10 .Check the outputs from AT2 and W10 to determine if AT2, W10, 

or A8 is defective (refer to Service Sheet 2). 


8-5


n. Discard the defective part or assembly. Reassemble the items removed in the reverse order (leave A20 till last). 

CAUTION 

When tightening the coaxial connectors, be sure the other end of the cable can be connected without 

bending the cable. Be sure all connectors are tightened but only enough to ensure a good connection. 

Excessive bending of semi-rigid coax or excessive tightening of the connectors may damage the cables 

and/or connectors beyond repair. 


8-6


Table 8-1. Front Panel Housing Repair 

FRONT PANEL HOUSING DISASSEMBLY AND REPAIR 

a. Place the RF Section in the normal upright position. 

b. With a Pozidriv screwdriver, remove the two screws which hold the top of the front panel to the housing. 

c. Turn the plug-in over with the bottom up. Remove the screw which is seen through the curved cutout slot in the 

latch when it is in the closed or latched position. 

d. With a knurled nut wrench, loosen the knurled nut on the OUTPUT jack. Remove the nut by hand. 

e. Pull the front panel away from the housing. 

f. Determine what part or assembly is defective and replace it. 

g. Reinstall the front panel by following the preceding steps in the reverse order. Be careful not to crush any wires 

between the front panel and the chassis. 

8-7


REAR PANEL DISASSEMBLY 

a. On the rear panel, remove screws 1 and 2 which hold the A13 Assembly in place. Screw 1 is 

located under the Option 002 sticker. 

b. Remove the screws 5 and 6 which hold the top rear deck to the rear panel. 

c. Remove the screws 3 and 4 which hold the rear panel to the left rear deck. Carefully pull the rear panel 

back and away to expose the assemblies and parts. 

Figure 8-2. Rear Panel Disassembly 

8-8

Section 8 TM 11-6625-2RI7-14 & P-7 

SCHEMATIC DIAGRAM NOTES 

Resistance in ohms, capacitance in microfarads, 

inductance in microhenries other otherwise noted. 

Asterisk denotes a factory-selected value. Value shown 

is typical. Part may be omitted. 

Indicates backdating. Refer to Table 7-2. 

Tool-aided adjustment. 

Manual control. 

Encloses front-panel designation. 

Encloses rear-panel designation. 

Circuit assembly borderline. 

Other assembly borderline. Also used to indicate 

mechanical inter-connection (ganging). 

Heavy line with arrows indicates path and direction of 

main signal. 

Heavy dashed line with arrows indicates path and 

direction of main feedback. 

Wiper moves toward CW with clockwise rotation of 

control (as viewed from shaft or knob.) 

Numbered Test Lettered Test point. 

point Measure- No measurement 

ment aid provided. Aid provided. 

Encloses wire color code. Code used is the same as the 

resistor color code. First number identifies the base 

color, second number identifies the wider strip, third 

number identifies the narrower stripe. E.g., 9 denotes 

white base, yellow wide stripe, violet narrow stripe. 

A direct conducting connection to the earth, or a 

conducting 

connection to a structure that has a similar function (e.g., 

the frame of an air, sea, or land vehicle). 

Coaxial or shielded cable. 

Figure 8-3. Schematic Diagram Notes (1 of 3) 

8-9 

Stripline (i.e., RF transmission line above ground).


EXAMPLE: A3S1AR(2-1/2) 

A3S1 = SWITCH SI WITHIN 

ASSEMBLY A3 

A = 1STWAFER FROM 

FRONT (A=IST, ETC) 

R = REAR OF WAFER 

(F=FRONT) 

(2-1/2) =TERMINAL LOCATION 

(2-1/2) (VIEWED FROM 

FRONT) 

SCHEMATIC DIAGRAM NOTES 

SWITCH DESIGNATIONS 

Arrows on relays indicate direction of arm movement 

when energized. 

Filters. Specific type indicated by crosses on curved 

lines. 

Example of Highpass Filter. 

Figure 8-3. Schematic Diagram Notes (2 3) 

8-10


Figure 8-3. Schematic Diagram Notes (3 of 3) 



SERVICE SHEET 1 

NOTE 

When a malfunction occurs, refer to Section 

VIII of the HP Model 8660- series mainframe 

Operating and Service Manual to begin 

troubleshooting (System Troubleshooting 

Guide). Then, if that information indicates 

possible problems in the RF Section, refer to 

the Systems Troubleshooting information in 

this manual (Service Sheet 1). This information 

may be used to Isolate the defect to the RF 

Section, another plug-in, or the mainframe. If 

the problem Is In this plug-in, refer to Service 

Sheet 2 for further troubleshooting information. 

RF SECTION OPERATION IN THE SYNTHE 

SIZED SIGNAL GENERATOR SYSTEM 

In order to understand the operation of the RF Section or 

to effectively troubleshoot it, the entire Synthesized 

Signal Generator System must be understood. The 

emphasis here is on the RF Section and its 

relationship with the other units which make up the 

system. 

PRINCIPLES OF OPERATION 

The HP Model 86602B RF Section Plug-in (as par of the 

HP 8660-series Synthesized Signal Generator System, 

has an RF Output of +10 to -146 dBm across 5092 from 

1 to 1299.999999 MHz. The RF signals coupled from 

mainframe to the Frequency Extension Module are 

converted to two phase. locked outputs which are 

coupled to the RF Section. The signals are mixed, 

amplified, and coupled to the OUTPUT jack through the 

RF Attenuator. The RF detector produces a dc output 

proportional to the RF output signal. The dc output is 

compared to a reference voltage. Any difference in dc 

levels produces an error current which drives the PIN 

diode modulator. The current flow through the PIN 

diodes controls the RF output level. The negative 

feedback loop described, is an ALC loop which holds the 

RF output level constant. 

Output Frequency Selection The desired output 

frequency is selected by the Digital Control Unit (DCU) in 

the mainframe Control logic levels to the mainframe RF 

circuits set the frequencies of the signals to the 

Frequency 

8-12 

Extension Module. Other logic levels are coupled to the 

extension module from the mainframe to set the 

frequency of the generated RF outputs which are 

coupled to RF Section. The signals are mixed and the 

converted signal is coupled to the OUTPUT jack. 

Modulation Selection 

Depending on the Auxiliary or Modulation Section, 

amplitude, frequency, phase, or pulse modulation may 

be selected. 

a. The amplitude modulation drive signal is coupled 

to the RF Section from the Modulation Section. The drive 

signal is superimposed on the reference level which 

controls the ALC loop. Thus, the ALC loop causes the 

RF output level to change at the modulation signal rate. 

b. Frequency modulation is accomplished by 

setting the modulation mode control to FM. The 

modulation drive signal frequency modulates a 20 MHz 

VCO signal which is generated in the Modulation 

Section. This signal is coupled to the RF Section, 

amplified, and coupled on to the Frequency Extension 

Module. The extension module circuits transfer the 

frequency modulation information from the 20 MHz 

signal to the 3.95 to 2.75 GHz oscillator signal. This 

signal is then coupled to the RF Section circuits. 

c. Phase modulation occurs when the selected 

modulation mode is set to M. The modulation drive 

signal from the modulation section is applied to the LO 

signal so its phase deviation varies with the drive signal 

amplitude. 

d. The Pulse ID logic input opens the ALC loop so 

there is no RF output without a pulse modulation drive 

signal. A -10 volt peak pulse will momentarily bias the RF 

output on. 

RF Output Level Selection 

The RF output level is selected by the front panel 

OUTPUT RANGE switch and the VERNIER control. The 

VERNIER control (in conjunction with the front panel 

meter) is used to set the output within a usable range of 

10 dB. The OUTPUT RANGE switch controls the output 

level range by inserting attenuation in 10 dB steps to 150 

dB.

Section 8 TM 11-6625-2837-14-P-7 

SERVICE SHEET 1 (Cont’d) 

Remote Operation 

In remote mode the frequency, modulation, and RF 

output levels are programmed into the DCU. Through 

parallel BCD PI (plug-in) control lines, an input is sent to 

the various storage registers. A one-of-six address 

selects the register which will accept the information. 

Frequency information is routed into one of 3 registers: 

center frequency, step (except 8660A), and sweep 

(except 8660A). Modulation information is routed to 

either the Modulation Mode/Source register or the 

Modulation Level register. RF output level (attenuation) 

information is routed to the attenuation storage register 

in the RF Section by addressing the ATTN CLK. 

The attenuation information is stored in the register until 

new data is received. Until that time the stored 

information is connected through various logic and 

decoding circuits and applied to the relays and switches 

which set the RF output level to the desired value. The 

RF Section front panel controls are inoperative in the 

remote mode. 

SYSTEM TROUBLESHOOTING 

When a malfunction occurs, refer to Section VIII of the 

HP Model 8660-series mainframe Operating and Service 

Manual to begin troubleshooting (System 

Troubleshooting Guide). Then, if that information 

indicates possible problems in the RF Section, return to 

this service sheet and perform the following tests which 

may help isolate the problem to an instrument 

(mainframe or a plug-in). 

Preparing the R F Section for Troubleshooting 

Follow the Removal and Disassembly Procedures on the 

foldout page which just preceeds the last foldout in the 

manual. Follow the directions for removing the RF 

Section from mainframe, removing its covers, and 

making the interconnections from mainframe to RF 

Section for troubleshooting purposes. 

Output Level Incorrect 

The following steps check the signal levels input to the 

RF Section from the Frequency Extension Module. Also, 

the attenuation data input to the RF Section must be 

checked if the instrument is being operated in the remote 

mode. 

8-13 

a. Disconnect the RF cable connected to P2 (on 

rear panel above the multi-pin connector P6). Measure 

the level of the 3.95 to 2.75 GHz signal from the cable 

with a spectrum analyzer (>+10 dBm). Reconnect the 

cable to P2. 

b. Disconnect the RF cable connected to P1 (on 

rear panel below the multi-pin connector). Measure the 

level of the 3.95 to 4.05 GHz signal from the cable with a 

spectrum analyzer (>-4 dBm). Reconnect the cable to 

P1. 

c. If either signal level from the extension module is 

incorrect, the problem is either in the extension module 

or the interconnections to the RF Section. Check the 

continuity of the cables and, if necessary, refer to the 

extension module manual for further troubleshooting 

information. 

d. If both signal levels are correct and the system is 

being operated in the remote mode, switch to local (front 

panel) control. If the problem is still evident, refer to 

Service Sheet 2 for further troubleshooting information. 

e. If the problem disappears, check continuity of 

the input data lines (PI-1, PI-2, PI-4, and PI-8) and the 

ATTN CLK input to the mainframe. If continuity exists, 

proceed to Section VIII of the mainframe manual and 

troubleshoot the DCU. Otherwise, refer to Service Sheet 

3. 

Frequency Problems 

The mainframe center frequency readout is correct but 

the frequency at the RF Section’s front panel jack is 

incorrect. The mainframe, and the frequency Extension 

Module contain the only controlled frequency sections. If 

the RF frequencies to the extension module are incorrect 

or if the levels are too low, the circuit defect is in the 

mainframe or the interconnections to the extension 

module (including the A15 20 MHz Amplifier Assembly). 

If these levels and frequencies are all correct, the 

extension module is malfunctioning or the data input 

from the mainframe DCU is incorrect. 

NOTE 

If the coaxial test cable 11672-60008 

(for checking outputs from the multi-pin 

connector J6) is not available, proceed 

to step b.



RF Signal Levels 

Pin 

Numbers 

J6 (Main- Signal 

frame) or Frequency* (MHz) Level 

Inter- (dBm) 

connect 

Cable 

62 20 MHz ± 1 Hz >-7 dBm 

63 20 to 30 MHz + 1 Hz >-7 dBm 

64 360 to 450 MHz + 1 Hz >+10 dBm 

65 100 MHz + 1 Hz >+10 dBm 

*To achieve the 1 117 tolerance, the System 

mainframe and the frequency counter must share 

a common timebase. 

a. Check the low frequency RF inputs to the 

RF Section. Set the mainframe Line switch to standby 

(STBY), disconnect the interconnect cable from the 

multi-pin connector P6 on the RF Section rear panel. 

Return the mainframe line switch to the ON position. 

Check the frequencies and levels according to the tables 

with a spectrum analyzer and a frequency counter. If the 

levels and frequencies are all correct, the same signals 

must be checked to ensure continuity into the Frequency 

Extension Module. Refer to the Troubleshooting 

Information in the extension module manual. Otherwise, 

proceed to step b. 

b. Check the RF signal levels and frequencies 

at their assembly outputs’ in the mainframe. Refer to the 

Section VIII of the mainframe manual. Check the 20 

Mhz FM/CW signal at A4J7, 100 MHz at A4J8, and 360 

to 450 MHz at A4J12. The 20 to 30 MHz signal is found 

on the A2 Mother Board Assembly which is located 

directly beneath the A4 Assembly. The tables of 

frequencies and levels still apply for these 

measurements. If any of the outputs are incorrect, refer 

to the appropriate troubleshooting information relating to 

the circuits which generate that particular frequency in 

Section VIII of the mainframe manual. 

c. If all inputs (step b) are correct and if any 

of the J6 outputs (step a) were incorrect, check continuity 

of the interconnections to the RF Section. In the case of 

problems with the 20 MHz CW’/FMI signal, refer to the 

Modulation Section manual. If all inputs (step b) are 

correct and the J6 outputs to the RF Section were not 

checked, proceed to the extension module for further 

troubleshooting Information. 

8-14 

Center Frequency Versus 

Frequency of 360 to 450 MHz Signal 

Center Frequency Actual Frequency 

Readout (350 to 450 MHz Signal) 

0.00 GHz 450 MHz 

0.01 440 

0.02 430 

0.03 420 

0.04 410 

0.05 400 

0.06 390 

0.07 380 

0.08 370 

0.09 360 

0.10 450 

NOTE 

If the problem is not in the RF Section or 

interconnections, the information in the 

Frequency Extension Module will 

determine if the problem is in the digit 8, 9, 

and 10 logic control units from the 

mainframe or the frequency controlled 

circuits in the extension module. 

Modulation Problems 

Amplitude, Frequency, and Phase Modulation. 

Defects in modulation circuits can usually be classed as 

either accuracy or distortion problems. In each case it 

must be determined if the problem is in the Modulation 

Section, RF Section, or (in FM mode only), the 

Frequency Extension Module. 

a. System modulation accuracy is checked by 

performing the appropriate performance test in Section 

IV of the modulation section manual. If the results 

indicate a problem exists, check the modulation section 

output with a full scale level setting. The table indicates 

where to make the measurement, the type of 

measurement, and the normal signal measured. A 

coaxial cable from the 11672A Service Kit (11672- 

60008) connects to the appropriate signal on J6 (the 

mainframe-to-RF Section interconnect jack). 

If the measured signal shows the output modulation 

signal is incorrect, perform the appropriate adjustment in 

Section V of the modulation section manual. If the signal 

cannot be properly adjusted, refer to Section VIII of the 

modulation section



Assembly (refer to the last foldout for its location). If 

either the signal or dc voltage is not present, check 

continuity back to the Auxiliary Section. If necessary, 

refer to the H 

Center Frequency Versus Frequency of 20 to 30 MHz Signal 

8-15 

Model 86631B Operating Note and troubleshoot the 

Auxiliary Section. Otherwise, refer to Service Sheet 1 for 

more troubleshooting information.



manual for further troubleshooting information. Once the 

adjustment is satisfactorily made, recheck the system 

modulation accuracy. If the system accuracy is still 

incorrect, perform the appropriate adjustment procedure 

in Section V of the RF Section manual. If this adjustment 

cannot satisfactorily be made, refer to the 

troubleshooting information of Service Sheet 2. 

b. Modulation distortion problems are verified 

by performing the appropriate distortion test determined 

by the modulation type (refer to Section IV of this 

manual). If the test indicates an excessive distortion 

level is present in the RF output signal, the source of the 

distortion must be determined. Measurements of the 

signals from the Modulation 

Section may be made at the J6 connector after the RF 

Section has been removed. For each modulation type, 

the output distortion is typically


Figure 8-4. System Test Point Locations 

8-17


MAINFRAME INTERCONNECT JACK 

Figure 8-5. Mainframe Interconnect Jack 

8-17A

Figure 8-6. System Troubleshooting Block Diagram 

8-17B 



NOTE 

When a malfunction occurs, refer to Section VIII of 

the HP Model 8660-series mainframe Operating and 

Service Manual to begin trouble-shooting (System 

Troubleshooting Guide). Then, if that information 

indicates possible problems in the RF Section, refer 

to the System Troubleshooting information (Service 

Sheet 1) in this manual. This information may be 

used to isolate the defect to the RF Section, another 

plug-in, or the mainframe. If the problem is in this 

plug-in, return to this service sheet for further 

troubleshooting information. 

ANALOG CIRCUITS 


General 

The LO and RF input signals from the frequency Extension 

Module are mixed and the difference frequency output is 

amplified and coupled to the OUTPUT jack. Thus, frequencies 

between 1 and 1300 MHz may be selected in 1 Hz steps. 

The RF output voltage level is detected and compared to a 

stable reference. The result-ant error voltage is used to 

control the level of the RF signal as it is passed through the 

Modulator assembly. This ALC (Automatic Level Control) 

loop, therefore, maintains a relatively constant output level 

across the system’s specified output range. 

The RF output level may be either locally controlled (front 

panel operation) or remotely controlled (programmed input). 

In either case, the logic control input is coupled to the Logic 

Section. This input data is manipulated so it selects the level 

of attenuation of the RF output signal by controlling the 10 

and/or 1 dB Step Attenuators. 

A power supply, RF interconnections, and a 20 MHz amplifier 

are contained in the RF Section. They supply the power and 

RF signals which operate the Frequency Extension Module. 

Phase Modulator Section 

The phase modulation drive signal from the Modulation section 

is coupled to the A16 Phase Modulation Driver Assembly 

where it passes through a gain tracking circuit (frequency 

variable attenuator). This circuit keeps the phase deviation 

constant with change in system center frequency because the 

sensitivity of the phase modulator circuitry changes with 

respect to the LO frequency. The signal is then amplified and 

coupled to the Phase Modulator Assembly. 

Phase modulation of the LO signal occurs when the signal 

(which passes through the Circulator Assembly to the Phase 

Modulator Assembly) is reflected back into the circulator. The 

phase of the reflected signal with respect to the incident signal 

is dependent on the instantaneous modulation drive voltage 

present at the phase modulator. The LO signal is first passed 

8-18 


through the isolator, through port 1 (J1) to port 2 (J2) of the 

circulator, and on to the phase modulator. The reflected signal 

is passed from port 2 to port 3 (J3) where it is again reflected 

from the phase modulator with additional phase shift 

approximately equal to that which occurred at port 2. The 

signal is passed from port 3 to port 4 (J4) and through the 3 dB 

attenuator to the 4 GHz Amplifier Assembly. 

In other than option 002 instruments (no phase modulation 

circuits), the LO signal is coupled directly from FL1 to the A8 

4.0 GHz Amplifier Assembly. 

Mixer Section 

The mixer output is derived from mixing the LO and RF inputs. 

The phase modulated or cw LO signal is amplified and 

coupled to the Mixer Assembly. The RF signal passes through 

the Isolator (20 dB reverse isolation) to the Modulator 

Assembly where it encounters variable series attenuation. 

The series attenuation is controlled by the bias signal from the 

ALC feedback loop. The modulator’s RF output signal is 

coupled directly to the Mixer where it is mixed with the LO 

signal. The difference frequency output is coupled to the 

Amplifier/Detector Assembly. 

Amplifier/Detector Section 

The RF input to the Amplifier/Detector Assembly is amplified 

41 dB. This high level signal is coupled to the 10 dB Step 

Attenuator. 

The Amplifier/Detector Assembly also contains the RF 

Detector circuit. It produces a dc voltage which is proportional 

to the peak RF output voltage. This signal, which is amplified 

to drive the front panel meter and the AM Gain compensation 

circuits in the Reference Assembly, is also coupled to the ALC 

Amplifier Assembly. 

ALC Section 

Reference Assembly. In the Local Mode, the RF output level 

is set by the front panel controls. The unmodulated RF level to 

the 10 dB Attenuator is set by the ALC loop’s dc bias voltage 

which, in turn, is controlled by the VERNIER setting. 

In the AM mode the modulation drive signal is superimposed 

on the reference voltage. The average amplitude of the RF 

output is dependent on the average dc level (which is equal to 

the dc reference voltage) while the instantaneous RF output 

voltage and its rate of change (modulation characteristics) are 

dependent on the superimposed modulation drive signal. 

In the remote mode, the entire system responds to 

programmed inputs; the front panel controls of all instruments 

are inhibited. In the RF Section, the reference output is 

coupled to the ALC Assembly through the 1 dB Step 

Attenuator. Therefore, the vernier function is controlled by the 

1 dB Step Attenuator. 

ALC Amplifier. The ALC Amplifier compares the Detector 

Amplifier Assembly output to the Reference Assembly output. 

Any change


in the detected RF level or the reference level is immediately 

reflected at the ALC assembly output. This output is coupled 

to the A5 Modulator Assembly as the Modulator Bias signal. 

Because the RF input to the 10 dB Step Attenuator is directly 

proportional to the Modulator RF output level (which is 

controlled by the Modulation Bias Signal), the ALC feedback 

loop is completed. 

Pulse Modulation Circuits. During Pulse Modulation, the 

ALC loop is opened at the ALC Amplifier output. With no 

signal input, a positive bias voltage to the A5 Modulation 

Assembly causes the RF signal output to be at least 40 dB 

down (60 dB down at center frequencies >1300 MHz) from the 

"on-condition". A -10 Vdc pulse biases the RF "on". 

Attenuation Section 

The Attenuator Section operates identically in local and remote 

modes. The inputs from the Logic Section (10D, 20D, 40D, 

and 80D) select the level of attenuation of the RF signal 

passing through the 10 dB Step Attenuator. 

TROUBLESHOOTING 

It is assumed that a problem has been isolated to the RF 

Section as a result of using the System Troubleshooting Guide 

found in Section VIII of the HP Model 8660-series mainframe 

Operating and Service Manual and the information entitled 

System Troubleshooting on Service Sheet 1. Troubleshoot the 

RF Section using the test equipment, information, and 

procedures which follow. 

Test Equipment 

Spectrum Analyzer ......................HP 8555A/8552B/140T 

Oscilloscope ...............................HP 180C/1801A/1821A 

Digital Voltmeter ..........................HP 34740A/34702A 

Test 1. It is good practice to first check the power supply 

inputs to the RF Section and at the same time, it may help to 

check AM, Pulse ID or any other inputs which relate to the 

problem. The inputs may be checked at the A12 Assembly 

test points on the right-side rear of this plug-in. 

A12 Assembly Test Points 

-10V -10.0 + 0.1 Vdc 

+ 20V + 20.0 + 0.1 Vdc 

-20Vu -21.0 + 0.2 Vdc 

+ 20VI +20.0 + 0.2 Vdc 

Test 2. If the problem is related to incorrect output level, 

proceed to Test 3. If it is a unique type problem such as 

amplitude modulation, noise, etc., refer to the following items 

for additional troubleshooting hints. 

a. Frequency Problems. Normally not caused by RF 

Section. Refer to Section VIII of the mainframe manual or 

Service Sheet 1 of this manual. 

8-18A 


b. Spurious Signals. May be isolated by checking for 

signal at various locations in the RF Section. Setting the A4S1 

switch to Test may help to isolate the problem to the RF 

circuitry or ALC loop. 

c. Noise. Generally, noise originates in Frequency 

Extension Module or the A15 20 MHz Amplifier Assembly. 

d. Amplitude Modulation. Verify that the AM signal 

reaches the A10 Reference Assembly. 

If amplitude modulation level changes with an RF level 

change, check the RF Section front panel meter reading 

versus measured RF OUTPUT level. If the panel meter 

reading is correct, refer to Service Sheet 7 (check AM Gain 

input and related circuits). Otherwise, check the meter driver 

amplifier and related components shown on Service Sheet 6. 

Distortion problems may be caused by defective components 

associated with the ALC Bandwidth Input. Check the logic 

inputs from Service Sheet 3. Then refer to Service Sheet 3, 6, 

or 7. 

If the amplitude modulation level differs from the level shown, 

perform the related adjustment procedures in Section V to see 

if the error is corrected. Be sure the fault isn’t in the 

Modulation Section. An input of 1.0 Vrms to the A10 

Reference Assembly should equal 100% AM level. 

e. Phase Modulation. The output of the A16 Phase 

Modulator Driver Assembly is a distorted sinusoidal waveform 

of approximately 7.5 Vp-p a full scale Modulation Section 

meter indication. If the output is incorrect, check the output of 

the cable, W12, to determine if W12 or A16 is defective. The 

output should be 1.5 Vrms. If the output of the A16 assembly 

is correct, either W14 or A17 is defective. Refer to the 

paragraph entitled LO Signal Circuits Repair procedure in 

Section VIII of this manual for disassembly and repair 

procedures. 

Phase modulation distortion problems in the RF section will 

generally be caused by the A16 Phase Modulator Driver 

Assembly or the A17 Phase Modulator Assembly. Refer to 


NOTE 

Excessive incidental AM during phase modulation 

may be caused by incorrect operation of the 50 MHz 

Low Pass Filter. Check the control input and the RF 

output level of the filter. Refer to Service Sheet 4. 

f. Pulse Modulation. Problems may be isolated by 

checking Pulse In and Pulse ID inputs. Also, check continuity 

from A5 Modulator Assembly inputs from Auxiliary Section. 

g. Incorrect Front Panel Meter Reading. Refer to 

Test 3. 

Test 3. If the RF output level is incorrect by more than 1 or 2 

dB, proceed to Test 4. Otherwise check the 10H input to the 

A10



Assembly related components. Refer to Service Sheet 3 if the input is incorrect. If necessary refer to Section V and perform the RF 

Output Level and 1 dB Step Attenuator Adjustment procedures. If the Adjustments cannot be done or do not correct the tracking 

across the VERNIER range, check the Meter Driver and meter circuitry, and the AM Gain circuits. Refer to Service Sheets 6 and 7 

respectively. Also check the circuits in the A4 Assembly which are influenced by the 10H input. 

Test 4. Proceed to Test 5 if the RF output level is higher than normal. The RF outputs listed in each step of this test (4) are lower 

than normal. The voltages enclosed in parenthesis are Modulator Bias Signal ranges. They indicate that the ALC loop is (1) holding 

the RF output low, (2) is trying to increase the RF output or (3) that a quiescent level, although incorrect, has been reached. Refer to 

the block diagram for the normal range of Modulator Bias Signal levels. 

a. The RF output is low but the ALC loop is trying to increase the level (>-3 Vdc). Check the RF outputs of FL1, 

A7, and A6 to isolate the problem to Service Sheets 4 (for other than option 002 instruments), Service Sheets 4 or 5 (option 002 

instruments only), or Service Sheet 6 respectively. 

If the output of FL1 is correct and the output of A7 is incorrect, the problem may be on either Service Sheets 4 or 5 in option 002 

instruments. In this case, refer to the LO Signal Circuits Repair procedure and the Troubleshooting Block Diagram to isolate the 

problem to an assembly or cable. 

On other than option 002 instruments, if the output of A7 is defective, refer to Service Sheet 4. 

Each of these assemblies and circuits, if defective, must be replaced as a unit with the exception of A7. If A7 is defective, refer to 

Service Sheet 4 for further troubleshooting information. 

b. The RF output is low and the ALC loop is holding the modulator Bias Signal level low (>+10 Vdc). First, check 

the A10 reference Assembly output with the VERNIER control set to the pw and ccw position with A4S1 in the Normal position. If the 

output is abnormal, refer to the troubleshooting information on Service Sheet 7. A normal output indicates the defect is either on the 

A3 ALC Assembly, or the A4 Detector Amplifier Assembly. 

Set the A4S1 switch to the Test position. If the Modulator Bias Signal exhibits the same response as shown in the following table, the 

problem is probably in the A4 Detector Amplifier Assembly. (Check the Detector Signal input at A4 pin 11.) 

System Troubleshooting Block Diagram 


8-18B



Modulator Bias Signal 

A4S1 Vernier Control Settings 

Switch CW CCW 

904 907 904 907 

Normal +0.2 Vdc +0.4 Vdc +1 to +0.8 Vdc 

+11 Vdc 

Test -4 Vdc -3.0Vdc +0.3Vdc +0.5Vdc 

c. The Modulator Bias Signal is at a quiescent level 

but is lower (more positive) than normal. 

Check the A10 Reference Assembly output level. If the output 

is lower (more positive than normal), check the 1A, 2A, 4A, 

and 8A inputs to the A10 Assembly (remote mode only). If 

they are correct or the instrument is in local mode, refer to 

Service Sheet 7. If the remote inputs are incorrect or the 

problem is associated with the 10 dB Step Attenuator, refer to 

troubleshooting information on Service Sheet 3. Otherwise, 

check the detector output and reference at A4 pin 10 and 11. 

Refer to Service Sheet 6. 

Test 5. The RF outputs listed in each step of this test are 

higher than normal. The voltages enclosed in parentheses are 

Modulator Bias Signal ranges. They indicate that the ALC loop 

(1) is holding the RF output high, (2) is trying to decrease the 

output level or (3) that a quiescent level, although incorrect, 

has been reached. Refer to the block diagram for normal 

values of Modulator Bias Signal. 

3-18 C 

a. High RF output level; the ALC has in-creased the 

level (>, -3 Vdc). Check the A10 Reference Assembly output. 

If the response to VERNIER control settings is abnormal, refer 

to Service Sheet 7 and troubleshoot the A10 Assembly. If the 

response is normal, set the A4S1 switch to test. If the 

Modulator Bias Signal responds to the VERNIER control 

settings as indicated by the table of Test 4b, check that the 

detector output responds properly to the increased RF signal 

level (check A4 pin 10 and 11) and refer to Service Sheet 6. 

Otherwise, turn to Service Sheet 7 and continue 

troubleshooting. 

b. High RF output level; the ALC is trying to 

decrease the level (, >+10 Vdc). The A5 Modulator 

Assembly or associated circuitry is probably defective (refer to 

Service Sheet 4). 

c. The Modulator Bias Signal is at a quiescent level 

but higher (more negative) than normal. 

Check the A10 Reference Assembly output. If the A10 output 

is more negative than normal, check the 1A, 2A, 4A, and 8A 

inputs to the A10 assembly (remote mode only). If the A10 

outputs are correct or the instrument is in local mode, refer to 

Service sheet 7. If the remote inputs are incorrect or the 

problem is associated with the 10 dB Step Attenuator, refer to 

the troubleshooting information on Service Sheet 3. 

Otherwise, check that the detector output responds properly to 

the increased RF signal level (check A4 pins 10 and 11). 

Refer to Service Sheet 6.

Figure 8-7. RF Section Simplified Block Diagram 

8-19 


Figure 8-8. Main Troubleshooting Block Diagram 

8-19A 



NOTE 


the HP Model 8660-series mainframe Operating and 

Service Manual to begin troubleshooting (System 

Trouble-shooting Guide). Then, if that information 

indicates possible problems in the RF Section, refer 

to the System Troubleshooting information in Service 

Sheet 1. This information may be used to isolate the 

defect to the RF Section, another plug-in, or the 

mainframe. If the problem is in this plug-in, return to 

Service Sheet 2 for further troubleshooting 

information. 

LOGIC CIRCUITRY 


General 

In this instrument, logic inputs to the analog circuits control 

functions such as 1 dB and 10 dB steps of attenuation of the 

RF output signal. These inputs also influence the phase 

modulation signal. 

In the remote mode, all control signals are external to the RF 

Section. In the local mode, the OUTPUT RANGE switch 

selects the range by using a binary coded hexadecimal output 

with an extra overrange line. Also, the VERNIER control is 

analog in nature. 

Filter Control Assembly 

The ninth and tenth digit BCD inputs from the mainframe (100 

MHz and 1 GHz) are used to control the A7A5 50 MHz Low 

Pass Filter. 

The decoder circuit determines when the frequency output 

from the A7 Assembly is greater than 100 MHz. The A7A5 50 

MHz High Pass Filter is switched on which effectively traps 

any low frequency phase modulation drive signals which would 

otherwise be amplified and passed on to the RF output. 

Logic Assembly 

Local operation of the 10 dB Step Attenuator is selected by a 

logic high on the LCL/RMT input. Thus, control of the 10 dB 

Step Attenuator by the inputs from the front panel OUTPUT 

RANGE switch is enabled while the remote inputs are 

inhibited. 

In Remote mode, a logic low in the LCL/RMT inputs inhibits 

front panel control and enables data information flow from the 

mainframe to the Logic Assembly. The ATTN CLK controls 

the actual data input on the PI-1, PI-2, PI-4, and PI-8 lines. 

The OUTPUTS to the 10 dB Step Attenuator (10L, 20L, 40L, 

8-20 


80L), the over-range (10H), and the 1 dB Step Attenuator 

outputs (1A, 2A, 4A, 8A) are all controlled by external 

programming in the Remote Mode. A safety feature, the 

RESET input, sets the 10 dB Step Attenuator to the maximum 

attenuation when the Remote mode is first initiated. 

Attenuator Driver Assembly 

The inputs from the Logic Assembly (10L, 20L, 40L, and 80L) 

switch the equivalent attenuator drive outputs (10D, 20D, 40D, 

and 80D). These outputs provide the higher voltages and 

current needed to drive the relays in the A13 Attenuator 

Assembly. 


Malfunctions in the RF Section which appear to be a logic 

problem may be an analog circuit problem. Refer to Service 

Sheet 2 to begin troubleshooting and return here if necessary. 


Oscilloscope ......................................HP 180C/1801A/1821A 

Digital Voltmeter ................................HP 34740A/34702A 

Logic Probe .......................................HP 10525T 

General 

If the malfunction is isolated to the logic circuits, the related 

inputs must be checked before an attempt is made to 

troubleshoot the individual circuit assemblies. The control 

levels are fixed and may change when a new center frequency 

or mode of operation (local or remote) has been selected. The 

clocked or momentary inputs, PI (plug-in), ATTN CLK, and 

RESET occur only at the instant the center frequency or mode 

change is made. 

Local Mode 

In local mode, the inputs mentioned in the preceding 

paragraph are not used. The 1A, 2A, 4A, and 8A outputs are 

also not used. (VERNIER control replaces the 1 dB step 

attenuator.) Check the 1F, 2F, 4F, 8F, and 1H inputs against 

the levels shown for the S1 switch in the diagram. 

Remote Mode 

Check the Logic Assembly PI, ATTN CLK, and RESET inputs. 

Switch to the local mode and then back to the remote mode of 

operation. Verify that the attenuation level has reset to 150 dB 

by checking the 10L, 20L, 40L, 80L, and 10H outputs [10H and 

10L should be low (+2.0 Vdc)]. The momentary low 

input (O Vdc as compared to the normal +5 Vdc) may be 

observed on an oscilloscope at the instant of switching. A 

logic probe may also be used to verify the presence of the 

reset pulse. To verify that the PI (data) and ATTN CLK inputs 

are correct, program the information shown in the table at the 

Main Troubleshooting Block Diagram 

SERVICE SHEET 2



bottom of this page. Check each output for the correct level. 

If any level is incorrect, the presence of the data and/or the 

ATTN CLK inputs may be checked at the instant of 

programming with an oscilloscope or logic probe. 

Check the A9 Attenuator Driver Assembly outputs against the 

inputs. 

8-20A 

NOTE 

If the problem is isolated between the inputs and 

outputs of an assembly, refer to the appropriate 

Service Sheet as indicated on the diagram.

Figure 8-9. Logic Troubleshooting Block Diagram 

8-21 




NOTE 

When a malfunction occurs, refer to Section VIII of the HP Model 8660-series mainframe Operating and Service 

Manual to begin troubleshooting (System Troubleshooting Guide). Then, if that information indicates possible 

problems in the RF Section, refer to the Systems Troubleshooting information (Service Sheet 1). This information 

maybe used to isolate the defect to the RF Section, another plug-in, or the mainframe. If the problem is in this plugin, 

refer to Service Sheet 2 for further troubleshooting information. 

MIXER SECTION 


General 

The LO signal is filtered and amplified to drive the mixer. The RF signal is leveled and may be amplitude modulated at the A5 

Modulator Assembly. After passing through the Modulator, the RF Signal and LO Signal are mixed; the difference frequency is passed 

on for further amplification. 

4 GHz Bandpass Filter/Amplifier 

Unwanted sidebands are eliminated from the LO signal by passing the signal through a bandpass filter. In option 002 instruments, the 

LO signal is coupled to the phase modulation circuits before being input to the 4 GHz Amplifier. The signal is amplified to a high level 

to drive the mixer. 

Isolator 

The 3.95 to 2.75 GHz RF Signal is passed through the Isolator to the Modulator Assembly. Reverse signal attenuation is about 20 dB. 

Modulator Assembly 

The effect of the PIN diode Modulator on the RF Signal is that of a variable attenuator. The level of attenuation and therefore the 

modulator RF output is dependent on the Modulator Bias Signal dc level. 

The PIN Diode Modulator has dynamic attenuation range of >50 dB. A more positive modulator bias signal turns off the series diodes 

while the shunt diodes are forward biased. The shunt diodes and the series resistor form a voltage divider which attenuates the RF 

Signal. As the bias voltage goes more negative, the impedance of the shunt diodes increases while the series diodes impedance 

decreases. Therefore, the RF signal attenuation decreases. The shunt diodes effectively control the attenuation from 12 to >50 dB 

down while the series diodes are effective only to about 12 dB down. 

8-22 

Logic Troubleshooting Block Diagram 

SERVICE SHEET 3



The RF output level at the front panel jack is directly 

proportional to the Modulator Assembly RF output. The 

Modulator Bias Signal controls the A5 Modulator Assembly 

output and is dependent on an error voltage derived from 

comparing the RF detector output to the reference dc level. 

Mixer Assembly 

The RF Signal is passed through a low pass filter and 

attenuator before leaving the Modulator Assembly. Then the 

RF signal is mixed with the LO signal in the Mixer Assembly, 

the mixer output passes through a low pass filter, and the 

difference frequency is a 1-1300 MHz phase-locked signal with 

frequency resolution of 1 Hz. 

At center frequencies >, 100 MHz, the High Pass Filter Control 

input from the A20 Filter Control Assembly to the A7A5 

Assembly causes the mixer output to pass through the 50 MHz 

High Pass Filter. This reduces incidental AM distortion 

generated by the phase modulated signal in the balanced 

mixer. 


It is assumed that the troubleshooting information on Service 

Sheet 1 was used to isolate a circuit defect to the assemblies 

or cables shown on the accompanying diagram. Troubleshoot 

the Mixer Section by using the test equipment and procedures 

given below. 

NOTE 

In Option 002 instruments, a defect cannot easily be 

isolated to circuits shown on this schematic diagram. 

Refer to Service Sheet 2 and the repair procedure 

entitled LO Signal Circuits Repair. 

8-22A 


Spectrum Analyzer ...................HP 8555A/8552B/140T 

Power Meter .............................HP 435A/8481A 

Digital Voltmeter .......................HP 34740A/34702A 

Service Kit ..............................HP 11672A 

Test 1. Check the power supply inputs to the A8 Assembly 

(+20V and -10V). If correct, proceed to Test 2. Otherwise 

check for continuity of interconnections to mainframe or an A8 

Assembly defect. 

Slight but repeated bending of semi-rigid coaxial 

cables will damage them very quickly. Bend the 

cables as little as possible. If necessary, loosen 

the assembly to release the cable. 

Test 2. If the RF power output is greater than normal (refer to 

the schematic), the A5 Modulator Assembly is probably 

defective. If the power output is less than normal, checking 

the difference assembly outputs will quickly isolate the 

defective assembly or cable. 

NOTE 

Defects in the A15 20 MHz Amplifier Assembly and 

RF interconnections from mainframe to Frequency 

Extension Module (through the RF Section) normally 

will be isolated by using the Systems Troubleshooting 

(Service Sheet 1).

Figure 8-10. A7 Mixer Assembly’s subAssembly and Component Locations 

8-23 


Figure 8-11. Mixer Section Schematic Diagram 

8-23A 




NOTE 

When a malfunction occurs, refer to Section VIII of the HP Model 8660-series mainframe Operating and Service 

Manual to begin troubleshooting (System Troubleshooting Guide). Then, if that information indicates possible 

problems in the RF Section, refer to the Systems Troubleshoot- ing information which precedes Service Sheet 1. 

This information may be used to isolate the defect to the RF Section, another plug-in, or the mainframe. If the 

problem is in this plug-in, refer to Service Sheet 1 for further troubleshooting information. 


General 

The phase modulation drive signal from the modulation section is coupled to the A16 Phase Modulation Driver Assembly. The signal 

is predistorted and the overall gain is varied (with respect to LC frequency) to compensate for the frequency sensitivity of the Al’7 

Phase Modulator Assembly. The signal is amplified before being connected to the phase modulator. 

With minimal loss, the LO signal passes through the A19 3.9-4.1 GHz Isolator Assembly to the A18 Circulator Assembly. The signal 

passes from port 1 to port 2 and on to the phase modulator. In the phase modulator, the varactor diode, A17A1CR1, reactively 

terminates the stripline transmission line which reflects the LO signal. Changing the bias voltage applied to the varactor diode 

changes the termination reactance. This causes the reflected signal to shift in phase with respect to the incident input signal. The 

reflected LO signal travels back down the transmission line and through port 2 to port 3, where it again enters the phase modulator. 

The same sequence of events occurs. Thus, the phase shift of the LO signal reflected back to port 3 is approximately doubled. 

The phase modulated LO signal continues from port 3 to port 4, through the AT2 3 dB Attenuator and on to the A8 4 GHz Amplifier 

Assembly. Due to the high input reflection coefficient of the 4 GHz: Amplifier, a large portion of the signal is reflected back to port 4, 

through to port 1, and on to the Frequency Extension Module. The AT2 3 dB Attenuator and A19 3.9-4.1 GHz Isolator Assemblies, 

reduce the level of the reflected signal to minimize the interference created in the extension module VCO circuits. 

A16 Phase Modulator Driver Assembly 

The shunt capacity of W12 and A16L1 forms a low pass filter which improves the frequency response of the input modulation drive 

signal up to 10 MHz. 

8-24


Diode Shaping Network. The shaping network introduces 

third order distortion to higher level input signals (when the 

A16CR2 diode begins to conduct). The level of distortion is 

adjusted with A16R1 to compensate for the third order 

distortion inherent in the phase modulator transfer 

characteristics. The demodulated third order phase 

modulation sidebands are minimized by adjusting A16R1, the 

Third Harmonic Adjust control. 

Gain Tracking. Gain tracking of the modulation drive signal is 

introduced to compensate for the phase modulator’s inability to 

produce a constant phase deviation at different LO 

frequencies. At higher LO frequencies, the phase modulator 

sensitivity is lower and a higher level modulation drive signal is 

required to produce the same phase deviation. The 

modulation drive signal level is changed, with respect to the 

LO frequency, by the digitally controlled attenuator A16U1 and 

differential amplifiers A16Q1 and Q2. At system center 

frequencies where digit 8 (10 MHz steps) is zero (LO 

frequency is 3.95 MHz) logic lows (< +0.8 Vdc) are present at 

inputs to A16U1. Lows cause cause the attenuator stage to 

be off with minimum attenuation of the signal at the junction of 

A16R12, R13. The differential voltage across the bases of 

A16Q1 is essentially zero and the gain is unity. When an input 

to A16U1 is high the transistor stage is turned on, current 

flows from the modulator drive signal path through either 

A16R4, R6, R8, or R10. Any difference in amplitude between 

the bases of A16Q1 is amplified and coupled to A16Q2 where 

it is further amplified. The differential output voltage across 

A16R27 is coupled to the gate of A16Q4. The gain control, 

A16R2, sets the modulation level at 3.95 GHz (unity gain). 

The Gain Tracking control adjusts the rate of change of 

attenuation with respect to the LO frequency by setting the 

phase modulation level at 4.05 GHz (maximum gain). 

J-FET Shaping Circuit. The J-FET A16Q1 is biased so it 

introduces second order distortion to the modulation drive 

signal. This distortion compensates for the second order 

distortion in the transfer characteristics of the phase 

modulator. The transfer characteristics of the phase 

modulator are varied by changing the dc output from the A16 

Assembly. The Second Harmonic Adjust Control A16R3 sets 

the second order distortion level of A16Q1 (by controlling the 

drain current flow) and the dc output from A16 (which is 

proportional to the A16Q1 drain voltage). The distortion level 

is set by demodulating the system’s RF output and nulling the 

second order harmonic distortion. 

Modulation Driver Amplifier. The J-FET output is coupled to 

the discrete component operational amplifier made up of 

A16Q5 through Q7 and their associated components. The 

amplifier’s high frequency rolloff is set by A16C7. The gain of 

approximately 10 is determined primarily by A16R49, 100O2, 

and A16R38, 110. The network of A16RT1, A16R38 and R39 

aid in reducing gain changes due to J-FET drift with 

temperature. 

8-24A 


A17 Phase Modulator Assembly. In the phase modulator, 

the LO signal passes through the blocking capacitors and 

down the stripline transmission lines to the varactor diode 

terminations, A17A1CR1 and CR2. The amount of phase shift 

between the incident and reflected signals is determined by 

the varactor capacitance. 

The varactor capacitance is voltage variable. The dc bias 

input sets the quiescent phase shift. The instantaneous phase 

shift is dependent on the sum of the dc bias and the ac 

modulation drive signal input to the phase modulator. 


It is assumed that the troubleshooting information on Service 

Sheet 2 and the LO Signal Circuits Repair procedure were 

used to isolate the defect to one of the Assemblies. 

Troubleshoot the A16 or A17 Assemblies by using the 

following procedure. 


Digital Voltmeter ..............................HP 34740A/34702A 

Oscilloscope.. ..................................HP 180C/1801A/1821A 

Spectrum Analyzer ..........................HP 8555A/8552B/140T 

A16 and A17 Assembly circuit malfunctions usually result in 

incorrect or no modulation drive, incorrect gain tracking, or 

unwanted distortion. Distortion may be due to misadjusted or 

defective components. 

Set the system’s modulation section switches for OM mode, 

internal 1 kHz source, and adjust the modulation level control 

for a full scale meter reading (100° or 200°). Refer to the 

schematics for the typical voltages. 

Al Modulator Filter Assembly 

A2 ALC Mother Board Assembly 

A5 Modulator Assembly 

A7 Mixer Assembly 

A8 4 GHz Amplifier Assembly 

A12 Logic Mother Board Assembly 

A15 20 MHz Amplifier Assembly 

AT1 Isolator 

FL1 4 GHz Band Pass Filter 

SERVICE SHEET 4


1 kHz source, and adjust the modulation level control for a full 

scale meter reading (1000 or 200°). Refer to the schematics 

for the typical voltages. 

A16 Assembly 

Test 1. Check the power supply inputs to the A16 Assembly. 

Test 2. Check the peak-to-peak ac voltages at the various 

points as indicated on the schematic. If all seem to be correct, 

refer to Section V and readjust the phase modulation circuits. 

Test 3. If the output of the discrete component operational 

amplifier is defective, check the dc output and compare it to 

the dc inputs. If the change in dc output voltage from normal 

does not 

8-24B 


follow the change in input dc voltage, the problem is probably 

in Q4 through Q10 or their associated components. For 

example, the output voltage is more positive than normal. 

Test 4. Check the dc voltages on A16Q1 through Q3 and Qll. 

Test 5. If the gain tracking is incorrect, check and compare 

the inputs and outputs of A16U1 and U2. 

A17 Assembly 

Test 1. Remove the assembly cover. Check for the presence 

of the dc bias and ac voltage on the varactor diodes, A17CR1 

and CR2. 

Test 2. Verify that A17C1 and C3 are not defective.

Section 8 

Figure 8-12. A16 Phase Modulator Driver Assembly Component and Test Point Locations 

Figure 8-13. A17 Phase Modulator Assembly component Locations 

8-25 


Figure 8-14. Phase Modulation Section Schematic Diagram (Option 002) 

8-25A 




NOTE 

When a malfunction occurs, refer to Section VIII of the Model 8660-series mainframe Operating and Service Manual 

to begin troubleshooting (Systems Troubleshooting Guide). Then, if that information indicates possible problems in 

the RF Section, refer to the Systems troubleshooting information in Service Sheet 1 in this manual. This 

information may be used to isolate the defect to the RF Section, another plug-in, or the mainframe. If the problem is 

in this plug-in, refer to Service Sheet 2 for further troubleshooting information. 


Amplifier/Detector Assembly 

The A6 1-1300 MHz Amplifier Assembly contains an RF Preamplifier and Amplifier which are separated by an elliptic low pass filter. 

The combined RF gain is approximately 41 dB. 

The RF Detector provides a dc output which is proportional to the peak RF output from the A6 Assembly. The dc level charges the 68 

pF capacitor which is coupled to the A3 Detector Amplifier Assembly. 

Detector Amplifier Assembly 

A small bias current through the RF and Reference Diodes is set by the A4R13 Detector Bias Adjustment for maximum detector 

sensitivity. Beyond the initial bias current, any further change in current flow is due to temperature variations. Because the two diodes 

are located in the same thermal environment, an increase in current flow through the RF Detector Diode is matched by an equal 

increase in current flow through the Reference Diode. The Reference Diode current is coupled to the non-inverting input of the 

Detector Amplifier (a discrete operational amplifier comprised of A4Q3, A4Q2, A4Q1 and associated components) while the RF 

Detector Diode output is coupled to the inverting output. Therefore, any change in current flow due to a change in temperature is 

cancelled in the operational amplifier which leaves the output level dependent only on the peak RF output from the A6 Assembly. 

At center frequenices of



As the center frequency is decreased, the detector output 

needs to be retained for a longer period of time so the leveling 

circuits respond to the average RF level rather than the 

instantaneous level. 

In output ranges of SO dBm, the Detector Amplifier is coupled 

directly to the A3 ALC Amplifier Assembly. The output is 

compared to a dc reference level and an error signal results 

which is coupled to the A5 Modulator Assembly to complete 

the ALC loop. When OUTPUT RANGE switch is set to +10 

dBm, the 10OH logic input goes high (x+5 Vdc) and turns 

A4Q5 off. Relay A4K1 opens and the dc voltage is attenuated 

10 dB by A4R19, A4R20, A4R21, and resistors on the A3 

assembly. The RF output signal increases 10 dB which brings 

the dc output to the A3 ALC Amplifier input back to the 

quiescent level present before switching to the +10 dBm 

range. 

Amplifier A4U1 functions as an active low pass filter because 

of A4R23 and A4C5 which are connected in the feedback 

loop. The amplifier drives the meter and provides a 

compensating dc level which varies the AM drive input to keep 

the amplifier modulation level constant with change in RF 

output level (VERNIER Control setting). 


It is assumed that the troubleshooting information Service 


shown on the accompanying diagram. Troubleshoot the 

Amplifier/Detector and Detector Amplifier Assemblies by using 

the test equipment and procedures given below. 

8-26A 


Spectrum Analyzer ..........................HP 8555A/8552B/140T 

Digital Voltmeter ..............................HP 34740A/34702A 

Test 1. If the circuit problem is associated with the meter and 

AM Gain output rather than the RF Output level, proceed to 

Test 2. Check the Detector Output, Detector Amplifier Output 

A4TP1, and output to ALC Amplifier to see if they are tracking 

the RF output level. Set A4S1 to the test position. If the RF 

Amplifier output remains low, the A6 assembly or an 

associated cable is probably defective. If the RF output 

increases, measure the detector and A4TP1 and A4TP2 

voltages. If the detector output doesn’t respond properly, the 

A6 assembly or an associated input component on the A4 

assembly, is probably defective. If the detector output 

increases but the A4TP1 voltage doesn’t go more negative, 

the Detector Amplifier or an associated component is probably 

defective. 

If the RF output level is incorrect only in the +10 dBm range or 

is correct only in the +10 dBm range, and the 10H input is 

correct for all ranges, the 10 dB attenuator, the relay (A4K1), 

or an associated component is probably defective. 

Test 2. Monitor the RF output with a Spectrum Analyzer. If 

the modulation level changes with respect to the RF carrier 

amplitude (change the VERNIER control to three or four 

different settings), A4U1 or associated components are 

probably defective. Otherwise, the meter control is 

misadjusted or the meter connections or an associated 

component is probably defective.


Figure 8-15. A4 Detector Amplifier Assembly Component and Test Point Locations. 

8-27

Figure 8-16. Amplifier/Detector Section Schematic Diagram 

8-27A 




NOTE 

When a malfunction occurs, refer to Section VIII of the Model 8660-series mainframe manual to begin 

troubleshooting (Systems Troubleshooting Guide). If the information then indicates possible problems in the RF 

Section, refer to the Systems Troubleshooting information Service Sheet 1 in this manual. This information may be 

used to isolate the defect to the RF Section, another plug-in, or the mainframe. If the problem is in this plug-in, refer 

to Service Sheet 2 for further troubleshooting information . 


General 

The detected signal output from the A4 Detector Amplifier Assembly is coupled into the A3 ALC Amplifier Assembly where it is 

compared to the reference input. Any difference in dc input levels causes an error output signal (i.e., a change from the loop quiescent 

state) at the difference amplifier output A3TP1. The error signal is coupled through the Gain-Shaping Amplifier to the A5 Modulator 

Assembly which controls the RF output level. The change in RF output level is reflected in a dc level change at the input to the dc 

amplifier. The change serves to balance the original error output signal at A3TP1. 

A10 Reference Assembly 

The Reference Assembly output is coupled to the ALC circuit where it is compared to the Detector Amplifier output. An error signal is 

generated which causes the RF signal to follow the reference dc level or, in AM mode, a low frequency ac signal which is 

superimposed on the reference dc output. 

A reference dc level is established by A1OVR1. This dc level is coupled to the inverting input of AlOUl where (in the +10 dBm range 

only) a small RF Detector diode linearity compensation current is added from the 10H input through resistor AlOR14. The output of 

AlOUl passes through a remotely controlled attenuator or an adjustable voltage divider which includes R1 VERNIER Control. This 

provides fine adjustment of the reference output, i.e., the RF Output level over a 10 dB range. 

The Amplitude Modulation drive signal is input at the non-inverting input of A1OU1. The AM Gain input is a dc compensation signal 

which effects the level of the AM drive input. As the VERNIER control is rotated cw, the dc level goes more negative which increases 

the RF Output level. At the same time a negative change of the AM Gain compensation increases the modulation drive signal 

attenuation of the AM drive signal input to A10U1. The resulting increase in modulation drive signal at the output of AlOUl tends to 

keep the percentage modulation level constant with change in RF output level. 

In the remote mode, the front panel VERNIER control of the RF output level is inhibited and the 1 dB step attenuator assumes 

"vernier" control over 

8-28


a 10 dB range. A logic low (40 dB down). A -10 

Vdc input pulse is required to cause the Modulator to exhibit 

minimum attenuation to the RF Signal. 


It is assumed that the Troubleshooting information on Service 


shown on the accompanying diagram. Troubleshoot the 

Reference and ALC Amplifier Assemblies and pulse 

modulation circuits by using the test equipment and 

procedures given below. 


Digital Voltmeter .........................................HP 34740A/34702A 

Test 1. Check the power supply inputs to the A3 and A10 

assemblies at A2XA3 pin 5 (+20V), pin 3 (+5V), and pin 8 (- 

10V) and A12XA10 pin D (+20V), pin C (+5V), and pin 5(-10V). 

If the voltages are correct proceed to Test 2. If incorrect, 

check the continuity of the inputs from the A12 Assembly. 

Test 2. Check the Reference Output at P14 Pin E. If the 

output level is incorrect for the extreme settings of the vernier 

control or 1 dB Step Attenuator settings, (see schematic for 

levels) proceed to Test 3. If the output is correct, set A4S1 

and check the levels at A3TP1 with the VERNIER (or 1 dB 

Step Attenuator) set to one extreme and then the other. If the 

output levels are normal, the Gain-Shaping Amplifier or the 

Modulator Bias Signal resistors are probably defective. Also 

check the Pulse ID input and the relays. Otherwise, the 

Difference Amplifier is probably defective. 

A4 Detector Amplifier Assembly 

A6 Amplifier/Detector Assembly 

SERVICE SHEET 6



Test 3. Check the reference diode A1OVR1, and Reference 

Amplifier AlOUl and their associated components. If the unit 

responds only to the local control or responds to remote 

control and not to the VERNIER, check the LCL/RMT input 

and the relay. If the reference output is incorrect in remote 

mode only, check the 1 dB Step Attenuator, relays, transistor 

switches, and other associated components. Small changes 

in RF Output level may be traceable to defective components 

coupled to the 10H input. If it was found that the amplitude 

modulation level varies with RF Output level, check the 

components associated with the AM Gain input. If the AM 

drive signal is reaching the RF Section, verify that it is 

reaching the A10 Assembly circuitry. Determine which 

component or part is defective, repair or replace it. 

Figure 8-17. A3 ALC Amplifier Assembly Component and Test Point Locations 

8-28B


Figure 8-18. A10 Reference Assembly Component Locations 

Figure 8-19. A2 ALC Mother Board Assembly Component Locations 

8-29


Figure 8-20. ALC Section Schematic Diagram 

8-29A



NOTE 


the Model 8660-series mainframe manual to begin 

troubleshooting (System Troubleshooting Guide). If 

the information then indicates possible problems in 

the RF Section, refer to the Systems Troubleshooting 

information in Service Sheet 1 of this manual. This 

information may be used to isolate the defect to the 

RF Section, another plug-in or the mainframe. If the 

problem is in this plug-in refer to Service Sheet 2 for 

further troubleshooting information before returning 

here. 


Logic high inputs (>+2.0 Vdc) from the All Logic Board 

Assembly will cause the driver transistors supply current to 

switch the appropriate attenuator section in the A13 Attenuator 

Assembly. A logic low (


Figure 8-21. A9 Attenuator Driver Assembly Component Locations. 

8-31

Figure 8-22. Attenuator Section Schematic Diagram 

8-31A 


SERVICE SHEET 9 TM 11-6625-2837-14 & P-7 

NOTE 


the Model 8660-series mainframe manual to begin 

troubleshooting (Systems Troubleshooting Guide). If 

the information then indicates possible problems in 

the RF Section, refer to the Systems Troubleshooting 

information in Service Sheet 1 of this manual. This 

information is used to isolate the defect to the RF 

Section, another plug-in, or the. mainframe. If the 

problem is in this plug-in, refer to Service Sheet 2 for 

preliminary troubleshooting information. 


Local (Front panel) Control 

The front panel OUTPUT RANGE switch provides a binary 

coded hexadecimal input (1F, 2F, 4F, 8F) and an over range 

input (1H) to the All Assembly in the local mode. The 

LCL/RMT input is logic high (>+1.3 Vdc) which causes the 

switch inputs to be gated directly to the outputs to the 

attenuator driver circuits and the 10H output. The following 

table shows the logic states of the inputs from the OUTPUT 

RANGE switch S1. The input signals are all active highs 

(attenuation) as are the outputs. 

Local Inputs to A11 Logic Assembly 

8-32 

Remote Operation 

In the remote mode, 3 digits of BCD attenuation information 

are clocked into the All Assembly Shift Registers from the 

System mainframe. On the ATTN CLK input, a series of 10 

pulses are received at pin K. These pulses are coupled to the 

trigger (T) input to the shift registers. The data input, which is 

synchronized with the pulses, contain no usable information 

for the first seven pulses. On the eighth pulse, units 

information is clocked into the left-handed column of registers 

with logic highs indicating data ones and lows indicating 

zeroes. On the ninth pulse, the units information is shifted to 

the center column of registers while tens information is entered 

into the left hand registers. On the tenth pulse, the units word 

is shifted into and stored in the right hand column, the tens 

information in the center registers, and the hundreds 

information in the left registers. 

The BCD information stored in the units registers is coupled to 

the 1 dB Step Attenuator on the A10 Reference Assembly. (In 

local mode these outputs are not used. The VERNIER control 

is used for fine control of output level.) 

The other two digits of BCD information are coupled to the 

BCD-to-Binary Decoder. The binary tens line actually 

bypasses the decoder because it expresses odd or even value 

in either the BCD or binary coded hexadecimal format. The 

second digit (20, 40 and 80) and third digit (100) in BCD 

format are output from the BCD-to-Binary Decoder in a 20, 40, 

and 80 binary format. With the tens level, these outputs are 

binary coded hexadecimal. In order to obtain the over-range 

output (10H), the 10, 20, 40 and 80 coded signals are inverted 

and coupled to a four input nand gate. The nand gate (overrange) 

output is low only with zero input attenuation (i.e., all 

the BCD-to-Binary Decoder output lines are low). The overrange 

level is coupled to All U5C and therefore to the 10H 

output. It is also coupled to the Full Adder along with the 10, 

20, 40, and 80 lines. The inputs to the adder are connected so 

a value of 10 is subtracted from the input with the Over-Range 

inactive (high); when the over-range line is low the output 

follows the input directly. The following tables express the 

assembly inputs and outputs, the BCD-to-Binary converter 

inputs and outputs, and the Full Adder inputs and outputs. In 

each case, a level of >+2.0 Vdc is a logic high and

SERVICE SHEET 9 (Cont’d) TM 11-6625-2837-14 & P-7 

8-32A



Full Adder 

Inputs Outputs 

A A A A C, B, B, B 4 3 2 1 

80 40 20 10 Over-Range 80 40 20 10 

L 

L L L 

L 

L 

L L L 

L 

L L H 

H 

L 

L L L 

L 

L H L 

H 

L 

L L H 

L 

L H H 

H 

L 

L H L 

L 

H L L 

H 

L 

L H H 

L 

H L H 

H 

L H L L 

L 

H H L 

H 

L H L H 

L 

H H H 

H 

L H H L 

H 

L L L 

H 

L H H H 

H 

L L H 

H 

H L L L 

H 

L H L 

H 

H L L H 

H 

L H H 

H 

H L H L 

H 

H L L 

H 

L 

L H H 

H 

H L H 

H 

H H L L 

H 

H H L 

H 

H H L H 

H 

H H H 

H 

H H H L 

Local Remote Multiplex 

The LCL/RMT input is a logic low in the remote mode. 

This enables the gates which are connected to the 

remote attenuation inputs (Full Adder and Over-range) 

so the remote signals drive the 10 Db Step Attenuator. 

At the same time logic inputs from the OUTPUT RANGE 

switch are inhibited. 


It is assumed that the troubleshooting information on 

Service Sheet 1 was used to isolate a circuit defect to the 

assembly shown on the accompanying diagram. 

Troubleshoot the Logic Assembly by using the test 

equipment and procedures given below. 


Digital Voltmeter .........................HP 34740A/34702A 

If the problem is evident only in the local mode of 

operation, check the OUTPUT RANGE switch, continuity 

of the connections to the All assembly, and the 

Local/Remote Multiplexer. Refer to the table showing 

8-32B 

the OUTPUT RANGE switch output. If the defect is 

evident only in the remote mode of operation, check the 

shift registers, the BCD-to-Binary Decoder, the Full 

Adder, and the Local/Remote Multiplexer for proper 

operation. Use the tables showing inputs versus outputs 

as a tool to isolate the defective component. If the defect 

is evident in both the Local and Remote modes, the 

Local/Remote Multiplexer or an associated component is 

probably defective. 

NOTE 

If the inputs and outputs of the All Logic 

Assembly are correct, check the 10 dB step 

attenuator (Service Sheet 6) in all ranges, the 10 

dB attenuator in the A4 Detector Amplifier 

Assembly, and the 1 dB Step Attenuator in the 

A10 Reference Assembly (also the 10OH inputs 

and associated components). Also, check 

the 1 dB and 10 dB Step Attenuator outputs with 

attenuation inputs of 1, 2, 4, and 8 dB and 10, 

20, 40, and 80 dB.

Figure 8-23. A11 Logic Assembly Component Locations. 

8-33 


Figure 8-24. A11 Logic Assembly Schematic Diagram. 

8-33A 



DISASSEMBLY AND INTERCONNECTION PROCEDURES 

Before removing the RF Section plug-in from the 

mainframe, remove the main (Mains) voltage by 

disconnecting the power cable from the power 

outlet. 

RF Section Plug-in Removal 

a. Release the latch below the front panel 

OUTPUT jack. 

b. Pull the latch out while rotating it to the left until 

it is perpendicular to the front panel. This separates the 

mating plug and jack (plug-in to mainframe). 

c. Grasp the latch and pull the plug-in straight out 

from mainframe. 

Plug-in Cover Removal 

a. Remove the 16 Pozidriv screws from both 

covers. 

b. Loosen the 4 screws which hold the 

teflon/aluminum plug-in guide in place. 

c. Remove the covers and set them aside. 

d. If necessary, remove the plug-in guides by 

removing the screws. 

Interconnection of RF Section to Mainframe for 

Troubleshooting Purposes 

After the RF Section is removed from the mainframe and its 

covers have been removed, the RF Section must be 

reconnected to the mainframe with interconnecting extender 

cables before troubleshooting can begin. 

With the mainframe top cover removed, power is 

supplied to the system during troubleshooting. 

Energy available at many points may constitute a 

shock hazard. 

a. Remove the mainframe top cover. First remove 

the 4 Pozidriv screws; then slide the cover back and off the 

mainframe siderails. 

NOTE 

The interconnect cables and adapters are parts found 

in the HP 11672A Service Kit. They may all be 

ordered in the kit or as individual pieces. Refer to the 

11672A Operating Note for a pictorial cross 

reference. 

8-34 

DISASSEMBLY AND INTERCONNECTION 

PROCEDURES (Cont’d) 

b. Make connection from J6 (mainframe) to P6 (RF 

Section rear panel) with the 11672-60001 multi-pin 

interconnect cable. 

To avoid contact with the line voltage, remove the 

line (main) power cable from the power outlet 

before removing or connecting cables to the 

Frequency Extension Module. 

c. Connect the 1250-1236 adapter to the 11672- 

60005 gray coaxial cable. Insert the adapter into P2 (on the 

RF Section rear panel above the multipin connector). 

d. Remove the gray-blue cable from the jack on 

the rear side of the Frequency Extension Module. Connect the 

gray coaxial cable to the extension module jack. 

e. Take the 11672-60004 red coaxial cable and 

connect it to P1 (RF Section rear panel below the multi-pin 

connector). 

f. Disconnect the gray cable from the other 

extension module output jack. Connect the red coaxial cable 

to the jack. 

g. Reconnect the mainframe line (Main) power 

cable to the power outlet and set the mainframe line switch to 

ON. 

All Logic Assembly 

SERVICE SHEET 9


Table 8-2. Assemblies, Chassis Mounted Parts, and Adjustable Component Locations (1 of 2) 

8-34A


Table 8-2. Assemblies, Chassis Mounted Parts, and Adjustable Component Locations (2 of 2) 

8-35

Section 8 TM 11-6625-’2837-14 & P-7 

Figure 8-25. Assemblies, Chassis Parts, and Adjustable 

Component Locations 

8-35A


SECTION IX MANUAL CHANGES 

ERRATA 

MANUAL IDENTIFICATION 

Model Number: 86602B 

RF SECTION 1-1300 MHz Date Printed: Oct. 1977 

Part Number: 86602-90021 

This supplement contains important information for correcting manual errors and for adapting the manual to instruments 

containing improvements made after the printing of the manual. 

To use this supplement: 

Make all ERRATA corrections 

ERRATA 

Page 6-7 and 6-8,space Table 6-2: 

Delete A7A3 HP Part Number. Not separately field replaceable, order new A7 Assembly. 

CHANGE 1 


Replace the parts list for the A9 Attenuator Driver Assembly found in this supplement (Part of Change 1). 

Page 8-31, Figure 8-21: 

Replace Figure 8-21 with the component locations diagram in this supplement (Part of Change 1). 

Page 8-31, Figure 8-22 (Service Sheet 8): 

Replace Figure 8-22 with the schematic found in this supplement (Part of Change 1). 

NOTE 

Manual change supplements are revised as often as necessary to keep manuals as current and accurate as possible. 

Hewlett-Packard recommends that you periodically request the latest edition of this supplement. Free copies are available 

from all HP offices. When requesting copies quote the manual identification information from your supplement, or the 

model number and print date from the title page of the manual. 

9-1

Section IX TM 11-6625-2837-14 & P-7 

TABLE 6-2. Replaceable Parts (P/O Change 1) 

Reference HP Part Qty Description Mfr Mfr Part Number 

Designation Number 

Code 

A9 86601-60129 1 ATTENUATOR DRIVER ASSEMBLY 28480 68801-60129 

A9C1 0160-0127 4 CAPACITOR-FXD 1UF +-20% 25VDC CER 28480 0160-0127 

A9C2 0160-0127 CAPACITOR-FXD 1UF +-20% 25VDC CER 28480 0160-0127 



A9MP1 1480-0073 2 PIN: DRIVE 0.250” LG 0000J OBD 

A9MP2 1480-0073 PIN: DRIVE 0.250” LG 0000J OBD 

A9MP3 4080-0073 2 EXTRACTOR-PC BOARD YEL POLYC 28480 4040-0752 

A9MP4 4080-0073 EXTRACTOR-PC BOARD YEL POLYC 28480 4040-0752 

A9Q1 1853-0213 4 TRANSISTOR PNP 2N4236 SI TO-5PD=1W 04713 2N4236 

A9Q2 1854-0361 4 TRANSISTOR NPN 2N4239 SI TO-5 PD=800MW 04713 2N4239 

A9Q3 1853-0213 TRANSISTOR PNP 2N4236 SI TO-5 PD=1W 04713 2N4236 

A9Q4 1854-0361 TRANSISTOR NPN 2N4239 SI TO-5 PD=800MW 04713 2N4239 

A9Q5 1854-0071 4 TRANSISTOR NPN SI PD=300MW FT=200MHZ 28480 1854-0071 

A9Q6 1853-0020 4 TRANSISTOR PNP SI PD=300MW FT=150MHZ 28480 1853-0020 

A9Q7 1854-0071 TRANSISTOR NPN SI PD=300MW FT=200MHZ 28480 1584-0071 

A9Q8 1853-0020 TRANSISTOR PNP SI PD=300MW FT=150MHZ 28480 1853-0020 

A9Q9 1853-0213 TRANSISTOR PNP 2N4236 SI TO-5 PD=1W 04713 2N4236 


A9Q11 1853-0213 TRANSISTOR PNP 2N4236 SI TO-5 PD=1W 04713 2N4236 






A9R1 0757-0280 4 RESISTOR 1K 1% .125W F TC=0+-100 24546 C4-1/8-TO-1001-F 

A9R2 0757-0280 RESISTOR 1K 1% .125W F TC=0+-100 24546 C4-1/8-TO-1001-F 



A0R5 0757-0159 8 RESISTOR 1K 1% .5W F TC=0+-100 19701 MF7C1/2-TO-196R-F 

A9R6 0698-3440 3 RESISTOR 196 1% .125W F TC=0+-100 24546 C4-1/8-TO-196R-F 

A9R7 0757-0159 RESISTOR 1K 1% .5W F TC=0+-100 19701 MF7C1/2-TO-1R0-F 


A9R9 0698-3440 RESISTOR196 1% .125W F TC=0+-100 24546 C4-1/8-TO-196R-F 

A9R10 0757-0159 RESISTOR 1K 1% ,5W F TC=0+-100 19701 MF7C1/2-TO-1R0-F 

A9R11 0757-0159 RESISTOR 1K 1% .5W F TC=0+-100 19701 MF7C1/2-TO-1R0-F 

A9R12 0698-3440 RESISTOR 196 1% .125W F TC=0+-100 24546 C4-1/8-TO-196R-F 



A9R15 0757-0401 1 RESISTOR 100 1% .125W F TC=0+-100 24546 C4-1/8-TO-101-F 


A9R17 0698-0082 8 RESISTOR 464 1% .125W F TC=0+-100 24546 C4-1/8-TO-4640-F 

A9R18 0698-0082 RESISTOR 464 1% .125W F TC=0+-100 24546 C4-1/8-TO-4640-F 







A9VR1 1902-3002 4 DIODE-ZNR 2.37V 5% 00-7 PD=.4W TC=-.074% 04713 8Z 10930-2 

A9VR2 1902-3002 DIODE-ZNR 2.37V 5% 00-7 PD=.4W TC=-.074% 04713 8Z 10930-2 



9-2


Figure 8-21. A9 Attenuator Driver Assembly Component Locations (P/O Change 1) 

9-3


Figure 8-22. Attenuator Section Schematic Diagram (P/O Change 1) 

9-4


CHANGE 2 


Add under CHASSIS PARTS, L3 9170-0499 CORE TOROID AL-2135-NH/T. 

Page 8-23, Figure 8-11 (Service Sheet 4): 

Add L3 in series with +20V line (red wire) between A12P13 pins 9,K and P5. 

CHANGE 3 


Add to the table: 

Reference Designator Selected For Normal Value Range Service Sheet 

A20R4 Current limiting in R1, R2, and None to 1.96k 4 

R3 of the 50 MHZ High Pass Filter 

The procedure for selecting the resistor (A20R4) is: 

1. Measure the voltage (Vdc) to ground at the junction of A7L1 and A7C1. 

2. If Vdc A 11.0, no resistor is needed. 

3. If 11.0 < Vdc < 14.0, select a 1.96K resistor. 

4. If Vdc > 14.0, select a 1.OK resistor. 


Add A20R4* 0698-7236 RESISTOR 1K 1% 0.05W F TC-O+100. *FACTORY SELECTED PART. 

Page 8-23, Figure 8-11 (Service Sheet 4): 

Add, to the A20 Filter Control Assembly, R4* 1000 from the junction of L1 and C3 to ground. 

Add to the REFERENCE DESIGNATION BOX, under A20, R4. 

CHANGE 4 


Change A2R9 to 0764-0013 RESISTOR 56 5%0 2W MO TC - 0 + 200. 

Page 8-29, Figure 8.20 (Service Sheet 7): 

Change A2R9 to 56. 

9-5

APPENDIX A 

REFERENCES 

DA Pam 310-4 Index of Technical Publications. 

TM 38-750 The Army Maintenance Management System (TAIMS). 

TM 750-244-2 Procedures for Destruction of Electronics Materiel 

to Prevent Enemy Use (Electronics Command). 

A-1 


D-1. General 

APPENDIX B 

MAINTENANCE ALLOCATION 

SECTION I. INTRODUCTION 


This appendix provides a summary of the maintenance operations for the Model 86602B RF Section. It authorizes 

categories of maintenance for specific maintenance functions on repairable items and components and the tools and 

equipment required to perform each function. This appendix may be used as an aid in planning maintenance operations. 

D-2. Maintenance Function 

Maintenance functions will be limited to and defined as follows: 

a. Inspect. To determine the serviceability of an item by comparing its physical, mechanical and/or electrical 

characteristics with established standards through examination. 

b. Test. To verify serviceability and to detect incipient failure by measuring the mechanical or electrical 

characteristics of an item and comparing those characteristics with prescribed standards. 

c. Service. Operations required periodically to keep an item in proper operating condition, i.e., to clean 

(decontaminate), to preserve, to drain, to paint, or to replenish fuel, lubricants, hydraulic fluids, or compressed air supplies. 

d. Adjust. To maintain, within prescribed limits, by bringing into proper or exact position, or by setting the 

operating characteristics to the specified parameters. 

e. Align. To adjust specified variable elements of an item to bring about optimum or desired performance. 

f. Calibrate. To determine and cause corrections to be made or to be adjusted on instruments or test 

measuring and diagnostic equipments used in precision measurement. 

g. Install. The act of emplacing, seating or fixing into position an item, part, module (component or assembly) in 

a manner to allow the proper functioning of the equipment or system. 

h. Replace. The act of substituting a serviceable like type part, subassembly or module (component or 

assembly) for an unserviceable counterpart. 

B-1


i. Repair. The application of maintenance services (inspect, test, service, adjust, align, calibrate, replace) or 

other maintenance actions (welding, grinding, riveting, straightening, facing, remachining or resurfacing) to restore 

serviceability to an item by correcting specific damage, fault, malfunction, or failure in part, subassembly, module 

(component or assembly), end item or system. 

j. Overhaul. That maintenance effort (service/action) necessary to restore an item to a completely 

serviceable/operational condition as prescribed by maintenance standards (i.e., DMWR) in appropriate technical 

publications. Overhaul is normally the highest degree of maintenance per-formed by the Army. Overhaul does not normally 

return an item to like new condition. 

k. Rebuild. Consists of those services/actions necessary for the restoration of unserviceable equipment to a like 

new condition in accordance with original manufacturing standards. Rebuild is the highest degree of materiel maintenance 

applied to Army equipment. The rebuild operation includes the act of returning to zero those age measurements (hours, 

miles, etc.) considered in classifying Army equipments/components. 

D-3. Column Entries 

a. Column 1, Group Number. Column 1 lists group numbers, the purpose of which is to identify components, 

assemblies, subassemblies and modules with the next higher assembly. 

b. Column 2, Component/Assembly. Column 2 contains the noun names of components, assemblies, 

subassemblies and modules for which maintenance is authorized. 

c. Column 3, Maintenance Functions. Column 3 lists the functions to be performed on the item listed in column 

2. When items are listed without maintenance functions, it is solely for purpose of having the group numbers in the MAC 

and RPSTL coincide. 

d. Column 4, Maintenance Category. Column 4 specifies, by the listing of a “work time” figure in the appropriate 

subcolumn(s), the lowest level of maintenance authorized to perform the function listed in column 3. This figure represents 

the active time required to perform that maintenance function at the indicated category of maintenance. If the number or 

complexity of the tasks within the listed maintenance function vary at different categories, appropriate “work time” figures 

will be shown for each category. The number of task-hours specified by the “work time” figure represents the average time 

required to restore an item (assembly, subassembly, component, module, end item or system) to a serviceable condition 

under typical field operating conditions. This time includes preparation time, troubleshooting time, and quality 

assurance/quality control time in addition to the time required to perform the specific tasks identified for the maintenance 

functions authorized in the Maintenance 

B-2

Allocation Chart. Subcolumns of column 4 are as follows: 

C - Operator/Crew 

0 - Organizational 

F - Direct Support 

H - General Support 

D - Depot 


e. Column 5, Tools and Equipment. Column 5 specifies by code, those common tool sets (not individual tools) 

and special tools, test and support equipment required to perform the designated function. 

f. Column 6, Remarks. Column 6 contains an alphabetic code which leads to the remark in section IV, 

Remarks, which is pertinent to the item opposite the particular code. 

D-4. Tool and Test Equipment Requirements (Sect. III). 

a. Tool or Test Equipment Reference Code. The numbers in this column coincide with the numbers used in the 

tools and equipment column of the MAC. The numbers indicate the applicable tool or test equipment for the main-tenance 

functions. 

b. Maintenance Category. The codes in this column indicate the maintenance category allocated the tool or test 

equipment. 

c. Nomenclature. This column lists the noun name amd nomenclature of the tools and test equipment required 

to perform the maintenance functions. 

d. National/NATO Stock Number. This column lists the National/NATO stock number of the specific tool or test 

equipment. 

e. Tool Number. This column lists the manufacturer’s part number of the tool followed by the Federal Supply 

Code for manufacturers (5-digit) in parentheses. 

D-5. Remarks (Sect. IV). 

a. Reference Code. This code refers to the appropriate item in section II, column 6. 

b. Remarks. This column provides the required explanatory information necessary to clarify items appearing in 

section II. 

B-3 

The next page is B-5.

SECTION II MAINTENANCE ALLOCATION CHART 

FOR 

RF SECTION HP-86602A & B 

TM 11-6625-2837-14 & =P-7 

(1) (2) (3) (4) (5) (6) 

GROUP MAINTENANCE MAINTENANCE CATEGORY TOOLS AND 

NUMBER COMPONENT ASSEMBLY FUNCTION C O F H D EQUIPMENT REMARKS 

00 RF SECTION Inspect 0.3 

Test 2 1-27 

Adjust 3 27 

Repair 2 27 

01 MODULATOR FILTER ASSEMBLY (Al) Inspect 0.3 27 

Test 0.5 1,5,13,26 

Replace 0.1 27 

Repair 0.5 27 

02 ALC MOTHER BOARD ASSEMBLY (A2) Inspect 0.3 27 

Test 0.5 1,5.13,26 


Repair 0.5 27 

03 ALC AMPLIFIER ASSEMBLY (A3) Inspect 0.3 27 

Test 0.5 1 


Repair 0.5 27 

04 DETECTOR AMPLIFIER ASSEMBLY (A4) Inspect 0.3 27 

Test 0.5 1,5 


Repair 0.5 27 

05 2.75 - 3.95 GHz NODULATOR ASSEMBLY (A5) Inspect 0.3 27 

Test 0.5 1,5,13,26 


06 1-1300 MHz AMPLIFIER/DETECTOR 

ASSEMBLY (A6) Inspect 0.3 27 

Test 0.5 1,5 


07 MIXER ASSEMBLY (A7) Inspect 0.3 27 

Test 0.5 1,5,13,26 


Repair 0.5 27 

08 4.0 GHz AMPLIFIER ASSEMBLY (A8) Inspect 0.3 27 

Test 0.5 1,5,13,26 


09 ATTENUATOR DRIVER ASSEMBLY (A9) Inspect 0.3 27 

Test 0.5 1 


Repair 0.5 27 

10 REFERENCE ASSEMBLY (A10) Inspect 0.3 27 

Test 0.5 1 


Repair 0.5 27 

11 LOGIC ASSEMBLY (All) Inspect 0.3 27 

Test 0.5 1 


Repair 0.5 27 

12 10 DB STEP ATTENUATOR ASSEMBLY (A13) Inspect 0.3 27 

Test 0.5 1 


13 20 MHz AMPLIFIER (A15) Inspect 0.3 27 

Test 0.5 1,5,13,26 


B-5

SECTION III TOOL AND TEST EQUIPMENT REQUIREMENTS 

FOR 

RF SECTION 86602A & B 


TOOL OR TEST MAINTENANCE NATIONAL/NATO 

EQUIPMENT CATEGORY NOMENCLATURE STOCK NUMBER TOOL 

REF CODE NUMBER 

1 H DIGITAL VOLTMETER HP 34740A 6625-00-578-6751 

2 D VOLTMETER, ELECTRONIC ME-30C/U 6625-00-929-1897 

3 D VECTOR VOLTMETER ME-512/U 6625-00-929-1897 

4 D OSCILLOSCOPE TEK 5440 

5 H SPECTRUM ANALYZER TEK 80009 6625-00-558-2329 

6 D TEST OSCILLATOR HP 651B 6625-00-937-4961 

7 D SYNTESIZED SIGNAL 8660A 6625-01-008-3284 

8 D MODULATOR SECTION HP 86632A 6625-00-607-9858 

9 D COMPUTING COUNTER HP 5360A w/HP 5365A 

PLUG-IN 7025-00-607-9858 

10 D WAVE ANALYZER HP 3581A 6625-21-872-1210 

11 D POWER SUPPLY JF 332 6625-00-481-8901 

12 D FREQUENCY METER HP 5345 AULF 4935-01-034-9167 

13 H POWER METER ME-441/U 6625-00-436-4883 

14 D ATTENUATOR HP 355C 6625-00-866-9462 

15 D PULSE GENERATOR SC-1105OS/U 6625-01-010-3524 

16 D CRYSTAL DETECTOR HP 8471A OR EQUIVALENT 5985-00-125-1313 

17 D MARKED CARD PROGRAMMER HP 3260A OPTION 001 

18 D DOUBLE BALANCED MIXER HP 10514A OR 

EQUIVALENT 5985-00-895-4608 

19 D FUNCTION GENERATOR HP 203A OR EQUIVALENT 6625-00-456-2712 

20 D MICROWAVE FREQUENCY COUNTER HP 5340A 6625-00-498-8946 

21 D POWER METER HP 435A 6625-01-033-6593 

22 D THERMISTOR MOUNT HP 8478B 6625-00-811-2435 

23 D PULSE GENERATOR HP 8013A 6625-01-010-3524 

24 D TERMINATION 50s’ HP 11048C OR EQUIVALENT 

25 D DOUBLE BALANCED MIXER WATKINS JOHNSON MIJ 

26 H SERVICE KIT HP 11672A 5895-01-031-5210 

27 H COMMON TOOLS AVALIABLE TO REPAIR PERSON 

* U.S. GOVERNMENT PRINTING OFFICE: 1981-703-029/1292 

B-6

By Order of the Secretary of the Army: 

E. C. MEYER 

General, United States Army 

Official: Chief of Staff 

ROBERT M. JOYCE 

Brigadier General, United States Army 

The Adjutant General

PIN: 049778-000

TM 11-6625-2837-14&P-7 TECHNICAL MANUAL OPERATOR'S ...

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