Figure : HP t630 Thin Client
Feature
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Description
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AMD GX-420GI
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2.2/2.0 GHz
Cores: 4
TDP: 16.1W
L2 cache: 2 MB
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GPU: 626 MHz
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Memory: DDR4
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Feature
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Description
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Type
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DDR4 dual channel SDRAM
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Data transfer rate
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Up to 1,866 MT/s
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Peak transfer rate
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14,933 MB/s
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Number of slots
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2 x SODIMM
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Capacities
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4 GB
8 GB
16 GB
32 GB
note: |
Reserved for graphics
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256 MB, 512 MB (default), or 1 GB
note: |
Feature
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Description
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Type
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NAND flash memory, non-volatile
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Number of sockets
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(2) M.2 designated as primary and secondary*
Primary storage options
No OS, Smart Zero and ThinPro: 8 GB, 16 GB, 32 GB, 64 GB, 128 GB
WES 7E, 32bit: 16 GB, 32 GB, 64 GB, 128 GB
Win 10 IoT, 64 bit: 32 GB, 64 GB, 128 GB
note: |
Capacities
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Secondary storage options*
All configurations: 8 GB, 16 GB, 32 GB, 64 GB
WES 7E, 32bit restrictions for factory: The secondary drive must be equal to or
greater than the capacity of the primary drive.
note: |
Flash memory
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Multi-level Cell (MLC)
Bits per cell: 2
Terabytes written (TBW)*: 5 TBW – 8GB, 10 TBW – 16GB, 20 TBW – 32GB
Ultra MLC (UMLC)
Bits per cell: 2 (only 1 is used)
Terabytes written (TBW)*: 50 TBW – 16GB, 100 TBW – 32GB
Triple-level Cell (TLC )
Bits per cell: 3
Terabytes written (TBW)*: 70 TBW - 128GB
note: |
Feature
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Description
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Keyboard
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USB or PS/2
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Mouse
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USB or PS/2
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Display/monitor
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Number of displays supported: 2*
(2) DisplayPort 1.2, 3840 x 2160 at 60 Hz**
(1) VGA (optional), 1920 x 1200 at 60 Hz**
note: note: |
Ports and slots
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(4) Hi-Speed USB 2.0 ports (2 front, 2 rear)
(3) SuperSpeed USB 3.0 ports (2 front, 1 inside chassis)
(2) DisplayPort 1.2 digital outputs
(1) VGA analog output (optional)*
(2) PS/2 keyboard/mouse ports
(1) RJ45 network interface connector
(1) Serial port, can be configured to produce 5V of power
(1) 3.5 mm headset port (front)
(1) 3.5 mm audio combo line-out/ line-in port (rear)
note: |
Feature
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Description
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Audio subsystem
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Internal amplified speaker system for basic audio playback
3.5 mm headset socket (front)
3.5 mm combo line-out/ line-in socket (rear)
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Audio CODECs
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MP3
AAC stereo
HE AAC
Includes hardware acceleration support
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Video CODECs
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MPEG-4 part 2 (DivX, Xvid)
MPEG-4 part 10 (H.264, AVC)
WMV 7/8/9 VC-1 and ASF Demuxer
Includes hardware acceleration support
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Feature
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Description
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Security
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Security lock slot (cable lock sold separately)
Power cord retention clip
Internal SuperSpeed USB 3.0 port
Trusted Platform Module (version 1.2 or 2.0 depending upon the configured operating system)
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Networking
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Realtek Gigabit Ethernet (GbE), RJ45 connector access
Wake on LAN (WOL)
Preboot Execution Environment (PXE)
TCP/IP with DNS and DHCP
Secure Socket Tunneling Protocol (SSTP), supported with Windows OS
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Feature
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Description
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Wi-Fi adapter options:
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Intel Dual Band Wireless-AC 3168 Wi-Fi/Bluetooth combo adapter
Intel Dual Band Wireless-AC 8260 Wi-Fi/Bluetooth combo adapter
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note:Wireless access point and internet access required. Availability of public wireless access points limited.
Feature
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Description
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Fiber optic adapter option: Allied Telesis AT-27M2/SC Fiber Fast Ethernet network interface
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Form factor: M.2
Connector: SC, compliant with IEC 61754-4
External Interface: Complies with IEEE 802.3 1000BASE-X operation
Features:
IEEE 802.1p priority encoding/tagging (QoS, CoS)
IEEE 802.1q VLAN tagging
IEEE 802.3x flow control
Buffer/FIFO: 2K transmit and 2K receive
Loopback mode
Descriptor-based buffer management
Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
Link Detection and PHY interface power (The PHY interface, Link detection, and Link LED
are enabled by default at power up.)
Performance:
>= 85 Mbit/s receive, <= 30% CPU utilization
>= 85 Mbit/s transmit, <= 30% CPU utilization
>= 170 Mbit/s total bi-directional, <= 30% CPU utilization
Power:
Uses less than 1775 mW of power at full performance
Supports all PCI Express bus states L0, L0s, L1, and L2
Non-volatile storage:
The MAC address is unique for each system, assigned from the board assembly manufacturer
IEEE registered allocation.
The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to
be finely controlled.
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Fiber optic adapter option: Allied Telesis AT-29M2/SC or AT-29M2/LC fiber Gigabit network interface
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Form factor: M.2
Connector: SC, compliant with IEC 61754-4
External Interface: Complies with IEEE 802.3 1000BASE-X operation
Features:
IEEE 802.1p priority encoding/tagging (QoS, CoS)
IEEE 802.1q VLAN tagging
IEEE 802.3x flow control
Buffer/FIFO: 22K transmit and 40K receive
Loopback mode
Descriptor-based buffer management
Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
Link Detection and PHY interface power (The PHY interface, Link detection, and Link LED
are enabled by default at power up.)
Performance:
>= 800 Mbit/s receive, <= 30% CPU utilization
>= 800 Mbit/s transmit, <= 30% CPU utilization
>= 1500 Mbit/s total bi-directional, <= 30% CPU utilization
note:
Power:
Uses less than 2100 mW of power at full performance
Supports all PCI Express bus states L0, L0s, L1, and L2
Non-volatile storage:
The MAC address is unique for each system, assigned from the board assembly manufacturer
IEEE registered allocation.
The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to
be finely controlled.
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Feature
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Description
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Power supply
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65W external power adapter
Worldwide auto-sensing 100-240 VAC, 50-60 Hz
Energy-saving automatic power down
Surge tolerant
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note:The dimensions of the power brick vary by supplier.
Feature
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Description
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H x W x D:
(vertical orientation)
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25.1 x 12 x 22 cm (9.88 x 4.72 x 8.66 in)
Without stand: 24 x 4.2 x 22 cm (9.45 x 1.65 x 8.66 in)
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Volume
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2.21 liters (74.73 fl oz)
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System weight
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1.52 kg (3.35 lb)
Without stand: 1.45 kg (3.2 lb)
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note:All measurements are approximate; the addition of optional modules will increase the weight.
Feature
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Description
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Operating systems
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HP Smart Zero Core
HP ThinPro
Windows Embedded Standard 7E
Windows 10 IoT Enterprise
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Feature
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Description
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Operating temperature range
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10° to 40° C (50° to 104° F)
Using Quick Release with a flat panel monitor: 10° to 35° C (50° to 95° F)
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Non-operating temperature
range
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-30° to 60° C (-22° to 140° F)
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Humidity
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Condensing: 20% to 80%
Non-condensing: 10% to 90%
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note:Specifications are at sea level with altitude derating of 1° C/300m (33.8° F/984 ft) to a maximum of 3 km (9,842 ft), with no direct, sustained sunlight. Upper limit may be limited by the type and number of options installed.