Henkel Loctite Eccobond FP4451 Datasheet Henkel Loctite Eccobond FP4451

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  • Description for Henkel Loctite Eccobond FP4451

    High purity, Minimal slumping, Green product, Epoxy, Black, Heat cure, UL 94 HB @ 25 mm thickness, Is designed as a flow control barrier around areas of bare chip encapsulation

    *See Terms of Use Below

    Brand Loctite, Hysol, Eccobond
    Application Type Encapsulation
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Industry BGA memory cards, IC memory cards
    Manufacturer Henkel
    Chemistry Epoxy, High purity
    Cure Method Heat cure
    Cure Temperature (°C) >125, 165, 165
    Cure Time (min) 30, 90, 60
    Viscosity (cPs) 1,300,000, 860,000, Minimal slumping
    Color Black
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -65
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): Flammability Rating UL 94 HB @ 25 mm thickness

  • Technical Data for Henkel Loctite Eccobond FP4451

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Industry
    • Chemistry
      • Epoxy
      • Other - High purity
    • Cure Method
      • Heat - Heat cure
    • Color
      • Black
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 HB - Flammability Rating UL 94 HB @ 25 mm thickness
    • Brand
      • Hysol
      • Loctite
      • Eccobond
    Specifications
    Cure Specs
    Cure Temperature (°C) >125, 165, 165 Test Method
    Cure Time (min) 30, 90, 60 Test Method
    Viscosity (cPs) 1,300,000, 860,000, Minimal slumping Test Method
    Set Time (min) 8 Test Method
    Work / Pot Time (min) 2,880 Test Method
    Material Resistance
    High Temperature Resistance (°C) 150 Test Method
    Low Temperature Resistance (°C) -65 Test Method
    Conductivity
    Filler Concentration % (%) 72 Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) 155 Test Method
    Specific Gravity 1.760 Test Method
    Coefficient of Thermal Expansion (CTE) 22 (ppm/°C) Test Method
    Business Information
    Shelf Life Details Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.; Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product properties., Uncured
    Shelf Life Temperature (°F) <-40
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 9
    Not Good For
    Don't Use With chlorine or their strong oxidizing materials

  • Best Practices for Henkel Loctite Eccobond FP4451

    *See Terms of Use Below

    1. Application

      Needle size <23 gauge not recommended. Dispense through a heated metal needle @ 60-70 C. Do not exceed 75 C as at temperatures above 70 C extra slump will occur. Tool Heat @ 70 C. If you need heat >70 C for needle or tool, consider using FP4451TD.

    2. Curing

      Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

  • Comparable Materials for Henkel Loctite Eccobond FP4451

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      Loctite Eccobond FP4450HF(Henkel)

      ● High purity ● Self-leveling ● Excellent corrosion resistance ● Excellent chemical resistance ● Excellent moisture resistance ● High temperature performance ● High flow control ● Epoxy ● Heat cure ● Encapsulation

    • Henkel
      Loctite Eccobond FP4460(Henkel)

      A high purity, low stress, improved work life, high temperature performance, excellent chemical resistance, excellent moisture resistance, high flow, designed for protection of bare semiconductor devices.

    • Henkel
      Loctite Eccobond FP4451TD(Henkel)

      Is designed as a flow control barrier around areas of bare chip encapsulation, high purity, excellent chemical resistance, exceptional thermal stability

    • Compare All
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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
>125°C Recommended Cure
165°C Recommended Cure
165°C Alternate Cure
Cure Time Test Methods
Cure Time Test Method
30 min Recommended Cure
90 min Recommended Cure
60 min Alternate Cure
Set Time Test Methods
Set Time Set Temperature Test Method
8 min 121°C Gel Time, Uncured
Viscosity Test Methods
Viscosity Test Method Temperature
1,300,000 cPs Brookfield - RVT, Spindle 7, speed 2 rpm, Uncured 25°C
860,000 cPs Brookfield - RVT, Spindle 7, speed 4 rpm, Uncured 25°C
Minimal slumping
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
2,880 min Pot Life, Time to double viscosity, Uncured 25°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
150°C Operating Temperature
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-65°C Operating Temperature
Filler Concentration % Test Methods
Filler Concentration % Filler Concentration Test Method
72 % ITM3A
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
22 (ppm/°C) 40 to 120°C Below Tg, Cured
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
155°C By TMA, Cured
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1.760 25°C Uncured