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Comparison HyperX Fury Black DDR4 1x8Gb HX432C16FB3/8 vs HyperX Fury DDR4 RGB 1x8Gb HX432C16FB3A/8

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HyperX Fury Black DDR4 1x8Gb HX432C16FB3/8
HyperX Fury DDR4 RGB 1x8Gb HX432C16FB3A/8
HyperX Fury Black DDR4 1x8Gb HX432C16FB3/8HyperX Fury DDR4 RGB 1x8Gb HX432C16FB3A/8
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Memory capacity8 GB8 GB
Memory modules11
Form factorDIMMDIMM
TypeDDR4DDR4
Memory ranksingle rank
Specs
Memory speed3200 MHz3200 MHz
Clock speed25600 MB/s25600 MB/s
CAS latencyCL16CL16
Memory timing16-18-1816-18-18
Voltage1.35 V1.35 V
Coolingradiatorradiator
Module profilestandardstandard
Module height34.1 mm41.24 mm
More features
overclocking series
XMP
 
overclocking series
XMP
lighting
Lighting syncmulti compatibility
Color
Added to E-Catalogseptember 2019august 2019

Memory rank

The number of ranks provided in the memory bar.

The rank in this case is called one logical module — a chipset with a total capacity of 64 bits. If there is more than one rank, this means that several logical ones are implemented on one physical module, and they use the data transmission channel alternately. A similar design is used in order to achieve large amounts of RAM with a limited number of slots for individual brackets. At the same time, it should be said that for consumer computers, you can not pay much attention to the memory rank — more precisely, peer-to-peer modules are quite enough for them. But for servers and powerful workstations, two-, four- and even eight-rank solutions are produced.

Note that other things being equal, a larger number of ranks allows achieving larger volumes, however, it requires more computing power and increases the load on the system.

More features

— A series for overclocking (overclocking). Belonging to such a series means that the manufacturer initially provided in the module the possibility of overclocking ("overclocking") — that is, increasing performance by changing the operating parameters, in particular, increasing the operating voltage and clock frequency. You can also “overclock” ordinary memory that is not related to overclocking — however, this is difficult and fraught with failures, up to complete burnout of the circuits, while in specialized series overclocking is a documented function, it is implemented quickly and simply, moreover, it is most often covered by a guarantee.

XMP support. Memory module compatibility with XMP technology. This technology, created by Intel, is used for overclocking (see the relevant paragraph). Its key principle is that certain overclocking profiles are recorded in the memory module — sets of settings tested for stability; and instead of manually setting individual parameters, the user just needs to select one of the profiles. This simplifies system setup and at the same time improves its reliability during overclocking. However, note that in order to use XMP, it must be supported not only by memory, but also by the motherboard.

— AMP support. Memory module compatibility with AMP technology. In terms of its main features, this technology is completely similar to the XMP described above and differs only in the creator — in this case, it is AMD.

EXPO support. Memory module compatibility with EXPO technology (Extended Profiles for Overclocking). It was created at AMD by a specialist for overclocking DDR5 strips as part of Ryzen 7000 systems. At its core, this is a factory set of RAM profiles that simplifies overclocking the “RAM”. Using the technology allows you to increase performance in games by about 11% with a resolution of the broadcast image Full HD.

Buffering support (Registered). The presence of the so-called memory module. buffer — a section for quickly saving incoming data — between the memory controller (control device) and the actual chips (storage devices). This scheme reduces the load on the controller, thereby achieving higher reliability; on the other hand, buffered modules have slightly reduced performance due to the delay in transferring information through the buffer. Buffered memory is used mainly in server systems and is expensive. When choosing memory, note that either only buffered or only unbuffered memory can be used in one system; it is impossible to combine these two types of memory.

ECC support. ECC (Error Checking and Correction) is a technology that allows you to correct minor errors that occur while working with data. To use ECC, it must be supported not only by the memory module, but also by the motherboard; Basically, such support is used in servers, but it is also found in "motherboards" for ordinary desktops.

Backlight. Decorative lighting, usually with LEDs. It does not affect the functionality of the memory module, but it gives it a bright and unusual appearance, which is appreciated by fans of external tuning of computers. Of course, in order for this backlight to be visible, the case must have at least a viewing window, and ideally a completely transparent wall.

Lighting sync

The timing technology provided by the backlit memory module (see "Options").

Synchronization itself allows you to "match" the backlighting of the memory with the backlighting of other system components — the motherboard, processor, graphics card, case, keyboard, mouse, etc. Thanks to this matching, all components can change colour synchronously, turn on / off at the same time, etc. The specific features of the operation of such a backlight depend on the synchronization technology used, and, usually, each manufacturer has its own (Aura Sync for Asus, RGB Fusion for Gigabyte, etc.). The compatibility of the components also depends on this: they must all support the same technology. So the easiest way to achieve backlight compatibility is to collect components from the same manufacturer. However, there are many memory modules in the multi compatibility format — that is, capable of working with several backlight technologies at once. Usually, such memory is produced by manufacturers that do not have their own backlight technologies; a specific list of compatible technologies should be specified separately.
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